GRM40X7R473J25PB [MURATA]
Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.047uF, Surface Mount, 0805, CHIP;型号: | GRM40X7R473J25PB |
厂家: | muRata |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.047uF, Surface Mount, 0805, CHIP |
文件: | 总16页 (文件大小:239K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
MONOLITHIC CERAMIC CAPACITOR
Series for General Electronic Equipment
GRM
!FEATURES
1. Terminations are made of metal highly resistant to
1
2
migration.
2. The GRM series is a complete line of chip ceramic
capacitors in 6.3V, 10V, 16V, 25V, 50V, 100V, 200V and
500V ratings. These capacitors have temperature
characteristics ranging from C0∆ to Y5V.
3. A wide selection of sizes is available, from the miniature
GRM36 (LZWZT : 1.0Z0.5Z0.5mm) to the larger sized
GRM44-1 (LZWZT : 5.7Z5.0Z2.0mm).
GRM39, GRM40 and GRM42-6 types are suited to flow
and reflow soldering.
GRM36, GRM42-2 and larger types are suited to reflow
soldering.
wTEMPERATURE CHARACTERISTICS
# Temperature Compensating Type
Code
4. Stringent dimensional tolerances allow highly reliable,
high speed automatic chip placements on PCBs.
5. The GRM series is available in both paper and plastic
embossed tape and reel packaging for automatic
placement. Bulk case packaging is also available.
(GRM 36, GRM39, GRM40 (T : 0.6, 1.25))
SL
C0G
C0H
P2H
R2H
S2H
T2H
U2J
3
Temp. range Y55 to W125D
Y55 to W85D
Temp. coeff.
(ppm/D)
W350 to
0T30 0T60 Y150T60 Y220T60 Y330T60 Y470T60Y750T120
1000
Y
# High Dielectric Constant Type
Code
X5R
X7R
Z5U
Y5V
Temp. range Y55 to W85D Y55 to W125D
W10 to W85D Y30 to W85D
!APPLICATION
General electronic equipment.
Cap. change
W22
Y56
W22
Y82
T15
T15
(% )
!PART NUMBERING
(*Please specify the part number when ordering)
eCAPACITANCE (Ex.)
4
5
Code
0R5
R75
010
Capacitance (pF)
Code
Capacitance (pF)
0.57
0.75
1.57
100
101
103
10
100
(Ex.)
GRM40 X7R 102
K
50
PT
q
w
e
r
t
y
u
10,000
qType
tRated Voltage
yMurata's Control No.
uPackaging
wTemperature Characteristics
eCapacitance
rCAPACITANCE TOLERANCE
Tol.
T0.25pF
T0.50pF
T5%0
Code
Capacitance range
rCapacitance Tolerance
C
D
J
10pF and below
qTYPE AND DIMENSIONS
g
e
e
T10%
K
M
Z
More than 10pF
T20%
W80, Y20%
6
7
8
tRATED VOLTAGE
Code
11116.3
10
DC Rated voltage (V)
(in mm)
L
W
1 116.3
10
16
16
Type (EIA Code)
L
W
T
e
g min.
25
25
GRM36 (0402)
GRM39* (0603)
1.0T0.05 0.5T0.05
0.5T0.05 0.15 to 0.3
0.8T0.10 0.2 to 0.5
0.6T0.10
0.4
0.5
50
50
1.6T0.1
0.8T0.10
100
200
500
100
200
500
GRM40 (0805)
0
0.7
1.5
2.0T0.1 1.25T0.1 0.85T0.10 0.2 to 0.7
1.25T0.10
0.85T0.10
3.2T0.15 1.6T0.15
GRM42-6 (1206)
uPACKAGING CODE
1.15T0.10 0.3 to 0.8
3.2T0.2
0
1.6T0.20
0.85T0.10
1.15T0.10
1.35T0.15
1.8T0.20
2.5T0.20
2.0 max.
1.6T0.2
Code
PB
Packaging
Bulk packaging in a bag
Tape carrier packaging
Bulk case packaging
PT
GRM42-2 (1210)
3.2T0.3
2.5T0.20
0.3 min.
1.0
PC
9
GRM43-2 (1812)
GRM44-1 (2220)
4.5T0.4
5.7T0.4
3.2T0.30
5.0T0.40
0.3 min.
0.3 min.
2.0
2.0
2.0 max.
*Bulk case packaging is L=1.6T0.07, W,T=0.8T0.07
1
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
FOR FLOW AND REFLOW SOLDERING
High Dielectric Constant Type 50V
/
25V
GRM40 (0805)
X7R
/
16V
/
10V
/
6.3V Char. X7R/X5R
*4
Type (EIA Code)
GRM36 (0402)
GRM39 (0603)
X7R
GRM42-6 (1206)
Char.
X7R X5R
X5R
X7R
X5R
10
Volt.
50 25 16 10 16 10 50 25 16 10
50
25
16
10
10 6.3
50
25
16 10 16
6.3
Cap. (pF)
220
270
!
THICKNESS AND PACKAGING TYPES/QUANTITY
Taping
330
1
2
390
Bulk
Bulk Case
(pcs./φ178mm
Type
Thickness : T (mm)
470
(pcs./bag)
(pcs./case)
reel) *2
560
680
: 0.5T0.05
: 0.8T0.1*3
: 0.6T0.1
GRM36
GRM39
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
10,000
4,000
4,000
4,000
3,000
4,000
3,000
2,000
50,000
15,000
10,000
820
1,000
1,200
1,500
: 0.85T0.1
: 1.25T0.1
: 0.85T0.1
: 1.15T0.1
: 1.6T0.2
GRM40
1,800
2,200
5,000
2,700
3,300
GRM42-6
3,900
4,700
5,600
*2 φ330mm reel is available on request.
*3 Bulk case packaging is T=0.8T0.07
6,800
3
8,200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
270,000
330,000
390,000
470,000
560,000
680,000
820,000
1,000,000
1,500,000
2,200,000
3,300,000
3,900,000
4,700,000
5,600,000
6,800,000
8,200,000
10,000,000
4
5
*6
*6
*5
*5
*5
*5
*7
6
7
8
*8
*4 GRM36 series is suited to only reflow soldering.
*5 Only for taping
*6 Type : GRM40-034 (L : 2T0.15, W : 1.25T0.15, T : 1.25T0.15)
*7 L : 3.2T0.2, W : 1.6T0.2, T : 1.15T0.15
W0
Y0.2
*8 Type : GRM42-631 (L : 3.2T0.2, W : 1.6T0.2, T : 1.3
)
!CAPACITANCE TOLERANCE
X7R/X5R Characteristics
K : T10% (E12 Series)
M: T20% (E6 Series)
9
4
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
# Capacitance- DC Voltage Characteristics
!CHARACTERISTICS (REFERENCE DATA)
# SELECTION OF CERAMIC CAPACITORS
When selecting capacitors, consider the voltage
characteristics (AC & DC) and aging characteristics.
Measuring condition Z5U
X7R, Y5V : 1kHz, 1Vr.m.s.
C0G : 1MHz, 1Vr.m.s.
: 1kHz, 0.5Vr.m.s.
+40
+20
0
C0G 50V
# Capacitance-Temperature Characteristics
-20
-40
-60
-80
-100
Measuring condition : 1MHz, 1Vr.m.s.
10
X7R 50V
Z5U 50V
1
2
5
Y5V 50V
C0G
0
10
20
30
40
50
0
P2H
DC Voltage (Vdc)
R2H
S2H
T2H
U2J
-5
# Capacitance- AC Voltage Characteristics
Measuring condition C0G
: 1MHz
X7R, Z5U, Y5V :1kHz
-10
-60
-40
-20
0
20
40
60
80
100
120
Temperature (D)
+80
+60
+40
+20
0
Measuring condition Z5U
: 1kHz, 0.5Vr.m.s.
X7R, Y5V : 1kHz, 1Vr.m.s.
20
Z5U 50V
3
Y5V 50V
X7R 50V
0
-20
X7R
C0G 50V
-20
0
1
2
3
-40
AC Voltage (Vr.m.s.)
Z5U
Y5V
-60
# Impedance- Frequency Characteristics
-80
C0G (GRM40)
100
-100
-60
-40
-20
0
20
40
60
80
100
120
1 [pF]
4
5
Temperature (D)
10 [pF]
100 [pF]
10
1
1000 [pF]
# Capacitance Change- Aging
+10
0
100m
10m
C0G
X7R
-10
-20
-30
-40
Y5V, Z5U
1M
10M
100M
1G
Frequency (Hz)
X7R, Y5V (GRM40)
0
50 100
1000
10000
100
Time (Hr)
6
7
8
10
1
1000 [pF]
0.01 [µF]
0.1 [µF]
100m
10m
1k
100k
1M
10M
100M
1G
Frequency (Hz)
9
14
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
NOTICE
!NOTICE
Process
1. Storage of
Chips
Cautions
Control Points
Reference Data
Data 1
# Chip monolithic ceramic capacitors
(chips) can experience degradation
of termination solderability when
subjected to high temperature or
humidity, or if exposed to sulfur or
chlorine gases.
# Storage environment must be at an ambient temperature of 5-40D and an
ambient humidity of 20-70% RH.
1
2
Solderability
Use chips within 6 months. If 6 months or more have elapsed, check
solderability before use.
# For GR series and GR500 series, do not unpack the minimum package until
immediately before use. After unpacking, re-seal promptly or store with a
desiccant.
# Avoid mechanical shock (ex. falling) to the capacitor to prevent mechanical
cracking inside of the ceramic dielectric due to its own weight.
2. Circuit
Design
3. PCB
Design
# These capacitors on this catalog are
not safety recognized products.
# Unlike leaded components, chip
components are susceptible to
flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to
mechanical and thermal stresses
than leaded components.
Data 2
# When designing substrates, take land patterns and dimensions into consideration
Board bending
strength for
solder filletheight
to eliminate the possibility of excess solder fillet height.
# [Pattern Forms]
Incorrect
Correct
Data 3
3
Lead wire
Temperature
cycling for solder
fillet height
Solder resist
Excess solder fillet height can
multiply these stresses and cause
chip cracking.
Data 4
Chassis
Board bending
strength for
board material
Solder (Ground)
Solder
resist
Electrode pattern
4
5
Soldering iron
Lead wire
Solder resist
Solder resist
[Land Dimensions]
Land
Chip Capacitor
Solder Resist
c
6
7
8
b
a
Table 1 Flow soldering method
(in mm)
GRM390
GRM420
GRM400
GRM425
GRM42-6
GRM430-
LL0508
LL0612
GRH706
GRH708
GRH110
Dimen-
L
1.6
0.8
2.00
1.25
3.2
1.6
1.25
2.00
1.6
3.2
1.25
1.00
2.00
1.25
1.4
1.4
sions
W
a
b
c
0.6
0.8
0.6
-
-
-
1.0
0.9
0.8
1.0
0.9
0.8
-
1.2
1.0
1.1
2.2
1.0
1.0
-
-
-
2.6
1.1
1.4
0.4
0.5
1.4
-
-
-
0.7
0.7
1.8
0.6-1.0
0.4
0.6
0.8
-
-
-
0.6
0.8
1.0
1.0
0.9
0.8
-
-
-
1.2
1.0
1.0
0.5-0.8
-
0.8
2.6
-
0.9
0.8
-0.9
-
-2.8
1.0
-1.2
9
84
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
NOTICE
Process
3. PCB
Cautions
Control Points
Reference Data
Table 2 Reflow soldering method
(in mm)
Design
1
2
GRM390 GRM400 GRM42-6 GRM42-2
GRM420 GRM425 GRM430- GRM235
GRM220 GRM225 GRM230- GRM435-
GRM36
GRM33
GRM43-2
GRM240
GRM44-1 LL0306
LL0508
LL0612 GRH706
GRM615
Dimen-
L
0.6
0.3
1.0
0.5
1.6
0.8
2.01
1.25
3.2
1.6
3.2
2.5
4.5
3.2
5.7
5.0
0.8
1.6
1.25
2.01
1.6
3.2
1.25
1.00
sions
W
a
b
c
0.2
-
-
-
0.30 0.30
-
-
-
0.50 0.6
-
-
-
0.8
1.0
-
-
-
1.2
2.2
-
-
-
2.4
2.0
-
-
-
2.4
3.0-
1.2-
2.3-
3.5
1.4
3.0
4.0
-
-
-
4.6
0.2
-
-
-
0.4
0.4
0.3
1.4
-0.6
-0.5
-1.8
0.6
-
-
-
0.8
0.4
-
-
-
0.6
0.2
0.2
0.35 0.35
0.40 0.40
0.45 0.6
0.60 0.6
0.7
0.8
0.6
0.8
0.7
1.1
0.8
1.0
0.9
1.4
1.0
1.8
1.2
2.3
1.4
3.5
1.6
4.8
0.3
1.0
0.4
1.4
0.6
2.6
0.7
2.8
0.6
0.8
0.8
1.0
GRH708 GRH710 GRH110 GRH111 GR530
GR535
GR540
GR545
GR550
GR555
GR580
Dimen-
L
2.01
1.25
3.2
2.5
1.4
1.4
2.8
2.8
4.5
3.8
5.6
5.0
10.6
15.0
10.6
10.0
11.8
10.6
16.0
05.0
28.1
13.2
sions
W
a
b
c
1.0
-
-
-
1.2
2.2
-
-
-
2.5
0.4
-
-
-
0.8
1.8
-
-
-
2.1
3.2
-
-
-
3.4
4.2
0.9
4.0
-4.5
-1.2
-5.0
8.5-
1.3-
4.0-
9.0 8.5
-
-
-
09.0 9.0
-
-
-
9.50 13.0
-
-
-
13.5 25.0
-
-
-
25.5
0.6
0.8
0.8
1.0
0.8
1.9
1.0
2.3
0.6
1.0
0.8
1.2
0.7
2.2
0.9
2.6
0.9
3.0
1.2
3.8
1.5 1.3
5.0 8.0
01.5 1.8
10.0 8.0
2.00 01.8
10.0 04.0
02.0 02.2
05.0 10.0
02.4
13.0
3
Table 3 GNM Series for reflow soldering method
Dimensions (mm)
Type
Chip Capacitor
a
L
W
a
b
c
d
GNM30-401
3.2
1.6
0.8-1.0 0.7-0.9 0.3-0.4 0.4-0.5
b
Land
c
d
# Choose a mounting position that minimizes the stress imposed on the chip during
4
5
flexing or bending of the board.
[Component Direction]
Locate chip horizontal
to the direction in
which stress acts
[Chip Mounting Close to Board Separation point]
Chip arrangement
C
Perforation
~
B
Worst A-C-(B D) Best
---
D
A
Slit
6
7
8
4. Solder
Paste
# Overly thick application of solder
paste results in excessive fillet height
solder.
# Make sure the solder has been applied smoothly to the end surface to a height of
0.2mm min.
Printing
This makes the chip more
[Optimum Solder Amount for Reflow Soldering]
susceptible to mechanical and
thermal stress on the board and may
cause cracked chips.
0.2mm min.
# Too little solder paste results in a
lack of adhesive strength on the
outer electrode, which may result in
chips breaking loose from the PCB.
9
85
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
NOTICE
Process
5. Chip
Cautions
Control Points
# Adjust the suction nozzle's bottom dead point by correcting warps in the board.
Reference Data
# An excessively low bottom dead
point of the suction nozzle imposes
great force on the chip during
mounting, causing cracked chips.
# Dirt particles and dust accumulated
between the suction nozzle and the
cylinder inner wall prevent the nozzle
from moving smoothly. This imposes
great force on the chip during
mounting, causing cracked chips.
# The locating claw, when worn out,
imposes uneven forces on the chip
when positioning, causing cracked
chips.
Data 5
Placing
Break Strength
Correct
Incorrect
1
2
suction nozzle
Deflection
Board
Board guide
Support pin
# Normally, the suction nozzle's bottom dead point must be set on the upper
surface of the board.
# Nozzle pressure for chip mounting must be a 1 to 3N static load.
# The suction nozzle and the locating claw must be maintained, checked and
replaced periodically.
6. Reflow
Soldering
# Sudden heating of the chip results in # When preheating, keep temperature differential, ∆T, within the range shown in
distortion due to excessive
expansion and construction forces
within the chip causing cracked
chips.
Table 4. The smaller the ∆T, the less stress on the chip.
Table 4
Chip Size
GRM33/36/39/40/42-6
GRM420/425/430/615
GRM220/225/230
Temperature Differential
3
∆TV190D
∆TV130D
LL0306/0508/0612
GRH706/708/110
GRM42-2/43-2/44-1/240/435
GRH710/111
GRM235/GNM30-401
GR530/535/540/545/550/555/580
# When components are immersed in solvent after mounting, be sure to maintain
the temperature difference (∆T) between the component and solvent within the
range shown in the above table.
4
5
[Standard Conditions for Reflow Soldering]
# Infrared reflow
# Vapor reflow
Soldering
Soldering
Gradual
cooling
(in the air)
200D
Gradual
cooling
(in the air)
Preheating
Preheating
Time
Time
20-40 seconds
GR500 Series
20 seconds max.
60 seconds min.
60 seconds min.
20 seconds max.
120 seconds max.
120 seconds max.
6
7
8
[Allowable Soldering Temperature and Time]
GRM /LL /GNM Series
GRH Series
GR500 Series
270
260
250
240
230
0
30
60
90
Soldering time (sec.)
# In case of repeated soldering, the accumulated soldering time must be within the
range shown above.
Inverting
the PCB
# Make sure not to impose an abnormal mechanical shock on the PCB.
9
86
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No.C02E5.pdf 99.8.13
NOTICE
Process
7. Adhesive
Application
Cautions
Control Points
Reference Data
# Thin or insufficient adhesive causes
chips to loosen or become
# The amount of adhesive must be more than dimension C shown in the drawing
below to obtain enough bonding strength.
1
2
disconnected when flow soldered.
# Low viscosity adhesive causes chips
to slip after mounting.
The chip's electrode thickness and land thickness must be taken into
consideration.
# Adhesive must have a viscosity of 500ps (at 25D) min.
GR500 Series
Chip capacitor
a : 20 to 70 µm
b : 30 to 35 µm
c : 50 to 105 µm
a : 40 to 70 µm
b : 30 to 35 µm
c : 70 to 105 µm
a
c
b
Adhesive
Land
Board
8. Adhesive
Curing
# Insufficient curing of the adhesive
causes chips to disconnect during
flow soldering and causes
# Control curing temperature and time in order to prevent insufficient hardening.
deteriorated insulation resistance
between outer electrodes due to
moisture absorption.
3
Inverting
the board
9. Leaded
Component
Insertion
# Make sure not to impose an abnormal mechanical shock on the PCB..
# If the PCB is flexed when leaded
components (such as transformers
and ICs) are being mounted, chips
may crack and solder joints may
break.
# Before mounting leaded components, support the PCB using backup pins or
special jigs to prevent warping.
10. Flux
# An excessive amount of flux
generates a large quantity of flux
gas, causing deteriorated
solderability.
# Apply flux thinly and evenly throughout. (A foaming system is generally used for
flow soldering).
Application
# Use flux with a halide content of 0.2wt% max. But do not use strongly acidix flux.
# Wash thoroughly because water soluble flux causes deteriorated insulation
resistance between outer electrodes unless sufficiently cleaned.
4
5
# Flux containing too high a
percentage of halide may cause
corrosion of the outer electrodes
unless sufficiently cleaned.
11. Flow
# Sudden heating of the chip results in # When preheating, keep the temperature differential between solder temperature
Data 6
and chip surface temperature, ∆T, within the range shown in Table 5. The smaller Thermal shock
the ∆T, the less stress on the chip.
Soldering
thermal distortion causing cracked
chips.
# An excessively long soldering time or # When components are immersed in solvent after mounting, be sure to maintain
Data 7
high soldering temperature results in
leaching of the outer electrodes,
the temperature difference between the component and solvent within the range
shown in Table 5.
Solder heat
resistance
causing poor adhesion or a reduction # Do not apply flow soldering to chips not listed in Table 5.
in capacitance value due to loss of
contact between electrodes and end
termination.
Table 5
Chip Size
GRM39/40/42-6
GRM420/425/430
LL0508/0612
Temperature Differential
∆TV150D
6
7
8
GRH706/708/110
[Standard Conditions for Flow Soldering]
Soldering
Gradual
cooling
(in the air)
Preheating
Time
5 seconds max.
60 -120 seconds
9
87
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No.C02E5.pdf 99.8.13
NOTICE
Process
11. Flow
Cautions
Control Points
Reference Data
[Allowable Soldering Temperature and Time]
Soldering
1
2
270
260
250
240
230
0
10
20
30
Soldering time (sec.)
In case of repeated soldering, the accumulated soldering time must be within the
range shown above.
[Optimum Solder Amount for Flow Soldering]
Up to chip thickness
3
Adhesive
# Set temperature and time to ensure that leaching of the outer electrode does not
exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D
shown below) and 25% of the length A-B shown below as mounted on substrate.
As a single chip
A
B
D
4
5
Outer electrode
C
As mounted on substrate
B
A
12. Correction
with a
<For chip type capacitors except
GRM200 series>
# When preheating, keep temperature differential, ∆T, within the range shown in
Table 6. The smaller the∆T, the less stress on the chip.
Data 8
Thermal shock
when making a
correction with a
soldering iron
Soldering
iron
# Sudden heating of the chip results in
distortion due to a high internal
temperature differential, causing
cracked chips.
Table 6
Chip Size
GRM36/39/40/42-6
GRM420/425/430/615
LL0306/0508/0612
GRH706/708/110
Temperature Differential
∆TV190D
6
7
8
GRM42-2/43-2/44-1/435
GNM30-401
∆TV130D
GRH710/111
GR530/535/540/545/550/555/580
[Standard Conditions for Soldering lron Temperature]
Soldering
Gradual
cooling
(in the air)
Preheating
Time
60
-
120 seconds
20 seconds max.
GR500 Series
5 seconds max.
9
88
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No.C02E5.pdf 99.8.13
NOTICE
Process
12. Correction
with a
Cautions
Control Points
Reference Data
[Allowable Time and Temperature for Making Corrections with a Soldering lron]
Data 8
Thermal shock
when making a
correction with a
soldering iron
1
2
Soldering
iron
The accumulated soldering time/temperature including reflow/flow soldering must
be within the range shown below :
270
260
250
240
230
0
30
60
90
Soldering time (sec.)
[Optimum Solder Amount when Corrections Are Made Using a Soldering lron]
3
Up to chip thickness
# When correcting chips with a soldering iron, no preheating is required if the chip
is listed in Table 7 and the following conditions (Table 7) are met.
Preheating should be performed on chips not listed in Table 7.
Table 7
Item
Conditions
GRM36/39/40
GRM42-6
GRM430
LL0612
GRM420/425/615
LL0306/0508
Chip Size
4
5
GRH706/708/110
GNM30-401
Temperature of
iron tip
300D max.
270D max.
Soldering iron
wattage
20W max.
Diameter of iron tip
Restriction
φ 3mm max.
Do not allow the iron tip to directly touch the ceramic element.
<For GRM200 series>
# When solder GRM200 series chip capacitor, keep the following conditions.
<Soldering iron method>
Item
Chip type
Conditions
GRM220
no pre-heating is possible
300D max.
GRM225/230/235/240
Pre-heating
∆V130D
Temperature of iron tip
Soldering iron wattage
Diameter of iron tip
Soldering time
Solder amount
Restriction
20W max.
φ 3mm max.
5 sec. max.
6
7
8
VChip thickness
V1/2 of chip thickness
Do not allow the iron tip to directly touch the ceramic element.
<For Microstrip types>
# Solder 1mm away from the ribbon terminal base, being careful that the solder tip
does not directly contact the capacitor. Preheating is unnecessary.
# Complete soldering within 3 seconds with a soldering tip less than 270D in
temperature.
13. Washing
# Excessive output of ultrasonic
oscillation during cleaning causes
PCBs to resonate, resulting in
cracked chips or broken solder.
# Take note not to vibrate PCBs.
14. Inspection
# Thrusting force of the test probe can # Provide support pins on the back side of the PCB to prevent warping or flexing.
flex the PCB, resulting in cracked
chips or open solder joints.
15. Resin
Coating
# When selecting resin materials, select those with low contraction.
16. Board
Separation
(or Depane-
lization)
# Board flexing at the time of
separation causes cracked chips or
broken solder.
# Severity of stresses imposed on the chip at the time of board break is in the order
of : PushbackFSlitterFV SlotFPerforator.
9
Board separation must be performed using special jigs, not with hands.
89
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No.C02E5.pdf 99.8.13
MONOLITHIC CERAMIC CAPACITOR
High-capacitance for General Electrical Equipment
Series
GHM1500
!FEATURES
!DIMENSIONS
1. A new monolithic structure for small, high-capacitance
capable of operating at high-voltage levels.
2. Sn-plated external electrodes allow mounting without
silver compound solder.
3. The GHM1525/1530 type for flow and reflow soldering,
and other types for reflow soldering.
1
2
W
T
g min.
e min.
L
!APPLICATIONS
1. Ideal use as hot-cold coupling for DC-DC converter.
2. Ideal use on line filter and ringer detector for telephone,
facsimile and modem.
3. Ideal use on diode-snubber circuit for switching power
supply.
Dimensions (mm)
T
Type
(EIA Code)
L
W
g
e
3
GHM1525
(0805)
2.0T0.2
1.25T0.2
1.6T0.2
2.5T0.2
3.2T0.3
5.0T0.4
0.7
GHM1530
(1206)
3.2T0.2
3.2T0.3
4.5T0.4
5.7T0.4
See
1.5
GHM1535
(1210)
"STANDARD
LIST"
0.3
GHM1540
(1812)
2.5
3.5
GHM1545
(2220)
4
5
!STANDARD LIST
B Characteristic (T10%)
High Dielectric Constant Type
Dimensions (mm)
Nom.Cap.
Cap.
Tol.
DC Rated Volt. Packaging Qty.
Part Number
(pF)
(V)
(pcs./reel)
L
W
T
GHM1525 B 102 K 250
GHM1525 B 152 K 250
GHM1525 B 222 K 250
GHM1525 B 332 K 250
GHM1525 B 472 K 250
GHM1525 B 682 K 250
GHM1525 B 103 K 250
GHM1530 B 153 K 250
GHM1530 B 223 K 250
GHM1530 B 333 K 250
GHM1530 B 473 K 250
GHM1535 B 683 K 250
GHM1535 B 104 K 250
GHM1540 B 154 K 250
GHM1540 B 224 K 250
GHM1545 B 334 K 250
GHM1545 B 474 K 250
GHM1530 B 102 K 630
GHM1530 B 152 K 630
GHM1530 B 222 K 630
GHM1530 B 332 K 630
GHM1530 B 472 K 630
GHM1530 B 682 K 630
GHM1530 B 103 K 630
GHM1535 B 153 K 630
GHM1535 B 223 K 630
GHM1540 B 333 K 630
GHM1540 B 473 K 630
GHM1540 B 683 K 630
GHM1540 B 104 K 630
GHM1545 B 154 K 630
GHM1545 B 224 K 630
1,000
1,500
2,200
W 0
Y0.3
1.0
4,000
2.0T0.2
1.25T0.2
3,300
4,700
6,800
1.25T0.2
10,000
15,000
22,000
33,000
47,000
68,000
100,000
150,000
220,000
330,000
470,000
1,000
3,000
4,000
3,000
2,000
W 0
Y0.3
1.0
250
3.2T0.2
1.6T0.2
W 0
Y0.3
1.25
1.65T0.2
W 0
Y0.3
6
7
8
1.5
3.2T0.3
4.5T0.4
5.7T0.4
2.5T0.2
3.2T0.3
5.0T0.4
W 0
Y0.3
2.0
1,000
500
W 0
Y0.3
2.5
2.0
W 0
Y0.3
T10%
1,000
1,500
2,200
W 0
Y0.3
3.2T0.2
1.6T0.2
1.25
3,300
3,000
4,700
6,800
10,000
15,000
22,000
33,000
47,000
68,000
100,000
150,000
220,000
630
3.2T0.3
4.5T0.4
5.7T0.4
2.5T0.2
3.2T0.3
5.0T0.4
2,000
1,000
W 0
Y0.3
1.5
W 0
Y0.3
W 0
Y0.3
W 0
Y0.3
W 0
Y0.3
2.0
2.6
2.0
2.7
500
1,000
500
9
100
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No.C02E5.pdf 99.8.13
TYPICAL CHARACTERISTICS DATA
•Capacitance-Temp. Char.
GHM3000 Series
GHM1000 Series • GHM2000 Series
20
30
15
10
20
10
X7R Char. Spec. (upper)
1
2
5
Type GC (V681)
Type GB
Type GC (102V)
B
0
0
SL
R
-5
-10
-10
X7R Char. Spec. (lower)
-20
-30
-15
-20
-60 -40 -20
0
20 40 60 80 100 120 140
Temperature (D)
-60 -40 -20
0
20 40 60 80 100 120 140
Temperature (D)
•Impedance-Freq. Char.
GHM1000 Series [ SL Char.]
GHM1000 Series [ R Char.]
100k
10k
3
10k
1k
100pF
220pF
10pF
22pF
47pF
1k
100
10
100
10
1
470pF
1000pF
100pF
220pF
1
100m
10m
4
5
100m
1M
10M
100M
Frequency (Hz)
1G
3G
1G
1G
1M
10M
Frequency (Hz)
100M
1G
1G
1G
GHM1500 Series
GHM2000 Series
1k
1k
100
10
100
10
1000pF
1000pF
10000pF
100000pF
10000pF
100000pF
1
1
6
7
8
100m
10m
100m
10m
1M
1M
10M
100M
Frequency (Hz)
10M
Frequency (Hz)
100M
GHM3000 Series (Type GC)
GHM3000 Series (Type GB)
1000
1000
100
10
1
100
10
1
4.7nF
10nF
0.68nF
100m
10m
100m
9
33nF
10m
1M
10M
100M
Frequency (Hz)
1M
10M
Frequency (Hz)
100M
109
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No.C02E5.pdf 99.8.13
CAUTION
1. Operating voltage
Be sure to use a capacitor only within its rated operating
voltage range. When DC-rated capacitors are to be used
in AC or ripple voltage circuits, be sure to maintain the
Vp-p value of the applied voltage within the rated voltage
range.
1
2
2. Operating temperature and self-generated heat
Keep the surface temperature of a capacitor within the
rated operating temperature range.
Be sure to take into account the heat produced by the
capacitor itself. When a capacitor is used in a high-fre-
quency circuit, pulse voltage circuit or the like, it may
produce heat due to dielectric loss.
Keep such self-generated temperature below 20D.
3. Operating and storage environment
3
Do not use or store capacitors in a corrosive
atmosphere, especially where chloride gas, sulfide gas,
acid, alkali, salt or the like are present and avoid
exposure to moisture.
Before cleaning, bonding or molding this product, verify
that these processes do not affect product quality by
testing the performance of a cleaned, bonded or molded
product in the intended equipment.
Store the capacitors where the temperature and relative
humidity do not exceed 5 to 40D and 20 to 70%.
Use capacitors within 6 months.
4
5
4. Vibration and impact
Do not expose a capacitor to excessive shock or
vibration during use.
5. Circuit board material
Please contact our sales representatives or engineers in
case that GHM products (size 4.5Z3.2mm and over) are
to be mounted upon a metal-board or metal-frame.
Soldering heat causes the expansion and shrinkage of a
board or frame, which may result in chip-cracking.
6
7
8
6. Land layout for cropping PC Board
Choose a mounting position that minimizes the stress imposed on the
chip during flexing or bending of the board.
[Chip Mounting Close to Board Separation Point]
[Component direction]
C
Perforation
B
Locate chip horizontal to
the direction in which
stress acts.
Chip arrangement
Y
Worst A
C B~D Best
D
A
slit
9
112
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No.C02E5.pdf 99.8.13
CAUTION
7. Soldering (Prevention of the thermal shock)
If a chip component is heated or cooled abruptly during
soldering, it may crack due to the thermal shock. To
prevent this, adequate soldering condition should be
taken following our recommendation below.
1
2
Carefully perform pre-heating so that temperature difference (∆T)
between the solder and component surface should be in the following
range.
• Infrared reflow soldering conditions
(Example)
• Vapor reflow soldering (VPS)
conditions (Example)
220 to 230D
Within 10 sec.
Chip Size
3.2Z1.6mm
3.2Z2.5mm
and under
and over
Soldering method
215D
Reflow method or
200D
∆T
∆TV190D
∆TV150D
∆TV130D
Soldering iron method
∆T
Flow method or
Dip Soldering method
Pre-heating
Pre-heating
When components are immersed in solvent after mounting, pay special
60 sec. min.
Within 20 sec.
attention to maintain the temperature difference within 100D.
60 sec. min.
Within 20 sec.
Within120 sec.
Within120 sec.
3
When soldering chips with a soldering iron, it should be performed in
following conditions.
• Dip soldering/Soldering iron
conditions (Example)
• Flow soldering conditions
(Example)
Item
Conditions
V2.0Z1.25mm
300D max.
Chip size
3.2Z1.6mm
270D max.
Temperature of iron-tip
Soldering iron wattage
Diameter of iron-tip
Soldering time
230 to 240D
20W max.
φ 3.0mm max.
∆
T
∆T
3 sec. max.
Ca ution
Do not allow the iron-tip to directly touch the ceramic element.
Pre-heating
Pre-heating
4
5
60 to 120 sec. Within 20 sec.
60 to 120 sec. Within 5 sec.
8. Soldering method
GHM products whose sizes are 3.2Z1.6mm and under
for flow and reflow soldering, and other sizes for reflow
soldering.
Be sure to contact our sales representatives or
engineers in case that GHM products (size 3.2Z2.5mm
and over) are to be mounted with flow soldering. It may
crack due to the thermal shock.
6
7
8
Failure to follow the above cautions may result, worst case,
in a short circuit and fuming when the product is used.
9
113
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No.C02E5.pdf 99.8.13
NOTICE
1. MOUNTING OF CHIPS
"Mechanical shock of the chip placer
"Termination thickness of chip capacitor and desirable
thickness of adhesives applied
When the positioning claws and pick up nozzle are worn,
the load is applied to the chip while positioning is
concentrated to one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
1
2
a : 20 to 70µm
Chip Capacitor
b : 30 to 35µm
c : 50 to 105µm
a
c
b
Adhesive
Base board
Land
0.3mm min.
0.3mm min.
100 to 120µm
Adhesive
Land
3
2. CONSTRUCTION OF BOARD PATTERN
vent this, be extremely careful in determining shape and
dimension before designing the circuit board diagram.
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause
destruction resistance characteristics to lower. To pre-
"Construction and dimensions of pattern (example)
"Flow soldering
(in mm)
Chip capacitor
c
Slit
a
b
c
LZW
Solder resist
2.0Z1.25
3.2Z1.65
1.0Y1.2
2.2Y2.6
0.9Y1.0
1.0Y1.1
0.8Y1.1
1.0Y1.4
4
5
d
a
L
e
"Reflow soldering
(in mm)
W
a
b
c
d
e
LZW
Land
2.0Z1.25
3.2Z1.65
3.2Z2.55
4.5Z2.05
4.5Z3.25
5.7Z2.85
5.7Z5.05
1.0Y1.2
2.2Y2.4
2.0Y2.4
2.8Y3.4
2.8Y3.4
4.0Y4.6
4.0Y4.6
0.9Y1.0
0.8Y0.9
1.0Y1.2
1.2Y1.4
1.2Y1.4
1.4Y1.6
1.4Y1.6
0.8Y1.1
1.0Y1.4
1.8Y2.3
1.4Y1.8
2.3Y3.0
2.1Y2.6
3.5Y4.8
Y
Y
b
1.0Y2.0
1.0Y2.0
1.0Y2.8
1.0Y2.8
1.0Y4.0
1.0Y4.0
3.2Y3.7
4.1Y4.6
3.6Y4.1
4.8Y5.3
4.4Y4.9
6.6Y7.1
Preparing slit help flux cleaning
and resin coating on the back of
the capacitor.
"Land layout to prevent excessive solder
Mounting close to a chassis
Mounting with leaded components
Mounting leaded Components later
6
7
8
Soldering Iron
Lead Wire of
Component to be
Connected Later.
d1
Lead Wire Connected
to a Part Provided
with Lead Wires.
Chassis
Solder (Ground solder)
Examples of
arrangements to
be avoided
Adhesive
Base board
Land Pattern
d2
d1<d2
Solder Resist
Solder Resist
Examples of
Solder Resist
improvements
by the land divi-
sion
9
114
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No.C02E5.pdf 99.8.13
NOTICE
3. SOLDERING
(Care for minimizing loss of the terminations)
"Limit of losing effective area of the terminations and
conditions needed for soldering.
1
2
Depending on the conditions of the soldering temperature and/or
immersion (melting time), effective areas may be lost in some part of the
terminations.
Soldering Allowance Time
Solder : 6Z4 eutectic Solder
270
260
250
240
230
To prevent this, be careful in soldering so that any possible loss of the
effective area on the terminations will securely remain minimum 25% on
all edge length A-B-C-D of part with A, B, C, D, shown in the Figure below.
A
Reflow Soldering and
Soldering Iron Methods
Flow
Soldering
Dip Soldering
(Static Solder)
B
0
30
60
Time (sec.)
90
D
Termination
C
3
In case of repeated soldering, the accumulated soldering time must be
within the range shown above.
(Flux and Solder)
• Use rosin-type flux and do not use a highly acidic flux
(any containing a minimum of 0.2wt% chlorine).
• Please use 6Z4 eutectic solder, or 5Z5 solder. (Do not use
solder with silver.)
Max. Buildup
Min. Buildup
Adhesive
4
5
(Solder Buildup)
(i) Flow soldering and iron soldering
Use as little solder as possible (as shown in Fig.1), and
confirm that the solder is securely placed.
(ii)Reflow soldering
Excessive Solder
Buildup
When soldering, confirm that the solder is placed over
0.2mm of the surface of the terminations (as shown in
Fig.2).
Solder buildup by flow method and soldering iron methods.
Fig.1
4. CLEANING
• To perform ultrasonic cleaning, observe the following
conditions.
Rinse bath capacity : Output of 20 watts per liter or less.
Rinsing time : 5 minutes maximum.
Chip Capacitor
6
7
8
0.2mm min.
5. RESIN COATING
• When selecting resin materials, select those with low
contraction and low moisture absorption coefficient
(generally epoxy resin is used).
• Buffer coat can decrease the influence of the resin
shrinking (generally silicone resin).
Solder buildup by reflow method.
Fig.2
9
115
This is the PDF file of catalog No.C02E-5.
No.C02E5.pdf 99.8.13
Note:
1. Export Control
For customers outside Japan
<
>
Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive
weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons.
For customers in Japan
<
>
For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required
for export.
2. Please contact our sales representatives or product engineers before using our products listed in this catalog for the applications listed below which require
especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property, or when intending to use one of
our products for other applications than specified in this catalog.
q Aircraft equipment
w Aerospace equipment
e Undersea equipment
r Medical equipment
t Transportation equipment (vehicles, trains, ships,etc.)
y Traffic signal equipment
u Disaster prevention / crime prevention equipment
i Data-processing equipment
o Application of similar complexity and/or reliability requirements to the applications listed in the above
3. Product specifications in this catalog are as of July 1999. They are subject to change or our products in it may be discontinued without advance notice. Please
check with our sales representatives or product engineers before your ordering. If there are any questions, please contact our sales representatives or product
engineers.
4. The parts numbers and specifications listed in this catalog are for information only. You are requested to approve our product specification or to transact the
approval sheet for product specification, before your ordering.
5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect
of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained
in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under
licenses without our consent.
6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us.
http://www.murata.co.jp/products/
He a d O ffice
In te rn a tio n a l Divisio n
2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-955-6502
3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan
Phone:81-3-5469-6123 Fax:81-3-5469-6155 E-mail:intl@murata.co.jp
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MURATA
GRM40Y5V102Z100BL
CAPACITOR, CERAMIC, MULTILAYER, 100V, Y5V, 0.001uF, SURFACE MOUNT, 0805, CHIP
MURATA
GRM40Y5V103Z025AL
CAPACITOR, CERAMIC, MULTILAYER, 25V, Y5V, 0.01uF, SURFACE MOUNT, 0805, CHIP
MURATA
GRM40Y5V103Z025BB
CAPACITOR, CERAMIC, MULTILAYER, 25V, Y5V, 0.01uF, SURFACE MOUNT, 0805, CHIP
MURATA
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