LBEE5KL1DX [MURATA]
W-LANBluetooth Combo Module Data Sheet;
| 型号： | LBEE5KL1DX |
| 厂家： | 
muRata |
| 描述： | W-LANBluetooth Combo Module Data Sheet 局域网 |
| 文件： | 总40页 (文件大小：1447K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Specification Number: SP-KL1DX-U
W-LAN+Bluetooth Combo Module Data Sheet
Cypress Chipset
for 802.11b/g/n + Bluetooth® v5.1
Sample P/N : LBEE5KL1DX-TEMP
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
Preliminary Specification Number: SP-KL1DX-U
1 / 39
The revision history of the product specification
Issued
Date
Revision
Revision
Page
-
Changed Items
Change Reason
Code
Dec.1, 2014
-
First Issue
m1 and m2 of Dimensions.
VDDIO of Rating.
Dimensions
P.4
P.8
P.4
P.3
Dec.4, 2014
A
Correction
Jan.23, 2015
Feb.9, 2015
B
C
Correction
Correction
Block Diagram
VBAT voltage
DC/RF Characteristics
Terminal Configurations (16)
P.8
P.15-17
Mar.4, 2015
D
E
Correction
P.5
Characteristics (Fix values on
items described TBD)
P.15-18
Correction
Spec. fixed
Mar.26, 2015
P.17
P.20
Conditions VBAT voltage
Reference circuit
P.21-23
Tape and Reel Packing
Add note of SDIO
P7
Jun.19, 2015
Jul.21, 2015
F
P19
Add BLE spec
Conditions VBAT voltage
Specification
Range
P8
Temperature
G
Correction
P23
Add recommend parts name
Typ values
4. Dimensions, Marking and
Terminal Configurations
11. Land pattern
Aug.26 2015
Sep. 26. 2015
Feb.8.2016
H
I
P14-17
P4
Addition
Addition
P23
P22
P4
J
Add BLE Rx spec
Add marking information
Addition
Addition
Feb.29.2016
K
P5
Terminal Conditions(14)
Correction
P6
P4
6.2 Power Up Sequence
Add structure
Correction
Addition
Mar.18.2016
Nov.24.2016
L
P6
P3
Terminal Conditions(37)
Add certification information
Correction
Addition
M
P5
P33
Add Pin Layout
APPENDIX
Dec.14.2016
Feb.28.2017
N
O
Addition
Changed
IC Part Number
Added 32.768kHz X’tal in
the reference circuit.
Updated Bluetooth version
with 4.2
Mar.20.2018
P
P25
P3
13. Reference Circuit
1. Scope
May.08.2018
Q
Updated QDID
4.2. Bluetooth® Qualification
Jun.14.2018
July 11, 2018
R
S
P4
P3
5.1. Dimensions
4.1 4. Certification Information Updated (Europe)
Correction
Updated
16. PRECONDITION TO USE
OUR PRODUCTS
Appendix
P31
P38
May 16, 2019
T
Added user manual for
Japan
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
2 / 39
Issued
Date
Revision
Code
Revision
Page
Changed Items
Change Reason
1. Scope
Updated Bluetooth version
with 5.1
Dec 6, 2019
U
P3
Updated QDID
4.2. Bluetooth® Qualification
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
3 / 39
TABLE OF CONTENTS1
1. Scope...................................................................................................................................................... 4
2. Part Number ......................................................................................................................................... 4
3. Block Diagram....................................................................................................................................... 4
4. Certification Information ..................................................................................................................... 4
4.1. Radio Certification......................................................................................................................... 4
4.2. Bluetooth® Qualification................................................................................................................ 4
5. Dimensions, Marking and Terminal Configurations ......................................................................... 5
5.1. Dimensions ..................................................................................................................................... 5
5.2. Pin Layout ...................................................................................................................................... 6
5.3. Module PIN Descriptions............................................................................................................... 7
6. Rating .................................................................................................................................................. 10
7. Operating Condition........................................................................................................................... 10
7.1. Operating condition ..................................................................................................................... 10
7.2. Power Up Sequence...................................................................................................................... 10
8. Digital I/O Requirements................................................................................................................... 14
9. External LPO Specification................................................................................................................ 14
10. Interface Timing ............................................................................................................................... 15
10.1. SDIO Timing (Default Mode) .................................................................................................... 15
10.2. SDIO Timing (High Speed Mode) ............................................................................................. 16
10.3. Bluetooth UART Timing (Default Mode) ................................................................................. 16
10.4. PCM Timing Short Frame Sync, Master Mode........................................................................ 17
10.5. PCM Timing Short Frame Sync, Slave Mode .......................................................................... 18
10.6. PCM Timing Long Frame Sync, Master Mode......................................................................... 18
10.7. PCM Timing Long Frame Sync, Slave Mode ........................................................................... 19
11. DC/RF Characteristics...................................................................................................................... 20
11.1. DC/RF Characteristics for IEEE802.11b.................................................................................. 20
11.2. DC/RF Characteristics for IEEE802.11g.................................................................................. 21
11.3. DC/RF Characteristics for IEEE802.11n.................................................................................. 22
11.4. DC/RF Characteristics for Bluetooth........................................................................................ 23
11.5. DC/RF Characteristics for Bluetooth(LE) ................................................................................ 24
12. Land pattern ..................................................................................................................................... 25
13. Reference Circuit .............................................................................................................................. 26
14. Tape and Reel Packing ..................................................................................................................... 27
15. NOTICE............................................................................................................................................. 30
15.1. Storage Conditions:.................................................................................................................... 30
15.2. Handling Conditions:................................................................................................................. 30
15.3. Standard PCB Design (Land Pattern and Dimensions): ........................................................ 30
15.4. Notice for Chip Placer:............................................................................................................... 30
15.5. Soldering Conditions:................................................................................................................. 31
15.6. Cleaning:..................................................................................................................................... 31
15.7. Operational Environment Conditions: ..................................................................................... 31
15.8. Input Power Capacity:............................................................................................................... 31
16. PRECONDITION TO USE OUR PRODUCTS............................................................................... 32
Please be aware that an important notice concerning availability, standard warranty and use in
critical applications of Murata products and disclaimers thereto appears at the end of this
specification sheet.
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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1. Scope
This specification is applied to the IEEE802.11b/g/n W-LAN + Bluetooth® v5.1 (BR/EDR/BLE) module.
- Interface
- IC/Firmware
: SDIO (WLAN), UART (BT)
: Cypress/CYW4343W
- Reference Clock : Reference clock is embedded.
- MSL
: Level 3
- RoHS
: This module is compliant with the RoHS directive.
2. Part Number
Sample Part Number
EVK Part Number
LBEE5KL1DX-TEMP
LBEE5KL1DX-TEMP-D
3. Block Diagram
4. Certification Information
4.1. Radio Certification
USA/Canada
FCC ID : VPYLB1DX
IC : 772C-LB1DX
*Please follow installation manual of Appendix
Europe
EN300328 v2.1.1 conducted test report is prepared.
Japan
Japanese type certification is prepared.
01- P00840
*Please follow user manual of Appendix
4.2. Bluetooth® Qualification
QDID: 140301
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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5. Dimensions, Marking and Terminal Configurations
5.1. Dimensions
< Bottom View >
< Top View >
< Side View >
B
D
012345678
1DX
C
A
Marking
Meaning
A
B
C
D
Pin 1 Marking
Murata Logo
Module Type
Inspection Number
Dimensions
(unit : mm)
Dimensions
Mark
L
a1
b1
c2
e2
e5
e8
m3
Dimensions
6.95 +/- 0.2
0.25 +/- 0.10
0.30 +/- 0.2
0.50 +/- 0.1
0.2 +/- 0.1
1.175 +/- 0.100
0.50 +/- 0.10
0.5 +/- 0.1
Mark
W
a2
b2
c3
e3
e6
m1
m4
Dimensions
5.15 +/- 0.2
0.5 +/- 0.1
Mark
T
a3
c1
e1
e4
e7
1.1 max.
0.25 +/- 0.10
0.50 +/- 0.1
0.2 +/- 0.1
0.3 +/- 0.1
0.30 +/- 0.2
0.375 +/- 0.100
0.2 +/- 0.1
1.0 +/- 0.1
1.0 +/- 0.1
0.5 +/- 0.1
0.525 +/- 0.100
1.0 +/- 0.1
m2
Structure
Preliminary
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5.2. Pin Layout
Top View
No.
1
2
3
4
5
6
7
8
Terminal Name
No.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Terminal Name
WL_GPIO_4
BT_I2S_dO
WL_GPIO_2
WL_GPIO_1
GND
SDIO_CLK
GND
SDIO_CMD
No.
29
30
31
32
33
34
35
36
37
38
39
40
41
42~46
Terminal Name
GND
GND
BT_UART_RXD
BT_UART_TXD
BT_UART_CTS_N
BT_UART_RTS_N
BT_GPIO_3
BT_GPIO_4
BT_PCM_SYNC
BT_PCM_IN
BT_PCM_OUT
BT_PCM_CLK
GND
BT_GPIO_5
BT_REG_ON
VBAT
VIN_LDO
GND (SR_PVSS)
GND (SR_PVSS)
SR_VLX
GND
VIO
LPO_IN (32kHz)
BT_HOST_WAKE
BT_DEV_WAKE
GND
9
SDIO_DATA_2
SDIO_DATA_0
SDIO_DATA_3
SDIO_DATA_1
WL_GPIO_0_HOST_WAKE
WL_REG_ON
10
11
12
13
14
ANT
GND
Preliminary
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5.3. Module PIN Descriptions
Connection to IC
No.
(1)
(2)
Terminal Name
GND
Type
Description
Terminal
UART serial input. Serial data
input for the HCI UART interface.
UART serial output. Serial data
output for the HCI UART
interface.
UART clear-to-send. Active-low
clear-to-send signal for the HCI
UART interface.
UART request-to-send.
Active-low request-to-send
signal for the HCI UART
interface.
I
BT_UART_RXD
BT_UART_TXD
BT_UART_RXD
(3)
(4)
O
BT_UART_TXD
I
BT_UART_CTS_N
BT_UART_RTS_N
BT_UART_CTS_N
(5)
O
BT_UART_RTS_N
(6)
(7)
BT_GPIO_3
BT_GPIO_4
BT_GPIO_3
BT_GPIO_4
BT_PCM_SYNC
BT_PCM_IN
BT_PCM_OUT
BT_PCM_CLK
GND
PCM sync; can be master
(output) or slave (input)
(8)
I/O BT_PCM_SYNC
(9)
I
BT_PCM_IN
PCM data input sensing
PCM data output
(10)
(11)
(12)
(13)
O
BT_PCM_OUT
PCM clock; can be master
(output) or slave (input)
I/O BT_PCM_CLK
BT_GPIO_5
BT_GPIO_5
Used by PMU to power up or
power down the internal
regulators used by the Bluetooth
section. Also, when deasserted,
this pin holds the Bluetooth
section in reset. This pin has an
internal 200kΩ pull-down
resistor that is enabled by
default. It can be disabled
through programming.
(14)
I
BT_REG_ON
GPIO_4
BT_REG_ON
(15)
(16)
(17)
(18)
(19)
(20)
(21)
WL_GPIO_4
BT_I2S_dO
WL_GPIO_2
WL_GPIO_1
GND
GPIO_2
GPIO_1
I
SDIO clock input
SDIO_CLK
GND
Preliminary
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(22)
(23)
(24)
I/O SDIO_CMD
SDIO command line
SDIO data line 2
SDIO data line 0
SDIO_CMD
SDIO_DATA_2
SDIO_DATA_0
I/O SDIO_DATA_2
I/O SDIO_DATA_0
(25)
SDIO_DATA_3
I/O SDIO_DATA_3
SDIO data line 3
SDIO data line 1
(26)
(27)
SDIO_DATA_1
I/O SDIO_DATA_1
GPIO_0
WL_GPIO_0_HOST_
WAKE
Used by PMU to power up or
power down the internal
regulators used by the WLAN
section. Also, when deasserted,
this pin holds the WLAN section
in reset. This pin has an internal
200kΩ pull-down resistor that is
enabled by default. It can be
disabled through programming.
(28)
WL_REG_ON
I
WL_REG_ON
(29)
(30)
(31)
(32)
(33)
(34)
(35)
(36)
(37)
(38)
(39)
(40)
(41)
GND
VBAT
LDO_VDDBAT5V,
SR_VDDBAT5V
LDO_VDD1P5,
VIN_LDO
WLRF_VDD_1P35
GND (SR_PVSS)
GND (SR_PVSS)
SR_VLX
CBUCK switching regulator
output.
SR_VLX
GND
SCC_VDDIO,
SYS_VDDIO
VIO
External sleep clock input
(32.768kHz).
HOST_WAKE or
general-purpose I/O signal
DEV_WAKE or general-purpose
I/O signal
LPO_IN (32kHz)
BT_HOST_WAKE
BT_DEV_WAKE
GND
I
LPO_IN
I/O BT_HOST_WAKE
I/O BT_DEV_WAKE
ANT
(42)
～
GND
(46)
Preliminary
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SDIO Pin Description
No. Pin Name
(i) SD 4-bit Mode
(ii) SD 1-bit Mode
20
24
26
23
25
22
SDIO_CLK
SDIO_D0
SDIO_D1
SDIO_D2
SDIO_D3
SDIO_CMD
CLK
Clock
CLK
DATA
IRQ
NC
Clock
DATA0
DATA1
DATA2
DATA3
CMD
Data line 0
Data line
Interrupt
Data line 1 /Interrupt
Data line 2
Not used
Not used
Command line
Data line 3
NC
Command line
CMD
CLK
CLK
CMD
CMD
LBEE5KL1DX
LBEE5KL1DX
SD Host
SD Host
DATA
IRQ
DATA[3:0]
(i) SD 4-bit Mode
(ii) SD 1-bit Mode
Note : 10 to 100kΩ pull-ups are required on the four DATA lines and the CMD line. This requirement
must be met during all operating states by using external pull-up resisters or properly programming
internal SDIO host pull-ups.
UART connection
Host
LBEE5KL1DX
BT_UART_TXD
BT_UART_RXD
TXD
RXD
RTS
CTS
BT_UART_RTS
BT_UART_CTS
UART Connection
Preliminary
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6. Rating
min.
-40
max.
+85
5.0
unit
deg.C
V
Storage Temperature
VBAT
-0.5
-0.5
Supply Voltage
VDDIO
3.9
V
* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation
is not implied under these conditions. Exposure to absolute ratings for extended periods of time
may adversely affect reliability. No damage assuming only one parameter is set at limit at a time
with all other parameters are set within operating condition.
7. Operating Condition
7.1. Operating condition
min.
-30
typ.
+25
max.
+70
+55
4.8
unit
deg.C
deg.C
V
Operating Temperature Range
Specification Temperature Range
-10
+25
VBAT
Operating Voltage
VDDIO
3.0
3.6
1.71
3.2
1.8 or 3.3
3.6
3.63
4.2
V
VBAT
V
Specification
Voltage
VDDIO
1.71
1.8 or 3.3
3.63
V
[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range and
Specification Voltage.
7.2. Power Up Sequence
-VBAT should not rise 10%-90%faster than 40 microsecond.
-VBAT should be up before or at the same time as VIO. VIO should NOT be present fast or be held high
before VBAT is high.
Power On Sequence for WLAN ON and BT ON
Preliminary
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Power On Sequence for WLAN ON and BT Off
Power On Sequence for WLAN OFF and BT ON
Power On Sequence for WLAN OFF and BT OFF
Preliminary
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WLAN Boot up Sequence
Ramp time from 0Vto 4.3V> 40µs
0.6V
VBAT
>2 ms
VDDIO
<1.5 ms
WL_REG_ON
<3 ms
VDDC
(frominternal PMU)
After a fixed delay following internal POR going high,
the device respondsto hostF0 (address0x14) reads
<50 ms
Internal POR
15※1 ms
Device requests a reference clock
After 15※1ms the referenceclock isassumed
to be up. Access to PLL resistaersis possible.
※1 This wait time is programmable in sleep-clock increments from 1 to 255 (30us to 15ms)
Preliminary
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Startup Signaling Sequence
Host IOs unconfigured
Host IOs configured
VDDIO
T1
Host ResetX
BT_GPIO_0
(BT_DEV_WAKE)
T2
BTH IOs configured
BTH IOs unconfigured
BT_REG_ON
T3
BT_GPIO_1
(BT_HOST_WAKE)
Host sidedrivesthisline low
BTH device drives thisline low
BT_UART_CTS_N
BT_UART_RTS_N
indicatong transport isready
T4
Driven
Pulled
T1 is the time for host to settle it’s IOs after a reset.
T2 is the time for host to drive BT_REG_ON high after the Host IOs are configured.
T3 is the time for BTH(Bluetooth) device to settle its IOs after a reset and reference clock settling
time has elapsed.
T4 is the time for BTH device to drive BT_UART_RTS_N low after the host drives
BT_UART_CTS_N low. This assumes the BTH device has already completed initialization.
Timing diagram assumes VBAT is present.
Preliminary
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8. Digital I/O Requirements
SDIO Interface I/O Pins
Input low voltage (VDDIO = 3.3V)
Input high voltage (VDDIO = 3.3V)
Input low voltage (VDDIO = 1.8V))
Input high voltage (VDDIO = 1.8V)
Output low voltage (VDDIO = 3.3V)
Output high voltage (VDDIO = 3.3V)
Output low voltage (VDDIO = 1.8V)
Output high voltage (VDDIO = 1.8V)
Sym
VIL
min.
max.
unit
V
-
0.25*VDDIO
VIH
0.625*VDDIO
-
V
VIL
-
0.58
V
VIH
1.27
-
V
VOL
VOH
VOL
VOH
-
0.125*VDDIO
V
0.75*VDDIO
-
0.45
-
V
-
V
1.40
V
Other Digital I/O Pins
Sym
VIL
min.
max.
unit
V
Input low voltage (VDDIO = 3.3V)
Input high voltage (VDDIO = 3.3V)
Input low voltage (VDDIO = 1.8V))
Input high voltage (VDDIO = 1.8V)
Output low voltage (VDDIO = 3.3V)
Output high voltage (VDDIO = 3.3V)
Output low voltage (VDDIO = 1.8V)
Output high voltage (VDDIO = 1.8V)
-
0.8
VIH
2.0
-
V
VIL
-
0.35*VDDIO
V
VIH
0.65*VDDIO
-
0.40
-
V
VOL
VOH
VOL
VOH
-
V
VDDIO-0.4
-
V
0.45
-
V
VDDIO-0.45
V
9. External LPO Specification
Specification
Parameter
Condition/Notes
Minimu
Maximu
Typical
Units
m
m
Frequency
Frequency accuracy
Duty cycle
Input amplitude
Signal type
-
-
-
32.768
-
KHz
ppm
%
mV, p-p
-
kΩ
pF
ppm
-200
30
200
-
100
-
-
-
-
-
-
-
-
+200
70
3300
-
-
5
Square wave or sine wave
Resistive
Capacitive
Input impedancea
Clock jitter
-
10,000
a. When power is applied or switched off.
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10. Interface Timing
10.1. SDIO Timing (Default Mode)
fPP
tWL
tWH
CLK
Input
tTHL
tTLH
tIH
tISU
Output
tODLY
tODLY
(min)
(max)
Parameter
Symbol Min(1)
Typ(1)
Max(1) Unit
Clock CLK (All values are referred to min. VIH and max. VIL(2)
Frequency-Data Transfer Mode
Frequency-Identification Mode
Clock Low Time
Clock High Time
Clock Rise Time
fPP
0
0
10
10
-
-
-
-
-
-
-
25
400
-
-
10
10
MHz
kHz
ns
ns
ns
fOD
tWL
tWH
tTLH
tTHL
Clock Fall Time
-
ns
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
Input Hold Time
tISU
tIH
5
5
-
-
-
-
ns
ns
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
Output Delay time-Identification Mode
tODLY
tODLY
0
0
-
-
14
50
ns
ns
(1). Timing is based on CL < 40pF load on CMD and Data.
(2). Min (Vih) = 0.7*VDDIO and max (Vil) = 0.2*VDDIO.
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10.2. SDIO Timing (High Speed Mode)
fPP
tWL
tWH
50% VDD
CLK
tTHL
tTLH
tIH
tISU
Input
Output
tODLY
tOH
Symbol Min(1)
Clock CLK (All values are referred to min. VIH and max. VIL(2)
Parameter
Typ(1)
Max(1) Unit
Frequency-Data Transfer Mode
Frequency-Identification Mode
Clock Low Time
Clock High Time
Clock Rise Time
fPP
0
0
7
7
-
-
-
-
-
-
-
50
400
-
-
3
MHz
kHz
ns
ns
ns
fOD
tWL
tWH
tTLH
tTHL
Clock Fall Time
-
3
ns
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
Input Hold Time
tISU
tIH
6
2
-
-
-
-
ns
ns
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
Output Hold time
tODLY
tOH
CL
-
-
-
-
14
-
40
ns
ns
pF
2.5
-
Total System Capacitance (each line)
(1). Timing is based on CL < 40pF load on CMD and Data.
(2). Min (Vih) = 0.7*VDDIO and max (Vil) = 0.2*VDDIO.
10.3. Bluetooth UART Timing (Default Mode)
BT_UART_CTS_N
Midpoint of STOP bit
2
BT_UART_TXD
1
Midpoint of STOP bit
BT_UART_RXD
3
BT_UART_RTS_N
Reference Description
Min
Typ
Max
1.5
0.5
0.5
Unit
Delay time, UART_CTS_N low to UART_TXD valid
1
2
3
-
-
-
-
-
-
Bit periods
Bit periods
Bit periods
Setup time, UART_CTS_N high before midpoint of stop bit
Delay time, midpoint of stop bit to UART_RTS_N high
Preliminary
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Murata Manufacturing Co., Ltd.
Preliminary Specification Number: SP-KL1DX-U
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10.4. PCM Timing Short Frame Sync, Master Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
0
0
8
8
Typ
Max
12
-
Unit
MHz
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
PCM bit clock low
PCM bit clock high
PCM_SYNC delay
PCM_OUT delay
PCM_IN setup
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
25
25
-
PCM_IN hold
-
Delay from rising edge of PCM_CLK during last bit period to
PCM_OUT becoming high impedance
0
-
25
ns
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
18 / 39
10.5. PCM Timing Short Frame Sync, Slave Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
8
8
0
8
8
Typ
Max
12
-
-
-
-
25
-
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
PCM bit clock Low
PCM bit clock High
PCM_SYNC setup
PCM_SYNC hold
PCM_OUT delay
PCM_IN setup
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
PCM_IN hold
-
Delay from rising edge of PCM_CLK during last bit period to
PCM_OUT becoming high impedance
9
0
-
25
ns
10.6. PCM Timing Long Frame Sync, Master Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
0
0
8
8
Typ
Max
12
-
Unit
MHz
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
PCM bit clock low
PCM bit clock high
PCM_SYNC delay
PCM_OUT delay
PCM_IN setup
1
2
3
4
5
6
7
-
-
-
-
-
-
-
-
25
25
-
PCM_IN hold
-
Delay from rising edge of PCM_CLK during last bit period to
PCM_OUT becoming high impedance
8
0
-
25
ns
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
19 / 39
10.7. PCM Timing Long Frame Sync, Slave Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
8
8
0
8
8
Typ
Max
12
-
-
-
-
25
-
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
PCM bit clock low
PCM bit clock high
PCM_SYNC setup
PCM_SYNC hold
PCM_OUT delay
PCM_IN setup
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
PCM_IN hold
-
Delay from rising edge of PCM_CLK during last bit period to
PCM_OUT becoming high impedance
9
0
-
25
ns
Preliminary
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11. DC/RF Characteristics
11.1. DC/RF Characteristics for IEEE802.11b
Specification
Mode
IEEE802.11b
DSSS / CCK
Frequency
Data rate
2400 - 2483.5MHz
1, 2, 5.5, 11Mbps
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=17dBm, 11Mbps mode
Items
Contents
- DC Characteristics -
min.
typ.
max.
unit
DC current
1) Tx mode (1024byte, 20usec interval)
2) Rx mode
320
47
370
60
mA
mA
- Tx Characteristics -
Output Power (tolerance)
min.
15
typ.
17
max.
19
unit
dBm
Spectrum Mask
1) 1st side lobes
2) 2nd side lobes
Power-on and Power-down ramp
RF Carrier Suppression
-
-
-
15
-
-43
-54
-30
-50
2.0
-
dBr
dBr
μsec
dB
Modulation Accuracy (EVM)
Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
Minimum Input Level (FER < 8%)
Maximum Input Level (FER < 8%)
Adjacent Channel Rejection (FER < 8%)
15
35
%
-
-
-
-
-
-
-
-36
-30
-47
-47
max.
-76
-
dBm
dBm
dBm
dBm
unit
dBm
dBm
dB
-
min.
-
-10
35
typ.
-89
-
-
-
Preliminary
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11.2. DC/RF Characteristics for IEEE802.11g
Specification
Mode
IEEE802.11g
OFDM
Frequency
Data rate
2400 - 2483.5MHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=13dBm, 54Mbps mode
Items
Contents
- DC Characteristics -
min.
typ.
max.
unit
DC current
1) Tx mode (1024byte, 20usec interval)
2) Rx mode
270
47
310
60
mA
mA
- Tx Characteristics -
Output Power (tolerance)
min.
11
typ.
13
max.
15
unit
dBm
Spectrum Mask
1) 9MHz to 11MHz (0dB ~ -20dB)
2) 11MHz to 20MHz (-20dB ~ -28dB)
3) 20MHz to 30MHz (-28dB ~ -40dB)
4) 30MHz to 33MHz (-40dB)
Constellation Error (EVM)
-33
-41
-53
-53
-30
-20
-28
-40
-40
-25
dBr
dBr
dBr
dBr
dB
-
Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
Minimum Input Level (PER < 10%)
Maximum Input Level (PER < 10%)
Adjacent Channel Rejection (PER < 10%)
-
-
-
-
-
-
-
-36
-30
-47
-47
max.
-65
-
dBm
dBm
dBm
dBm
unit
dBm
dBm
dB
-
min.
-
-20
-1
typ.
-75
-
-
-
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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11.3. DC/RF Characteristics for IEEE802.11n
Specification
Mode
IEEE802.11n
OFDM
Frequency
Data rate
2400 - 2483.5MHz
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=12dBm, 65Mbps mode
Items
Contents
- DC Characteristics -
min.
typ.
max.
unit
DC current
1) Tx mode (1024byte, 20usec interval)
2) Rx mode
260
47
300
60
mA
mA
- Tx Characteristics -
Output Power (tolerance)
Spectrum Mask
min.
10
typ.
12
max.
14
unit
dBm
1) 9MHz to 11MHz (0dB ~ -20dB)
2) 11MHz to 20MHz (-20dB ~ -28dB)
3) 20MHz to 30MHz (-28dB ~ -45dB)
4) 30MHz to 33MHz (-45dB)
Constellation Error (EVM)
Outband Spurious Emissions
1) 30MHz to 1GHz
-33
-41
-53
-53
-31
-20
-28
-45
-45
-27
dBr
dBr
dBr
dBr
dB
-
-
-
-
-
-
-
-
-36
-30
-47
-47
max.
-64
-
dBm
dBm
dBm
dBm
unit
dBm
dBm
dB
2) 1GHz to 12.75GHz
3) 1.8GHz to 1.9GHz
4) 5.15GHz to 5.3GHz
-
- Rx Characteristics -
min.
-
-20
-2
typ.
-73
-
Minimum Input Level (PER<10%)
Maximum Input Level (PER < 10%)
Adjacent Channel Rejection (PER < 10%)
-
-
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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11.4. DC/RF Characteristics for Bluetooth
Normal conditions : 25deg.C, VBAT = 3.6V, VDDIO = 3.3V
Items
Contents
Bluetooth specification (power class)
Channel frequency (spacing)
Version 2.1 + EDR (Class1)
2402 to 2480 MHz (1MHz)
Current Consumption
(a) Tx=Rx=DH5 (fully occupied)
(b) Tx=Rx=2DH5 (fully occupied)
(c) Tx=Rx=3DH5 (fully occupied)
Transmitter
Output Power
Frequency range
20dB bandwidth
Adjacent Channel Power *1
(a) [M-N] =2
min.
-
-
-
min.
6
2400
-
typ.
28
25
25
typ.
10
-
max.
60
50
50
max.
14
unit
mA
mA
mA
unit
dBm
MHz
MHz
2483.5
1
-
-
-
-
-
-20
-40
dBm
dBm
(b) [M-N] ≥3
Modulation characteristics
(a) Modulation Δf1avg
(b) Modulation Δf2max
(c) Modulation Δf2avg / Δf1avg
Carrier Frequency Drift
(a) 1slot
(b) 3slot / 5slot
(c) Maximum drift rate
EDR Relative Power
140
115
0.8
-
-
-
175
-
-
kHz
kHz
-25
-40
-
-
-
-
-
+25
+40
20
kHz
kHz
kHz/50us
-4
+1
dB
EDR Carrier Frequency Stability and Modulation Accuracy
(a) ωi
(b) ωi+ωo
(c) ωo
-75
-75
-10
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
+75
+75
+10
20
35
30
13
25
20
kHz
kHz
kHz
%
%
%
%
%
%
(d) RMS DEVM (DQPSK)
(e) Peak DEVM (DQPSK)
(f) 99% DEVM (DQPSK)
(g) RMS DEVM (8DPSK)
(h) Peak DEVM (8DPSK)
(i) 99% DEVM (8DPSK)
Out-of-Band Spurious Emissions
(a) 30-1000MHz
(b) 1000-12750MHz
(c) 1800-1900MHz
(d) 5150-5300MHz
Receiver
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-80
dBm
dBm
dBm
dBm
unit
-
Min.
-
-
Typ.
-91
Sensitivity (BER<0.1%)
C/I Performance (BER<0.1%) *2
(a) co-channel
dBm
-
-
-
-
-
-
-
-
-
-
-
-
11
0
-30
-40
-9
dB
dB
dB
dB
dB
(b) 1MHz
(c) 2MHz
(d) 3MHz
(e) image (+4MHz)
(f) image +/- 1MHz
Maximum Input Level (PER<0.1%)
EDR Sensitivity (PER<0.007%)
(a) 8DPSK
-
-20
-
dB
dBm
-20
-
-88
-77
dBm
*1: Up to three spurious responses within Bluetooth limits are allowed.
*2: Up to five spurious responses within Bluetooth limits are allowed.
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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11.5. DC/RF Characteristics for Bluetooth(LE)
Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V
Items
Contents
Version 5.1(LE)
2402 to 2480 MHz (2MHz)
40
Bluetooth specification (power class)
Channel frequency (spacing)
Number of RF Channel
Item / Condition
Min.
Typ.
Max.
Unit
MHz
MHz
-
Center Frequency
Channel Spacing
Number of RF channel
Output power
2402
-
2
40
-
2480
-
-
-
-
-
10
dBm
Modulation Characteristics
1) Δf1avg
2) Δf2max (at 99.9%)
225
185
0.8
-
-
-
275
-
-
kHz
kHz
-
3) Δf2avg / Δf1avg
Carrier frequency offset and drift
1) Frequency offset
2) Frequency drift
-
-
-
-
-
150
50
20
-70
-
65.4
kHz
kHz
kHz
dBm
dBm
%
3) Drift rate
-
-95
-
Receiver sensitivity (PER < 30.8%)
Maximum input signal level (PER < 30.8%)
PER Report Integrity (-30dBm input)
-
-10
50
-
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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12. Land pattern
Top View. Unit : mm
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
26 / 39
13. Reference Circuit
A
B
C
D
E
F
G
H
VIO
1
2
3
4
5
1
2
3
4
5
Antenna
*1) LQM18PN2R2MGH recommended
Antenna matching
2.2uF
BT_DEV_WAKE
BT_HOST_WAKE
VIO
32.768 kHz
GND(SR_PVSS) have to be isolated from typical GND
2.2uH
*1)
4.7uF
VBAT
4.7uF
32
1
2
GND1
GND(SR_PVSS)
31
30
29
28
27
26
25
24
23
22
BT_UART_RXD
BT_UART_RXD
BT_UART_TXD
BT_UART_CTS
BT_UART_RTS
BT_GPIO_3
VIN_LDO
VBAT
3
BT_UART_TXD
BT_UART_CTS
BT_UART_RXD
BT_GPIO_3
4
GND29
TYPE1DX
5
WL_REG_ON
WL_HOST_WAKE
SDIO_DATA_1
SDIO_DATA_3
SDIO_DATA_0
SDIO_DATA_2
SDIO_CMD
WL_REG_ON
6
WL_HOST_WAKE
7
BT_GPIO_4
BT_GPIO_4
SDIO_DATA_1
SDIO_DATA_3
SDIO_DATA_0
SDIO_DATA_2
SDIO_CMD
8
BT_PCM_SYNC
BT_PCMIN
BT_PCM_SYNC
BT_PCM_IN
BT_PCM_OUT
BT_PCM_CLK
9
10
11
BT_PCM_OUT
BT_PCM_CLK
A
B
C
D
E
F
G
H
Preliminary
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14. Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
2.0±0.1
1.5+0.1/-0.0
0.3±0.05
4.0±0.1
1.5±0.1
5.55±0.1
feeding direction
8.0±0.1
1.8 max.
(1.7±0.1)
1) The corner and ridge radiuses (R) of inside cavity are 0.3mm max.
2) Cumulative tolerance of 10 pitches of the sprocket hole is +/-0.2mm
3) Measuring of cavity positioning is based on cavity center in accordance with JIS/IES standard.
(2) Dimensions of Reel
17.5
2±0.5
Φ 13±2
22.5 max.
(unit : mm)
Preliminary
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(3) Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape
[4] Base tape
: 62μm in thickness
: As specified in (1)
[3]
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Pin 1 Marking
Chip
(4) Leader and Tail tape
Feeding direction
Tail tape
(No components)
No components
150mm min.
Leader tape
(Cover tape alone)
Components
40 to 200mm
250mm min.
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit : 1000pcs./ reel
(9) material : Base tape : Plastic
Real
: Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
(10) Peeling of force : 1.1N max. in the direction of peeling as shown below.
1.1 N max.
165 to 180 °
Cover tape
Base tape
(11) Packaging (Humidity proof Packing)
Label
Desiccant
Humidity
Indicator
Label
Anti-humidity
Plastic Bag
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
Preliminary
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15. NOTICE
15.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, NOx, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
15.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
15.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
15.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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15.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set
up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other
soldering conditions.
Reflow soldering standard conditions (Example)
Within 10s
250 deg.C
Tpeak-5deg.C
220 deg.C
Cooling down
Slowly
180 deg.C
150 deg.C
Pre-heating
Within 120s
time(s)
Within 60s
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
15.6. Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is
done the customer is responsible for any issues or failures caused by the cleaning process.
15.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas (Cl2, NH3, SOx, NOx, etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
15.8. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Preliminary
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16. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications
of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products,
which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and
blob) we may provide or to be embedded into our product (“Software”) provided that you use the Software bundled with
our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU “AS- IS” BASIS, MURATA MAKES
NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT
INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND
WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY
AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR
THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
You shall indemnify and hold harmless us, our affiliates and our licensor from and against any and all claims,
costs, expenses and liabilities (including attorney’s fees), which arise in connection with the using the
Software.
The product shall not be used in any application listed below which requires especially high reliability for the prevention of
such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if
you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the
regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services are used. Information provided by us regarding third-party products or services does not constitute a
license from us to use such products or services or a warranty or endorsement thereof. Use of such information may
require a license from a third party under the patents or other intellectual property of the third party, or a license from us
under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
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Murata Manufacturing Co., Ltd.
Preliminary Specification Number: SP-KL1DX-U
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APPENDIX
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1DX Installation Manual (FCC)
FCC ID of this product is as follows.
FCC ID:VPYLB1DX
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC on the product and in
the Installation manual Notice.
Contents
1. Antenna
2. Notice
1. Antenna
■Please perform the antenna design that followed the specifications of the antenna.
The concrete contents of a check are the following three points.
１）It is the same type as the antenna type of antenna specifications.
Confirm the same size as the Gerber file.
２）An antenna gain is lower than a gain given in antenna specifications.
Measure the gain, and confirm the peak gain is less than the application value (1.4dBi)
３）The emission level is not getting worse.
Measure the spurious, and confirm degradation of less than 3dB than spurious value of worst of
report used for the application. However it is spurious defined below.
Please send those reports to Murata.
2. Notice
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in
the Installation manual Notice.
Please describe the following warning on the final product which contains this module.
Contains Transmitter Module FCC ID:VPYLB1DX
or
Contains FCC ID:VPYLB1DX
●Please describe the following warning to the manual.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
FCC CAUTION
Changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter.
※When the product is small, as for these words mentioned above, the posting to a manual is possible.
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●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment
and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
RF Exposure requirements are met when installed in mobile equipment.
This module cannot be installed in portable equipment without further testing and a change to FCC's
grant of authorization.
Contact Murata regarding portable applications.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used
within 20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2)The transmitter module may not be co-located with any other transmitter or antenna.
3)The use of an antenna with gain less than 1.4 dBi.
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer
considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM
integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled in
a visible area with the following: “Contains FCC ID:XXXXXXXXXX”. The grantee's FCC ID can be used
only when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
Preliminary
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Preliminary Specification Number: SP-KL1DX-U
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1DX Installation Manual (IC)
IC No. of this product is as follows.
IC : 772C-LB1DX
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by IC on the product and in the
Installation manual Notice.
Contents
1. Antenna
2. Notice
1. Antenna
■Please perform the antenna design that followed the specifications of the antenna.
The concrete contents of a check are the following three points.
1) It is the same type as the antenna type of antenna specifications.
Confirm the same size as the Gerber file.
2) An antenna gain is lower than a gain given in antenna specifications.
Measure the gain, and confirm the peak gain is less than the application value (1.4dBi)
3) The emission level is not getting worse.
Measure the spurious, and confirm degradation of less than 3dB than spurious value of worst of report
used for the application. However it is spurious defined below.
Please send those reports to Murata.
2. Notice
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in
the Installation manual Notice.
Please describe the following warning on the final product which contains this module.
Contains IC:772C-LB1DX
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts
de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage;
2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
※When the product is small, as for these words mentioned above, the posting to a manual is possible
Preliminary
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●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment and
meets RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un
environnement non contrôlé et respecte les règles d’exposition aux fréquences radioélectriques (RF)
CNR-102 de l’IC. Cet équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus
entre le radiateur et le corps humain.
RF Exposure requirements are met when installed in mobile equipment.
This module cannot be installed in portable equipment without further testing and a change to FCC's
grant of authorization.
Contact Murata regarding portable applications.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used
within 20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
This device is intended only for OEM integrators under the following conditions: (For module
device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
3)The use of an antenna with gain less than 1.4 dBi.
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
(Pour utilisation de dispositif module)
1)L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et
les utilisateurs, et
2)Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 3 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront
pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final
pour toutes exigences de conformité supplémentaires requis pour ce module installé.
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IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the Canada authorization is no longer considered valid and the IC ID
cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada
n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et
l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users. The final end product must be labeled in
a visible area with the following: “Contains IC: ”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut
être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les
utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient
des IC:
".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la
façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre
ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et
avertissements comme indiqué dans ce manuel.
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1DX User Manual for Japan
■Regarding Japan Radio Certification of 1DX
R 001-P00840
This module is the product that has been authorized “Japan Radio Certification” (Certification of
Construction Type) based on type approval system.
Also it is recommended to describe the following contents in the end product that is built in this module or
the user manual.
[This product has built-in specified radio equipment which authorized “Japan Radio Certification”
(certification number: 001-P00840) based on type approval system.]
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
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