LLL216R71E223MA01K_技术文档

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note

C02E10.pdf 04.1.20

Chip Monolithic

Ceramic Capacitors

Mu ra ta

Ma nu fa cturin g Co., Ltd .

Cat.No.C02E-10

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.

!Note

C02E10.pdf 04.1.20

CONTENTS

Part Numbering

Selection Guide

2

6

1

2

3

4

for Flow/ Reflow Soldering GRM15/ 18/ 21/ 31 Series

for Reflow Soldering GRM32/ 43/ 55 Series

Ultra-small GRM03 Series

7

15

18

Thin Type (Flow/ Reflow)

20

GRM Series Specifications and Test Methods

22

5

6

Thin Layer Large-capacitance Type

Low-dissipation Type

27

32

GRM Series Data

37

7

8

Microchips

39

Capacitor Arrays

42

9

for Ultrasonic Sensors

Low ESL

48

10

11

12

13

51

High Frequency for Flow/ Reflow Soldering

High-Q & High Power Type

High Frequency Type

56

61

69

ERF/ERH/ERA/ERD Series Data

Package

79

81

! Caution

85

Notice

91

Reference Data

97

14

15

16

17

18

19

20

Medium-voltage Low Dissipation Factor

104

109

113

117

121

122

123

Medium-voltage High-Capacitance for General-Use

Only for Information Devices/ Tip & Ring

AC250V(r.m.s.) Type

Safety Standard Recognized Type GC (UL, IEC60384-14 Class X1/ Y2)

Safety Standard Recognized Type GD (IEC60384-14 Class Y3)

Safety Standard Recognized Type GF (IEC60384-14 Class Y2)

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.

!Note

C02E10.pdf 04.1.20

1

2

21

Safety Standard Recognized Type GB (IEC60384-14 Class X2)

124

125

129

132

135

141

145

3

GA3 Series Specifications and Test Methods

GRM/GR4/GA2/GA3 Series Data

Package

4

5

! Caution

Notice

6

ISO 9000 Certifications

7

Please refer to "Specifications and Test Methods" at the end of each chapter of

5

– .

17

8

9

10

11

12

13

14

15

16

17

18

19

20

21

Recycled Paper

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

o Part Numbering

Chip Monolithic Ceramic Capacitors

(Part Number)

GR

M

18

8

B1 1H 102

K

A01

K

q

w

e

r

t

y

u

i

o

!

qProduct ID

wSeries

rDimension (T)

Code

2

Dimension (T)

Product ID

Code

M

Series

2-elements (Array Type)

Tin Plated Layer

3

0.3 mm

GR

4

Only for Information Devices / Tip & Ring

4

4-elements (Array Type)

5

0.5 mm

High Frequency and

high Power Type

F

6

0.6 mm

7

0.7 mm

High Frequency and High Power Type

H

A

D

(Ribbon Terminal)

ER

8

0.8 mm

High Frequency Type

9

0.85 mm

A

B

C

D

E

F

1.0 mm

High Frequency Type

(Ribbon Terminal)

1.25 mm

1.6 mm

High Frequency for

Flow/Reflow Soldering

GQ

M

2.0 mm

GM

GN

LL

A

M

L

Monolithic Microchip

Capacitor Array

2.5 mm

3.2 mm

Low ESL Wide Width Type

M

N

R

S

Q

X

1.15 mm

1.35 mm

High Frequency Low Loss Type

Tin Plated Type

M

GJ

1.8 mm

2.8 mm

6

2

High Frequency Low Loss Type

for AC250V (r.m.s.)

1.5 mm

GA

GC

Depends on individual standards.

3

Safety Standard Recognized Type

Automotive Soldering Electrode

Automotive Tin Plated Layer

P

M

With the array type GNM series, "Dimension(T)" indicates the number of

elements.

eDimension (LgW)

Code

03

05

08

11

15

18

1D

1X

21

22

31

32

3X

42

43

52

55

Dimension (LgW)

0.6g0.3 mm

0.5g0.5 mm

0.8g0.8 mm

1.25g1.0 mm

1.0g0.5 mm

1.6g0.8 mm

1.4g1.4 mm

EIA

0201

0202

0303

0504

0402

0603

Depends on individual standards.

2.0g1.25 mm

2.8g2.8 mm

3.2g1.6 mm

3.2g2.5 mm

0805

1111

1206

1210

Depends on individual standards.

4.5g2.0 mm

4.5g3.2 mm

5.7g2.8 mm

5.7g5.0 mm

1808

1812

2211

2220

Continued on the following page.

2

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

tTemperature Characteristics

Temperature

Range

Capacitance Change or

Temperature Coefficient

Operating

Temperature Range

Code

Characteristics

1X

2C

2P

2R

2S

2T

3C

3P

3R

3S

3T

3U

4C

5C

6C

6P

6R

6S

6T

7C

7U

8C

B1

B3

E4

F1

F5

R1

R3

R6

R7

C8

SL

CH

20 to 85°C

-55 to 125°C

-25 to 85°C

-55 to 125°C

-25 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-25 to 85°C

10 to 85°C

+350 to -1000ppm/°C

0±60ppm/°C

-150±60ppm/°C

-220±60ppm/°C

-330±60ppm/°C

-470±60ppm/°C

0±120ppm/°C

-150±120ppm/°C

-220±120ppm/°C

-330±120ppm/°C

-470±120ppm/°C

-750±120ppm/°C

0±250ppm/°C

0±30ppm/°C

0±60ppm/°C

-150±60ppm/°C

-220±60ppm/°C

-330±60ppm/°C

-470±60ppm/°C

0±120ppm/°C

-750±120ppm/°C

0±250ppm/°C

±10%

-55 to 125°C

-25 to 85°C

-55 to 125°C

-25 to 85°C

-55 to 125°C

-25 to 85°C

10 to 85°C

PH

RH

SH

TH

CJ

PJ

RJ

SJ

TJ

UJ

CK

C0G

C0H/CH *1

P2H

R2H

S2H

T2H

CJ *1

U2J

CK *1

B *2

B

±10%

Z5U

F *2

Y5V

R *2

R

+22, -56%

-25 to 85°C

-30 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-55 to 105°C

-25 to 20°C

20 to 85°C

+30, -80%

-25 to 85°C

-30 to 85°C

-55 to 125°C

-55 to 85°C

-55 to 125°C

-55 to 105°C

+22, -82%

±15%

X5R

X7R

X6S

±15%

±22%

-4700+100/-2500ppm/°C

-4700+500/-1000ppm/°C

9E

ZLM

-25 to 85°C

*1 ER series only.

*2 Add 50% of the rated voltage.

Continued on the following page.

3

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

yRated Voltage

uCapacitance

Expressed by three figures. The unit is pico-farad (pF). The first

and second figures are significant digits, and the third figure

expresses the number of zeros which follow the two numbers.

If there is a decimal point, it is expressed by the capital letter "R".

In this case, all figures are significant digits.

Code

0G

0J

Rated Voltage

DC4V

DC6.3V

1A

1C

1E

DC10V

Ex.)

DC16V

Code

R50

1R0

100

Capacitance

0.5pF

DC25V

1H

2A

2D

2E

DC50V

1.0pF

DC100V

10pF

DC200V

103

10000pF

DC250V

YD

2H

2J

DC300V

DC500V

DC630V

3A

3D

3F

DC1kV

DC2kV

DC3.15kV

E2

AC250V

GB

GC

GD

GF

X2; AC250V (Safety Standard Recognized Type GB)

X1, Y2; AC250V (Safety Standard Recognized Type GC)

Y3; AC250V (Safety Standard Recognized Type GD)

Y2; AC250V (Safety Standard Recognized Type GF)

iCapacitance Tolerance

Code

Capacitance Tolerance

TC

C∆

Series

GJM

Capacitance Step

B

±0.1pF

V5pF

E24 Series,1pF

* 1pF

C∆–SL

C∆

GRM/ERF/ERH/ERA/ERD/GQM

C

D

G

J

±0.25pF

GJM

<10pF

E24 Series,1pF

* 1pF

C∆–SL

C∆

GRM

6.0 to 9.0pF

5.1 to 9.1pF

U10pF

±0.5pF

±2%

ERF/ERH/ERA/ERD/GQM/GJM

E24 Series

E12 Series

E24 Series

E12 Series

E24 Series

C∆

GJM

C∆

GQM

U10pF

C∆–SL

C∆

GRM/GA3

U10pF

±5%

ERF/ERH/ERA/ERD/GQM/GJM

U10pF

GRM/GA3

GR4

E6 Series

K

±10%

B,R,X7R,X5R,ZLM

E12 Series

E3 Series

E6 Series

E3 Series

Z5U

B,R,X7R

X7R

GRM

M

±20%

GMA/LLL

GA2

Z

+80% , -20%

F,Y5V

GRM

R

Depends on individual standards.

E24 series is also available.

*

oIndividual Specification Code

Temperature

Undercoat

Code

Series

Individual Specification

Characteristics Inner Electrode Metal of Outer

Type *4

Electrode

GRM *1

TC

A01

Standard Type

Base Metal

GRM *1/LLL/GNM

HiK

Special Dimension Type

A11

GRM *1

HiK

Base Metal

(Tolerances of LgWgT are ±0.15mm)

Special Characteristics

A12

GRM *1

(Applied Voltage is g1.25 of Rated Voltage

at High Temperature Load Test)

HiK

Base Metal

A35/A39

Special Dimension Type

Continued on the following page.

4

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Temperature

Undercoat

Code

Series

Individual Specification

Characteristics Inner Electrode Metal of Outer

Type *4

Electrode

A61/A88/A92/A93

GRM *1

GJM/GQM

GRM *1

Special Characteristics (Under special control)

Standard Type

HiK

Base Metal

B01

C01

TC

Base Metal (Cu) Base Metal

Base Metal Precious Metal

Standard Type

HiK

Special Dimension Type

C11

C12

GRM *1

HiK

Base Metal Precious Metal

(Tolerances of LgW are ±0.2mm, others)

Special Dimension Type (Length is 3.2±0.2,

Width is 1.6±0.2mm, Thickness is 1.2 ±0.1mm)

ERA/ERD/ERF/ERH

GRM *1/GNM

GRM *1/GMA/LLL/GNM

ERH

TC

Standard Type

D01

Precious Metal Precious Metal

(Non-coated type for ERH series)

HiK

TC

D02

DB4

E01

Standard Type (Coated with Resin)

Special Dimension Type (Thickness is 0.25±0.05mm)

Standard Type (Thin Layer Large Capacitance Type)

Special Characteristics (Under Special Control)

Special Dimension Type

Precious Metal Precious Metal

GJM

TC

GRM *1

HiK

TC

Base Metal

E19

/

E34

GRM *1

E20

E39

V01

GRM *1

Special Dimension Type

GRM *2

Standard Type (New Ceramic Material)

Precious Metal Precious Metal

GRM *3/GR4/GA2/GA3

GRM *3

HiK

TC

W01

Tolerance of Thickness is +0/-0.3mm

Base Metal

W02

W03

W07

GA3

Tolerance of Thickness is ±0.2mm

Tolerance of Thickness is ±0.1mm

HiK

TC

Base Metal

GRM *3

Y01

Y02

Tolerance of Thickness is +0/-0.3mm

Precious Metal Precious Metal

GRM *3

HiK

TC

GA3

Tolerance of Thickness is ±0.3mm

GRM *3/GA3

GA3

Y06

Y21

Z01

Thickness is 2.7±0.3mm

Standard Type

HiK

TC

Precious Metal Precious Metal

GRM *2

GRM *1

Standard Type (New Ceramic Material)

TC

1 Apply to rated voltage 100V and under.

*

2 Apply to rated voltage 200/500V.

*

3 Apply to rated voltage 250V, 630V to 3.15kV.

*

4 "TC" means Temperature Compensating Type and "HiK" means High Dielectric Type.

*

!Packaging

Code

L

Packaging

ø178mm Plastic Taping

ø178mm Paper Taping

ø330mm Plastic Taping

ø330mm Paper Taping

ø178mm Special Packaging

ø330mm Special Packaging

Bulk

D

K

J

E

F

B

C

Bulk Case

T

Bulk Tray

5

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Selection Guide of Chip Monolithic Ceramic Capacitors

Start

Application

General Electronics

Specific Applications

Function and Circuit

Filtering

Bypassing

Coupling

High Frequency

Ultra Thin Circuit

Medium Voltage

Synchronize Circuit

Oscillation Circuit

De-coupling

Time Constant Circuits

High-frequency/

High-power type

Soldering Electrode

Thin type Soldering

Electrode

630V/1kV/2kV/3.15kV

Low-dissipation

Soldering Electrodes

Y5V Char.

Soldering Electrode

X5R/X7R Char.

GRM15X Series

GRM Series

Soldering Electrode

C0G Char.

ERF Series

0.5pF–4700pF

10pF–1000pF

GRM_F5 Series

GRM_R6,R7 Series

0.75pF–1000pF

2200pF–22µF

220pF–10µF

GRM_5C Series

250V/630V/1kV

High-capacitance

Low Dissipation

0.5pF–47000pF

High-frequency/

High-Power

Ribbon Terminal type

Microchip Y5V Char.

GMA_F5 Series

4700pF–0.1µF

Soldering Electrode

C0G/C0H Char.

GJM Series

GRM Series

Capacitor Arrays

C0G Char.

0.5pF–18pF

220pF–1µF

GRM_6C Series

ERH Series

0.5pF–47000pF

GNM_5C Series

0.75pF–1000pF

Ultrasonic Sensors

2kV

Capacitor Arrays

Y5V Char.

10pF–360pF

Only for Information

Devices/Tip & Ring

Thin Layer

Large-capacitance Type

X5R Char.

ZLM Char.

High-frequency type

ERA Series

GNM_F5 Series

GRM2199E Series

1000pF/1500pF

Temperature

Compensation

GR4 Series

22000pF–0.15µF

0.75pF–1000pF

100pF–4700pF

GRM_R6 Series

47000pF–100µF

Low-ESL Y5V Char.

LLL31_F5 Series

0.22µF–1.0µF

Soldering Electrode

for temperature

compensation

High-frequency

Ribbon Terminal type

Safety Standard

Recognized

Microchip

ERD Series

GMA_R7 Series

470pF–10000pF

GRM_ Series

AC250V which meet

Japanese Law

0.75pF–1000pF

0.5pF–47000pF

GA2 Series

High-frequency

for flow/reflow

soldering

Capacitor Arrays

GNM Series

390pF–1.0µF

Capacitor Arrays

for temperature

compensation

470pF–0.1µF

GQM Series

UL/IEC

Safety Standard

Recognized

GNM_5C Series

0.5pF–100pF

Low-ESL

10pF–360pF

LLL Series

2200pF–1.0µF

GA3 Series

10pF–33000pF

Automotive ( Power-train, Safety equipment )

GCMSeries*

0.5pF–2.2µF

Information

Automotive PC

Entertainment equipment

Power-train equipment

Safety equipment

Comfort equipment

Security equipment

For other automotive equipment such as comfort, security, information,

entertainment, GRM series (for general electronics) are available.

*

6

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

1

Chip Monolithic Ceramic Capacitors

for Flow/Reflow Soldering GRM15/18/21/31 Series

e

g

e

■ Features

1. Terminations are made of metal highly resistant to

migration.

2. The GRM series is a complete line of chip ceramic

capacitors in 6.3V, 10V, 16V, 25V, 50V, 100V, 200V

L

W

and 500V ratings. These capacitors have

Dimensions (mm)

T

1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.15 to 0.3

Part Number

temperature characteristics ranging from C0G to

Y5V.

L

W

e

g min.

0.4

0.5

GRM155

GRM188*

GRM216

GRM219

GRM21A

GRM21B

GRM316

GRM319

GRM31M

GRM31C

1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5

3. A wide selection of sizes is available, from the

miniature LxWxT: 1.0x0.5x0.5mm to

LxWxT: 3.2x1.6x1.15mm.

0.6 ±0.1

0.85 ±0.1

2.0 ±0.1 1.25 ±0.1

0.2 to 0.7

0.3 to 0.8

0.7

1.5

1.0 +0/-0.2

1.25 ±0.1

0.6 ±0.1

GRM18, 21 and GRM31 types are suited to flow and

reflow soldering.

3.2 ±0.15 1.6 ±0.15 0.85 ±0.1

1.15 ±0.1

GRM15 type is applied to only reflow soldering.

4. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip placement on

PCBs.

3.2 ±0.2 1.6 ±0.2 1.6 ±0.2

Bulk Case : 1.6 ±0.07(L)g0.8 ±0.07(W)g0.8 ±0.07(T)

*

5. The GRM series is available in paper or plastic

embossed tape and reel packaging for automatic

placement. Bulk case packaging is also available

for GRM15, GRM18 and GRM21.

■ Applications

General electronic equipment

Temperature Compensating Type GRM15 Series (1.0x0.5 mm) 50V/25V

Part Number

L x W [EIA]

GRM15

1.00x0.50 [0402]

C0G

(5C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

50

(1H)

50

(1H)

50

(1H)

50

(1H)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF(R50)

0.75pF(R75)

1.0pF(1R0)

2.0pF(2R0)

3.0pF(3R0)

4.0pF(4R0)

5.0pF(5R0)

6.0pF(6R0)

7.0pF(7R0)

8.0pF(8R0)

9.0pF(9R0)

10pF(100)

12pF(120)

15pF(150)

18pF(180)

22pF(220)

27pF(270)

33pF(330)

0.50(5)

Continued on the following page.

7

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W [EIA]

GRM15

1

1.00x0.50 [0402]

C0G

(5C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

50

(1H)

50

(1H)

50

(1H)

50

(1H)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

39pF(390)

47pF(470)

0.50(5)

56pF(560)

68pF(680)

82pF(820)

100pF(101)

120pF(121)

150pF(151)

180pF(181)

220pF(221)

270pF(271)

330pF(331)

390pF(391)

470pF(471)

560pF(561)

680pF(681)

820pF(821)

1000pF(102)

0.50(5)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Temperature Compensating Type GRM18 Series (1.60x0.80 mm) 200V/100V/50V/25V

Part Number

L x W [EIA]

GRM18

1.60x0.80 [0603]

C0G

(5C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

200

(2D)

100

(2A)

50

(1H)

50

(1H)

50

(1H)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF(R50) 0.80(8)

0.75pF(R75) 0.80(8)

1.0pF(1R0) 0.80(8)

2.0pF(2R0) 0.80(8)

3.0pF(3R0) 0.80(8)

4.0pF(4R0) 0.80(8)

5.0pF(5R0) 0.80(8)

6.0pF(6R0) 0.80(8)

7.0pF(7R0) 0.80(8)

8.0pF(8R0) 0.80(8)

9.0pF(9R0) 0.80(8)

10pF(100) 0.80(8)

12pF(120)

0.80(8)

15pF(150)

18pF(180)

22pF(220)

27pF(270)

33pF(330)

39pF(390)

47pF(470)

56pF(560)

Continued on the following page.

8

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W [EIA]

GRM18

1

1.60x0.80 [0603]

C0G

(5C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

200

(2D)

100

(2A)

50

(1H)

50

(1H)

50

(1H)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

68pF(680)

82pF(820)

0.80(8)

100pF(101)

120pF(121)

150pF(151)

180pF(181)

220pF(221)

270pF(271)

330pF(331)

390pF(391)

470pF(471)

560pF(561)

680pF(681)

820pF(821)

1000pF(102)

1200pF(122)

1500pF(152)

1800pF(182)

2200pF(222)

2700pF(272)

0.80(8)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Temperature Compensating Type GRM21 Series (2.00x1.25 mm) 200V/100V/50V/25V

Part Number

L x W [EIA]

GRM21

2.00x1.25 [0805]

C0G

(5C)

C0H

(6C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

12pF(120) 0.85(9)

15pF(150) 0.85(9)

18pF(180) 0.85(9)

22pF(220) 0.85(9)

27pF(270) 0.85(9)

33pF(330) 0.85(9)

39pF(390) 0.85(9)

47pF(470) 0.85(9)

56pF(560) 0.85(9)

68pF(680) 1.25(B) 0.85(9)

82pF(820) 1.25(B) 0.85(9)

100pF(101) 1.25(B) 0.60(6)

120pF(121) 1.25(B) 0.60(6)

150pF(151) 1.25(B) 0.60(6)

180pF(181) 1.25(B) 0.60(6)

220pF(221) 1.25(B) 0.60(6)

0.85(9)

1.25(B)

0.85(9)

1.25(B)

0.85(9)

1.25(B)

270pF(271)

330pF(331)

390pF(391)

0.60(6)

0.85(9) 1.25(B)

1.25(B) 0.85(9)

Continued on the following page.

9

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W [EIA]

GRM21

1

2.00x1.25 [0805]

C0G

(5C)

C0H

(6C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

470pF(471)

560pF(561)

0.60(6)

0.85(9)

1.25(B) 0.85(9)

0.85(9) 1.25(B) 0.85(9)

1.25(B) 1.25(B) 1.25(B)

1.25(B) 1.25(B)

1.25(B)

0.85(9)

1.25(B)

680pF(681)

820pF(821)

1.25(B) 0.60(6)

1.25(B) 0.85(9)

0.85(9)

1.25(B) 0.60(6)

1.25(B) 0.85(9)

0.85(9)

1000pF(102)

1200pF(122)

1500pF(152)

1800pF(182)

2200pF(222)

2700pF(272)

3300pF(332)

3900pF(392)

4700pF(472)

5600pF(562)

6800pF(682)

8200pF(822)

10000pF(103)

12000pF(123)

15000pF(153)

18000pF(183)

22000pF(223)

27000pF(273)

33000pF(333)

39000pF(393)

47000pF(473)

0.60(6)

0.60(6) 1.25(B)

0.60(6)

1.25(B)

0.85(9)

1.25(B)

0.85(9)

0.60(6)

0.85(9)

1.00(A)

1.25(B)

0.60(6)

0.85(9)

1.00(A)

1.25(B)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Temperature Compensating Type GRM31 Series (3.20x1.60 mm) 500V/200V/100V/50V/25V

Part Number

L x W [EIA]

GRM31

3.20x1.60 [1206]

C0G

(5C)

C0H

(6C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

500

(2H)

200

(2D)

50

(1H)

25

(1E)

25

(1E)

50

(1H)

50

(1H)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

1.0pF(1R0) 1.15(M)

2.0pF(2R0) 1.15(M)

3.0pF(3R0) 1.15(M)

4.0pF(4R0) 1.15(M)

5.0pF(5R0) 1.15(M)

6.0pF(6R0) 1.15(M)

7.0pF(7R0) 1.15(M)

8.0pF(8R0) 1.15(M)

9.0pF(9R0) 1.15(M)

10pF(100) 1.15(M)

12pF(120) 1.15(M)

15pF(150) 1.15(M)

18pF(180) 1.15(M)

22pF(220) 1.15(M)

Continued on the following page.

10

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W [EIA]

GRM31

1

3.20x1.60 [1206]

C0G

(5C)

C0H

(6C)

P2H

(6P)

R2H

(6R)

S2H

(6S)

SL

(1X)

T2H

(6T)

U2J

(7U)

TC

500

(2H)

200

(2D)

50

(1H)

25

(1E)

25

(1E)

50

(1H)

50

(1H)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

25

(1E)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

27pF(270) 1.15(M)

33pF(330) 1.15(M)

39pF(390) 1.15(M)

47pF(470) 1.15(M)

56pF(560) 1.15(M)

68pF(680) 1.15(M)

82pF(820) 1.15(M)

270pF(271)

330pF(331)

1.15(M)

390pF(391)

470pF(471)

560pF(561)

1.15(M)

680pF(681)

0.85(9)

820pF(821)

0.85(9) 0.85(9)

1000pF(102)

1200pF(122)

1500pF(152)

1800pF(182)

2200pF(222)

2700pF(272)

3300pF(332)

3900pF(392)

4700pF(472)

5600pF(562)

6800pF(682)

8200pF(822)

10000pF(103)

12000pF(123)

15000pF(153)

27000pF(273)

33000pF(333)

47000pF(473)

56000pF(563)

68000pF(683)

82000pF(823)

0.10µF(104)

1.15(M) 1.15(M) 0.85(9) 1.15(M)

1.15(M) 1.15(M) 1.15(M) 1.15(M)

1.15(M) 1.15(M) 1.15(M)

1.15(M)

1.15(M) 0.85(9)

0.85(9)

1.15(M) 0.85(9)

0.85(9)

1.15(M)

0.85(9)

1.15(M)

0.85(9)

1.15(M)

0.85(9)

1.15(M)

1.60(C)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type X5R (R6) Characteristics

X5R

(R6)

TC

Part Number

L x W [EIA]

GRM15

GRM18

GRM21

2.00x1.25 [0805]

GRM31

3.20x1.60 [1206]

1.00x0.50 [0402]

1.60x0.80 [0603]

16

(1C)

10

(1A)

10

(1A)

6.3

(0J)

10

(1A)

6.3

(0J)

10

(1A)

6.3

(0J)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

68000pF(683)

0.10µF(104)

0.33µF(334)

0.50(5)

0.80(8)

Continued on the following page.

11

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

X5R

(R6)

TC

1

Part Number

L x W [EIA]

GRM15

GRM18

GRM21

GRM31

1.00x0.50 [0402]

1.60x0.80 [0603]

2.00x1.25 [0805]

3.20x1.60 [1206]

16

(1C)

10

(1A)

10

(1A)

6.3

(0J)

10

(1A)

6.3

(0J)

10

(1A)

6.3

(0J)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.47µF(474)

0.68µF(684)

1.0µF(105)

1.5µF(155)

2.2µF(225)

3.3µF(335)

4.7µF(475)

10µF(106)

0.80(8)

0.85(9)

1.25(B)

0.85(9)

1.25(B)

0.85(9)

1.30(X)

1.60(C)

1.15(M)

1.60(C)

The part numbering code is shown in each ( ).

3.3µF and 4.7µF, 6.3V rated are GRM21 series of L: 2±0.15, W: 1.25±0.15, T: 1.25±0.15.

T: 1.15±0.1mm is also available for GRM31 1.0µF for 16V.

L: 3.2±0.2, W: 1.6±0.2 for GRM31 16V 1.0µF type. Also L: 3.2±0.2, W: 1.6±0.2, T: 1.15±0.15 for GRM31 16V 1.5µF and 2.2µF type.

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type X7R (R7) Characteristics

X7R

(R7)

TC

Part Number

L x W [EIA]

GRM15

GRM18

GRM21

GRM31

3.20x1.60 [1206]

50 25 16

1.00x0.50 [0402]

1.60x0.80 [0603]

2.00x1.25 [0805]

50

25

16

10

100

50

25

16

10

100

50

25

16

100

10

Rated Volt.

(1H) (1E) (1C) (1A) (2A) (1H) (1E) (1C) (1A) (2A) (1H) (1E) (1C) (2A) (1H) (1E) (1C) (1A)

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

220pF 0.50

(221) (5)

0.80

(8)

330pF 0.50

(331) (5)

0.80

(8)

470pF 0.50

(471) (5)

0.80

(8)

680pF 0.50

(681) (5)

0.80

(8)

1000pF 0.50

(102) (5)

0.80

(8)

1500pF 0.50

(152) (5)

0.80

(8)

2200pF 0.50

(222) (5)

0.80 0.80

(8)

3300pF 0.50

(332) (5)

0.80 0.80

(8)

4700pF 0.50

0.80

0.85

(472)

(5)

(8)

(9)

6800pF

0.50

0.80

0.85

(682)

(5)

(8)

(9)

10000pF

0.50

0.80

1.25

(103)

(5)

(8)

(B)

15000pF

0.50

0.80

(153)

(5)

(8)

22000pF

0.50

0.80

(223)

(5)

(8)

33000pF

0.50

0.80 0.80

0.85

1.15

(333)

(5)

(8)

(9)

(M)

Continued on the following page.

12

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

X7R

(R7)

TC

Part Number

1

GRM15

GRM18

GRM21

GRM31

L x W [EIA]

1.00x0.50 [0402]

1.60x0.80 [0603]

2.00x1.25 [0805]

3.20x1.60 [1206]

50

25

16

10

100

50

25

16

10

100

50

25

16

100

50

25

16

10

Rated Volt.

(1H) (1E) (1C) (1A) (2A) (1H) (1E) (1C) (1A) (2A) (1H) (1E) (1C) (2A) (1H) (1E) (1C) (1A)

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

47000pF

0.50

(5)

0.80 0.80

(8) (8)

1.25

(B)

1.15

(M)

(473)

68000pF

0.80 0.80

(8) (8)

1.25

(B)

(683)

0.10µF

(104)

0.50 0.50

0.80 0.80 0.80

1.25 1.25

(5)

(8)

(B)

0.15µF

(154)

0.80

(8)

0.80

(8)

1.25 1.25

(B) (B)

0.22µF

(224)

0.80 0.80

(8) (8)

1.25 0.85

(B) (9)

0.33µF

(334)

0.85 1.25

(9) (B)

0.85

(9)

0.47µF

(474)

1.25 1.25 0.85

1.15

(M)

(B)

(9)

0.68µF

(684)

0.85

(9)

0.85

(9)

1.0µF

(105)

1.25

(B)

1.15 1.15 0.85 0.85

(M)

(9)

1.5µF

(155)

1.60

(C)

1.15

(M)

2.2µF

(225)

1.60

(C)

1.15 0.85

(M)

(9)

3.3µF

(335)

1.60

(C)

4.7µF

(475)

1.60

(C)

The part numbering code is shown in each ( ).

The tolerance will be changed to L: 3.2±0.2, W: 1.6±0.2 for GRM31 16V 1.0µF type. Also L: 3.2±0.2, W: 1.6±0.2, T: 1.15±0.15 for GRM31 16V 1.5µF and 2.2µF type.

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type Y5V (F5) Characteristics

Y5V

(F5)

TC

Part Number

L x W [EIA]

GRM15

GRM18

GRM21

GRM31

1.00x0.50 [0402]

1.60x0.80 [0603]

2.00x1.25 [0805]

3.20x1.60 [1206]

50

25

16

100

50

25

16

10

50

25

16

10

50

25

16

10

6.3

(0J)

Rated Volt.

(1H) (1E) (1C) (2A) (1H) (1E) (1C) (1A) (1H) (1E) (1C) (1A) (1H) (1E) (1C) (1A)

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

2200pF 0.50

(222)

(5)

4700pF 0.50

0.80

(472) (5)

(8)

10000pF 0.50

0.80

(103)

(5)

(8)

22000pF

0.50

0.80

(223)

(5)

(8)

47000pF

0.50

0.80

(473)

(5)

(8)

0.10µF

(104)

0.50

(5)

0.50

(5)

0.80

(8)

0.80

(8)

0.85

(9)

Continued on the following page.

13

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Y5V

(F5)

TC

Part Number

1

GRM15

GRM18

GRM21

GRM31

L x W [EIA]

1.00x0.50 [0402]

1.60x0.80 [0603]

2.00x1.25 [0805]

3.20x1.60 [1206]

50

25

16

100

50

25

16

10

50

25

16

10

50

25

16

10

6.3

(0J)

Rated Volt.

(1H) (1E) (1C) (2A) (1H) (1E) (1C) (1A) (1H) (1E) (1C) (1A) (1H) (1E) (1C) (1A)

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.22µF

(224)

0.80

(8)

1.25

(B)

0.85

(9)

0.47µF

(474)

0.80

(8)

0.80

(8)

1.25

(B)

1.15

(M)

1.0µF

(105)

0.80

(8)

0.80

(8)

0.85

(9)

0.85

(9)

0.85

(9)

1.15

(M)

0.85

(9)

2.2µF

(225)

1.25

(B)

1.25

(B)

1.25

(B)

1.15

(M)

0.85

(9)

4.7µF

(475)

1.25

(B)

1.15

(M)

1.15

(M)

1.15

(M)

10µF

(106)

1.60

(C)

1.15

(M)

1.15

(M)

The part numbering code is shown in each ( ).

T: 1.25±0.1mm is also available for GRM21 25V or 16V 1.0µF type.

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type Z5U (E4) Characteristics

Z5U

(E4)

TC

Part Number

L x W [EIA]

GRM18

GRM21

GRM31

1.60x0.80 [0603]

2.00x1.25 [0805]

3.20x1.60 [1206]

50

(1H)

50

(1H)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

10000pF(103)

22000pF(223)

47000pF(473)

0.10µF(104)

0.22µF(224)

0.80(8)

0.60(6)

0.85(9)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

14

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

for Reflow Soldering GRM32/43/55 Series

2

Dimensions (mm)

Part Number

L

W

T

e min. g min.

■ Features

0.85 ±0.1

1.15 ±0.1

3.2 ±0.3 2.5 ±0.2 1.35 ±0.15 0.3

GRM329

GRM32M

GRM32N

GRM32R

GRM32E

GRM43M

GRM43N

1. Terminations are made of metal highly resistant to

1.0

2.0

migration.

1.8 ±0.2

2.5 ±0.2

1.15 ±0.1

1.35 ±0.15

2. The GRM series is a complete line of chip ceramic

capacitors in 10V, 16V, 25V, 50V, 100V and 200V

ratings.

GRM43R 4.5 ±0.4 3.2 ±0.3 1.8 ±0.2

0.3

e

g

e

GRM43D

GRM43E

GRM55M

GRM55N

GRM55C

GRM55R

GRM55D

GRM55E

2.0 ±0.2

2.5 ±0.2

1.15 ±0.1

1.35 ±0.15

1.6 ±0.2

1.8 ±0.2

2.0 ±0.2

2.5 ±0.2

These capacitors have temperature characteristics

ranging from C0G to Y5V.

5.7 ±0.4 5.0 ±0.4

2.0

3. This series consists of type LxWxT: 3.2x2.5x0.85mm

to LxWxT: 5.7x5.0x2.5mm. These are suited to only

reflow soldering.

L

W

4. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip placement on

PCBs.

5. The GRM series is available in paper or plastic

embossed tape and reel packaging for automatic

placement.

■ Applications

General electronic equipment

Temperature Compensating Type GRM32/43/55 Series

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

GRM32N5C2D561JV01

GRM32N5C2D681JY21

GRM32N5C2D821JY21

GRM32N5C2D102JY21

GRM43R5C2D122JV01

GRM43R5C2D152JV01

GRM43R5C2D182JY21

GRM43R5C2D222JY21

GRM43R5C2D272JY21

GRM55N5C2D332JY21

GRM55R5C2D392JY21

GRM55R5C2D472JY21

GRM55R5C2D562JY21

GRM32N1X2D152JV01

GRM43N1X2D182JV01

GRM43N1X2D222JV01

GRM43R1X2D272JV01

GRM43R1X2D332JV01

GRM43R1X2D392JV01

GRM55N1X2D472JV01

GRM55R1X2D562JV01

GRM55R1X2D682JV01

GRM55R1X2D822JV01

GRM32N1X2A562JZ01

GRM32N1X2A682JZ01

GRM43N1X2A822JZ01

GRM43R1X2A103JZ01

C0G (EIA)

SL (JIS)

200

100

560 ±5%

680 ±5%

3.20

4.50

5.70

3.20

4.50

5.70

3.20

4.50

2.50

3.20

5.00

2.50

3.20

5.00

2.50

3.20

1.35

1.80

1.35

1.80

1.35

1.80

1.35

1.80

1.35

1.80

820 ±5%

1000 ±5%

1200 ±5%

1500 ±5%

1800 ±5%

2200 ±5%

2700 ±5%

3300 ±5%

3900 ±5%

4700 ±5%

5600 ±5%

1500 ±5%

1800 ±5%

2200 ±5%

2700 ±5%

3300 ±5%

3900 ±5%

4700 ±5%

5600 ±5%

6800 ±5%

8200 ±5%

5600 ±5%

6800 ±5%

8200 ±5%

10000 ±5%

SL (JIS)

Continued on the following page.

15

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

GRM43R1X2A123JZ01

GRM43R1X2A153JZ01

GRM55M1X2A183JZ01

GRM55N1X2A223JZ01

GRM55R1X2A273JZ01

GRM55R1X2A333JZ01

GRM55R1X2A393JZ01

GRM32N1X1H103JZ01

GRM32N1X1H123JZ01

GRM43R1X1H153JZ01

GRM55M1X1H183JZ01

GRM55N1X1H223JZ01

GRM55R1X1H273JZ01

GRM55R1X1H333JZ01

GRM55R1X1H393JZ01

SL (JIS)

100

50

12000 ±5%

15000 ±5%

18000 ±5%

22000 ±5%

27000 ±5%

33000 ±5%

39000 ±5%

10000 ±5%

12000 ±5%

15000 ±5%

18000 ±5%

22000 ±5%

27000 ±5%

33000 ±5%

39000 ±5%

4.50

5.70

3.20

4.50

5.70

3.20

5.00

2.50

3.20

5.00

1.80

1.15

1.35

1.80

1.35

1.80

1.15

1.35

1.80

2

50

High Dielectric Constant Type Type GRM32 Series (3.20x2.50mm)

TC Code

(Standard)

Rated Voltage

(Vdc)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

Capacitance

GRM32ER61A106KC01

GRM32NR72A683KA01

GRM32NR72A104KA01

GRM32ER72A105KA01

GRM32NR71H684KA01

GRM32RR71H105KA01

GRM32RR71E225KC01

GRM32MR71C225KC01

GRM32NR71C335KC01

GRM32RR71C475KC01

GRM32ER71H475KA88

GRM32NF52A104ZA01

GRM32RF51H105ZA01

GRM32DF51H106ZA01

GRM329F51E475ZA01

GRM32NF51E106ZA01

GRM32NF51C106ZA01

X5R (EIA)

X7R (EIA)

Y5V (EIA)

10

100

50

10µF ±10%

68000pF ±10%

0.10µF ±10%

1.0µF ±10%

3.20

2.50

1.35

2.50

1.35

1.80

1.15

1.35

1.80

2.50

1.35

1.8

0.68µF ±10%

1.0µF ±10%

50

25

2.2µF ±10%

16

2.2µF ±10%

16

3.3µF ±10%

16

4.7µF ±10%

16

4.7µF ±10%

100

50

0.10µF +80/-20%

1.0µF +80/-20%

10µF +80/-20%

4.7µF +80/-20%

10µF +80/-20%

50

2.00

0.85

1.35

25

16

High Dielectric Constant Type Type GRM43 Series (4.50x3.20mm)

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

(µF)

GRM43RR72A154KA01

GRM43RR72A224KA01

GRM43DR72A474KA01

GRM43ER72A225KA01

GRM43ER71H225KA01

X7R (EIA)

100

50

0.15 ±10%

0.22 ±10%

0.47 ±10%

2.2 ±10%

4.50

3.20

1.80

2.00

2.50

16

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

High Dielectric Constant Type Type GRM55 Series (5.70x5.00mm)

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

2

Part Number

(µF)

GRM55DR61H106KA01

GRM55DR72A105KA01

GRM55ER72A475KA01

GRM55RR71H105KA01

GRM55RR71H155KA01

GRM55ER71H475KA01

GRM55RF52A474ZA01

X5R (EIA)

X7R (EIA)

Y5V (EIA)

50

100

50

10.0 ±10%

1.0 ±10%

5.70

5.00

2.00

2.50

1.80

2.50

1.80

4.7 ±10%

1.0 ±10%

50

1.5 ±10%

50

4.7 ±10%

100

0.47 +80/-20%

17

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Ultra-small GRM03 Series

3

e

g

e

■ Features

1. Small chip size (LxWxT: 0.6x0.3x0.3mm).

2. Terminations are made of metal highly resistant to

migration.

3. GRM03 type is suited to only reflow soldering.

4. Stringent dimensional tolerances allow highly

reliable, high speed automatic chip placement on

PCBs.

L

W

Dimensions (mm)

T

Part Number

5. GRM03 series are suited to miniature micro wave

L

W

e

g min.

0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.1 to 0.2

0.2

GRM033

module, portable equipment and high frequency

circuits.

■ Applications

1. Miniature micro wave module

2. Portable equipment

3. High frequency circuit

Part Number

L x W

GRM03

0.6x0.3

C0G

(5C)

X5R

(R6)

X7R

(R7)

Y5V

(F5)

TC

25

(1E)

10

(1A)

16

(1C)

6.3

(0J)

10

(1A)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF(R50)

1.0pF(1R0)

2.0pF(2R0)

3.0pF(3R0)

4.0pF(4R0)

5.0pF(5R0)

6.0pF(6R0)

7.0pF(7R0)

8.0pF(8R0)

9.0pF(9R0)

10pF(100)

12pF(120)

15pF(150)

18pF(180)

22pF(220)

27pF(270)

33pF(330)

39pF(390)

47pF(470)

56pF(560)

68pF(680)

82pF(820)

100pF(101)

150pF(151)

220pF(221)

330pF(331)

470pF(471)

680pF(681)

0.3(3)

Continued on the following page.

18

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

GRM03

0.6x0.3

C0G

(5C)

X5R

(R6)

X7R

(R7)

Y5V

(F5)

TC

25

(1E)

10

(1A)

16

(1C)

6.3

(0J)

10

(1A)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

3

1000pF(102)

1500pF(152)

2200pF(222)

3300pF(332)

4700pF(472)

6800pF(682)

10000pF(103)

0.3(3)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

19

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Thin Type (Flow/Reflow)

e

g

e

■ Features

1. This series is suited to flow and reflow soldering.

Capacitor terminations are made of metal highly

resistant to migration.

4

2. Large capacitance values enable excellent bypass

effects to be realized.

L

W

3. Its thin package makes this series ideally suited

for the production of small electronic products

Dimensions (mm)

Part Number

and for mounting underneath ICs.

L

W

T

e

g min.

1.0 ±0.05 0.5 ±0.05 0.25 ±0.05 0.1 to 0.3

0.4

GRM15X

■ Applications

Thin equipment such as IC cards

Temperature Compensating Type

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

GRM15X5C1H1R0CDB4

GRM15X5C1H2R0CDB4

GRM15X5C1H3R0CDB4

GRM15X5C1H4R0CDB4

GRM15X5C1H5R0CDB4

GRM15X5C1H6R0DDB4

GRM15X5C1H7R0DDB4

GRM15X5C1H8R0DDB4

GRM15X5C1H9R0DDB4

GRM15X5C1H100JDB4

GRM15X5C1H120JDB4

GRM15X5C1H150JDB4

GRM15X5C1H180JDB4

GRM15X5C1H220JDB4

GRM15X5C1H270JDB4

GRM15X5C1H330JDB4

GRM15X5C1H390JDB4

GRM15X5C1H470JDB4

GRM15X5C1H560JDB4

GRM15X5C1H680JDB4

GRM15X5C1H820JDB4

GRM15X5C1H101JDB4

GRM15X5C1E121JDB4

GRM15X5C1E151JDB4

GRM15X5C1E181JDB4

GRM15X5C1E221JDB4

C0G (EIA)

50

25

1.0 ±0.25pF

2.0 ±0.25pF

3.0 ±0.25pF

4.0 ±0.25pF

5.0 ±0.25pF

6.0 ±0.5pF

7.0 ±0.5pF

8.0 ±0.5pF

9.0 ±0.5pF

10 ±5%

1.00

0.50

0.25

12 ±5%

15 ±5%

18 ±5%

22 ±5%

27 ±5%

33 ±5%

39 ±5%

47 ±5%

56 ±5%

68 ±5%

82 ±5%

100 ±5%

120 ±5%

150 ±5%

180 ±5%

220 ±5%

High Dielectric Constant Type

TC Code

(Standard)

Rated Voltage

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

(Vdc)

GRM15XR71H221KA86

GRM15XR71H331KA86

GRM15XR71H471KA86

X7R (EIA)

50

220 ±10%

330 ±10%

470 ±10%

1.00

0.50

0.25

Continued on the following page.

20

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

GRM15XR71H681KA86

GRM15XR71H102KA86

GRM15XR71H152KA86

GRM15XR71E182KA86

GRM15XR71E222KA86

GRM15XR71C332KA86

GRM15XR71C472KA86

GRM15XR71C682KA86

X7R (EIA)

50

25

16

680 ±10%

1000 ±10%

1500 ±10%

1800 ±10%

2200 ±10%

3300 ±10%

4700 ±10%

6800 ±10%

1.00

0.50

0.25

4

21

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Specifications and Test Methods

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

R6 : Y55 to W85D

R7 : Y55 to W125D

E4 : W10 to W85D

F5 : Y30 to W85D

Operating

Temperature

Y55 to W125D

1

2

4

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, V or V ,

P-P

O-P

Rated Voltage

See the previous page.

whichever is larger, should be maintained within the rated

voltage range.

Visual inspection

3

4

Appearance

Dimensions

No defects or abnormalities

Using calipers on micrometer

Within the specified dimensions

*

No failure should be observed when 300% of the rated voltage

*

(C0∆ to U2J and SL) or 250% of the rated voltage (X5R, X7R,

Z5U and Y5V) is applied between the terminations for 1 to 5

seconds, provided the charge/discharge current is less than

50mA. ^*200% for 500V

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25D and 75%RH

max. and within 2 minutes of charging.

Insulation

Resistance

6

7

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Capacitance

Within the specified tolerance

The capacitance/Q/D.F. should be measured at 25D at the

frequency and voltage shown in the table.

[R6, R7]

Char.

Frequency

Voltage

Item

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V

∆C to 7U, 1X

(1000pF and

below)

1T0.1MHz

0.5 to 5Vrms

0.05max.(CF3.3µF)

0.1max.(CU3.3µF)

∆C to 7U, 1X

(more than

1000pF)

1T0.1kHz

1T0.2Vrms

Q/

30pFmin. : QU1000

[E4]

8

Dissipation Factor 30pFmax. : QU400+20C

W.V. : 25Vmin. : 0.025max.

(D.F.)

C : Nominal Capacitance (pF)

R6, R7, F5

[F5]

W.V. : 25Vmin.

(10µF and below)

:

0.05max.(CF0.10µF)

0.09max.(CU0.10µF)

R6, R7, F5

(more than 10µF)

120T24Hz

1T0.1kHz

0.5T0.1Vrms

0.5T0.05Vrms

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

E4

The capacitance change should be measured after 5 min. at

each specified temperature stage.

(1) Temperature Compensating Type

The temperature coefficient is determined using the

Capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1 through

5 (C0∆ : W25D to W125D : other temp. coeffs. : W25D to

W85D) the capacitance should be within the specified tolerance

for the temperature coefficient and capacitance change as

Table A.

R6 : WithinT15%

(Y55 to W85D)

R7 : Within±15%

(Y55 to W125D)

E4 : Within W22/Y56%

(W10 to W85D)

Capacitance

Change

Within the specified tolerance

(Table A)

F5 : Within W22/Y82%

(Y30 to W85D)

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

Capacitance

Temperature

Characteristics

Temperature

Coefficient

Within the specified tolerance

(Table A)

Step

Temperature(D)

25T2

9

1

Y55T3 (for ∆C to 7U/1X/R6/R7)

Y30T3 (for F5)

2

10T3 (for E4)

3

4

5

25T2

125T3 (for ∆C/R7)

85T3 (for other TC)

Within T0.2% or T0.05pF

(Whichever is larger.)

*Does not apply to 1X/25V

25T2

Capacitance

Drift

(2) High Dielectric Constant Type

The ranges of capacitance change compared with the above

25D value over the temperature ranges shown in the table

should be within the specified ranges.

Continued on the following page.

22

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 10N* force in parallel

with the test jig for 10T1sec. The soldering should be done

either with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock. *2N (GRp03) 5N (GRp15,

GRM18)

4

c

Adhesive Strength

of Termination

Solder resist

10

No removal of the terminations or other defect should occur.

Baked electrode or

copper foil

Type

GRp03

a

b

c

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

(in mm)

Fig. 1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

[R6, R7]

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10). The

capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute. This motion should be

applied for a period of 2 hours in each of 3 mutually perpendic-

ular directions (total of 6 hours).

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V :

0.05max. (CF3.3µF)

0.1max. (CU3.3µF)

Vibration

11

30pFmin. : QU1000

[E4]

Resistance

Q/D.F.

30pFmax. : QU400W20C

W.V. : 25Vmin. : 0.025max.

C : Nominal Capacitance (pF)

[F5]

W.V. : 25Vmin.

:

0.05max. (CF0.10µF)

0.09max. (CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the

direction shown in Fig. 3. The soldering should be done either

with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

No crack or marked defect should occur.

b

c

φ4.5

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

a

R230

100

12 Deflection

t : 1.6mm (GRp03/15 : 0.8mm)

Flexure : V1

Type

GRp03

a

b

c

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

Capacitance meter

45 45

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

Fig. 3

(in mm)

Fig. 2

Continued on the following page.

23

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Preheat at 80 to 120D for 10 to 30 seconds. After preheating,

immerse in eutectic solder solution for 2T0.5 seconds at

230T5D.

Solderability of

Termination

75% of the terminations are to be soldered evenly and

continuously.

13

4

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R6, R7 : Within T7.5%

E4, F5 : Within T20%

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

Preheat the capacitor at 120 to 150D for 1 minute.

Immerse the capacitor in a eutectic solder solution at 270T5D

for 10T0.5 seconds. Let sit at room temperature for 24T2 hours

(temperature compensating type) or 48T4 hours (high dielectric

constant type), then measure.

[R6, R7]

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V :

Resistance

to

Soldering

Heat

0.05max. (CF3.3µF)

0.1max. (CU3.3µF)

#Initial measurement for high dielectric constant type

Perform a heat treatment at 150 Y10D for one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

W 0

14

30pFmin. : QU1000

30pFmax. : QU400W20C

C : Nominal Capacitance (pF)

[E4]

Q/D.F.

W.V. : 25Vmin. : 0.025max.

[F5]

*Preheating for GRM32/43/55

W.V. : 25Vmin.

: 0.05max. (CF0.10µF)

: 0.09max. (CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

Step

1

2

Temperature

100D to 120D

170D to 200D

Time

1 min.

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R6, R7 : Within T7.5%

E4, F5 : Within T20%

Within T2.5% or T0.25pF

(Whichever is larger)

Capacitance

Change

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following

table. Let sit for 24T2 hours (temperature compensating type)

or 48T4 hour (high dielectric constant type) at room

temperature, then measure.

[R6, R7]

W.V. : 25Vmin. : 0.025max.

W.V. : 16/10V : 0.035max.

W.V. : 6.3V

0.05max. (CF3.3µF)

0.1max. (CU3.3µF)

Step

1

2

3

4

Temperature

Cycle

Min.

Operating

Temp.W0/Y3

Max.

Operating

Temp.W3/Y0

15

30pFmin. : QU1000

30pFmax. : QU400W20C

C : Nominal Capacitance (pF)

Room

Temp.

Room

Temp.

[E4]

Temp. (D)

Q/D.F.

W.V. : 25Vmin. : 0.025max.

[F5]

30T3

Time (min.)

2 to 3

W.V. : 25Vmin.

#Initial measurement for high dielectric constant type

W 0

: 0.05max. (CF0.10µF)

: 0.09max. (CU0.10µF)

W.V. : 16V/10V : 0.125max.

W.V. : 6.3Vmax. : 0.15max.

Perform a heat treatment at 150 Y10D for one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Continued on the following page.

24

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R6, R7 : Within T12.5%

E4, F5 : Within T30%

Capacitance

Change

Within T5% or T0.5pF

(Whichever is larger)

4

[R6, R7]

W.V. : 25Vmin. : 0.05max.

W.V. : 16/10V : 0.05max.

W.V. : 6.3V

Let the capacitor sit at 40T2D and 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) or 48T4 hours (high dielectric constant type) at room tem-

perature, then measure.

30pF and over : QU350

10pF and over

30pF and below :

QU275W5C/2

10pF and below :

QU200W10C

C : Nominal Capacitance (pF)

0.075max. (CF3.3µF)

0.125max. (CU3.3µF)

Humidity

16 Steady

State

[E4]

Q/D.F.

W.V. : 25Vmin. : 0.05max.

[F5]

W.V. : 25Vmin.

:

0.075max. (CF0.10µF)

0.125max. (CU0.10µF)

W.V. : 16V/10V : 0.15max.

W.V. : 6.3Vmax. : 0.2max.

I.R.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R6, R7 : Within T12.5%

E4 : Within T30%

Within T7.5% or T0.75pF

F5 : Within T30%

Capacitance

Change

(Whichever is larger)

[W.V. : 10Vmax.]

F5 : Within W30/Y40%

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours (temperature

compensating type) or 48T4 hours (high dielectric constant

type) at room temperature, then measure. The charge/discharge

current is less than 50mA.

[R6, R7]

W.V. : 25Vmin. : 0.05max.

W.V. : 16/10V : 0.05max.

W.V. : 6.3V

Humidity

17

0.075max. (CF3.3µF)

0.125max. (CU3.3µF)

Load

30pF and over : QU200

#Initial measurement for F5/10V max.

30pF and below :

QU100+10C/3

C : Nominal Capacitance (pF)

[E4]

Apply the rated DC voltage for 1 hour at 40T2D.

Remove and let sit for 48T4 hours at room temperature.

Perform initial measurement.

Q/D.F.

W.V. : 25Vmin. : 0.05max.

[F5]

W.V. : 25Vmin.

: 0.075max. (CF0.10µF)

: 0.125max. (CU0.10µF)

W.V. : 16V/10V : 0.15max.

W.V. : 6.3Vmax. : 0.2max.

I.R.

More than 500MΩ or 25Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Continued on the following page.

25

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R6, R7 : Within T12.5%

E4 : Within T30%

4

F5 : Within T30%

(CapF1.0µF)

F5 : Within

Capacitance

Change

Within T3% or T0.3pF

(Whichever is larger)

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D. Let sit for 24T2 hours

(temperature compensating type) or 48T4 hours (high dielectric

constant type) at room temperature, then measure.

W30/Y40% (CapU1.0µF)

[R6, R7]

W.V. : 25Vmin. : 0.05max.

W.V. : 16/10V : 0.05max.

W.V. : 6.3V

High

18 Temperature

Load

The charge/discharge current is less than 50mA.

#Initial measurement for high dielectric constant type.

Apply 200% of the rated DC voltage for one hour at the

maximum operating temperature T3D. Remove and let sit for

48T4 hours at room temperature. Perform initial measurement.

30pF and over : QU350

10pF and over

0.075max. (CF3.3µF)

0.125max. (CU3.3µF)

30pF and below :

QU275+5C/2

[E4]

Q/D.F.

W.V. : 25Vmin. : 0.05max

10pF and below :

QU200+10C

C : Nominal Capacitance (pF)

[F5]

W.V. : 25Vmin.

*150% for 500V and CU10µF

:

0.075max. (CF0.10µF)

0.125max. (CU0.10µF)

W.V. : 16V/10V : 0.15max.

W.V. : 6.3Vmax. : 0.2max.

More than 1,000MΩ or 50Ω#F (Whichever is smaller)

I.R.

Dielectric

Strength

No failure

Table A

Capacitance Change from 25D (% )

Nominal Values (ppm/D)*

Y55

Y30

Y10

Char. Code

Max.

0.58

0.87

2.33

3.02

4.09

5.46

8.78

Y

Min.

Y0.24

Y0.48

0.72

1.28

2.16

3.28

5.04

Y

Max.

0.40

0.59

1.61

2.08

2.81

3.75

6.04

Y

Min.

Y0.17

Y0.33

0.50

0.88

1.49

2.26

3.47

Y

Max.

0.25

0.38

1.02

1.32

1.79

2.39

3.84

Y

Min.

Y0.11

Y0.21

0.32

0.56

0.95

1.44

2.21

Y

Y000 T030

Y000 T060

Y150 T060

Y220 T060

Y330 T060

Y470 T060

Y750 T120

W350 to Y1000

5C

6C

6P

6R

6S

6T

7U

1X

*Nominal values denote the temperature coefficient within a range of 25D to 125D (for ∆C)/85D (for other TC).

26

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Thin Layer Large-capacitance Type

Dimensions (mm)

Part Number

L

W

T

e min.

g min.

■ Features

GRM033 0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.1 to 0.2 0.2

GRM155 1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.15 to 0.3 0.4

GRM185 1.6 ±0.1 0.8 ±0.1 0.5 +0/-0.2 0.2 to 0.5 0.5

GRM188 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5 0.5

1. Smaller size and higher capacitance value.

2. High reliability and no polarity.

3. Excellent pulse responsibility and noise

reduction due to the low impedance at high

frequency.

0.6 ±0.1

GRM219 2.0 ±0.1 1.25 ±0.1 0.85 ±0.1 0.2 to 0.7 0.7

GRM216

GRM21B

GRM316

GRM319

GRM31M

GRM31C

GRM32D

GRM32E

GRM43D

1.25 ±0.1

0.6 ±0.1

0.85 ±0.1

1.6 ±0.2

1.15 ±0.1

2.0 ±0.2

2.5 ±0.2

2.0 ±0.2

3.2 ±0.15 1.6 ±0.15

3.2 ±0.2 1.6 ±0.2

3.2 ±0.3 2.5 ±0.2

0.3 to 0.8 1.5

5

e

g

e

0.3

1.0

■ Applications

General electronic equipment

GRM43E 4.5 ±0.4 3.2 ±0.3 2.5 ±0.2

0.3

2.0

GRM43S

2.8 ±0.2

L

W

GRM55F 5.7 ±0.4 5.0 ±0.4 3.2 ±0.2

TC Code

(Standard)

Rated Voltage

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

Capacitance

(Vdc)

GRM188R61C105KE93

GRM219R61C225KA88

GRM319R61C475KA88

GRM32ER61C226KE20

GRM185R61A105KE36

GRM155R61A154KE19

GRM155R61A224KE19

GRM188R61A225KE34

GRM188R61A225ME34

GRM216R61A225KE24

GRM219R61A225KA01

GRM219R61A335KE19

GRM316R61A335KE19

GRM219R61A475KE19

GRM219R61A475KE34

GRM316R61A475KE19

GRM319R61A475KA01

GRM31MR61A106KE19

GRM033R60J153KE01

GRM033R60J223KE01

GRM033R60J333KE01

GRM033R60J393KE19

GRM033R60J473KE19

GRM033R60J104KE19

GRM155R60J154KE01

GRM155R60J224KE01

GRM155R60J334KE01

GRM155R60J474KE19

GRM155R60J105KE19

GRM185R60J105KE21

GRM185R60J105KE26

GRM185R60J225KE26

GRM188R60J225KE01

GRM188R60J225KE19

GRM188R60J475KE19

GRM219R60J475KE01

GRM219R60J106KE19

GRM219R60J106ME19

X5R (EIA)

16

1.0µF ±10%

2.2µF ±10%

4.7µF ±10%

22µF ±10%

1.60

2.00

3.20

1.60

1.00

1.60

2.00

3.20

2.00

3.20

0.6

0.80

1.25

1.60

2.50

0.80

0.50

0.80

1.25

1.60

1.25

1.60

0.3

0.80

0.85

2.50

0.50

0.80

0.60

0.85

0.60

0.85

0.60

0.85

1.15

0.3

16

10

1.0µF ±10%

1.5µF ±10%

2.2µF ±10%

3.3µF ±10%

4.7µF ±10%

10µF ±10%

10

6.3

15000pF ±10%

22000pF ±10%

33000pF ±10%

39000pF ±10%

47000pF ±10%

0.10µF ±10%

0.15µF ±10%

0.22µF ±10%

0.33µF ±10%

0.47µF ±10%

1.0µF ±10%

2.2µF ±10%

4.7µF ±10%

10µF ±10%

0.6

0.3

0.6

0.3

0.6

0.3

0.6

0.3

0.6

0.3

1.00

1.60

2.00

0.50

0.80

1.25

0.50

0.80

0.85

10µF ±20%

Continued on the following page.

27

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

TC Code

(Standard)

Rated Voltage

(Vdc)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

Capacitance

GRM21BR60J106KE01

GRM21BR60J106KE19

GRM21BR60J106ME01

GRM21BR60J106ME19

GRM21BR60J226ME39

GRM31CR60J226ME19

GRM32DR60J226KA01

GRM32DR60J336ME19

GRM32ER60J476ME20

GRM32ER60J107ME20

GRM43SR60J107ME20

GRM32ER71A226KE20

GRM32ER71A226ME20

GRM188F51A225ZE01

GRM188F50J225ZE01

GRM21BF50J106ZE01

X5R (EIA)

X7R (EIA)

Y5V (EIA)

6.3

10

10µF ±10%

2.00

3.20

4.50

3.20

1.60

2.00

1.25

1.60

2.50

3.20

2.50

0.80

1.25

1.60

2.00

2.50

2.80

2.50

0.80

1.25

10µF ±20%

10µF +10/-20%

22µF ±20%

22µF ±10%

33µF ±10%

47µF ±20%

100µF ±20%

22µF ±10%

5

10

22µF ±20%

10

2.2µF +80/-20%

10µF +80/-20%

6.3

28

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Temperature

Range

Test Method

R6 : Y55D to W85D

R7 : Y55D to W125D

F5 : Y30D to W85D

C8 : Y55D to W105D

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated

voltage range.

Visual inspection

Using calipers

5

3

4

Appearance

Dimensions

No defects or abnormalities

Within the specified dimension

No failure should be observed when 250% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provided

the charge/discharge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC voltage

not exceeding the rated voltage at 25D and 75%RH max. and

within 1 minute of charging.

Insulation

6

7

50Ω • F min.

Resistance

Capacitance

Within the specified tolerance

The capacitance/D.F. should be measured at 25D at the

frequency and voltage shown in the table.

Capacitance

CV10µF (10V min.)*¹

CV10µF (6.3V max.)

CG10µF

Frequency

1T0.1kHz

120T24Hz

Voltage

1.0T0.2Vrms*¹

0.5T0.1Vrms

Dissipation Factor R6 / R7 / C8 : 0.1 max.

8

*1 Table 1 items are applied to 0.5+/-0.1Vrms.

(D.F.)

F5 : 0.2 max.

Table 1

GRM155R61A124~224K

GRM185R61A105K

GRM188R61A225K

GRM219R61A475K

The capacitance change should be measured after 5 min. at

each specified temperature stage.

The ranges of capacitance change compared with the 25D

value over the temperature ranges shown in the table should

be within the specified ranges.

Char. Temp. Range Reference Temp. Cap. Change

Y55 to W85D

Y55 to W125D

Y30 to W85D

Y55 to W105D

25D

WithinT15%

Within+22/–82%

WithinT22%

R6

R7

F5

C8

Capacitance

Temperature

Characteristics

9

Measuring Voltage : GRM43 R6 0J/1A 336/476 : 1.0+/–0.2Vrms

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.1 using a eutectic solder. Then apply *²10N force in parallel

with the test jig for 10T1 sec. The soldering should be done

either with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

*²5N (GRp15, GRM18) / 2N (GRp03)

c

Adhesive Strength

of Termination

Solder resist

10

No removal of the terminations or other defects should occur.

Baked electrode or

copper foil

Type

GRp03

a

b

c

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

(in mm)

Fig.1

Continued on the following page.

29

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No defects or abnormalities

No.

Item

Test Method

Appearance

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).The

capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute. This motion should be

applied for a period of 2 hours in each 3 mutually perpendicular

directions (total of 6 hours).

Capacitance

Within the specified tolerance

11 Vibration

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

D.F.

5

No cracking or marking defects should occur.

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.2 using a eutectic solder. Then apply a force in the direction

shown in Fig.3. The soldering should be done either with an

iron or using the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

b

ø4.5

R230

c

Flexure : V1

a

100

Capacitance meter

12 Deflection

t : 1.6mm

45

(GRp03, GRp15 : t : 0.8mm)

Type

GRp03

a

b

c

Fig.3

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.9

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

GRp15

GRM18

GRM21

GRM31

GRM32

GRM43

GRM55

(in mm)

Fig.2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Preheat at 80 to 120D for 10 to 30 seconds. After preheating,

immerse in eutectic solder solution for 2T0.5 seconds at

230T5D.

Solderability of

Termination

75% of the terminations is to be soldered evenly and

continuously.

13

Appearance

No marking defects

Preheat the capacitor at 120 to 150D for 1 minute.

Immerse the capacitor in a eutectic solder solution at 270T5D

for 10T0.5 seconds. Let sit at room temperature for 48T4

hours, then measure.

R6 / R7 / C8 : Within T7.5%

F5 : Within T20%

Capacitance

Change

Resistance

to

Soldering

Heat

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

D.F.

I.R.

14

#Initial measurement

Perform a heat treatment at 150 Y10D for one hour and then

W 0

50Ω • F min.

No failure

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

Dielectric

Strength

Appearance

No marking defects

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following

table. Let sit for 48T4 hours at room temperature, then mea-

sure.

R6 / R7 / C8 : Within T7.5%

F5 : Within T20%

Capacitance

Change

R6 / R7 / C8 : 0.1 max.

F5 : 0.2 max.

D.F.

I.R.

Step

1

2

3

4

50Ω • F min.

Temperature

Min.

Operating

Temp.W0/Y3

Max.

Operating

Temp.W3/Y0

Room

Temp.

Room

Temp.

15 Sudden

Change

Temp.(D)

30T3

Time(min.)

2 to 3

Dielectric

Strength

No failure

#Initial measurement

W 0

Perform a heat treatment at 150Y10D for one hour and then

let sit for 48T4 hours at room temperature.

Perform the initial measurement.

Continued on the following page.

30

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours. The charge/discharge current is less than 50mA.

Appearance

No marking defects

R6 / R7 / C8 : Within T12.5%

Capacitance

Change

F5 : Within T30%

High

#Initial measurement

Perform a heat treatment at 150Y10D for one hour and then

W 0

Temperature

R6 / R7 / C8 : 0.2 max.

F5 : 0.4 max.

D.F.

let sit for 48T4 hours at room temperature.

16 High

Humidity

Perform the initial measurement.

(Steady)

#Measurement after test

I.R.

12.5Ω • F min.

W 0

Perform a heat treatment at 150Y10D for one hour and then

5

let sit for 48T4 hours at room temperature, then measure

Apply 150% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D.

The charge/discharge current is less than 50mA.

Appearance

No marking defects

R6 / R7 / C8 : Within T12.5%

F5 : Within T30%

Capacitance

Change

R6 / R7 / C8 : 0.2 max.

F5 : 0.4 max.

#Initial measurement

Perform a heat treatment at 150Y10D for one hour and then

let sit for 48T4 hours at room temperature.

D.F.

W 0

17 Durability

Perform the initial measurement.

I.R.

25Ω • F min.

#Measurement after test

W 0

Perform a heat treatment at 150Y10D for one hour and then

let sit for 48T4 hours at room temperature, then measure.

31

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Low-dissipation Type

e

g

e

■ Features

1. Mobile telecommunication and RF module, mainly

2. Quality improvement of telephone calls, Low power

consumption, yield ratio improvement

L

W

■ Applications

VCO, PA, Mobile Telecommunications

Dimensions (mm)

T

Part Number

6

L

W

e

g min.

0.4

0.2

1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.15 to 0.3

0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.1 to 0.2

GJM15

GJM03

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

GJM1555C1HR50CB01

GJM1555C1HR75CB01

GJM1555C1H1R0CB01

GJM1555C1H1R1CB01

GJM1555C1H1R2CB01

GJM1555C1H1R3CB01

GJM1555C1H1R5CB01

GJM1555C1H1R6CB01

GJM1555C1H1R8CB01

GJM1555C1H2R0CB01

GJM1555C1H2R2CB01

GJM1555C1H2R4CB01

GJM1555C1H2R7CB01

GJM1555C1H3R0CB01

GJM1555C1H3R3CB01

GJM1555C1H3R6CB01

GJM1555C1H3R9CB01

GJM1555C1H4R0CB01

GJM1555C1H4R3CB01

GJM1555C1H4R7CB01

GJM1555C1H5R0CB01

GJM1555C1H5R1CB01

GJM1555C1H5R6CB01

GJM1555C1H6R0CB01

GJM1555C1H6R0DB01

GJM1555C1H6R2CB01

GJM1555C1H6R8CB01

GJM1555C1H7R0CB01

GJM1555C1H7R0DB01

GJM1555C1H7R5CB01

GJM1555C1H8R0CB01

GJM1555C1H8R0DB01

GJM1555C1H8R2CB01

GJM1555C1H9R0CB01

GJM1555C1H9R0DB01

GJM1555C1H9R1CB01

GJM1555C1H100JB01

GJM1555C1H100RB01

C0G (EIA)

50

0.50 ±0.25pF

0.75 ±0.25pF

1.0 ±0.25pF

1.1 ±0.25pF

1.2 ±0.25pF

1.3 ±0.25pF

1.5 ±0.25pF

1.6 ±0.25pF

1.8 ±0.25pF

2.0 ±0.25pF

2.2 ±0.25pF

2.4 ±0.25pF

2.7 ±0.25pF

3.0 ±0.25pF

3.3 ±0.25pF

3.6 ±0.25pF

3.9 ±0.25pF

4.0 ±0.25pF

4.3 ±0.25pF

4.7 ±0.25pF

5.0 ±0.25pF

5.1 ±0.25pF

5.6 ±0.25pF

6.0 ±0.25pF

6.0 ±0.5pF

6.2 ±0.25pF

6.8 ±0.25pF

7.0 ±0.25pF

7.0 ±0.5pF

7.5 ±0.25pF

8.0 ±0.25pF

8.0 ±0.5pF

8.2 ±0.25pF

9.0 ±0.25pF

9.0 ±0.5pF

9.1 ±0.25pF

10 ±5%

1.00

0.50

10 ±2.5%

Continued on the following page.

32

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

TC Code

(Standard)

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

GJM1555C1H120JB01

GJM1555C1H150JB01

GJM1555C1H180JB01

C0G (EIA)

50

12 ±5%

15 ±5%

18 ±5%

1.00

0.50

6

33

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

Item

Test Method

Temperature Compensating Type

Y55 to W125D

Operating

Temperature Range

1

2

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, V or V ,

P-P

O-P

Rated Voltage

See the previous pages

whichever is larger, should be maintained within the rated

voltage range.

Visual inspection

Using calipers

3

4

Appearance

Dimensions

No defects or abnormalities

Within the specified dimensions

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds,

provided the charge/discharge current is less than 50mA.

6

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25D and 75%RH

max. and within 2 minutes of charging.

Insulation Resistance

(I.R.)

6

7

10,000MΩ min. or 500Ω • F min. (Whichever is smaller)

Capacitance

Within the specified tolerance

The capacitance/Q should be measured at 25D at the

frequency and voltage shown in the table.

Char.

Frequency

Voltage

∆C (1000pF and below)

1T0.1MHz

Item

30pF max. : QU400W20C

C : Nominal Capacitance (pF)

8

Q

0.5 to 5Vr.m.s.

Capacitance

Change

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Temperature Compensating Type

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

Within the specified tolerance (Table A)

Temperature

Coefficient

When cycling the temperature sequentially from step 1 through

5, (∆C : W25D toW125D : other temp. coeffs. : W25D to 85D)

the capacitance should be within the specified tolerance for the

temperature coefficient and capacitance change as Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

Capacitance

Temperature

Characteristics

9

Capacitance

Drift

Within T0.2% or T0.05pF

(Whichever is larger.)

Step

Temperature (D)

25T2

1

2

3

4

5

Y55T3

25T2

125T3

25T2

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply a 5N* force in parallel

with the test jig for 10T1sec. The soldering should be done either

with an iron or using the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such

as heat shock.

*2N (GJM03)

c

Adhesive Strength

of Termination

10

No removal of the terminations or other defect should occur.

Solder resist

Baked electrode or

copper foil

Type

a

b

c

GJM03

GJM15

0.3

0.4

0.9

1.5

0.3

0.5

(in mm)

Fig. 1

Continued on the following page.

34

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature Compensating Type

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz.

The frequency range, from 10 to 55Hz and return to 10Hz,

should be traversed in approximately 1 minute. This motion

should be applied for a period of 2 hours in each of 3 mutually

perpendicular directions (total of 6 hours).

Vibration

Resistance

11

30pF max. : QU400W20C

C : Nominal Capacitance (pF)

Q

Solder the capacitor to the test jig (glass epoxy boards) shown

in Fig. 2 using a eutectic solder.

No cracking or marking defects should occur

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

6

soldering is uniform and free of defects such as heat shock

.

b

φ4.5

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

c

12 Deflection

R230

a

t : 0.8mm

100

Type

a

b

c

Flexure : V1

GJM03

GJM15

0.3

0.4

0.9

1.5

0.3

0.5

Capacitance meter

45 45

(in mm)

Fig. 2

Fig. 3

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Preheat at 80 to 120D for 10 to 30 seconds. After preheating,

immerse in eutectic solder solution for 2T0.5 seconds at 230T5D.

Solderability of

Termination

75% of the terminations are to be soldered evenly and

continuously.

13

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

Preheat the capacitor at 120 to 150D for 1 minute.

Immerse the capacitor in a eutectic solder solution at 270T5D

for 10T0.5 seconds.

Resistance

14 to Soldering

Heat

30pF and below : QU400W20C

C : Nominal Capacitance (pF)

Q

Let sit at room temperature for 24T2 hours.

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following table.

Let sit for 24T2 hours at room temperature, then measure.

Appearance

No marking defects

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

Temperature

15

Step

1

2

3

4

Cycle

30pF and below : QU400W20C

C : Nominal Capacitance (pF)

Q

Min. Operating

Temp.

Max. Operating

Temp.

Room

Temp.

Room

Temp.

Temp. (D)

W0

Y3

W3

Y0

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

30T3

Time (min.)

2 to 3

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Let the capacitor sit at 40T2D and 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) at room temperature, then measure.

Humidity,

16 Steady

State

Capacitance

Change

Within T5% or T0.5pF

(Whichever is larger)

5

2

10pF and over, 30pF and below : QU275W

10pF and below : QU200W10C

C

Q

C : Nominal Capacitance (pF)

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Continued on the following page.

35

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature Compensating Type

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T7.5% or T0.75pF

(Whichever is larger)

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours.

Humidity

Load

17

10

3

Remove and let sit for 24T2 hours at room temperature, then

measure. The charge/discharge current is less than 50mA.

30pF and below : QU100W

C

Q

C : Nominal Capacitance (pF)

I.R.

More than 500MΩ or 25Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

6

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T3% or T0.3pF

(Whichever is larger)

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D. Let sit for 24T2 hours

(temperature compensating type) at room temperature, then

measure.

High

5

2

18 Temperature

Load

10pF and over, 30pF and below : QU275W

10pF and below : QU200W10C

C : Nominal Capacitance (pF)

C

Q

The charge/discharge current is less than 50mA.

I.R.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

No failure

Dielectric

Strength

0.5pFVCV1pF : 350mΩ • pF below

The ESR should be measured at room Temperature. and

frequency 1T0.2GHz with the equivalent of BOONTON Model

34A.

1pFFCV5pF

: 300mΩ below

5pFFCV10pF : 250mΩ below

19 ESR

The ESR should be measured at room Temperature. and

frequency 500T50MHz with the equivalent of HP8753B.

10pFFCV20pF : 400mΩ below

Table A

Capacitance Change from 25D Value (% )

Temp. Coeff.

(ppm/D) Note 1

Y55D

Y30D

Y10D

Char. Code

Max.

Min.

Max.

Min.

Max.

Min.

0T30

Y0.24

Y0.17

Y0.11

5C

0.58

0.40

0.25

Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.(for ∆C)

36

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Data

■ Capacitance-Temperature Characteristics

■ Capacitance-DC Voltage Characteristics

Measuring condition Z5U

X7R, Y5V

C0G

: 1kHz, 0.5Vrms

: 1kHz, 1Vrms

: 1MHz, 1Vrms

Measuring condition : 1MHz, 1Vrms

10

+40

+20

0

5

C0G 50V

C0G

0

−20

−40

−60

−80

−100

P2H

R2H

S2H

T2H

U2J

X7R 50V

Z5U 50V

−5

−10

Y5V 50V

40 50

6

−60

−40

−20

0

20

40

60

80

100

120

Temperature [˚C]

0

10

20

DC Voltage [Vdc]

30

■ Capacitance-AC Voltage Characteristics

■ Capacitance Change-Aging

Measuring condition C0G

X7R, Z5U, Y5V

: 1MHz

: 1kHz

10

0

+80

+60

C0G

X7R

−10

−20

−30

−40

+40

Y5V, Z5U

Z5U 50V

Y5V 50V

+20

X7R 50V

0

C0G 50V

0

50 100

1000

10000

−20

0

Time [Hr]

1

2

3

AC Voltage [Vrms]

■ Impedance-Frequency Characteristics

■ Allowable Voltage-Frequency

[∆T=20˚C]

C0G (GRM21)

100

1 [pF]

10 [pF]

1pF

10

100 [pF]

10

1000 [pF]

1

100m

10M

10m

1M

100M

1G

10M

100M

Frequency [Hz]

1G

Frequency [Hz]

Continued on the following page.

37

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM Series Data

Continued from the preceding page.

■ Allowable Current-Frequency

■ Allowable Apparent Power

[∆T=20˚C]

10

100

1000pF

1

100pF

10

10pF

1pF

6

1pF

100m

1

10m

10M

100m

10M

100M

Frequency [Hz]

1G

100M

Frequency [Hz]

1G

38

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Microchips

L

W

■ Features

1. Better microwave characteristics

2. Suitable for by-passing

3. High density mounting

■ Applications

1. Optical device for telecommunication

2. IC, IC packaging built-in

Dimensions (mm)

W

Part Number

L

T

3. Measuring equipment

0.5 ±0.05

0.8 ±0.05

0.5 ±0.05

0.8 ±0.05

0.35 ±0.05

0.5 ±0.1

GMA05X

GMA085

7

TC Cod

(Standard)

Rated Voltage

(Vdc)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

Capacitance

GMA05XR71H471MD01

GMA05XR71C102MD01

GMA05XR71C152MD01

GMA05XR71C222MD01

GMA085R71C103MD01

GMA05XF51C472ZD01

GMA05XF51C682ZD01

GMA085F51C473ZD01

GMA05XF51A153ZD01

GMA085F51A104ZD01

X7R (EIA)

Y5V (EIA)

50

16

10

470pF ±20%

1000pF ±20%

0.5

0.8

0.5

0.8

0.5

0.8

0.5

0.8

0.5

0.8

0.5

0.8

0.35

0.5

1500pF ±20%

2200pF ±20%

10000pF ±20%

4700pF +80/-20%

6800pF +80/-20%

47000pF +80/-20%

15000pF +80/-20%

0.10µF +80/-20%

0.35

0.5

0.35

0.5

39

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

R7 : Y55D to W125D

F5 : Y30D to W85D

Temperature

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated volt-

age range.

Visual inspection

3

4

Appearance

Dimensions

No defects or abnormalities

See the previous pages.

No failure should be observed when a voltage of 250% of the rated

voltage is applied between the both terminations for 1 to 5 seconds,

provided the charge/discharge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at normal temperature and

humidity and within 2 minutes of charging.

Insulation Resistance

10,000MΩ min.

(I.R.)

6

7

8

7

The capacitance should be measured at 25D with 1T0.1kHz in

frequency and 1T0.2Vr.m.s. in voltage.

Capacitance

Within the specified tolerance

R7 : 0.035 max.

F5 : 0.09 max. (for 16V)

F5 : 0.125 max. (for 10V)

Dissipation Factor

(D.F.)

D.F. should be measured under the same conditions at the

capacitance.

The range of capacitance change in reference to 25D within

the temperature range shown in the table should be within the

specified ranges.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Temp. Range Reference Temp. Cap. Change Rate

Capacitance

Temperature

Characteristics

Char.

R7

F5

Y55 to W125D

Y30 to W85D

25D

WithinT15%

9

22

WithinT %

82

MIL-STD-883 Method 2011 Condition D

Mount the capacitor on a gold metallized alumina substrate with

Au-Sn (80/20) and bond a 20µm (0.0008 inch) gold wire to the

capacitor terminal using an ultrasonic wedge bond. Then, pull

wire.

Bond

Strength

Pull force : 3.0g min.

Mechanical

Strength

10

MIL-STD-883 Method 2019

Mount the capacitor on a gold metallized alumina substrate

with Au-Sn (80/20). Apply the force parallel to the substrate.

Die Shear

Strength

Die Shear force : 200g min.

Appearance

No defects or abnormalities

Within the specified tolerance

Ramp frequency from 10 to 55Hz then return to 10Hz all within

1 minute. Amplitude : 1.5 mm (0.06 inch) max. total excursion.

Apply this motion for a period of 2 hours in each of 3 mutually

perpendicular directions (total 6 hours).

Capacitance

Vibration

Resistance

D.F.

11

R7 : 0.035 max.

F5 : 0.09 max. (for 16V)

F5 : 0.125 max. (for 10V)

The capacitor should be set for 48T4 hours at room tempera-

W0

The measured values should satisfy the values in the following

table.

ture after one hour heat of treatment at 150

D, then mea-

Y10

sure for the initial measurement. Fix the capacitor to the sup-

porting jig in the same manner and under the same conditions

as (11) and conduct the five cycles according to the tempera-

tures and time shown in the following table. Set it for 48T4

hours at room temperature, then measure.

Item

Appearance

Specifications

No marked defect

WithinT7.5%

WithinT20%

More than 10,000MΩ

.......

R7

F5

Capacitance Change

I.R.

12 Temperature Cycle

.......

Step

1

2

3

4

R7

F5

0.035 max.

0.09 max.(for 16V)

0.125 max.(for 10V)

Min. Operating

Temp.

Max. Operating

Temp.

Room

Temp.

Room

Temp.

D.F.

Temp.(D)

W0

Y3

W3

Y0

Dielectric Strength

No failure

30T3

Time(min.)

2 to 3

The measured values should satisfy the values in the following

table.

Item

Specifications

Appearance

No marked defect

Set the capacitor for 500T12 hours at 40T20D, in 90 to 95%

humidity.

Take it out and set it for 48T4 hours at room temperature, then

measure.

.......

R7

F5

WithinT12.5%

WithinT30%

Capacitance Change

I.R.

Humidity

13

(Steady State)

More than 1,000MΩ

.......

R7

F5

0.05 max.

0.125 max.(for 16V)

0.15 max.(for 10V)

D.F.

Dielectric Strength

No failure

Continued on the following page.

40

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

The measured values should satisfy the values in the following

table.

Apply the rated voltage for 500T12 hours at 40T20D, in 90 to

95% humidity and set it for 48T4 hours at room temperature,

then measure. The charge/discharge current is less than

50mA.

Item

Specifications

Appearance

No marked defect

.......

R7

F5

WithinT12.5%

30

WithinT

40

Capacitance Change

I.R.

%

14 Humidity Load

# Initial measurement for Y5V

Perform a heat treatment at 150

More than 500MΩ

W0

Y10

D for one hour and then

.......

R7

F5

0.05 max.

0.125 max.(for 16V)

0.15 max.(for 10V)

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

D.F.

Dielectric Strength

No failure

The measured values should satisfy the values in the following

table.

A voltage treatment should be given to the capacitor, in which a

DC voltage of 200% the rated voltage is applied for one hour at

the maximum operating temperature T3D then it should be set

for 48T4 hours at room temperature and the initial measurement

should be conducted.

Then apply the above mentioned voltage continuously for

1000T12 hours at the same temperature, remove it from the

bath, and set it for 48T4 hours at room temperature, then

measure. The charge/discharge current is less than 50mA.

Item

Specifications

Appearance

No marked defect

.......

R7

F5

WithinT12.5%

30

WithinT

40

Capacitance Change

I.R.

High Temperature

Load

%

15

7

More than 1,000MΩ

.......

R7

F5

0.05 max.

0.125 max.(for 16V)

0.15 max.(for 10V)

D.F.

Dielectric Strength

No failure

Mounting for testing : The capacitors should be mounted on the substrate as shown below using die bonding and wire bonding when tests No. 11 to 15 are performed.

Capacitor

Gold wire

Die bond

Gold land

Alumina substrate

Gold land

41

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Capacitor Arrays

GNM1M2/212

P

GNM214/314

P

■ Features

1. High density mounting due to mounting space saving

2. Mounting cost saving

■ Applications

L

W

General electronic equipment

Dimensions (mm)

Part Number

L

W

T

P

1.37 ±0.15

1.0 ±0.15

0.6 ±0.1

0.85 ±0.1

0.6 ±0.1

0.8 ±0.1

1.0 ±0.1

0.64 ±0.05

1.0 ±0.1

0.5 ±0.05

GNM1M2

GNM212

GNM214

2.0 ±0.15

1.25 ±0.15

1.6 ±0.15

3.2 ±0.15

0.8 ±0.1

GNM314

Temperature Compensating Type

8

Part Number

L x W

GNM31

3.2x1.6

C0G

(5C)

TC

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

10pF(100)

11pF(110)

12pF(120)

13pF(130)

15pF(150)

16pF(160)

18pF(180)

20pF(200)

22pF(220)

24pF(240)

27pF(270)

30pF(300)

33pF(330)

36pF(360)

39pF(390)

43pF(430)

47pF(470)

51pF(510)

56pF(560)

62pF(620)

68pF(680)

75pF(750)

82pF(820)

91pF(910)

100pF(101)

110pF(111)

120pF(121)

130pF(131)

150pF(151)

160pF(161)

180pF(181)

0.8(4)

Continued on the following page.

42

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

GNM31

3.2x1.6

C0G

(5C)

TC

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

200pF(201)

220pF(221)

240pF(241)

270pF(271)

300pF(301)

330pF(331)

360pF(361)

0.8(4)

The part numbering code is shown in each ( ). The (4) code in T(mm) means number of elements (four).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GNM1 Series

8

Part Number

L x W

GNM1M

1.37x1.00

X7R

(R7)

TC

16

(1C)

10

(1A)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

22000pF(223)

47000pF(473)

0.10µF(104)

0.6(2)

The part numbering code is shown in each ( ). The (2) code in T(mm) means number of elements (two).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GNM2 Series

Part Number

L x W

GNM21

2.0x1.25

X7R

(R7)

TC

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

1000pF(102)

10000pF(103)

0.6(4)

The part numbering code is shown in each ( ). The (4) code in T(mm) means number of elements (four).

Dimensions are shown in mm and Rated Voltage in Vdc.

High Dielectric Constant Type GNM3 Series

Part Number

L x W

GNM31

3.2x1.6

X7R

(R7)

Y5V

(F5)

TC

100

(2A)

50

(1H)

25

(1E)

16

(1C)

100

(2A)

50

(1H)

16

(1C)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

220pF(221) 0.8(4)

Continued on the following page.

43

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

GNM31

3.2x1.6

X7R

(R7)

Y5V

(F5)

TC

100

(2A)

50

(1H)

25

(1E)

16

(1C)

100

(2A)

50

(1H)

16

(1C)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

270pF(271)

330pF(331)

0.8(4)

390pF(391)

0.8(4)

470pF(471)

560pF(561)

680pF(681)

820pF(821)

1000pF(102)

1200pF(122)

1500pF(152)

1800pF(182)

2200pF(222)

2700pF(272)

3300pF(332)

3900pF(392)

4700pF(472)

5600pF(562)

6800pF(682)

8200pF(822)

10000pF(103)

12000pF(123)

15000pF(153)

18000pF(183)

22000pF(223)

27000pF(273)

33000pF(333)

39000pF(393)

47000pF(473)

68000pF(683)

0.10µF(104)

0.15µF(154)

0.8(4)

8

0.8(4)

1.0(4)

0.8(4)

The part numbering code is shown in each ( ). The (4) code in T(mm) means number of elements (four).

Dimensions are shown in mm and Rated Voltage in Vdc.

44

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

R7 : Y55D to +125D

F5 : Y30D to +85D

Operating

Temperature Range

5C : Y55D to +125D

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated volt-

age range.

Visual inspection

Using calipers

3

4

Appearance

Dimension

No defects or abnormalities

Within the specified dimensions

No failure should be observed when 300% of the rated voltage

(5C) or 250% of the rated voltage (R7, F5) is applied between

the terminations for 1 to 5 seconds, provided the charge/dis-

charge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25D and 75%RH max.

and within 2 minutes of charging.

More than 10,000MΩ or 500Ω • F

Insulation Resistance

6

7

(Whichever is smaller)

Capacitance

Within the specified tolerance

The capacitance/Q/D.F. should be measured at 25D at the fre-

8

quency and voltage shown in the table.

30pF min. : QU1000

Char.

25V min.

Char.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

16V

10V

0.035 max.

Y

30pF max. : QU400+20C

5C

R7, F5

Item

Q/Dissipation Factor

(D.F.)

8

Frequency

Voltage

1T0.1MHz

1T0.1kHz

C : Nominal Capacitance

(pF)

1.0T0.2Vr.m.s.

0.5 to 5Vr.m.s.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

(1)Temperature Compensating Type

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step1

through 5, the capacitance should be within the specified

tolerance for the temperature coefficient and capacitance

change as Table A.

Temp. Reference

Char.

Cap.

Change

Range

Temp.

Capacitance

Change

Within the specified

tolerance (Table A)

Y55 to W125D

Y30 to W85D

WithinT15

%

R7

F5

25D

W22

WithinT

Y82

Temperature

Coefficient

Within the specified

tolerance (Table A)

The capacitance drift is calculated by dividing the

differences between the maximum and minimum measured

values in steps 1, 3 and 5 by the capacitance value in step 3.

Capacitance

Temperature

Characteristics

9

Step

Temperature (D)

1

25T2

Y55T3 (for 5C/ R7), Y30T3 (for F5)

25T2

Capacitance

Drift

Within T0.2% or T0.05 pF

(Whichever is larger)

2

3

4

5

125T3 (for 5C/R7), 85T3 (F5)

25T2

(2)High Dielectric Constant Type

The ranges of capacitance change compared with the

above 25D value over the temperature ranges shown in the

table should be within the specified ranges.

No removal of the terminations or other defect should occur.

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 5N force in parallel

with the test jig for 10T1 sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

a

Adhesive Strength

of Termination

10

Type

a

b

c

d

GNM1M

GNM21

GNM31

0.5

0.4

0.8

Y

1.6

2.5

0.32

0.25

0.4

0.32

0.5

0.8

Solder resist

Copper foil

(in mm)

Fig. 1

Continued on the following page.

45

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

Appearance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz.

The frequency range, from 10 to 55Hz and return to 10Hz,

should be traversed in approximately 1 minute. This motion

should be applied for a period of 2 hours in each of 3 mutually

perpendicular directions (total of 6 hours).

Capacitance

30pF min. : QU1000

30pF max. : QU400W20C Char.

Vibration

Resistance

11

25V min.

16V

10V

0.035 max.

Y

Q/D.F.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

C : Nominal Capacitance

(pF)

No cracking or marking defects should occur.

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the direc-

tion shown in Fig. 3 for 5T1 sec. The soldering should be done

either with an iron or using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

#GNMpp4

#GNMpp2

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

100

1.0

100

1.0

5.0

a

b

a

b

R230

12 Deflection

8

c

Flexure : V1

c

d

Type

a

b

c

d

Capacitance meter

45 45

2.0T0.05 0.5T0.05

2.0T0.05 0.7T0.05 0.3T0.05 0.2T0.05

2.5T0.05 0.8T0.05 0.4T0.05 0.4T0.05

0.32T0.05

GNM1M

GNM21

GNM31

(in mm)

Fig. 3

(in mm)

t=0.8mm (GNM21), 1.6mm (GNM31)

Fig. 2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120D for 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

Solderability of

Termination

75% of the terminations are to be soldered evenly and

continuously.

13

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Preheat the capacitor at 120 to 150D for 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5D for 10T0.5

seconds. Let sit at room temperature for 24T2 hours (tempera-

ture compensating type) or 48T4 hours (high dielectric constant

type), then measure.

R7 : Within T7.5%

F5 : Within T20%

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

Resistance

14 to Soldering

Heat

30pF min. : QU1000

30pF max. : QU400+20C

25V min.

Char.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

16V

10V

0.035 max.

Y

Q/D.F.

I.R.

# Initial measurement for high dielectric constant type

W0

C : Nominal Capacitance

(pF)

Perform a heat treatment at 150

D for one hour and then

Y10

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10). Perform the five cycles

according to the four heat treatments listed in the following

table. Let sit for 24T2 hours (temperature compensating type)

or 48T4 hours (high dielectric constant type) at room tempera-

ture, then measure

Appearance

No marking defects

R7 : Within T7.5%

F5 : Within T20%

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

30pF min. : QU1000

30pF max. : QU400+20C

Step

1

2

3

4

Temperature

15

25V min.

Char.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

16V

10V

0.035 max.

Y

Min. Operating

Temp.

Max. Operating

Temp.

Room

Temp.

Room

Temp.

Cycle

Temp. (D)

W0

Y3

W3

Y0

Q/D.F.

I.R.

C : Nominal Capacitance

(pF)

30T3

Time (min.)

2 to 3

# Initial measurement for high dielectric constant type

W0

Perform a heat treatment at 150

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

D for one hour and then

Y10

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

Dielectric

Strength

No failure

Continued on the following page.

46

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature

Compensating Type

High Dielectric Type

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R7 : Within T12.5%

F5 : Within T30%

Capacitance

Change

Within T5% or T0.5pF

(Whichever is larger)

Let the capacitor sit at 40T2D and 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) or 48T4 hours (high dielectric constant type) at room tem-

perature, then measure.

30pF and over : QU350

10pF and over, 30pF and

below :

QU275+5C/2

10pF and below :

QU200+10C

Humidity

16 Steady

State

25V min.

16V

10V

0.035 max.

Y

Char.

Q/D.F.

I.R.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

C : Nominal Capacitance

(pF)

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

8

Appearance

No marking defects

R7 : Within T12.5%

F5 : Within T30%

Capacitance

Change

Within T7.5% or T0.75pF

(Whichever is larger)

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours (temperature

compensating type) or 48T4 hours (high dielectric constant

type) at room temperature, then measure. The charge/dis-

charge current is less than 50mA.

30pF and over : QU200

30pF and below :

QU100+10C/3

Humidity

Load

17

25V min.

16V

10V

0.035 max.

Y

Char.

Q/D.F.

I.R.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

C : Nominal Capacitance

(pF)

More than 500MΩ or 25Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

R7 : Within T12.5%

F5 : Within T30%

Capacitance

Change

Within T3% or T0.3pF

(Whichever is larger)

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D. Let sit for 24T2 hours

(temperature compensating type) or 48T4 hours (high dielectric

constant type) at room temperature, then measure.

30pF and over : QU350

10pF and over, 30pF and

below :

QU275+5C/2

10pF and below :

QU200+10C

High

The charge/discharge current is less than 50mA.

18 Temperature

Load

25V min.

Char.

R7 0.025 max. 0.035 max.

F5 0.05 max. 0.07 max.

16V

10V

0.035 max.

Y

Q/D.F.

#Initial measurement for high dielectric constant type.

Apply 200% of the rated DC voltage for one hour at the maxi-

mum operating temperature T3D. Remove and let sit for 48T4

hours at room temperature. Perform initial measurement.

C : Nominal Capacitance

(pF)

I.R.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Table A

Capacitance Change from 25D (% )

Y30

Nominal Values

Y55

Y10

Char.

(ppm/D) Note 1

Max.

Min.

Max.

Min.

Max.

Min.

0T30

Y0.24

Y0.17

Y0.11

5C

0.58

0.40

0.25

Note 1 : Nominal values denote the temperature coefficient within a range of 25D to 125D.

47

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

for Ultrasonic Sensors

e

g

e

■ Features

1. Proper compensation for ultrasonic sensors

2. Small chip size and high capacitance value

■ Application

Ultrasonic sensor

L

W

(back sonar, corner sonar, etc.)

Dimensions (mm)

T

Part Number

L

W

e

g min.

2.0 ±0.1 1.25 ±0.1 0.85 ±0.1 0.2 to 0.7

0.7

GRM219

Rated Voltage

(Vdc)

Capacitance

(pF)

Length L

(mm)

Width W

(mm)

Thickness T

(mm)

Part Number

TC Code

GRM2199E2A102KD42

GRM2199E2A152KD42

ZLM (Murata)

100

1000 ±10%

1500 ±10%

2.0

1.25

0.85

9

48

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y25D to W85D

Temperature

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated volt-

age range.

Visual inspection.

Using calipers.

3

4

Appearance

Dimensions

No defects or abnormalities

Within the specified dimensions

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

5

6

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 20D and 75%RH max.

and within 2 minutes of charging.

Insulation Resistance

More than 10,000MΩ or 500Ω • F. (Whichever is smaller)

(I.R.)

7

8

Capacitance

Within the specified tolerance

0.01 max.

The capacitance/D.F. should be measured at 20D with

1T0.1kHz in frequency and 1T0.2Vr.m.s. in voltage.

Dissipation Factor

(D.F.)

The temperature coefficient is determined using the

capacitance measured in step 1 as a reference.

When cycling the temperature sequentially from step 1 through

5, the capacitance should be within the specified tolerance for

the temperature coefficient.

9

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Capacitance

Temperature

Characteristics

W1,000

Y2,500

Y

D

Y

W

D

Within 4,700

ppm/ (at 25 to 20

)

9

W500

Y1,000

Y

D W W

ppm/ (at 20 to 85

Within 4,700

Step

Temperature(D)

20T2

1

2

3

4

5

Y25T3

20T2

85T3

20T2

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.1 using a eutectic solder. Then apply 10N force in the

direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

c

Adhesive Strength

of Termination

10

No removal of the terminations or other defect should occur.

Solder resist

Baked electrode or

copper foil

Type

GRM21

a

1.2

b

4.0

c

1.65

(in mm)

Fig.1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute. This motion should be

applied for a period of 2 hours in each of 3 mutually perpendic-

ular directions (total of 6 hours).

Vibration

Resistance

D.F.

11

0.01 max.

Continued on the following page.

49

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Solder the capacitor to the test jig (glass epoxy boards) shown

in Fig. 2 using a eutectic solder.

No cracking or marking defects should occur.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

φ4.5

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

c

12 Deflection

R230

a

t : 1.6mm

100

Flexure : V1

Type

GRM21

a

1.2

b

4.0

c

Capacitance meter

45 45

1.65

(in mm)

Fig. 2

Fig.3

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120D for 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

Solderability of

Termination

75% of the terminations are to be soldered evenly and

continuously

13

Appearance

No defects or abnormalities

9

Capacitance

Change

Within T7.5%

Preheat the capacitor at 120 to 150D for 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5D for 10T0.5

seconds. Let sit at room temperature for 24T2 hours, then

measure.

Resistance

14 to Soldering D.F.

0.01 max.

Heat

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Appearance

No defects or abnormalities

Within T7.5%

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (11).

Perform the five cycles according to the four heat treatments

listed in the following table. Let sit for 24T2 hours at room tem-

perature, then measure.

Capacitance

Change

Temperature

Cycle

15

D.F.

I.R.

0.01 max.

Step

1

2

3

4

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

W0

Y3

W3

Y0

Y25

85

Temp. (D)

RoomTemp.

2 to 3

RoomTemp.

2 to 3

Dielectric

Strength

No failure

30T3

Time (min.)

Appearance

No defects or abnormalities

Within T12.5%

Capacitance

Change

Sit the capacitor at 40T2D and 90 to 95% humidity for 500T12

Humidity,

16 Steady

State

hours.

D.F.

I.R.

0.02 max.

Remove and let sit for 24T2 hours at room temperature, then

measure.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Appearance

No defects or abnormalities

Within T12.5%

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours at room tem-

perature, then measure. The charge/discharge current is less

than 50mA.

Capacitance

Change

Humidity

Load

17

D.F.

0.02 max.

I.R.

More than 500MΩ or 25Ω • F (Whichever is smaller)

No defects or abnormalities

Appearance

Capacitance

Change

High

Apply 200% of the rated voltage for 1,000T12 hours at 85T3D.

Let sit for 24T2 hours at room temperature, then measure.

The charge/discharge current is less than 50mA.

Within T12.5%

18 Temperature

Load

D.F.

I.R.

0.02 max.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

50

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Low ESL

W

L

■ Features

1. Low ESL, good for noise reduction for high

frequency

2. Small, high capacitance

Dimensions (mm)

■ Applications

1. High speed micro processors

Part Number

L

W

0.8 ±0.1

T

1.6 ±0.1

0.6 max.

0.6 ±0.1

0.85 ±0.1

0.7 ±0.1

1.15 ±0.1

LLL185

2. High frequency digital equipment

LLL216

2.0 ±0.1

1.25 ±0.1

1.6 ±0.15

LLL219

LLL317

LLL31M

3.2 ±0.15

LLL18 Series

Part Number

L x W

LLL18

1.6x0.8

X7R

(R7)

Y5V

(F5)

TC

10

50

(1H)

25

(1E)

16

(1C)

10

(1A)

25

(1E)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

2200pF(222)

3300pF(332)

4700pF(472)

6800pF(682)

10000pF(103)

15000pF(153)

22000pF(223)

33000pF(333)

47000pF(473)

68000pF(683)

0.10µF(104)

0.5(5)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

LLL21 Series

Part Number

L x W

LLL21

2.0x1.25

X7R

(R7)

TC

50

(1H)

25

(1E)

16

(1C)

10

(1A)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

4700pF(472)

6800pF(682)

10000pF(103)

15000pF(153)

22000pF(223)

33000pF(333)

47000pF(473)

0.6(6)

0.85(9)

0.6(6)

Continued on the following page.

51

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

LLL21

2.0x1.25

X7R

(R7)

TC

50

(1H)

25

(1E)

16

(1C)

10

(1A)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

68000pF(683)

0.10µF(104)

0.15µF(154)

0.22µF(224)

0.33µF(334)

0.47µF(474)

0.6(6)

0.85(9)

0.6(6)

0.85(9)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

LLL31 Series

Part Number

L x W

LLL31

3.2x1.6

X7R

(R7)

TC

50

(1H)

25

(1E)

16

(1C)

10

(1A)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

10

10000pF(103)

15000pF(153)

22000pF(223)

33000pF(333)

47000pF(473)

68000pF(683)

0.10µF(104)

0.15µF(154)

0.22µF(224)

0.33µF(334)

0.47µF(474)

0.68µF(684)

1.0µF(105)

0.7(7)

1.15(M)

0.7(7)

1.15(M)

0.7(7)

1.15(M)

0.7(7)

1.5µF(155)

1.15(M)

2.2µF(225)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

52

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Temperature

Range

Test Method

R7 : Y55D to W125D

F5 : Y30D to W85D

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated

voltage range.

Visual inspection

Using calipers

3

4

Appearance

Dimensions

No defects or abnormalities

Within the specified dimension

No failure should be observed when 250% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25D and 75%RH max.

and within 2 minutes of charging.

Insulation Resistance

(I.R.)

6

7

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Capacitance

Within the specified tolerance

The capacitance/D.F. should be measured at 25D at the

frequency and voltage shown in the table.

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

Y

R7

Item

Dissipation Factor

(D.F.)

8

Frequency

Voltage

1T0.1kHz

1T0.2Vr.m.s.

The ranges of capacitance change compared with the 25D

value over the temperature ranges shown in the table should

be within the specified ranges.

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Temp. Range (D)

Y55 to W125

Y30 to W85

Capacitance

Temperature

Characteristics

Char.

R7

F5

Reference Temp. Cap. Change.

25D

WithinT15%

WithinW22/Y82%

9

10

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 10N^*force in the

direction of the arrow. *5N: LLL18

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

c

Adhesive Strength

of Termination

10

No removal of the terminations or other defect should occur.

Solder resist

Baked electrode or

copper foil

Type

a

b

c

LLL18

LLL21

LLL31

0.3

0.6

1.0

1.2

1.6

3.0

2.0

2.4

3.7

(in mm)

Fig. 1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute.

Vibration

Resistance

D.F.

11

Char.

R7

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

Y

F5

This motion should be applied for a period of 2 hours in each of

3 mutually perpendicular directions (total of 6 hours).

Continued on the following page.

53

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Solder the capacitor to the test jig (glass epoxy boards) shown

in Fig. 2 using a eutectic solder.

No crack or marked defect should occur.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

φ4.5

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

c

12 Deflection

R230

a

t : 1.6mm

100

Flexure : V1

Type

a

b

c

Capacitance meter

45 45

LLL18

LLL21

LLL31

0.3

0.6

1.0

1.2

1.6

3.0

2.0

2.4

3.7

(in mm)

Fig. 3

Fig. 2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120D for 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

Solderability of

Termination

75% of the terminations are to be soldered evenly and

continuously.

13

Appearance

No defects or abnormalities

Preheat the capacitor at 120 to 150D for 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5D for 10T0.5

seconds. Let sit at room temperature for 48T4 hours , then

measure.

R7 : WithinT7.5%

F5 : WithinT20%

Capacitance

Change

10

Resistance

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

Y

14 to Soldering D.F.

Heat

#Initial measurement.

W0

Perform a heat treatment at 150

D for one hour and then

Y10

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

No failure

let sit for 48T4 hours at room temperature. Perform the initial

measurement.

Dielectric

Strength

Appearance

No defects or abnormalities

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10).

Perform the five cycles according to the four heat treatments

listed in the following table. Let sit for 48T4 hours at room tem-

perature, then measure.

R7 : WithinT7.5%

F5 : WithinT20%

Capacitance

Change

Char.

R7

F5

25V min.

0.025 max.

0.05 max.

16V

0.035 max.

Y

D.F.

I.R.

Step

1

2

3

4

Temperature

Cycle

Min. Operating

Temp.

Max. Operating

Temp.

Room

Temp.

Room

Temp.

15

Temp. (D)

W0

Y3

W3

Y0

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

30T3

Time (min.)

2 to 3

#Initial measurement.

Perform a heat treatment at 150

let sit for 48T4 hours at room temperature. Perform the initial

Dielectric

Strength

W0

Y10

D for one hour and then

No failure

measurement.

Appearance

No defects or abnormalities

R7 : WithinT12.5%

F5 : WithinT30%

Capacitance

Change

Let the capacitor sit at 40T2D and 90 to 95% humidity for

500T12 hours.

Remove and let sit for 48T4 hours at room temperature, then

measure.

Humidity,

16 Steady

State

Char.

R7

25V min.

0.05 max.

0.075 max.

16V

0.05 max.

Y

D.F.

F5

I.R.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Appearance

No defects or abnormalities

R7 : WithinT12.5%

F5 : WithinT30%

Capacitance

Change

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours. Remove and let sit for 48T4 hours at room tem-

perature, then measure. The charge/discharge current is less

than 50mA.

Char.

R7

F5

25V min.

0.05 max.

0.075 max.

16V

0.05 max.

Y

Humidity

Load

17

D.F.

I.R.

More than 500MΩ or 25Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Continued on the following page.

54

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No defects or abnormalities

No.

Item

Test Method

Appearance

Apply 200% of the rated voltage for 1,000T12 hours at maxi-

mum operating temperature T3D. Let sit for 48T4 hours at

room temperature, then measure.

R7 : WithinT12.5%

F5 : WithinT30%

Capacitance

Change

The charge/discharge current is less than 50mA.

High

Char.

R7

F5

25V min.

0.05 max.

0.075 max.

16V

0.05 max.

Y

18 Temperature

Load

D.F.

I.R.

#Initial measurement.

Apply 200% of the rated DC voltage for one hour at the maxi-

mum operating temperature T3D.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Remove and let sit for 48T4 hours at room temperature.

Perform initial measurement.

Dielectric

Strength

No failure

10

55

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

High Frequency for Flow/Reflow Soldering

e

g

e

■ Features

1. HiQ and low ESR at VHF, UHF, Microwave

2. Feature improvement, low power consumption for

mobile telecommunication. (Base station, terminal,

etc.)

L

W

■ Applications

High frequency circuit (Mobile telecommunication, etc.)

Dimensions (mm)

T

Part Number

L

W

e

g min.

0.5

0.7

1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5

2.0 ±0.1 1.25 ±0.1 0.85 ±0.1 0.2 to 0.7

GQM188

GQM219

Part Number

L x W

GQM18

GQM21

1.60x0.80

2.00x1.25

C0G

(5C)

C0G

(5C)

TC

100

(2A)

50

(1H)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF(R50)

0.75pF(R75)

1.0pF(1R0)

1.1pF(1R1)

1.2pF(1R2)

1.3pF(1R3)

1.5pF(1R5)

1.6pF(1R6)

1.8pF(1R8)

2.0pF(2R0)

2.2pF(2R2)

2.4pF(2R4)

2.7pF(2R7)

3.0pF(3R0)

3.3pF(3R3)

3.6pF(3R6)

3.9pF(3R9)

4.0pF(4R0)

4.3pF(4R3)

4.7pF(4R7)

5.0pF(5R0)

5.1pF(5R1)

5.6pF(5R6)

6.0pF(6R0)

6.2pF(6R2)

6.8pF(6R8)

7.0pF(7R0)

7.5pF(7R5)

8.0pF(8R0)

8.2pF(8R2)

9.0pF(9R0)

9.1pF(9R1)

10pF(100)

0.80(8)

0.85(9)

11

0.80(8)

Continued on the following page.

56

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

GQM18

GQM21

1.60x0.80

2.00x1.25

C0G

(5C)

C0G

(5C)

TC

100

(2A)

50

(1H)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

11pF(110)

12pF(120)

13pF(130)

15pF(150)

16pF(160)

18pF(180)

20pF(200)

22pF(220)

24pF(240)

27pF(270)

30pF(300)

33pF(330)

36pF(360)

39pF(390)

43pF(430)

47pF(470)

0.80(8)

0.85(9)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

■ Q-Frequency Characteristics

■ Resonant Frequency-Capacitance

11

Q-Frequency Characteristics

GQM18

Resonant Frequency • Capacitance

10000

100

6.8pF

2.4pF 1pF

1000

100

10

GQM21

1

GQM18

10

1

0

0.1

1

10

100

Capacitance (pF)

100M

1G

Frequency (Hz)

10G

57

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

5C : Y55D to 125D

Temperature

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, V or V ,

P-P

O-P

2

Rated Voltage

See the previous page.

whichever is larger, should be maintained within the rated

voltage range.

Visual inspection

Using calipers

3

4

Appearance

Dimension

No defects or abnormalities

Within the specified dimensions

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds,

provided the charge/discharge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC

voltage not exceeding the rated voltage at 25D and 75%RH

max. and within 2 minutes of charging.

More than 10,000MΩ or 500Ω • F

Insulation Resistance

6

7

(whichever is smaller)

Capacitance

Q

Within the specified tolerance

The capacitance/Q should be measured at 25D at the

frequency and voltage shown in the table.

30pF min. : QU1000

30pF max. : QU400+20C

Char.

Frequency

Voltage

5C (1000pF and below)

Item

8

1T0.1MHz

0.5 to 5Vrms

C : Nominal Capacitance (pF)

Capacitance

Change

The temperature coefficient is determined using the capaci-

tance measured in step 3 as a reference.

Within the specified tolerance (Table A)

When cycling the temperature sequentially from step 1 through 5

the capacitance should be within the specified tolerance for the

temperature coefficient and capacitance change as in Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in the

steps 1, 3 and 5 by the capacitance. value in step 3.

Temperature

Coefficient

Within the specified tolerance (Table A)

Capacitance

Temperature

Characteristics

9

11

Step

Temperature (D)

25T2

Capacitance

Drift

Within T0.2% or T0.05pF

(Whichever is larger.)

1

2

3

4

5

Y55T3

25T2

125T3

25T2

No removal of the terminations or other defect should occur.

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply 10N* force in parallel

with the test jig for 10T1sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

*5N (GQM188)

c

Adhesive Strength

of Termination

10

Type

a

b

c

GQM18

GQM21

GQM32

1.0

1.2

2.2

3.0

4.0

5.0

1.2

1.65

2.9

Solder resist

Baked electrode or

copper foil

(in mm)

Fig .1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (10).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should

be traversed in approximately 1 minute.

Vibration

Resistance

Q

30pF min. : QU1000

30pF max. : QU400+20C

11

C : NominalCapacitance (pF)

This motion should be applied for a period of 2 hours in each of

3 mutually perpendicular directions (total of 6 hours).

Continued on the following page.

58

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

No crack or marked defect should occur.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

φ4.5

c

20

Pressurizing

50

speed : 1.0mm/sec.

Pressurize

a

12 Deflection

100

R230

t : 1.6mm

Type

a

b

c

Flexure : V1

GQM18

GQM21

GQM32

1.0

1.2

2.2

3.0

4.0

5.0

1.2

1.65

2.9

Capacitance meter

45 45

(in mm)

Fig. 2

Fig. 3

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120D for 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2T0.5 seconds at 230T5D.

Solderability of

Termination

75% of the terminations are to be soldered evenly

and continuously.

13

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T2.5% or T0.25 pF

(Whichever is larger)

Preheat the capacitor at 120 to 150D for 1 minute. Immerse the

capacitor in a eutectic solder solution at 270T5D for 10T0.5

seconds. Let sit at room temperature for 24T2 hours.

Resistance

14 to Soldering

Heat

30pF min. : QU1000

30pF max. : QU400+20C

Q

11

C : Nominal Capacitance (pF)

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (10).

Perform the five cycles according to the four heat treatments

listed in the following table.

Appearance

No marking defects

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

Temperature

Let sit for 24T2 hours at room temperature, then measure.

30pF min. : QU1000

30pF max. : QU400+20C

15

Cycle

Step

1

2

3

4

Q

Min. Operating

Temp.W0/Y3

Max. operating

Temp.W3/Y0

Room

Temp.

Room

Temp.

Temp. (D)

C : Nominal Capacitance (pF)

30T3

Time (min.)

2 to 3

I.R.

More than 10,000MΩ or 500Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T5% or T0.5pF

(Whichever is larger)

Let the capacitor sit at 40T2D and 90 to 95% humidity for

500T12 hours.

Remove and let sit for 24T2 hours (temperature compensating

type) at room temperature, then measure.

Humidity

16 Steady

State

30pF min. : QU350

10pF and over, 30pF and below : QU275+5C/2

10pF max. : QU200+10C

Q

C : Nominal Capacitance (pF)

I.R.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

Continued on the following page.

59

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T7.5% or T0.75pF

(Whichever is larger)

Apply the rated voltage at 40T2D and 90 to 95% humidity for

500T12 hours. Remove and let sit for 24T2 hours at room tem-

perature then measure. The charge/discharge current is less

than 50mA.

Humidity

Load

30pF min. : QU200

30pF max. : QU100+10C/3

17

Q

C : Nominal Capacitance (pF)

I.R.

More than 500MΩ or 25Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

The measured and observed characteristics should satisfy the

specifications in the following table.

Appearance

No marking defects

Capacitance

Change

Within T3% or T0.3pF

(Whichever is larger)

Apply 200% of the rated voltage for 1000T12 hours at the

maximum operating temperature T3D.

Let sit for 24T2 hours (temperature compensating type) at

room temperature, then measure.

High

30pF min. : QU350

10pF and over, 30pF and below : QU275+5C/2

10pF max. : QU200+10C

18 Temperature

Load

Q

The charge/discharge current is less than 50mA.

C : Nominal Capacitance (pF)

I.R.

More than 1,000MΩ or 50Ω • F (Whichever is smaller)

Dielectric

Strength

No failure

11

Table A

Capacitance Change from 25D (% )

Nominal Values

Y55

Y30

Y10

Char.

(ppm/D) Note 1

Max.

Min.

Max.

Min.

Max.

Min.

0T30

Y0.24

Y0.17

Y0.11

5C

0.58

0.40

0.25

Note1 : Nominal values denote the temperature coefficient within a range of 25D to 125D (for 5C)

60

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

High-Q & High Power Type

SMD Type

e

■ Features (ERF Series)

1. The dielectric is composed of low dielectric loss

ceramic. This series is perfectly suited to

high frequency applications (VHS-microwave band).

2. The series is ultraminiature, yet has a high-power

capacity. This is the best capacitor available for

L

W

Dimensions (mm)

transmitter and amplifier circuits such as those

in broadcasting equipment and mobile base stations.

3. ERF1D type is designed for both flow and reflow

soldering and ERF22 type is designed for reflow

soldering.

Part Number

L

+0.6

- 0.4

+0.6

- 0.4

W

+0.6

- 0.4

+0.6

- 0.4

T

e

+0.50

- 0.35

+0.25

- 0.15

+0.4

- 0.3

1.4

2.8

1.4

2.8

1.15

2.3

0.25

0.4

ERF1DM

ERF22X

+0.5

- 0.3

■ Applications

High frequency and high power circuits

Part Number

L x W

ERF1D

ERF22

2.80x2.80

1.40x1.40

C0G

(5C)

CH

(6C)

C0G

(5C)

CH

(6C)

TC

50

(1H)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

12

0.50pF(R50) 1.15(M)

0.6pF(R60) 1.15(M)

0.7pF(R70) 1.15(M)

0.75pF(R75)

1.15(M)

2.30(X)

0.8pF(R80) 1.15(M)

0.9pF(R90) 1.15(M)

1.0pF(1R0) 1.15(M)

1.1pF(1R1) 1.15(M)

1.2pF(1R2) 1.15(M)

1.3pF(1R3) 1.15(M)

1.4pF(1R4) 1.15(M)

1.5pF(1R5) 1.15(M)

1.6pF(1R6) 1.15(M)

1.7pF(1R7) 1.15(M)

1.8pF(1R8) 1.15(M)

1.9pF(1R9) 1.15(M)

2.0pF(2R0) 1.15(M)

2.1pF(2R1) 1.15(M)

2.2pF(2R2) 1.15(M)

2.4pF(2R4) 1.15(M)

2.7pF(2R7) 1.15(M)

3.0pF(3R0) 1.15(M)

3.3pF(3R3) 1.15(M)

3.6pF(3R6) 1.15(M)

3.9pF(3R9) 1.15(M)

4.0pF(4R0)

2.30(X)

1.15(M)

2.30(X)

1.15(M)

2.30(X)

4.3pF(4R3) 1.15(M)

4.7pF(4R7) 1.15(M)

2.30(X)

Continued on the following page.

61

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERF1D

ERF22

1.40x1.40

2.80x2.80

C0G

(5C)

CH

(6C)

C0G

(5C)

CH

(6C)

TC

50

(1H)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

5.0pF(5R0)

1.15(M)

2.30(X)

5.1pF(5R1) 1.15(M)

5.6pF(5R6) 1.15(M)

6.0pF(6R0)

2.30(X)

6.2pF(6R2) 1.15(M)

6.8pF(6R8) 1.15(M)

7.0pF(7R0)

2.30(X)

1.15(M)

2.30(X)

7.5pF(7R5) 1.15(M)

8.0pF(8R0)

2.30(X)

8.2pF(8R2) 1.15(M)

9.0pF(9R0)

9.1pF(9R1) 1.15(M)

10pF(100) 1.15(M)

11pF(110) 1.15(M)

12pF(120) 1.15(M)

13pF(130) 1.15(M)

15pF(150) 1.15(M)

16pF(160) 1.15(M)

18pF(180) 1.15(M)

20pF(200) 1.15(M)

22pF(220) 1.15(M)

24pF(240) 1.15(M)

27pF(270) 1.15(M)

30pF(300) 1.15(M)

33pF(330) 1.15(M)

36pF(360) 1.15(M)

39pF(390) 1.15(M)

43pF(430) 1.15(M)

47pF(470) 1.15(M)

51pF(510) 1.15(M)

56pF(560) 1.15(M)

62pF(620) 1.15(M)

68pF(680) 1.15(M)

75pF(750) 1.15(M)

82pF(820) 1.15(M)

91pF(910) 1.15(M)

100pF(101) 1.15(M)

110pF(111)

2.30(X)

1.15(M)

2.30(X)

12

2.30(X)

120pF(121)

130pF(131)

150pF(151)

160pF(161)

180pF(181)

200pF(201)

220pF(221)

2.30(X)

240pF(241)

270pF(271)

300pF(301)

330pF(331)

360pF(361)

390pF(391)

430pF(431)

Continued on the following page.

62

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERF1D

ERF22

1.40x1.40

2.80x2.80

C0G

(5C)

CH

(6C)

C0G

(5C)

CH

(6C)

TC

50

(1H)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

470pF(471)

510pF(511)

560pF(561)

620pF(621)

680pF(681)

750pF(751)

820pF(821)

910pF(911)

1000pF(102)

2.30(X)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

Ribbon Terminal

■ Features (ERH Series)

L

1. The dielectric is composed of low dielectric loss

ceramics. This series is perfectly suited to high

frequency applications (VHS-microwave band).

2. The series is ultraminiature, yet has a high power

capacity. This is the best capacitor available for

transmitter and amplifier circuits such as those

***

R

Silver ribbon leads.

0.1 - 0.2

: Capacitance Code

***

in broadcasting equipment and mobile base stations.

3. ERH1X/3X Series capacitors withstand high

temperatures because ribbon leads are attached with

silver paste.

Dimensions (mm)

T max.

Part Number

L

W

R

w

12

1.6 ±0.4 1.4 ±0.4

3.2 ±0.4 2.8 ±0.4

1.6

3.0

5.0 min. 1.3 ±0.4

9.0 ±2.0 2.35 ±0.15

ERH1XC

ERH3XX

4. ERH1X/3X Series capacitors are easily soldered and

especially well suited in applications where only

a soldering iron can be used.

■ Applications

High frequency and high power circuits

Part Number

L x W

ERH1X

ERH3X

3.20x2.80

1.60x1.40

C0G

(5C)

CH

(6C)

C0G

(5C)

CH

(6C)

TC

50

(1H)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF(R50) 1.60(C)

0.6pF(R60) 1.60(C)

0.7pF(R70) 1.60(C)

0.75pF(R75)

1.60(C)

3.00(X)

0.8pF(R80) 1.60(C)

0.9pF(R90) 1.60(C)

1.0pF(1R0) 1.60(C)

1.1pF(1R1) 1.60(C)

1.2pF(1R2) 1.60(C)

1.3pF(1R3) 1.60(C)

1.4pF(1R4) 1.60(C)

1.5pF(1R5) 1.60(C)

3.00(X)

1.60(C)

3.00(X)

Continued on the following page.

63

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERH1X

ERH3X

1.60x1.40

3.20x2.80

C0G

(5C)

CH

(6C)

C0G

(5C)

CH

(6C)

TC

50

(1H)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

1.6pF(1R6) 1.60(C)

1.7pF(1R7) 1.60(C)

1.8pF(1R8) 1.60(C)

1.9pF(1R9) 1.60(C)

2.0pF(2R0) 1.60(C)

2.1pF(2R1) 1.60(C)

2.2pF(2R2) 1.60(C)

2.4pF(2R4) 1.60(C)

2.7pF(2R7) 1.60(C)

3.0pF(3R0) 1.60(C)

3.3pF(3R3) 1.60(C)

3.6pF(3R6) 1.60(C)

3.9pF(3R9) 1.60(C)

4.0pF(4R0)

3.00(X)

1.60(C)

3.00(X)

1.60(C)

3.00(X)

4.3pF(4R3) 1.60(C)

4.7pF(4R7) 1.60(C)

5.0pF(5R0)

3.00(X)

5.1pF(5R1) 1.60(C)

5.6pF(5R6) 1.60(C)

6.0pF(6R0)

3.00(X)

6.2pF(6R2) 1.60(C)

6.8pF(6R8) 1.60(C)

7.0pF(7R0)

3.00(X)

1.60(C)

3.00(X)

7.5pF(7R5) 1.60(C)

8.0pF(8R0)

3.00(X)

12

8.2pF(8R2) 1.60(C)

9.0pF(9R0)

9.1pF(9R1) 1.60(C)

10pF(100) 1.60(C)

11pF(110) 1.60(C)

12pF(120) 1.60(C)

13pF(130) 1.60(C)

15pF(150) 1.60(C)

16pF(160) 1.60(C)

18pF(180) 1.60(C)

20pF(200) 1.60(C)

22pF(220) 1.60(C)

24pF(240) 1.60(C)

27pF(270) 1.60(C)

30pF(300) 1.60(C)

33pF(330) 1.60(C)

36pF(360) 1.60(C)

39pF(390) 1.60(C)

43pF(430) 1.60(C)

47pF(470) 1.60(C)

51pF(510) 1.60(C)

56pF(560) 1.60(C)

62pF(620) 1.60(C)

68pF(680) 1.60(C)

75pF(750) 1.60(C)

82pF(820) 1.60(C)

91pF(910) 1.60(C)

3.00(X)

1.60(C)

3.00(X)

Continued on the following page.

64

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERH1X

ERH3X

1.60x1.40

3.20x2.80

C0G

(5C)

CH

(6C)

C0G

(5C)

CH

(6C)

TC

50

(1H)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

500

(2H)

300

(YD)

200

(2D)

100

(2A)

50

(1H)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

1.60(C) 3.00(X) 3.00(X)

100pF(101) 1.60(C)

110pF(111)

120pF(121)

130pF(131)

150pF(151)

160pF(161)

180pF(181)

200pF(201)

220pF(221)

240pF(241)

270pF(271)

300pF(301)

330pF(331)

360pF(361)

390pF(391)

430pF(431)

470pF(471)

510pF(511)

560pF(561)

620pF(621)

680pF(681)

750pF(751)

820pF(821)

910pF(911)

1000pF(102)

3.00(X)

12

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

65

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y55D to W125D

Temperature Range

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated volt-

age range.

Visual inspection

Using calipers

3

4

Appearance

Dimensions

No defects or abnormalities

Within the specified dimension

No failure should be observed when 250% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

470pFFCV1,470pF :1,000,000MΩ min.

470pFFCV1,000pF :1,100,000MΩ min.

25D

Insulation

Resistance

(I.R.)

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25D and 125D standard

humidity and within 2 minutes of charging.

6

470pFFCV1,470pF :1,100,000MΩ min.

470pFFCV1,000pF :1,110,000MΩ min.

125D

7

8

Capacitance

Q

Within the specified tolerance.

The capacitance/Q should be measured at 25D at the frequen-

cy and voltage shown in the table.

220pF<CV1,220pF : QU10,000

220pF<CV1,470pF : QU15,000

470pF<CV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Item

Frequency

1T0.1MHz

Voltage

0.5 to 5Vr.m.s.

Capacitance

Variation

Rate

The temperature coefficient is determined using the capaci-

tance measured in step 3 as a reference. When cycling the

temperature sequentially from step 1 through 5, the capaci-

tance should be within the specified tolerance for the tempera-

ture coefficient and capacitance change as Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

Within the specified tolerance (Table A-7)

Temperature

Coefficient

Capacitance

Temperature

Characteristics

The capacitance change should be measured after 5 min. at

each specified temperature stage.

9

Step

Temperature (D)

25T2

Capacitance Within T0.2% or T0.05pF

12

1

Drift

(Whichever is larger)

2

3

4

5

Y55T3

25T2

125T3

25T2

Solder the capacitor to the test jig (alumina substrate) shown in

Fig. 1 using solder containing 2.5% silver. The soldering should

be done either with an iron or in furnace and be conducted with

care so the soldering is uniform and free of defects such as heat

shock. Then apply a 10N* force in the direction of the arrow.

Adhesive

Strength of

Termination

(for chip type)

No removal of the terminations or other defects should occur.

*ERF1D : 5N

10N*

Alumina substrate

Terminal

Strength

Fig. 1

10

Tensile

Strength

(for micro-

strip type)

The capacitor body is fixed and a load is applied gradually in

the axial direction until its value reaches 10N (5N for ERH1X).

Capacitor should not be broken or damaged.

Lead wire should not be cut or broken.

Bending

Position the main body of the capacitor so the lead wire termi-

nal is perpendicular, and load 2.5N to the lead wire terminal.

Bend the main body by 90 degrees, bend back to original posi-

tion, bend 90 degrees in the reverse direction, and then bend

back to original position.

Strength of

lead wire

terminal

(for micro-

strip type)

Continued on the following page.

66

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (alumina substrate) shown in

Fig. 2 using solder containing 2.5% silver. The soldering should

be done either with an iron or using the reflow method and should

be conducted with care so the soldering is uniform and free of

defects such as heat shock. The capacitor should be subjected to

a simple harmonic motion having a total amplitude of 1.5mm, the

frequency being varied uniformly between the approximate limits

of 10 and 55Hz. The frequency range, from 10 to 55Hz and

return to 10Hz, should be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours in each of 3

mutually perpendicular directions (total of 6 hours).

Satisfies the initial value.

Vibration

Resistance

11

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Q

Solder resist

Ag/Pd

Alumina substrate

Fig. 2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

Solderability of

Termination

95% of the terminations are to be soldered evenly and continuous- 80 to 120D for 10 to 30 seconds. After preheating immerse in

12

ly.

solder containing 2.5% silver for 5T0.5 seconds at 230T5D.

The dipping depth for microstrip type capacitors is up to 1 mm

from the root of the terminal.

The measured and observed characteristics should satisfy the

specifications in the following table.

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T2.5% or T0.25pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

Preheat the capacitor at 80 to 100D for 2 minutes and then at

150 to 200D for 5 minutes.

Immerse in solder containing 2.5% silver for 3T0.5 seconds at

270T5D. Set at room temperature for 24T2 hours, then mea-

sure. The dipping depth for microstrip type capacitors is up to

2mm from the root of the terminal.

Resistance

to Soldering Heat

13

Q

I.R.

12

No failure

Dielectric Strength

C : Nominal Capacitance (pF)

The measured and observed characteristics should satisfy the

specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (11). Perform the five cycles

according to the four heat treatments listed in the following table.

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T1% or T0.25pF

(Whichever is larger)

Then, repeat twice the successive cycles of immersion, each

W5

Y0

cycle consisting of immersion in a fresh water at 65

D for 15

minutes and immersion in a saturated aqueous solution of salt at

0T3D for 15 minutes.

The capacitor is promptly washed with running water, dried with a

dry cloth, and allowed to sit at room temperature for 24T2 hours.

Temperature

Cycle

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

14

Q

Step

1

2

3

4

I.R.

W0

Y3

W3

Y0

Y55

125

Temp.(D)

RoomTemp.

2 to 3

RoomTemp.

2 to 3

No failure

Dielectric Strength

30T3

Time(min.)

C : Nominal Capacitance (pF)

Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 98%)

treatment shown below, 10 consecutive times. Remove, let sit for

24T2 hours at room temperature, and measure.

Humidity

Humidity 80 98%

90 98%

Humidity

Humidity 80 98%

90 98%

-

D

70

65

60

55

50

45

40

35

30

25

20

15

10

5

The measured and observed characteristics should satisfy the

specifications in the following table.

-

Humidity90-98%

-

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T5% or T0.5pF

(Whichever is larger)

15 Humidity

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

Q

+10

-

D

2

Initial measurement

I.R.

Applied voltage 50Vdc

0

-5

C : Nominal Capacitance (pF)

-10

One cycle 24 hours

0

1

2

3

4

5

6

7

8

9 101112 1314 1516 17 18 19 2021222324

Hours

Continued on the following page.

67

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

The measured and observed characteristics should satisfy

the specifications in the following table.

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T2.5% or T0.25pF

(Whichever is larger)

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

More than 30% of the initial spec-

ification value at 25D.

Apply 150% of the rated voltage for 2,000T12 hours at 125T3D.

Remove and let sit for 24T2 hours at room temperature, then

measure.

High Temperature

Load

16

Q

The charge/discharge current is less than 50mA.

I.R.

C : Nominal Capacitance (pF)

Table A

Capacitance Change from 25D Value (% )

Y30D

Temp. Coeff.

(ppm/D) Note 1

Y55D

Y10D

Char. Code

Max.

Min.

Max.

Min.

Max.

Min.

0T30

Y0.24

Y0.17

Y0.11

5C

0.58

0.40

0.25

Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.

12

68

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

High Frequency Type

SMD Type

e

g

e

■ Features (ERA Series)

1. Negligible inductance is achieved by its monolithic

structure so the series can be used at frequencies

above 1GHz.

L

W

2. Nickel barriered terminations of ERA series improve

Dimensions (mm)

T max.

solderability and decrease solder leaching.

3. ERA11A/21A series are designed for both flow and

reflow soldering and ERA32 series are designed for

reflow soldering.

Part Number

L

W

e

g min.

+0.5

- 0.3

+0.5

- 0.3

+0.6

- 0.4

+0.5

- 0.3

+0.5

- 0.3

+0.5

- 0.3

1.0±0.2 0.15 min. 0.3

1.0±0.2

ERA11A

1.25

2.0

1.0

1.25

2.5

ERA21A

ERA21B

0.2 min.

0.5

1.25±0.2

1.7±0.2 0.3 min.

0.5

ERA32X

3.2

■ Applications

High frequency and high power circuits

Part Number

L x W

ERA11

ERA21

ERA32

1.25x1.00

2.00x1.25

3.20x2.50

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

TC

200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200

(2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF 1.00

1.20 1.00

1.00 1.70

1.70

(R50) (A)

(A) (A)

(A) (X)

(X)

0.6pF 1.00

1.00

1.70

(R60) (A)

(A)

(X)

0.7pF 1.00

(R70) (A)

1.00

1.70

13

(A)

(X)

0.75pF

1.20

1.00

1.70

(R75)

(A)

(X)

0.8pF 1.00

1.00

1.70

(R80) (A)

(A)

(X)

0.9pF 1.00

1.00

1.70

(R90) (A)

(A)

(X)

1.0pF 1.00

1.20 1.00

1.00 1.70

1.70

(1R0) (A)

(A) (A)

(A) (X)

(X)

1.1pF 1.00

1.00

1.70

(1R1) (A)

(A)

(X)

1.2pF 1.00

1.00

1.70

(1R2) (A)

(A)

(X)

1.3pF 1.00

1.00

1.70

(1R3) (A)

(A)

(X)

1.4pF 1.00

1.00

1.70

(1R4) (A)

(A)

(X)

1.5pF 1.00

1.20 1.00

1.00 1.70

1.70

(1R5) (A)

(A) (A)

(A) (X)

(X)

1.6pF 1.00

1.00

1.70

(1R6) (A)

(A)

(X)

1.7pF 1.00

1.00

1.70

(1R7) (A)

(A)

(X)

1.8pF 1.00

1.00

1.70

(1R8) (A)

(A)

(X)

Continued on the following page.

69

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERA11

ERA21

ERA32

1.25x1.00

2.00x1.25

3.20x2.50

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

TC

200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200

(2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

1.9pF 1.00

1.00

1.70

(1R9) (A)

(A)

(X)

2.0pF 1.00

1.20 1.00

1.00 1.70

1.70

(2R0) (A)

(A) (A)

(A) (X)

(X)

2.1pF 1.00

1.00

1.70

(2R1) (A)

(A)

(X)

2.2pF 1.00

1.00

1.70

(2R2) (A)

(A)

(X)

2.4pF 1.00

1.00

1.70

(2R4) (A)

(A)

(X)

2.7pF 1.00

1.00

1.70

(2R7) (A)

(A)

(X)

3.0pF 1.00

1.20

1.00

1.70

(3R0) (A)

(A)

(X)

3.3pF 1.00

1.00

1.70

(3R3) (A)

(A)

(X)

3.6pF 1.00

1.00

1.70

(3R6) (A)

(A)

(X)

3.9pF 1.00

1.00

1.70

(3R9) (A)

(A)

(X)

4.0pF

1.00

1.70

(4R0)

(A)

(X)

4.3pF 1.00

1.00

1.70

(4R3) (A)

(A)

(X)

4.7pF 1.00

1.00

1.70

(4R7) (A)

(A)

(X)

5.0pF

(5R0)

1.00

1.70

13

(A)

(X)

5.1pF 1.00

1.00

1.70

(5R1) (A)

(A)

(X)

5.6pF 1.00

1.00

1.70

(5R6) (A)

(A)

(X)

6.0pF

1.00

1.70

(6R0)

(A)

(X)

6.2pF 1.00

1.00

1.70

(6R2) (A)

(A)

(X)

6.8pF 1.00

1.00

1.70

(6R8) (A)

(A)

(X)

7.0pF

1.20

1.00

1.70

(7R0)

(A)

(X)

7.5pF 1.00

1.00

1.70

(7R5) (A)

(A)

(X)

8.0pF

1.20

1.00

1.70

(8R0)

(A)

(X)

8.2pF 1.00

1.00

1.70

(8R2) (A)

(A)

(X)

9.0pF

1.20 1.00

1.25

1.70

(9R0)

(A) (A)

(B)

(X)

9.1pF 1.00

1.25

1.70

(9R1) (A)

(B)

(X)

10pF 1.00

1.00 1.00

1.25

1.70

(100) (A)

(A) (A)

(B)

(X)

Continued on the following page.

70

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERA11

ERA21

ERA32

1.25x1.00

2.00x1.25

3.20x2.50

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

TC

200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200

(2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

11pF 1.00

1.00 1.00

1.25

1.70

(110) (A)

(A) (A)

(B)

(X)

12pF 1.00

1.00 1.00

1.25

1.70

(120) (A)

(A) (A)

(B)

(X)

13pF 1.00

1.00 1.00

1.25

1.70

(130) (A)

(A) (A)

(B)

(X)

15pF

1.00

1.25

1.70

(150)

(A)

(B)

(X)

16pF

1.00

1.00 1.00

1.25

1.00

1.70

(160)

(A)

(A) (A)

(B)

(X)

18pF

1.00

1.00 1.00

1.25

1.70

(180)

(A)

(A) (A)

(B)

(X)

20pF

1.00

1.00 1.00

1.25

1.70

(200)

(A)

(A) (A)

(B)

(X)

22pF

1.00

1.00 1.00

1.25

1.70

(220)

(A)

(A) (A)

(B)

(X)

24pF

1.00

1.25

1.70

(240)

(A)

(B)

(X)

27pF

1.00

1.25

1.70

(270)

(A)

(B)

(X)

30pF

1.00

1.25

1.70

(300)

(A)

(B)

(X)

33pF

1.00

1.25

1.70

(330)

(A)

(B)

(X)

36pF

1.00

1.25

1.70

(360)

(A)

(B)

(X)

39pF

(390)

1.00

1.25

1.70

13

(A)

(B)

(X)

43pF

1.00

1.25

1.70

(430)

(A)

(B)

(X)

47pF

1.00

1.25

1.70

(470)

(A)

(B)

(X)

51pF

1.00

1.25

1.70

(510)

(A)

(B)

(X)

56pF

1.25

1.70

(560)

(B)

(X)

62pF

1.25

1.70

(620)

(B)

(X)

68pF

1.25

1.70

(680)

(B)

(X)

75pF

1.25

1.70

(750)

(B)

(X)

82pF

1.25

1.70

(820)

(B)

(X)

91pF

1.25

1.70

(910)

(B)

(X)

100pF

1.00

1.70

(101)

(A)

(X)

110pF

1.25

1.70

(111)

(B)

(X)

120pF

1.25

1.70

(121)

(B)

(X)

Continued on the following page.

71

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERA11

ERA21

ERA32

1.25x1.00

2.00x1.25

3.20x2.50

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

C0G

(5C)

CH

(6C)

CJ CK

(7C) (8C)

TC

200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200 200 100 50 200 100 50 200 200

(2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D) (2D) (2A) (1H) (2D) (2A) (1H) (2D) (2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

130pF

1.25

1.70

(131)

(B)

(X)

150pF

1.25

1.70

(151)

(B)

(X)

160pF

1.25

1.70

(161)

(B)

(X)

180pF

1.70

(181)

(X)

200pF

1.70

(201)

(X)

220pF

1.70

(221)

(X)

240pF

1.70

(241)

(X)

270pF

1.70

(271)

(X)

300pF

1.70

(301)

(X)

330pF

1.70

(331)

(X)

360pF

1.70

(361)

(X)

390pF

1.70

(391)

(X)

430pF

1.70

(431)

(X)

470pF

(471)

1.70

13

(X)

510pF

1.70

(511)

(X)

560pF

1.70

(561)

(X)

620pF

1.70

(621)

(X)

680pF

1.70

(681)

(X)

750pF

1.70

(751)

(X)

820pF

1.70

(821)

(X)

910pF

1.70

(911)

(X)

1000pF

1.70

(102)

(X)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

72

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Ribbon Terminal

■ Features (ERD Series)

L

1. Negligible inductance is achieved by its monolithic

structure so the series can be used at frequencies

above 1GHz.

***

10T1

2. ERD Series capacitors withstand at high

temperatures because ribbon leads are attached

with silver paste.

Silver ribbon leads.

0.1

: Capacitance Code

***

3. ERD Series capacitors are easily soldered and are

especially well suited in applications where only

a soldering iron can be used.

Dimensions (mm)

Part Number

L max.

4.0

W max.

3.0

T max.

2.3

ERD32D

■ Application

High frequency and high power circuits

Part Number

L x W

ERD32

4.00x3.00

C0G

(5C)

CH

(6C)

CJ

(7C)

CK

(8C)

TC

200

(2D)

100

(2A)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

200

(2D)

200

(2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

0.50pF(R50)

0.6pF(R60)

0.7pF(R70)

0.75pF(R75)

0.8pF(R80)

0.9pF(R90)

1.0pF(1R0)

1.1pF(1R1)

1.2pF(1R2)

1.3pF(1R3)

1.4pF(1R4)

1.5pF(1R5)

1.6pF(1R6)

1.7pF(1R7)

1.8pF(1R8)

1.9pF(1R9)

2.0pF(2R0)

2.1pF(2R1)

2.2pF(2R2)

2.4pF(2R4)

2.7pF(2R7)

3.0pF(3R0)

3.3pF(3R3)

3.6pF(3R6)

3.9pF(3R9)

4.0pF(4R0)

4.3pF(4R3)

4.7pF(4R7)

5.0pF(5R0)

5.1pF(5R1)

5.6pF(5R6)

6.0pF(6R0)

6.2pF(6R2)

6.8pF(6R8)

7.0pF(7R0)

2.30(D)

13

2.30(D)

Continued on the following page.

73

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERD32

4.00x3.00

C0G

(5C)

CH

(6C)

CJ

(7C)

CK

(8C)

TC

200

(2D)

100

(2A)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

200

(2D)

200

(2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

7.5pF(7R5)

8.0pF(8R0)

8.2pF(8R2)

9.0pF(9R0)

9.1pF(9R1)

10pF(100)

11pF(110)

12pF(120)

13pF(130)

15pF(150)

16pF(160)

18pF(180)

20pF(200)

22pF(220)

24pF(240)

27pF(270)

30pF(300)

33pF(330)

36pF(360)

39pF(390)

43pF(430)

47pF(470)

51pF(510)

56pF(560)

62pF(620)

68pF(680)

75pF(750)

82pF(820)

91pF(910)

100pF(101)

110pF(111)

120pF(121)

130pF(131)

150pF(151)

160pF(161)

180pF(181)

200pF(201)

220pF(221)

240pF(241)

270pF(271)

300pF(301)

330pF(331)

360pF(361)

390pF(391)

430pF(431)

470pF(471)

510pF(511)

560pF(561)

620pF(621)

680pF(681)

750pF(751)

820pF(821)

2.30(D)

13

2.30(D)

Continued on the following page.

74

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Part Number

L x W

ERD32

4.00x3.00

C0G

(5C)

CH

(6C)

CJ

(7C)

CK

(8C)

TC

200

(2D)

100

(2A)

50

(1H)

200

(2D)

100

(2A)

50

(1H)

200

(2D)

200

(2D)

Rated Volt.

Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)

910pF(911)

2.30(D)

1000pF(102)

The part numbering code is shown in ( ).

Dimensions are shown in mm and Rated Voltage in Vdc.

13

75

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y55D to W125D

Temperature Range

The rated voltage is defined as the maximum voltage which

may be applied continuously to the capacitor.

P-P

O-P

2

Rated Voltage

See the previous pages.

When AC voltage is superimposed on DC voltage, V or V ,

whichever is larger, should be maintained within the rated volt-

age range.

Visual inspection

Using calipers

3

4

Appearance

Dimensions

No defects or abnormalities

Within the specified dimension

No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provid-

ed the charge/discharge current is less than 50mA.

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with a DC volt-

age not exceeding the rated voltage at 25D and standard

humidity and within 2 minutes of charging.

Insulation Resistance

10,000MΩ min.

(I.R.)

6

7

Capacitance

Q

Within the specified tolerance

The capacitance/Q should be measured at 25D at the frequen-

cy and voltage shown in the table.

220pF<CV1,220pF : QU10,000

220pF<CV1,470pF : QU15,000

470pF<CV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Char.

Item

Frequency

Voltage

C0G (1,000pF and below)

1T0.1MHz

8

0.5 to 5Vr.m.s.

Capacitance

Variation

Rate

The temperature coefficient is determined using the capaci-

tance measured in step 3 as a reference. When cycling the

temperature sequentially from step 1 through 5, the capaci-

tance should be within the specified tolerance for the tempera-

ture coefficient and capacitance change as Table A.

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in steps

1, 3 and 5 by the capacitance value in step 3.

Within the specified tolerance (Table A-6)

Temperature

Coefficient

Capacitance

Temperature

Characteristics

The capacitance change should be measured after 5 min. at

each specified temperature stage.

9

Step

Temperature(D)

25T2

Capacitance Within T0.2% or T0.05pF

1

Drift

(Whichever is larger)

2

3

4

5

Y55T3

25T2

125T3

13

25T2

Solder the capacitor to the test jig (alumina substrate) shown in

Fig.1 using solder containing 2.5% silver. The soldering should

be done either with an iron or in furnace and be conducted with

care so the soldering is uniform and free of defects such as heat

Adhesive

*

shock. Then apply a 10N force in the direction of the arrow.

Strength of

Termination

(for chip type)

No removal of the terminations or other defects should occur.

*5N (ERA11)

10N^*

Alumina substrate

Terminal

Strength

Fig.1

10

Tensile

Strength

(for micro-

strip type)

The capacitor body is fixed and a load is applied gradually in

the axial direction until its value reaches 5N.

Capacitor should not be broken or damaged.

Lead wire should not be cut or broken.

Bending

Position the main body of the capacitor so the lead wire termi-

nal is perpendicular, and load 2.5N to the lead wire terminal.

Bend the main body by 90 degrees, bend back to original posi-

tion, bend 90 degrees in the reverse direction, and then bend

back to original position.

Strength of

lead wire

terminal

(for micro-

strip type)

Continued on the following page.

76

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (alumina substrate) shown in

Fig. 2 using solder containing 2.5% silver. The soldering should

be done either with an iron or using the reflow method and should

be conducted with care so the soldering is uniform and free of

defects such as heat shock. The capacitor should be subjected to

a simple harmonic motion having a total amplitude of 1.5mm, the

frequency being varied uniformly between the approximate limits

of 10 and 55Hz. The frequency range, from 10 to 55Hz and

return to 10Hz, should be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours in each of 3

mutually perpendicular directions (total of 6 hours).

Satisfies the initial value.

Vibration

Resistance

11

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

C : Nominal Capacitance (pF)

Q

Solder resist

Ag/Pd

Alumina substrate

Fig. 2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

Solderability of

Termination

75% of the terminations are to be soldered evenly and continuous- 80 to 120D for 10 to 30 seconds. After preheating immerse in

12

ly.

solder containing 2.5% silver for 5T0.5 seconds at 230T5D.

The dipping depth for microstrip type capacitors is up to 1 mm

from the root of the terminal.

The measured and observed characteristics should satisfy the

specifications in the following table.

Preheat according to the conditions listed in the table below.

Immerse in solder containing 2.5% silver for 3T0.5 seconds at

270T5D. Set at room temperature for 24T2 hours, then mea-

sure. The dipping depth for microstrip type capacitors is up to

2mm from the root of the terminal.

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T2.5% or T0.25pF

(Whichever is larger)

Resistance

to Soldering Heat

13

220pFFCV1,220pF : QU10,000

220pFFCV1,470pF : QU15,000

470pFFCV1,000pF : QU13,000

No failure

Chip Size

2.0Z1.25mm max.

3.2Z2.5mm

Preheat Condition

1minute at 120 to 150D

Q

Each 1 minute at 100 to 120D and then 170 to 200D

Dielectric Strength

C : Nominal Capacitance (pF)

The measured and observed characteristics should satisfy the

specifications in the following table.

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T5% or T0.5pF

(Whichever is larger)

10pFVCU30pF : QU350

10pFVCF30pF : QU275W

10pFVCF10pF : QU200W10C

1,000MΩ min.

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (11). Perform the five cycles

according to the four heat treatments listed in the following table.

Let sit for 24T2 hours at room temperature, then measure.

13

Temperature

Cycle

14

Step

1

2

3

4

5

2

C

Q

W0

Y3

W3

Y0

Y55

125

Temp.(D)

RoomTemp.

2 to 3

RoomTemp.

2 to 3

30T3

Time(min.)

I.R.

No failure

Dielectric Strength

C : Nominal Capacitance (pF)

Apply the 24-hour heat (Y10 to W65D) and humidity (80 to 98%)

treatment shown below, 10 consecutive times. Remove, let sit for

24T2 hours at room temperature, and measure.

Humidity

Humidity 80 98%

90 98%

Humidity

Humidity 80 98%

90 98%

-

D

70

65

60

55

50

45

40

35

30

25

20

15

10

5

-

The measured and observed characteristics should satisfy the

specifications in the following table.

-

Humidity90-98%

-

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T5% or T0.5pF

(Whichever is larger)

15 Humidity

10pFVCU30pF : QU350

10pFVCF30pF : QU275W

5

2

C

Q

+10

-

D

2

10pFVCF10pF : QU200W10C

1,000MΩ min.

Initial measurement

I.R.

C : Nominal Capacitance (pF)

Applied voltage 50Vdc

0

-5

-10

One cycle 24 hours

0

1

2

3

4

5

6

7

8

9 101112 1314 1516 17 18 19 2021222324

Hours

Continued on the following page.

77

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

The measured and observed characteristics should satisfy the

specifications in the following table.

Item

Appearance

Capacitance

Change

Specifications

No marked defect

Within T3% or T0.3pF

(Whichever is larger)

10pFVCU30pF : QU350

10pFVCF30pF : QU275W

Apply 200% of the rated voltage for 1,000T12 hours at 125T3D.

Remove and let sit for 24T2 hours at room temperature, then

measure.

High Temperature

Load

16

5

2

The charge/discharge current is less than 50mA.

C

Q

10pFVCF10pF : QU200W10C

1,000MΩ min.

I.R.

C : Nominal Capacitance (pF)

Table A

Capacitance Change from 25D Value (% )

Y30D

Temperature Coefficient

Y55D

Y10D

Char. Code

(ppm/D) Note 1

Max.

Min.

Max.

Min.

Max.

Min.

0T30

Y0.24

Y0.17

Y0.11

5C

0.58

0.40

0.25

Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.

13

78

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

ERA/ERD/ERF/ERH Series Data

■ Q-Frequency Characteristics

ERF Series

ERA Series

ERA21

ERF1D

100000

10000

1000

10000

1000

1pF

100

10

100

10

10pF

100pF

1

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

BOONTON RESONANT

COAXIAL-LINE 34A

0.1

100M

1G

Frequency [Hz]

10G

100M

1G

10G

Frequency [Hz]

■ Impedance-Frequency Characteristics

ERF Series

ERA Series

ERA21

100k

10k

ERF1D

100k

10k

PARALLEL

RESONANCE

1k

PARALLEL

1k

RESONANCE

100

10

1

10

1

13

1pF

10pF

100m

10m

1m

10pF

100pF

10m

1m

1M

10M

100M

1G

10G

1M

10M

100M

Frequency [Hz]

1G

10G

Frequency [Hz]

■ ESR-Frequency Characteristics

ERF Series

ERA Series

ERA21

ERF1D

1

1pF

10pF

100pF

1pF

10pF

100pF

0.1

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

measured by

BOONTON RESONANT

COAXIAL-LINE 34A

0.01

100M

1G

10G

1G

10G

Frequency [Hz]

Continued on the following page.

79

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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!Note

Note

C02E10.pdf 04.1.20

ERA/ERD/ERF/ERH Series Data

Continued from the preceding page.

■ Resonant Frequency-Capacitance

ERF Series

ERA Series

100G

10G

100G

10G

ERF1D

ERA21

1G

ERF22

ERA32

100M

0.1

1

10

100

1000

0.1

1

10

Capacitance [pF]

100

1000

Capacitance [pF]

■ Allowable Voltage-Frequency

■ Allowable Current-Frequency

[∆T=20˚C]

50V SERIES

[∆T=20˚C]

100

10

50V SERIES

ERF1D

GRM21

10

1

100m

10m

0.1

10M

100M

1G

10G

10M

100M

1G

10G

Frequency [Hz]

■ Allowable Apparent Power-Frequency

■ Allowable Effective Power-Frequency

13

[∆T=20˚C]

50V SERIES

[∆T=20˚C]

50V SERIES

1

100

100m

10m

1m

10

1

0.1

10M

100M

1G

10G

10M

100M

1G

10G

Frequency [Hz]

80

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Packaging Code

Packaging Type

Bulk Packaging

Tape Carrier Packaging

Bulk Case Packaging

Bulk Packaging in a bag

Bulk Packaging in a tray

Packaging Code

D, L, K, J, E, F

C

B

T

Minimum Quantity Guide

Quantity (pcs.)

ø330mm reel

Dimensions (mm)

Part Number

ø180mm reel

Bulk Case

Bulk Bag

L

W

T

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

Ultra Miniaturized GRM03

0.6

0.3

0.8

0.3

0.8

15,000

-

50,000

-

1,000

500

GRM18

1.6

4,000

-

10,000

-

15,000

0.6

4,000

-

10,000

-

10,000

0.85

1.0

4,000

-

10,000

-

GRM21

2.0

1.25

1.6

-

3,000

-

10,000

3)

For Flow/Reflow

1.25

0.6

-

10,000

5,000

4,000

10,000

-

0.85

1.15

1.6

4,000

-

10,000

-

GRM31

3.2

-

3,000

2,000

-

10,000

-

6,000

-

GRM155

GRM15X

1.0

0.5

10,000

50,000

-

50,000

0.25

1.15

1.35

1.8/1.6

2.0

10,000

-

50,000

-

3,000

2,000

1,000

500

1,000

500

300

-

10,000

-

8,000

-

GRM32

3.2

2.5

-

4,000

-

4,000

-

2.5

-

4,000

-

For Reflow

1.15

1.35/1.6

1.8/2.0

-

5,000

-

4,000

-

GRM43

4.5

5.7

3.2

5.0

2.5

2.8

-

2,000

-

1,500

-

1.15

1.35/1.6

1.8/2.0

-

5,000

-

4,000

-

GRM55

2.5

3.2

-

2,000

-

1,500

-

500

13

GJM03

High Power Type

0.6

1.0

2.0

0.3

0.5

0.3

15,000

50,000

-

1,000

-

GJ6/GJM15

0.5

10,000

-

50,000

-

50,000

GJ221

1.25

1.15

1.35

1.6

-

3,000

2,000

1,000

500

-

10,000

-

10,000

-

GJ231

3.2

4.5

1.6

2.5

3.2

-

8,000

-

Smoothing ¹⁾

-

6,000

-

GJ232

1.8

-

4,000

-

1.8

-

3,000

-

GJ243

2.2

-

2,000

-

GQM18

1.6

2.0

1.25

2.0

3.2

1.4

2.8

2.0

0.5

0.8

1.37

0.8

1.25

1.0

0.8

4,000

10,000

-

1,000

GQM21

0.85

1.0

4,000

-

10,000

-

ERA11

High Frequency ERA21

ERA32

-

1.25 1.0/1.25

-

3,000

2,000

1,000

-

2.5

1.4

2.8

1.25

0.5

0.8

1.0

1.7

1.15

2.3

-

ERF1D

-

ERF22

-

For Ultrasonic

Micro Chip

GRM21

GMA05

GMA08

GNM1M

0.85

0.35

0.5

4,000

10,000

-

2)

-

400

2)

-

400

0.6

4,000

-

10,000

-

1,000

0.8

4,000

-

10,000

-

Array

GNM31

3.2

1.6

1.0

-

3,000

-

10,000

-

GNM21

LLL18

2.0

0.8

1.25 0.6/0.85

4,000

10,000

1.6

0.6

4,000

-

10,000

-

4,000

3,000

4,000

3,000

-

10,000

LLL21

LLL31

1.25

1.6

2.0

Low ESL

0.85

0.7

3.2

1.15

1) Available in tape/reel only.

2) Tray

3) 3.3/4.7µF of 6.3 R6 rated are not available by bulk case.

Continued on the following page.

81

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Continued from the preceding page.

Tape Carrier Packaging

(1) Dimensions of Reel

φ180mm Reel

φ330mm Reel

2.5±0.5

2.0±0.5

φ13.0±0.5

2.0±0.5

φ13.0±0.5

φ21.0±0.8

10±1.5 for 8mm wide tape

14±1.5 for 12mm wide tape

10±1.5 for 8mm wide tape

14±1.5 for 12mm wide tape

(in mm)

(2) Dimensions of Paper Tape

8mm width 4mm pitch Tape

8mm width 2mm pitch Tape

0.5 max.

4.0±0.1

(GRM03/GJM03)

0.8 max.

4.0±0.1

2.0±0.1

4.0±0.1

φ1.5^+0.1

1.75±0.1

φ1.5^+0.1

2.0±0.1

2.0±0.05

1.1 max.

(GRM15/GJM15)

-0

-

0

1.75±0.1

A

13

Direction of Feed

Part Number

A

B

Part Number

A*

B*

GRM18

GQM18

GJM03

GRM03

1.05±0.1

1.17±0.05

1.85±0.1

0.37

0.67

1.55±0.05

GNM1M

GJM15

GRM15

0.65

1.15

GRM21

(TV0.85mm)

GQM21

*Nominal Value

1.55±0.15

2.3±0.15

GNM21

GRM31

(TV0.85mm)

GNM31

(TV0.8mm)

2.0±0.2

2.8±0.2

3.6±0.2

(in mm)

GRM32

(T=0.85mm)

Continued on the following page.

82

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Continued from the preceding page.

(3) Dimensions of Plastic Tape

8mm width 4mm pitch Tape

12mm width 8mm pitch Tape

4.0±0.1

2.0±0.1

+0.1

-0

0.25±0.1(TV2.0mm)

0.3±0.1(T=2.5mm)

φ1.5

+0.1

-0

8.0±0.1 2.0±0.1

4.0

0.3±0.1

φ1.5

4.0±0.1

1.75

±0.1

1.75±0.1

±

0.1

A

Direction of feed

2.5 max.

for GRM43/GRM55

(3.7 max. for T=2.5mm)

(4.7 max. for TU3.0mm)

(3.0 max. T=1.8/2.0 rank)

(3.7 max. for TU2.5 mm)

Part Number

A

B

Part Number

GRM43, GJ243

GRM55

A*

3.6

5.2

B*

4.9

6.1

1.05±0.1

1.85±0.1

LLL18

GRM21

(TU1.0mm)

LLL21, GJ221

GRM31

(TU1.15mm)

LLL31

GNM31

(TU1.0mm)

GJ231

GRM32

(TU1.15mm)

GJ232

1.45±0.2

2.25±0.2

3.5±0.2

*Nominal Value

1.9±0.2

2.8±0.2

1.8*

2.8*

2.0*

3.1*

2.6*

3.5*

2.1*

3.2*

ERA21

ERA32

ERF1D

ERF22

(in mm)

*Nominal Value

(4) Taping Method

13

q Tapes for capacitors are wound clockwise. The

sprocket holes are to the right as the tape is pulled

toward the user.

Vacant Section Chip-mounting Unit Vacant Section

Leader unit

w Part of the leader and part of the empty tape should be

attached to the end of the tape as follows.

e The top tape and base tape are not attached at the

end of the tape for a minimum of 5 pitches.

r Missing capacitors number within 0.1% of the number

per reel or 1 pc, whichever is greater, and are not

continuous.

160 min.

190 min.

210 min.

(Top Tape alone)

Direction of Feed

(in mm)

t The top tape and bottom tape should not protrude

beyond the edges of the tape and should not cover

sprocket holes.

y Cumulative tolerance of sprocket holes, 10 pitches :

±0.3mm.

Top Tape

u Peeling off force : 0.1 to 0.6N* in the direction shown

below.

*GRM03

GJM03

Base Tape

: 0.05 to 0.5N

}

Continued on the following page.

83

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Continued from the preceding page.

Dimensions of Bulk Case Packaging

The bulk case uses antistatic materials. Please contact

Murata for details.

1.5

2.0

3.0

110

(in mm)

13

84

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

■ Storage and Operating Conditions

Chip monolithic ceramic capacitors (chips) can

experience degradation of termination solderability

when subjected to high temperature or humidity, or if

exposed to sulfur or chlorine gases.

Storage environment must be at an ambient temperature

of 5-40 degree C and an ambient humidity of 20-70%RH.

Use chip within 6 months. If 6 months or more have

elapsed, check solderability before use.

(Reference Data 1. Solderability)

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND FUMING WHEN THE PRODUCTS IS USED.

■ Handling

1. Inspection

(3) Board separation must be performed using special

jigs, not with hands.

Thrusting force of the test probe can flex the

PCB, resulting in cracked chips or open solder

joints. Provide support pins on the back side of

the PCB to prevent warping or flexing.

2. Board Separation (or depanalization)

(1) Board flexing at the time of separation causes

cracked chips or broken solder.

3. Reel and bulk case

In the handling of reel and case, please be careful

and do not drop it.

Please do not use chips from a case which has been

dropped.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND FUMING WHEN THE PRODUCTS IS USED.

(2) Severity of stresses imposed on the chip at the

time of board break is in the order of :

Pushback<Slitter<V Slot<Perforator.

13

85

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

■ Notice(Soldering and Mounting)

!Caution

■ Soldering and Mounting

1. Mounting Position

Choose a mounting position that minimizes the stress

imposed on the chip during flexing or bending of the

board.

[Component Direction]

Locate chip

horizontal to the

direction in

which stress

acts

[Chip Mounting Close to Board Separation Point]

C

Chip arrangement

Worst A-C-(B~D) Best

Perforation

B

D

A

Slit

(Reference Data 2. Board bending strength for solder fillet height)

(Reference Data 3. Temperature cycling for solder fillet height)

(Reference Data 4. Board bending strength for board material)

2. Solder Paste Printing

Overly thick application of solder paste results in

[Optimum Solder Amount for Reflow Soldering]

excessive fillet height solder.

This makes the chip more susceptible to mechanical and

thermal stress on the board and may cause cracked

chips.

0.2mm min.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in chips

breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

13

3. Chip Placing

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. So adjust the suction nozzle's

bottom dead point by correcting warp in the board.

Normally, the suction nozzle's bottom dead point must be

set on the upper surface of the board. Nozzle pressure

for chip mounting must be a 1 to 3N static load.

Dirt particles and dust accumulated between the suction

nozzle and the cylinder inner wall prevent the nozzle from

moving smoothly. This imposes great force on the chip

during mounting, causing cracked chips. And the locating

claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction

nozzle and the locating claw must be maintained,

checked and replaced periodically.

[Incorrect]

Suction Nozzle

Deflection

Board

Board Guide

[Correct]

Support Pin

(Reference Data 5. Break strength)

Continued on the following page.

86

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

4. Reflow Soldering

Sudden heating of the chip results in distortion due to

excessive expansion and construction forces within the

chip causing cracked chips. So when preheating, keep

temperature differential, ∆T, within the range shown in

Table 1. The smaller the ∆T, the less stress on the chip.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

(∆T) between the component and solvent within the

range shown in the above table.

[Standard Conditions for Reflow Soldering]

Infrared Reflow

Soldering

Gradual

cooling

200D

(in the air)

Preheating

Time

20-40 seconds

Table 1

60 seconds min.

120 seconds max.

Part Number

GRM03/15/18/21/31

GJ615, GJ221/31

LLL18/21/31

Temperature Differential

Vapor Reflow

∆TV190D

Soldering

ERA11/21/32, ERF1D

GQM18/21

GRM32/43/55

Gradual

cooling

(in the air)

GNM, GJ232/43

ERA32, ERF22

∆TV130D

Preheating

Time

60 seconds min.

20 seconds max.

120 seconds max.

[Allowable Soldering Temperature and Time]

270

260

250

240

230

13

0

30

60

90

Soldering time (sec.)

Inverting the PCB

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Make sure not to impose an abnormal mechanical shock on

the PCB.

5. Leaded Component Insertion

If the PCB is flexed when leaded components (such as

transformers and ICs) are being mounted, chips may

crack and solder joints may break.

Before mounting leaded components, support the PCB

using backup pins or special jigs to prevent warping.

Continued on the following page.

87

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

6. Flow Soldering

Sudden heating of the chip results in thermal distortion

causing cracked chips. And an excessively long soldering

time or high soldering temperature results in leaching of

the outer electrodes, causing poor adhesion or a

reduction in capacitance value due to loss of contact

between electrodes and end termination.

[Standard Conditions for Flow Soldering]

Soldering

Gradual

Cooling

(in the air)

When preheating, keep the temperature differential

between solder temperature and chip surface

temperature, ∆T, within the range shown in Table 2. The

smaller the ∆T, the less stress on the chip.

Preheating

Time

60

-120 seconds 5 seconds max.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

between the component and solvent within the range

shown in Table 2.

[Allowable Soldering Temperature and Time]

Do not apply flow soldering to chips not listed in Table 5.

270

260

250

240

230

Table 2

Part Number

GRM18/21/31

LLL21/31

Temperature Differential

∆TV150D

ERA11/21, ERF1D

GQM18/21

0

10

20

30

Soldering Time (sec.)

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Optimum Solder Amount for Flow Soldering

Up to Chip Thickness

13

Adhesive

Continued on the following page.

88

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

7. Correction with a Soldering Iron

(1) For Chip Type Capacitors <Except GJ2 Series>

Sudden heating of the chip results in distortion due to a

high internal temperature differential, causing cracked

chips. When preheating, keep temperature differential,

∆T, within the range shown in Table 3. The smaller the

∆T, the less stress on the chip.

[Standard Conditions for Soldering lron Temperature]

Soldering

Gradual

Cooling

(in the air)

Table 3

Part Number

GRM15/18/21/31

Temperature Differential

Preheating

Time

-120 seconds 20 seconds max.

GJ615

60

LLL18/21/31

GQM18/21

ERA11/21, ERF1D

GRM32/43/55

GNM

∆TV190D

[Allowable Time and Temperature for Making

Corrections with a Soldering lron]

∆TV130D

ERA32, ERF22

270

260

250

240

230

0

30

60

90

Soldering Time (sec.)

The accumulated soldering Time / temperature including reflow /

flow soldering must be within the range shown above.

Optimum Solder Amount when Corrections Are Made

Using a Soldering lron

13

Up to Chip Thickness

(2) For GJ2 Series

When solder GJ2 series chip capacitor, keep the following conditions.

Temperature Soldering iron

Part Number

Pre-heating

Diameter of iron tip Soldering time Soldering amount

Restriction

of iron tip

wattage

Do not allow the iron tip to

directly touch the ceramic

element.

V1/2 of chip

thickness

GJ221/31/32/43

∆V130D

300D max.

20W max.

φ 3mm max.

5 sec. max.

(3) For Microstrip Types

Solder 1mm away from the ribbon terminal base, being

careful that the solder tip does not directly contact the

capacitor. Preheating is unnecessary.

Complete soldering within 3 seconds with a soldering tip

less than 270°C in temperature.

Continued on the following page.

89

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

8. Washing

Excessive output of ultrasonic oscillation during cleaning

causes PCBs to resonate, resulting in cracked chips or

broken solder. Take note not to vibrate PCBs.

Failure to follow the above cautions may result, worst case,

in a short circuit and fuming when the product is used.

13

90

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

■ Rating

Die Bonding/Wire Bonding (GMA Series)

gently apply the load. Be sure to complete the

operation in 1 minute.

1. Die Bonding of Capacitors

•Use the following materials Braze alloy :

Au-Si (98/2) 400 to 420 degree C in N2 atmosphere

Au-Sn (80/20) 300 to 320 degree C in N2 atmosphere

Au-Ge (88/12) 380 to 400 degree C in N2 atmosphere

•Mounting

2. Wire Bonding

•Wire

Gold wire :

20mm (0.0008 inch), 25mm (0.001 inch) diameter

•Bonding

(1) Control the temperature of the substrate so

that it matches the temperature of the braze

alloy.

(1) Thermocompression, ultrasonic ball bonding.

(2) Required stage temperature : 150 to 250 degree C

(3) Required wedge or capillary weight : 0.5N to 2N.

(4) Bond the capacitor and base substrate or other

devices with gold wire.

(2) Place braze alloy on substrate and place the

capacitor on the alloy. Hold the capacitor and

13

91

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

■ Notice(Soldering and Mounting)

Notice

■ Soldering and Mounting

1. PCB Design

(1) Notice for Pattern Forms

Unlike leaded components, chip components are

susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal

stresses than leaded components.

Excess solder fillet height can multiply these stresses and

cause chip cracking. When designing substrates, take

land patterns and dimensions into consideration to

eliminate the possibility of excess solder fillet height.

Pattern Forms

Placing of Chip Components

and Leaded Components

Placing of Leaded Components

after Chip Component

Placing Close to Chassis

Lateral Mounting

Soldering Iron

Lead Wire

Chassis

Lead Wire

Solder (ground)

Incorrect

Electrode Pattern

Solder Resist

Solder

Resist

Solder Resist

Correct

Continued on the following page.

13

92

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

Continued from the preceding page.

(2) Land Dimensions

Land

Solder Resist

Chip Capacitor

c

b

a

Table 1 Flow Soldering Method

Dimensions

Dimensions (LgW)

a

b

c

Part Number

GRM18

1.6g0.8

0.6e1.0

1.0e1.2

0.8e0.9

0.9e1.0

0.6e0.8

0.8e1.1

GQM18

GRM21

GQM21

GRM31

LLL21

2.0g1.25

3.2g1.6

1.25g2.0

1.6g3.2

1.25g1.0

2.0g1.25

1.4g1.4

2.2e2.6

0.4e0.7

0.6e1.0

0.4e0.6

1.0e1.2

0.5e0.8

1.0e1.1

0.5e0.7

0.8e0.9

0.6e0.8

0.9e1.0

0.8e0.9

1.0e1.4

1.4e1.8

2.6e2.8

0.8e1.0

1.0e1.2

LLL31

ERA11

ERA21

ERF1D

(in mm)

Table 2 Reflow Soldering Method

Dimensions

Dimensions (LgW)

a

b

c

Part Number

GRM03

0.6g0.3

1.0g0.5

0.2e0.3

0.3e0.5

0.2e0.35

0.2e0.4

0.4e0.6

GRM15

GRM18

GQM18

0.35e0.45

1.6g0.8

0.6e0.8

0.6e0.7

0.6e0.8

13

GRM21

GQM21

GJ221

GRM31

GJ231

GRM32

GJ232

GRM43

GJ243

GRM55

LLL18

LLL21

LLL31

ERA11

ERA21

ERA32

ERF1D

ERF22

2.0g1.25

1.0e1.2

0.6e0.7

0.8e1.1

3.2g1.6

3.2g2.5

4.5g3.2

2.2e2.4

2.0e2.4

3.0e3.5

0.8e0.9

1.0e1.2

1.2e1.4

1.0e1.4

1.8e2.3

2.3e3.0

5.7g5.0

0.8g1.6

1.25g2.0

1.6g3.2

1.25g1.0

2.0g1.25

3.2g2.5

1.4g1.4

2.8g2.8

4.0e4.6

0.2e0.4

0.4e0.6

0.6e0.8

0.4e0.6

1.0e1.2

2.2e2.5

0.4e0.8

1.8e2.1

1.4e1.6

0.3e0.4

0.3e0.5

0.6e0.7

0.6e0.8

0.8e1.0

0.6e0.8

0.7e0.9

3.5e4.8

1.0e1.4

1.4e1.8

2.6e2.8

0.8e1.0

1.9e2.3

1.0e1.2

2.2e2.6

(in mm)

Continued on the following page.

93

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

Continued from the preceding page.

GNM Series for reflow soldering method

GNMpp2

GNMpp4

Chip Capacitor

a

b

a

b

c

Land

p

c

p

Table 3

Dimensions (mm)

Part Number

L

W

a

b

c

p

GNM1M2

GNM212

GNM214

GNM314

1.37

2.0

3.2

1.0

0.45~0.5

0.6~0.7

0.8~1.0

0.5~0.55

0.5~0.7

0.7~0.9

0.3~0.35

0.4~0.5

0.64+/-0.1

1.0+/-0.1

0.5+/-0.05

0.8+/-0.05

1.25

1.6

0.25~0.35

0.3~0.4

2. Adhesive Application

Thin or insufficient adhesive causes chips to loosen or

become disconnected when flow soldered. The amount

of adhesive must be more than dimension C shown in the

drawing below to obtain enough bonding strength.

The chip's electrode thickness and land thickness must

be taken into consideration.

a : 20 to 70 µm

b : 30 to 35 µm

c : 50 to 105 µm

Chip Capacitor

a

c

b

Adhesive

Land

Board

Low viscosity adhesive causes chips to slip after

mounting. Adhesive must have a viscosity of 5000Pa•s

(500ps) min. (at 25D)

Adhesive Coverage*

Part Number

GRM18

Adhesive Coverage*

13

0.05mg Min.

GQM18

GRM21

GQM21

GRM31

0.1mg Min.

0.15mg Min.

*Nominal Value

3. Adhesive Curing

Insufficient curing of the adhesive causes chips to

disconnect during flow soldering and causes deteriorated

insulation resistance between outer electrodes due to

moisture absorption.

Control curing temperature and time in order to prevent

insufficient hardening.

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued on the following page.

94

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

Continued from the preceding page.

4. Flux Application

An excessive amount of flux generates a large quantity of

flux gas, causing deteriorated solderability. So apply flux

thinly and evenly throughout. (A foaming system is

generally used for flow soldering).

cleaned. Use flux with a halide content of 0.2wt% max.

But do not use strong acidic flux.

Wash thoroughly because water soluble flux causes

deteriorated insulation resistance between outer

electrodes unless sufficiently cleaned.

Flux containing too high a percentage of halide may

cause corrosion of the outer electrodes unless sufficiently

5. Flow Soldering

Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown below) and 25% of the length A-B shown below as

mounted on substrate.

[As a Single Chip]

A

B

D

Outer Electrode

C

[As Mounted on Substrate]

B

A

(Reference Data 6. Thermal shock)

(Reference Data 7. Solder heat resistance)

13

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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!Note

Note

C02E10.pdf 04.1.20

Notice

■ Others

1. Resin Coating

The above notices are for standard applications and

conditions. Contact us when the products are used

in special mounting conditions. Select optimum

conditions for operation as they determine the

reliability of the product after assembly.

The data herein are given in typical values, not

guaranteed ratings.

When selecting resin materials, select those with

low contraction.

2. Circuit Design

The capacitors listed in the previous sections of

this catalog are not safety recognized products.

3. Remarks

13

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!Note

Note

C02E10.pdf 04.1.20

Reference Data

1. Solderability

(1) Test Method

(2) Test Samples

Subject the chip capacitor to the following conditions.

Then apply flux (a ethanol solution of 25% rosin) to the

chip and dip it in 230D eutectic solder for 2 seconds.

Conditions :

GRM21 : Products for flow/reflow soldering.

(3) Acceptance Criteria

With a 60-power optical microscope, measure the surface

area of the outer electrode that is covered with solder.

(4) Results

Expose prepared at room temperature (for 6 months and

12 months, respectively)

Refer to Table 1.

Prepared at high temperature (for 100 hours at 85D)

Prepared left at high humidity (for 100 hours under

90%RH to 95%RH at 40D)

Table 1

Prepared at High

Temperature for

100 Hours at 85D

Prepared at High Humidity

for 100 Hours at 90 to

95% RH and 40D

Prepared at Room Temperature

Sample

Initial State

6 months

12 months

GRM21 for flow/reflow soldering

95 to 100%

95%

90 to 95%

95%

2. Board Bending Strength for Solder Fillet Height

(1) Test Method

Solder the chip capacitor to the test PCB with the amount

of solder paste necessary to achieve the fillet heights.

Then bend the PCB using the method illustrated and

measure capacitance.

50

20

Pressurizing

Speed : 1.0mm/sec.

Pressurize

Capacitor

Note : The material of pressure application jig and

support is the quenched metal.

R230

Supporting

Base

45

(hardness HB 183

HRA90 or more)

-255 or superhardness

Flexure

13

Capacitance Meter

Solder Amount

1.2

Larger Fillet.

Fillet up to Chip

Thickness

4.0

1.6

100

Material : Glass Epoxy

: Copper Foil (0.35mm thick)

: Solder Resist

(in mm)

(2) Test Samples

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm

(3) Acceptance Criteria

Products shall be determined to be defective if the

change in capacitance has exceeded the values specified

in Table 2.

Table 2

Characteristics

Change in Capacitance

Within T5% or T0.5pF, whichever is greater

Within T12.5%

1

C0G

X7R

Y5V

Within T20%

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Reference Data

Continued from the preceding page.

(4) Results

GRM21 C0G (T=0.6)

GRM21 X7R (T=0.6)

100

80

60

40

20

0

100

80

60

40

20

0

Fillet up to Chip

Thickness

Fillet up to Chip

Thickness

Larger Fillet

0

2

4

6

8

0

2

4

6

8

Flexure (mm)

GRM21 Y5V (T=0.6)

100

80

60

40

20

0

Fillet up to Chip

Thickness

Larger Fillet

0

2

4

6

8

Flexure (mm)

3. Temperature Cycling for Solder Fillet Height

(1) Test Method

[Temperature Cycling]

Solder the chips to the substrate various test fixtures

+125D

using sufficient amounts of solder to achieve the required

fillet height. Then subject the fixtures to the cycle

illustrated below 200 times.

Room Temperature

13

Time (min.)

-

55D

5

30

5

30

q Solder Amount

[Solder Amount]

Alumina substrates are typically designed for reflow

soldering.

Glass Epoxy

Substrate

Alumina

or Paper Phenol

Glass epoxy or paper phenol substrates are typically

used for flow soldering.

q

w

w Material

Alumina

(Thickness : 0.64mm)

Glass epoxy (Thickness : 1.6 mm)

Paper phenol (Thickness : 1.6 mm)

e

Solder to be used

6Z4 Eutectic solder

e Land Dimension

[Land Dimension]

Land Pattern

Ag/Pd=72/28

Alumina

Thickness : 10 to 12µm

Substrate

1.5

1.2

1.5

Glass Epoxy

Substrate

Cu

(in mm)

Thickness : 35µm

Paper Phenol

Substrate

Continued on the following page.

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Reference Data

Continued from the preceding page.

(2) Test Samples

GRM40 C0G/X7R/Y5V Characteristics T=0.6mm

(3) Acceptance Criteria

Products are determined to be defective if the change in

capacitance has exceeded the values specified in Table

3.

Table 3

Characteristics

Change in Capacitance

Within T2.5% or T0.25pF, whichever is greater

Within T7.5%

C0G

X7R

Y5V

Within T20%

(4) Results

Alumina Substrate

GRM21 C0G (T=0.6)

GRM21 X7R (T=0.6)

GRM21 Y5V (T=0.6)

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

e

w

q

e

w

q

qw

0

50

100

150

200

0

50

100

150

200

0

50

100

150

200

Number of Cycles

Glass Epoxy Substrate

13

GRM21 C0G (T=0.6)

GRM21 X7R (T=0.6)

GRM21 Y5V (T=0.6)

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

e

qw

200

Number of Cycles

qw

200

Number of Cycles

0

50

100

150

0

50

100

150

200

0

50

100

150

Number of Cycles

Paper Phenol Substrate

GRM21 C0G (T=0.6)

GRM21 X7R (T=0.6)

GRM21 Y5V (T=0.6)

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

e

qwe

200

Number of Cycles

qw

200

Number of Cycles

qw

200

Number of Cycles

0

50

100

150

0

50

100

150

0

50

100

150

Continued on the following page.

99

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Reference Data

Continued from the preceding page.

4. Board Bending Strength for Board Material

(1) Test Method

Solder the chip to the test board. Then bend the board

using the method illustrated below, to measure

capacitance.

50

Pressurizing

Speed : 1.0mm/sec.

20

Capacitor

Pressurize

Note : Material of the pressurizing jig and

R230

the supporting base must be hardened steel

(Hardness : HB183 to 255 or carbide Hardness

: HRA90 min.)

Supporting

Base

45

Flexure

Capacitance Meter

Solder Amount

1.2

Up to Chip

Thickness

4.0

1.6

100

: Copper Foil (0.035mm thick)

: Solder Resist

(in mm)

(2) Test Samples

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm typical

(3) Acceptance Criteria

Products shall be determined to be defective if the

change in capacitance has exceeded the values specified

in Table 4.

Table 4

Characteristics

Change in Capacitance

Within T5% or T0.5pF, whichever is greater

Within T12.5%

C0G

X7R

Y5V

13

Within T20%

(4) Results

GRM21 X7R (T=0.6)

GRM21 C0G (T=0.6)

100

80

60

40

20

0

100

Paper Phenol

80

60

Glass Epoxy

40

20

0

Glass Epoxy

0

2

4

6

8

0

2

4

6

8

Flexure (mm)

GRM21 Y5V (T=0.6)

100

80

60

40

20

0

Paper Phenol

Glass Epoxy

0

2

4

6

8

Flexure (mm)

Continued on the following page.

100

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Reference Data

Continued from the preceding page.

5. Break Strength

(1) Test Method

P

Pressurizing

speed : 2.5mm/sec.

Loading Jig End

φ1.0mm

Place the chip on a steel plate as illustrated on the right.

Increase load applied to a point near the center of the

test sample.

Storage

scope

Amplifier

Load cell

(2) Test Samples

Sample

Steel plate

GRM21 C0G/X7R/Y5V Characteristics

GRM31 C0G/X7R/Y5V Characteristics

P0.5mm

(3) Acceptance Criteria

Define the load that has caused the chip to break or

crack, as the bending force.

W

T

γ

C0G

X7R

Y5V

Chip Size

L

W

Charac- Charac- Charac-

teristics teristics teristics

(4) Explanation

Break strength, P, is proportionate to the square of the

thickness of the ceramic element and is expressed as a

curve of secondary degree.

GRM21 1.5 1.2

GRM31 2.7 1.5

L

300

180

160

(in mm)

The formula is :

2

γ

2 WT

P=

(N)

3L

W : Width of ceramic element (mm)

T : Thickness of element (mm)

L : Distance between fulcrums (mm)

γ : Bending stress

(N/mm²)

(5) Results

GRM21

GRM31

140

120

100

X7R

C0G

Y5V

120

100

80

13

X7R

Y5V

80

60

40

20

0

60

40

20

0

0.4

0.8

1.2

1.6

0

0.4

0.8

1.2

1.6

Thickness of Ceramic Element (mm)

6. Thermal Shock

(1) Test method

Dipping Speed : 25mm/sec.

After applying flux (an ethanol solution of 25% rosin), dip

the chip in a solder bath (6Z4 eutectic solder) in

accordance with the following

Solder

Temperature

Chip Capacitor

∆T

Natural

Cooling

conditions :

Solder Bath

25D

(2) Test samples

2 sec.

Time

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm typical

(3) Acceptance criteria

Visually inspect the test sample with a 60-power optical

microscope. Chips exhibiting breaks or cracks shall be

determined to be defective.

Continued on the following page.

101

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Reference Data

Continued from the preceding page.

(4) Results

100

80

60

40

Y5V

X7R

C0G

20

0

200

240

280

320

360

Temperature Differential ∆T (D)

7. Solder Heat Resistance

(1) Test Method

q Reflow soldering :

e Dip soldering :

Apply about 300 µm of solder paste over the alumina

substrate. After reflow soldering, remove the chip and

check for leaching that may have occurred on the

outer electrode.

After dipping the test sample with a pair of tweezers in

static solder (eutectic solder), check for leaching that

may have occurred on the outer electrode.

r Flux to be used : An ethanol solution of 25% rosin.

w Flow soldering :

After dipping the test sample with a pair of tweezers in

wave solder (eutectic solder), check for leaching that

may have occurred on the outer electrode.

(2) Test samples

GRM21 : For flow/reflow soldering T=0.6mm

(3) Acceptance criteria

A

The starting time of leaching should be defined as the

time when the outer electrode has lost 25 % of the total

edge length of A-B-C-D as illustrated :

B

D

13

C

Outer Electrode

(4) Results

Reflow Soldering

Flow Soldering

280

270

260

250

240

230

220

210

280

270

260

250

240

230

220

210

0

60

120

180

240

0

10

20

30

40

50

60

Leaching Starting Time (sec.)

Dip Soldering

280

270

260

250

240

230

220

210

0

10

20

30

40

50

60

Leaching Starting Time (sec.)

Continued on the following page.

102

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Reference Data

Continued from the preceding page.

8. Thermal Shock when Making Corrections with a

Soldering Iron

(1) Test Method

Apply a soldering iron meeting the conditions below to

the soldered joint of a chip that has been soldered to a

paper phenol board, while supplying wire solder. (Note:

the soldering iron tip should not directly touch the ceramic

element of the chip.)

Soldering lron

Wire Solder

Mounting Solder

Duration of

Touching :

Approx. 3 sec.

Paper Phenol Substrate

(2) Test Samples

Soldering Iron

Tip diameter

φ3mm

GRM21 C0G/X7R/Y5V Characteristics T=0.6mm

Ceramic heater 20W

(3) Acceptance Criteria for Defects

Observe the appearance of the test sample with a

60-power optical microscope. Those units displaying any

breaks or cracks are determined to be defective.

(4) Results

GRM21 C0G (T=0.6)

GRM21 X7R (T=0.6)

100

80

60

40

20

0

100

80

60

40

20

0

200

240

280

320

360

200

240

280

320

360

Soldering Iron Tip Temperature (D)

GRM21 Y5V (T=0.6)

13

100

80

60

40

20

0

200

240

280

320

360

Soldering Iron Tip Temperature (D)

103

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

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!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Medium-voltage Low Dissipation Factor

e

g

e

■ Features

1. Murata's original internal electrode structure

realizes high flash-over voltage.

2. A new monolithic structure for small, surface-

L

W

Dimensions (mm)

mountable devices capable of operating at high

voltage levels.

Part Number

L

W

T

e min. g min.

GRM31A

GRM31B

GRM32Q

GRM42A

GRM42B

GRM42D

GRM43D

GRM43E

1.0 +0,- 0.3

1.25 +0,- 0.3

3.2 ±0.2 1.6 ±0.2

1.5*

3. Sn-plated external electrodes realize good

solderability.

3.2 ±0.2 2.5 ±0.2 1.5 +0,- 0.3

1.0 +0,- 0.3

1.8

0.3

4.5 ±0.3 2.0 ±0.2 1.25 +0,- 0.3

2.0 ±0.3

4. Use the GRM31 type with flow or reflow soldering,

and other types with reflow soldering only.

5. Low-loss and suitable for high frequency circuits.

6. The temperature characteristics C0G and SL are

temperature compensating type, and R is high

dielectric constant type.

2.9

2.0 +0,- 0.3

2.5 +0,- 0.3

4.5 ±0.3 3.2 ±0.3

* GRM31B1X3D : 1.8mm min.

■ Applications

1. Ideal for use on high frequency pulse circuits such

as snubber circuits for switching power supplies,

DC/DC converters, ballasts (inverter fluorescent

lamps), etc.

2. Ideal for use as the ballast in liquid crystal back

lighting inverters.

3. Please contact our sales representatives or

engineers before using our products for other

applications not specified above.

Electrode g

Rated Voltage

(V)

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

min.

(mm)

GRM31AR32J101KY01D

GRM31AR32J151KY01D

GRM31AR32J221KY01D

GRM31AR32J331KY01D

GRM31BR32J471KY01L

GRM31BR32J681KY01L

GRM31BR32J102KY01L

GRM31AR33A470KY01D

GRM31AR33A680KY01D

GRM31AR33A101KY01D

GRM31AR33A151KY01D

GRM31AR33A221KY01D

GRM31AR33A331KY01D

GRM31BR33A471KY01L

GRM31B1X3D100JY01L

GRM31B1X3D120JY01L

GRM31B1X3D150JY01L

GRM31B1X3D180JY01L

GRM31B1X3D220JY01L

GRM32Q1X3D270JY01L

GRM32Q1X3D330JY01L

GRM32Q1X3D390JY01L

GRM32Q1X3D470JY01L

GRM32Q1X3D560JY01L

DC630

R (JIS)

SL (JIS)

100 ±10%

150 ±10%

220 ±10%

330 ±10%

470 ±10%

680 ±10%

1000 ±10%

47 ±10%

68 ±10%

100 ±10%

150 ±10%

220 ±10%

330 ±10%

470 ±10%

10 ±5%

3.2

1.6

2.5

1.0

1.5

1.8

0.3 min.

14

DC630

1.0

DC630

1.0

DC630

1.25

1.0

DC630

DC1000

DC2000

1.0

1.25

1.5

12 ±5%

15 ±5%

18 ±5%

22 ±5%

27 ±5%

33 ±5%

1.5

39 ±5%

1.5

47 ±5%

1.5

56 ±5%

1.5

Continued on the following page.

104

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Electrode g

min.

Rated Voltage

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

(V)

(mm)

GRM32Q1X3D680JY01L

GRM32Q1X3D820JY01L

GRM43D1X3D121JY01L

GRM43D1X3D151JY01L

GRM43D1X3D181JY01L

GRM43D1X3D221JY01L

GRM42A5C3F100JW01L

GRM42A5C3F120JW01L

GRM42A5C3F150JW01L

GRM42A5C3F180JW01L

GRM42A5C3F220JW01L

GRM42D1X3F560JY02L

GRM42D1X3F680JY02L

GRM42D1X3F820JY02L

GRM43E1X3F101JY01L

DC2000

DC3150

SL (JIS)

C0G (EIA)

SL (JIS)

68 ±5%

82 ±5%

120 ±5%

150 ±5%

180 ±5%

220 ±5%

10 ±5%

12 ±5%

15 ±5%

18 ±5%

22 ±5%

56 ±5%

68 ±5%

82 ±5%

100 ±5%

3.2

4.5

2.5

3.2

2.0

3.2

1.5

2.0

1.0

2.0

2.5

1.8

2.9

0.3 min.

Please contact us for SL characteristics information.

DC3150V items are considered to use for the application which is not LCD back lighting inverters circuit.

14

105

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

Item

Test Method

Temperature Compensating

Type (C0G, SL Char.)

High Dielectric

Constant Type (R Char.)

Operating

Temperature Range

Y55 to W125D

1

Visual inspection

Using calipers

2

3

Appearance

No defects or abnormalities

Dimensions

Within the specified dimension

No failure should be observed when voltage in Table is applied

between the terminations for 1 to 5 sec., provided the charge/

discharge current is less than 50mA.

Rated voltage

DC630V

DC1kV, DC2kV

DC3.15kV

Test voltage

150% of the rated voltage

120% of the rated voltage

DC4095V

4

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

Insulation Resistance

More than 10,000MΩ

(I.R.)

5

6

The capacitance/Q/D.F. should be measured at 20D at the

frequency and voltage shown as follows.

(1) Temperature Compensating Type

Frequency : 1T0.2MHz

Capacitance

Within the specified tolerance

Voltage : AC0.5 to 5V (r.m.s.)

(2) High Dielectric Constant Type

Frequency : 1T0.2kHz

Voltage : AC1T0.2V (r.m.s.)

#Pretreatment

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

Q/

D.F.V0.01

7

Dissipation

Factor (D.F.)

2

CF30pF : QU400W20C*

W0

Y10

Perform a heat treatment at 150

D for 60T5 min. and

1

then let sit for 24T2 hrs. at * room condition.

(1) Temperature Compensating Type

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from step 1

through 5 (SL : W20 to W85 D) the capacitance should be

within the specified tolerance for the temperature coefficient.

Step

Temperature (D)

Temp. Coefficient

C0G char. :

0T30ppm/°C

(Temp. Range : -55 to +125°C)

SL char. :

W350 to Y1,000 ppm/D

(Temp. Range : W20 to W85D)

1

20T2 (25T2 for C0G char.)

Min. Operating Temp.T3

20T2 (25T2 for C0G char.)

Max. Operating Temp.T2

20T2 (25T2 for C0G char.)

Capacitance

Temperature

Characteristics

2

3

4

5

Cap. Change

Within T15%

8

(2) High Dielectric Constant Type

The range of capacitance change compared to the 20D value

within Y55 to W125D should be within the specified range.

14

#Pretreatment

Perform a heat treatment at 150

then let sit for 24T2 hrs. at * room condition.

W0

Y10

D for 60T5 min. and

1

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder.

Then apply 10N force in the direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

Adhesive Strength

of Termination

9

No removal of the terminations or other defect should occur.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Continued on the following page.

106

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature Compensating

High Dielectric

Type (C0G, SL Char.)

No defects or abnormalities

Within the specified tolerance

Constant Type (R Char.)

Appearance

Capacitance

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Vibration

Resistance

C0G char. : QU1,000

SL char. :

10

D.F.V0.01

Q/D.F.

CU30pF : QU1,000

CF30pF : QU400W20C*

2

Solder resist

Cu

Glass Epoxy Board

No cracking or marking defects should occur.

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

φ4.5

d

c

50

a

Pressurizing

20

speed : 1.0mm/s

t : 1.6

100

11 Deflection

Pressurize

R230

Dimension (mm)

LZW

(mm)

a

b

c

d

Flexure=1

3.2Z1.6

3.2Z2.5

4.5Z2.0

4.5Z3.2

2.2

3.5

5.0

7.0

2.0

2.9

2.4

3.7

Capacitance meter

45 45

1.0

(in mm)

Fig. 3

Fig. 2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in

eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solderability of

Termination

75% of the terminations are to be soldered evenly

and continuously.

12

*

Preheat the capacitor at 120 to 150D for 1 min.

Appearance

No marking defects

Immerse the capacitor in eutectic solder solution at 260T5D for

10T1 sec. Let sit at * room condition for 24T2 hrs., then

measure.

Capacitance

Change

Within T2.5% or T0.25pF

Within T10%

1

(Whichever is larger)

#Immersing speed : 25T2.5mm/s

14

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

CF30pF : QU400W20C*

#Pretreatment for high dielectric constant type

Resistance

13 to Soldering

Heat

W0

Y10

D.F.V0.01

Perform a heat treatment at 150

D for 60T5 min. and then

Q/D.F.

I.R.

1

let sit for 24T2 hrs. at * room condition.

2

*Preheating for more than 3.2Z2.5mm

More than 10,000MΩ

Step

Temperature

100D to 120D

170D to 200D

Time

1 min.

Dielectric

Strength

1

2

In accordance with item No.4

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Continued on the following page.

107

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Temperature Compensating

Type (C0G, SL Char.)

High Dielectric

Constant Type (R Char.)

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Appearance

No marking defects

Capacitance

Change

Within T2.5% or T0.25pF

(Whichever is larger)

Within T10%

D.F.V0.01

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

1

Let sit for 24T2 hrs. at * room condition, then measure.

C0G char. : QU1,000

SL char. :

CU30pF : QU1,000

Time (min.)

30T3

2 to 3

30T3

2 to 3

Temperature (D)

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

Step

Q/D.F.

I.R.

1

2

3

4

2

CF30pF : QU400W20C*

More than 10,000MΩ

In accordance with item No.4

No marking defects

Temperature

Cycle

14

#Pretreatment for high dielectric constant type

W0

Perform a heat treatment at 150

let sit for 24T2 hrs. at * room condition.

D for 60T5 min. and then

Y10

1

Dielectric

Strength

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Appearance

Capacitance

Change

Within T5.0% or T0.5pF

(Whichever is larger)

Within T10%

D.F.V0.01

Let the capacitor sit at 40T2D and relative humidity of 90 to 95%

W24

for 500

hrs.

Y00

C0G char. : QU350

SL char. :

1

Remove and let sit for 24T2 hrs. at * room condition, then

Humidity

measure.

15 (Steady

State)

Q/D.F.

I.R.

CU30pF : QU350

CF30pF : QU275W C*

2

#Pretreatment for high dielectric constant type

Perform a heat treatment at 150

let sit for 24T2 hrs. at * room condition.

5

2

W00

Y10

D for 60T5 min. and then

1

More than 1,000MΩ

Dielectric

Strength

In accordance with item No.4

No marking defects

W48

Y00

Apply the voltage in following table for 1,000

hrs. at

Appearance

maximum operating temperature T3D.

Remove and let sit for 24T2 hrs. at * room condition, then

measure.

Capacitance

Change

Within T3.0% or T0.3pF

(Whichever is larger)

1

Within T10%

D.F.V0.02

C0G char. : QU350

SL char. :

The charge/discharge current is less than 50mA.

#Pretreatment for high dielectric constant type

Apply test voltage for 60T5 min. at test temperature.

16 Life

Q/D.F.

I.R.

CU30pF : QU350

CF30pF : QU275W C*

2

14

5

2

1

Remove and let sit for 24T2 hrs. at * room condition.

Rated voltage

More than DC1kV

Less than DC1kV

Test voltage

Rated voltage

120% of the rated voltage

More than 1,000MΩ

Dielectric

Strength

In accordance with item No.4

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

108

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Medium-voltage High-Capacitance for General-Use

e

g

L

e

■ Features

1. A new monolithic structure for small, high

capacitance capable of operating at high voltage

W

Dimensions (mm)

T

Part Number

levels.

L

W

e

g min.

0.4

GRM188

GRM21A

GRM21B

GRM31B

GRM31C

GRM32Q

GRM32D

GRM43Q

GRM43D

GRM55D

1.6 ±0.1 0.8 ±0.1

0.8 ±0.1

1.0 +0,-0.3

1.25 ±0.2

1.25 +0,-0.3

1.6 ±0.2

1.5 +0,-0.3 0.3 min.

2.0 +0,-0.3

0.2 to 0.5

2. Sn-plated external electrodes realized good

solderability.

2.0 ±0.2 1.25 ±0.2

0.7

3.2 ±0.2 1.6 ±0.2

3.2 ±0.3 2.5 ±0.2

4.5 ±0.4 3.2 ±0.3

3. Use the GRM18/21/31 types with flow or reflow

soldering, and other types with reflow soldering

only.

1.2

1.5 +0,-0.3

2.0 +0,-0.3

2.2

5.7 ±0.4 5.0 ±0.4 2.0 +0,-0.3

3.2*

* GRM55DR73A : 2.5mm min.

■ Applications

1. Ideal for use as a hot-cold coupling for DC/DC

converter.

2. Ideal for use on line filters and ringer detectors

for telephones, facsimiles and modems.

3. Ideal for use on diode-snubber circuits for

switching power supplies.

Electrode g

min.

Rated Voltage

(V)

TC Code

(Standard)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

Capacitance

(mm)

GRM188R72E221KW07D

GRM188R72E331KW07D

GRM188R72E471KW07D

GRM188R72E681KW07D

GRM188R72E102KW07D

GRM21AR72E102KW01D

GRM188R72E152KW07D

GRM21AR72E152KW01D

GRM188R72E222KW07D

GRM21AR72E222KW01D

GRM21AR72E332KW01D

GRM21AR72E472KW01D

GRM21AR72E682KW01D

GRM21BR72E103KW03L

GRM31BR72E153KW01L

GRM31BR72E223KW01L

GRM31CR72E333KW03L

GRM31CR72E473KW03L

GRM32QR72E683KW01L

GRM31CR72E104KW03L

GRM32DR72E104KW01L

GRM43QR72E154KW01L

GRM32DR72E224KW01L

GRM43DR72E224KW01L

GRM43DR72E334KW01L

GRM55DR72E334KW01L

GRM43DR72E474KW01L

GRM55DR72E474KW01L

GRM55DR72E105KW01L

GRM31BR72J102KW01L

GRM31BR72J152KW01L

GRM31BR72J222KW01L

DC250

DC630

X7R (EIA)

220pF ±10%

330pF ±10%

470pF ±10%

680pF ±10%

1000pF ±10%

1500pF ±10%

2200pF ±10%

3300pF ±10%

4700pF ±10%

6800pF ±10%

10000pF ±10%

15000pF ±10%

22000pF ±10%

33000pF ±10%

47000pF ±10%

68000pF ±10%

0.10µF ±10%

0.15µF ±10%

0.22µF ±10%

0.33µF ±10%

0.47µF ±10%

1.0µF ±10%

1.6

2.0

1.6

2.0

1.6

2.0

3.2

4.5

3.2

4.5

5.7

4.5

5.7

3.2

0.8

1.25

0.8

1.25

0.8

1.25

1.6

2.5

1.6

2.5

3.2

2.5

3.2

5.0

3.2

5.0

1.6

0.8

1.0

0.8

1.0

0.8

1.0

1.25

1.6

1.5

1.6

2.0

1.5

2.0

1.25

0.4

0.7

0.4

0.7

0.4

0.7

1.2

2.2

1.2

2.2

3.2

2.2

3.2

1.2

0.2 to 0.5

0.3 min.

0.2 to 0.5

0.3 min.

0.2 to 0.5

0.3 min.

15

1000pF ±10%

1500pF ±10%

2200pF ±10%

Continued on the following page.

109

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Continued from the preceding page.

Electrode g

min.

Rated Voltage

TC Code

(Standard)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

Capacitance

(V)

(mm)

GRM31BR72J332KW01L

GRM31BR72J472KW01L

GRM31BR72J682KW01L

GRM31BR72J103KW01L

GRM31CR72J153KW03L

GRM32QR72J223KW01L

GRM32DR72J333KW01L

GRM32DR72J473KW01L

GRM43QR72J683KW01L

GRM43DR72J104KW01L

GRM55DR72J154KW01L

GRM55DR72J224KW01L

GRM31BR73A102KW01L

GRM31BR73A152KW01L

GRM31BR73A222KW01L

GRM31BR73A332KW01L

GRM31BR73A472KW01L

GRM32QR73A682KW01L

GRM32QR73A103KW01L

GRM32DR73A153KW01L

GRM32DR73A223KW01L

GRM43DR73A333KW01L

GRM43DR73A473KW01L

GRM55DR73A104KW01L

DC630

DC1000

X7R (EIA)

3300pF ±10%

4700pF ±10%

6800pF ±10%

10000pF ±10%

15000pF ±10%

22000pF ±10%

33000pF ±10%

47000pF ±10%

68000pF ±10%

0.10µF ±10%

0.15µF ±10%

0.22µF ±10%

1000pF ±10%

1500pF ±10%

2200pF ±10%

3300pF ±10%

4700pF ±10%

6800pF ±10%

10000pF ±10%

15000pF ±10%

22000pF ±10%

33000pF ±10%

47000pF ±10%

0.10µF ±10%

3.2

4.5

5.7

3.2

4.5

5.7

1.6

2.5

3.2

5.0

1.6

2.5

3.2

5.0

1.25

1.6

1.2

2.2

3.2

1.2

2.2

2.5

0.3 min.

1.5

2.0

1.5

2.0

1.25

1.5

2.0

15

110

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y55 to W125D

Y

Temperature Range

Visual inspection

Using calipers

2

3

Appearance

No defects or abnormalities

Dimensions

Within the specified dimensions

No failure should be observed when 150% of the rated voltage

(200% of the rated voltage in case of rated voltage : DC250V,

120% of the rated voltage in case of rated voltage : DC1kV) is

applied between the terminations for 1 to 5 sec., provided the

charge/discharge current is less than 50mA.

4

5

Dielectric Strength No defects or abnormalities

The insulation resistance should be measured with DC500T50V

(DC250T50V in case of rated voltage : DC250V) and within 60T5

sec. of charging.

CU0.01µF : More than 100MΩ • µF

CF0.01µF : More than 10,000MΩ

Insulation Resistance

(I.R.)

The capacitance/D.F. should be measured at 25D at a frequency

of 1T0.2kHz and a voltage of AC1T0.2V (r.m.s.)

6

7

Capacitance

Within the specified tolerance

0.025 max.

#Pretreatment

Perform a heat treatment at 150

W0

Y10

Dissipation

Factor (D.F.)

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

The range of capacitance change compared with the 25D value

within Y55 to W125D should be within the specified range.

Cap. Change

Within T15%

(Temp. Range : Y55 to W125D)

Capacitance

Temperature

Characteristics

#Pretreatment

Perform a heat treatment at 150

8

W0

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder.

Then apply 10N force in the direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

Adhesive Strength

of Termination

9

No removal of the terminations or other defect should occur.

10N (5N : Size 1.6g0.8mm only), 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Vibration

Resistance

D.F.

10

0.025 max.

15

Solder resist

Cu

Glass Epoxy Board

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

No cracking or marking defects should occur.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

φ4.5

d

c

50

Pressurizing

20

a

speed : 1.0mm/s

t : 1.6

Pressurize

100

R230

11 Deflection

Dimension (mm)

LZW

(mm)

a

b

c

d

Flexure=1

1.6Z0.80

2.0Z1.25

3.2Z1.60

3.2Z2.50

4.5Z3.20

5.7Z5.00

1.0

1.2

2.2

3.5

4.5

3.0

4.0

5.0

7.0

8.0

1.25

1.65

2.05

2.95

3.75

5.65

Capacitance meter

45 45

(in mm)

1.0

Fig. 3

Fig. 2

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Continued on the following page.

111

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

12

Item

Test Method

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solderability of

Termination

75% of the terminations are to be soldered evenly and continuously.

*

Preheat the capacitor at 120 to 150D for 1 min.

Appearance

No marking defects

Within T10%

Immerse the capacitor in eutectic solder solution at 260T5D for

10T1 sec. Let sit at *room condition for 24T2 hrs., then measure.

#Immersing speed : 25T2.5mm/s

Capacitance

Change

#Pretreatment

Perform a heat treatment at 150

let sit for 24T2 hrs. at *room condition.

D.F.

I.R.

0.025 max.

W00

Y10

Resistance

13 to Soldering

Heat

D for 60T5 min. and then

CU0.01µF : More than 100MΩ • µF

CF0.01µF : More than 10,000MΩ

*Preheating for more than 3.2Z2.5mm

Dielectric

Strength

Step

1

2

Temperature

100D to 120D

170D to 200D

Time

1 min.

In accordance with item No.4

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Appearance

No marking defects

Within T7.5%

0.025 max.

Capacitance

Change

D.F.

I.R.

Let sit for 24T2 hrs. at *room condition, then measure.

Time (min.)

30T3

2 to 3

30T3

2 to 3

Temperature (D)

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

Step

CU0.01µF : More than 100MΩ • µF

CF0.01µF : More than 10,000MΩ

1

2

3

4

Temperature

14

#Pretreatment

Perform a heat treatment at 150

Cycle

W00

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

Dielectric

Strength

In accordance with item No.4

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Appearance

No marking defects

Within T15%

0.05 max.

Let the capacitor sit at 40T2D and relative humidity of 90 to 95%

W24

Capacitance

Change

for 500

hrs.

Y00

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

Humidity

15 (Steady

State)

D.F.

I.R.

CU0.01µF : More than 10MΩ • µF

CF0.01µF : More than 1,000MΩ

#Pretreatment

Perform a heat treatment at 150

W00

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

15

Dielectric

Strength

In accordance with item No.4

No marking defects

Appearance

Apply 120% of the rated voltage (150% of the rated voltage in

case of rated voltage : DC250V, 110% of the rated voltage in

Within T15% (rated voltage : DC250V, DC630V)

Within T20% (rated voltage : DC1kV)

Capacitance

Change

W48

Y00

case of rated voltage : DC1kV) for 1,000

hrs. at maximum

operating temperature T3D. Remove and let sit for 24 T2 hrs. at

*room condition, then measure.

The charge/discharge current is less than 50mA.

#Pretreatment

D.F.

I.R.

0.05 max.

16 Life

CU0.01µF : More than 10MΩ • µF

CF0.01µF : More than 1,000MΩ

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

Dielectric

Strength

In accordance with item No.4

No marking defects

Within T15%

Appearance

Apply the rated voltage at 40T2D and relative humidity of 90 to

W24

Capacitance

Change

Humidity

Loading

95% for 500

hrs.

Y00

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

(Application :

D.F.

I.R.

0.05 max.

17

DC250V,

CU0.01µF : More than 10MΩ • µF

CF0.01µF : More than 1,000MΩ

DC630V

item)

Dielectric

Strength

In accordance with item No.4

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

112

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Only for Information Devices/Tip & Ring

0.3 min.

g

0.3 min.

■ Features

1. These items are designed specifically for tele-

communication devices (IEEE802.3) in Ethernet LAN.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

L

W

Dimensions (mm)

Part Number

3. Sn-plated external electrodes realizes good

L

W

T

g min.

2.5

2.2*

2.5

solderability.

GR442Q

GR443D

GR443Q

4.5 ±0.3

2.0 ±0.2

1.5 +0, -0.3

2.0 +0, -0.3

1.5 +0, -0.3

4. Only for reflow soldering.

4.5 ±0.4

3.2 ±0.3

5. The low-profile type (thickness: 1.5mm max.) is

available. Fit for use on thinner type equipment.

* GR443DR73D : 2.5mm min.

■ Applications

Ideal for use on telecommunication devices in Ethernet

LAN.

Electrode g

min.

Rated Voltage

(V)

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

(mm)

GR442QR73D101KW01L

GR442QR73D121KW01L

GR442QR73D151KW01L

GR442QR73D181KW01L

GR442QR73D221KW01L

GR442QR73D271KW01L

GR442QR73D331KW01L

GR442QR73D391KW01L

GR442QR73D471KW01L

GR442QR73D561KW01L

GR442QR73D681KW01L

GR442QR73D821KW01L

GR442QR73D102KW01L

GR442QR73D122KW01L

GR442QR73D152KW01L

GR443QR73D182KW01L

GR443QR73D222KW01L

GR443QR73D272KW01L

GR443QR73D332KW01L

GR443QR73D392KW01L

GR443DR73D472KW01L

DC2000

X7R (EIA)

100 ±10%

120 ±10%

150 ±10%

180 ±10%

220 ±10%

270 ±10%

330 ±10%

390 ±10%

470 ±10%

560 ±10%

680 ±10%

820 ±10%

1000 ±10%

1200 ±10%

1500 ±10%

1800 ±10%

2200 ±10%

2700 ±10%

3300 ±10%

3900 ±10%

4700 ±10%

4.5

2.0

3.2

1.5

2.0

2.5

0.3 min.

16

113

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y55 to W125D

Y

Temperature Range

Visual inspection

Using calipers

2

3

Appearance

No defects or abnormalities

Dimensions

Within the specified dimensions

No failure should be observed when voltage in table is applied

between the terminations, provided the charge/discharge current

is less than 50mA.

4

5

Dielectric Strength No defects or abnormalities

Rated voltage

Test Voltage

120% of the rated voltage 60±1 sec.

AC1500V (r.m.s.) 60±1 sec.

Time

DC2kV

10 impulse of alternating polarity is subjected.

Pulse Voltage

(Application :

DC2kV item)

No self healing break downs or flash-overs have taken place in (5 impulse for each polarity)

the capacitor.

The interval between impulse is 60 sec.

Applied Voltage : 2.5kV zero to peak

The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

Insulation Resistance

(I.R.)

6

7

More than 6,000MΩ

The capacitance/D.F. should be measured at 25D at a frequency

of 1T0.2kHz and a voltage of AC1T0.2V (r.m.s.)

Capacitance

Within the specified tolerance

#Pretreatment

Perform a heat treatment at 150

W0

Y10

Dissipation

Factor (D.F.)

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

8

9

0.025 max.

The range of capacitance change compared with the 25D value

Cap. Change

within ±15%

(Temp. Range : Y55 to W125D)

within the specified range.

#Pretreatment

Perform a heat treatment at 150

Capacitance

Temperature

Characteristics

W0

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder.

Then apply 10N force in the direction of the arrow.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

Adhesive Strength

of Termination

10

No removal of the terminations or other defect should occur.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Vibration

Resistance

D.F.

11

16

0.025 max.

Solder resist

Cu

Glass Epoxy Board

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Continued on the following page.

114

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

No cracking or marking defects should occur.

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder.

Then apply a force in the direction shown in Fig. 3.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

b

φ4.5

d

c

a

50

Pressurizing

speed : 1.0mm/s

20

t : 1.6

100

12 Deflection

Pressurize

Dimension (mm)

LZW

R230

(mm)

a

b

c

d

4.5Z2.00

4.5Z3.20

3.5

7.0

2.45

3.75

Flexure=1

1.0

Capacitance meter

45 45

Fig. 2

(in mm)

Fig. 3

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solderability of

Termination

13

75% of the terminations are to be soldered evenly and continuously.

*

Preheat the capacitor at 120 to 150D for 1 min.

Appearance

No marking defects

Immerse the capacitor in eutectic solder solution at 260T5D for

10T1 sec. Let sit at *room condition for 24T2 hrs., then measure.

#Immersing speed : 25T2.5mm/s

Capacitance

Change

Within T10%

D.F.

I.R.

0.025 max.

#Pretreatment

Perform a heat treatment at 150

let sit for 24T2 hrs. at *room condition.

W00

Y10

D for 60T5 min. and then

Resistance

More than 1,000MΩ

14 to Soldering

Heat

*Preheating for more than 3.2Z2.5mm

Dielectric

Strength

In accordance with item No.4

Step

1

2

Temperature

100D to 120D

170D to 200D

Time

1 min.

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Appearance

No marking defects

Capacitance

Change

Within T15%

D.F.

I.R.

0.05 max.

Let sit for 24T2 hrs. at *room condition, then measure.

Time (min.)

30T3

Temperature (D)

Min. Operating Temp.T3

Room Temp.

Step

More than 3,000MΩ

1

2

3

4

2 to 3

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

Temperature

15

#Pretreatment

Perform a heat treatment at 150

Cycle

W00

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

Dielectric

Strength

In accordance with item No.4

16

Solder resist

Cu

Glass Epoxy Board

Fig. 4

Appearance

No marking defects

Let the capacitor sit at 40T2D and relative humidity of 90 to 95%

W24

Capacitance

Change

for 500

hrs.

Within T15%

Y00

Remove and let sit for 24T2 hrs. at *room condition, then

Humidity

16 (Steady

State)

measure.

#Pretreatment

Perform a heat treatment at 150

D.F.

I.R.

0.05 max.

More than 1,000MΩ

W00

Y10

D for 60T5 min. and then

Dielectric

Strength

let sit for 24T2 hrs. at *room condition.

In accordance with item No.4

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Continued on the following page.

115

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Appearance

No marking defects

W48

Y00

Apply 110% of the rated voltage for 1,000

hrs. at maximum

Capacitance

Change

operating temperature T3D. Remove and let sit for 24 T2 hrs. at

*room condition, then measure.

Within T20%

The charge/discharge current is less than 50mA.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

17 Life

D.F.

I.R.

0.05 max.

More than 2,000MΩ

Dielectric

Strength

In accordance with item No.4

No marking defects

Within T15%

Appearance

Apply the rated voltage at 40T2D and relative humidity of 90 to

W24

Humidity

Capacitance

Change

95% for 500

hrs.

Y00

Loading

(Applicat

ion :

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

18

D.F.

I.R.

0.05 max.

More than 10MΩ • µF

DC250V

item)

Dielectric

Strength

In accordance with item No.4

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

16

116

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

AC250V Type (Which Meet Japanese Law)

e

g

e

■ Features

1. Chip monolithic ceramic capacitor for AC lines.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

L

W

3. Sn-plated external electrodes realizes good

Dimensions (mm)

T

2.0 ±0.2 1.5 +0, -0.3

Part Number

L

W

e min. g min.

solderability.

GA242Q

GA243D

GA243Q

GA255D

4.5 ±0.3

4. Only for reflow soldering.

2.0 +0, -0.3

1.5 +0, -0.3

4.5 ±0.4

5.7 ±0.4

3.2 ±0.3

0.3

2.5

5. Capacitance 0.01 to 0.1 uF for connecting lines and

470 to 4700 pF for connecting lines to earth.

5.0 ±0.4 2.0 +0, -0.3

■ Applications

Noise suppression filters for switching power supplies,

telephones, facsimiles, modems.

■ Reference Standard

GA2 series obtains no safety approval.

This series is based on JIS C 5102, JIS C 5150, and

the standards of the electrical appliance and material

safety law of Japan (separated table 4).

Electrode g

Rated Voltage

(V)

TC Code

(Standard)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

Capacitance

min.

(mm)

GA242QR7E2471MW01L

GA242QR7E2102MW01L

GA243QR7E2222MW01L

GA243QR7E2332MW01L

GA243DR7E2472MW01L

GA243QR7E2103MW01L

GA243QR7E2223MW01L

GA243DR7E2473MW01L

GA255DR7E2104MW01L

AC250 (r.m.s.)

X7R (EIA)

470pF ±20%

1000pF ±20%

2200pF ±20%

3300pF ±20%

4700pF ±20%

10000pF ±20%

22000pF ±20%

47000pF ±20%

0.10µF ±20%

4.5

5.7

2.0

3.2

5.0

1.5

2.0

1.5

2.0

2.5

0.3 min.

17

117

Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y55 to W125D

Y

Temperature Range

Visual inspection

Using calipers

2

3

Appearance

No defects or abnormalities

Dimensions

Within the specified dimensions

No failure should be observed when voltage in table is applied

between the terminations for 60T1 sec., provided the

charge/discharge current is less than 50mA.

4

Dielectric Strength No defects or abnormalities

Nominal Capacitance

Test voltage

U

F

C

10,000pF

AC575V (r.m.s.)

AC1500V (r.m.s.)

The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

Insulation Resistance

More than 2,000MΩ

(I.R.)

5

6

Capacitance

Within the specified tolerance

The capacitance/D.F. should be measured at 25D at a frequency

of 1T0.2kHz and a voltage of AC1T0.2V (r.m.s.)

#Pretreatment

Perform a heat treatment at 150

let sit for 24T2 hrs. at *room condition.

Dissipation

Factor (D.F.)

W00

Y10

7

8

0.025 max.

D for 60T5 min. and then

The range of capacitance change compared with the 25D value

within Y55 to W125D should be within the specified range.

#Pretreatment

Cap. Change

Within T15%

(Temp. Range : Y55 to W125D)

Capacitance

Temperature

Characteristics

W00

Y10

Perform a heat treatment at 150

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

As in Fig., discharge is made 50 times at 5 sec. intervals from

the capacitor (Cd) charged at DC voltage of specified.

R3

R1

Discharge

Test

(Application:

9

Appearance

No defects or abnormalities

R2

Ct

Nominal

10kV

V

Cd

Capacitance

CF10,000pF)

Ct : Capacitor under test Cd : 0.001µF

R1 : 1,000Ω R2 : 100MΩ R3 : Surge resistance

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder. Then apply 10N force in the

direction of the arrow. The soldering should be done either with

an iron or using the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

Adhesive Strength

of Termination

10

No removal of the terminations or other defects should occur.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

17

Vibration

Resistance

D.F.

11

0.025 max.

Solder resist

Cu

Glass Epoxy Board

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Continued on the following page.

118

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the

direction shown in Fig. 3. The soldering should be done either

with an iron or using the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such

as heat shock.

No cracking or marking defects should occur.

b

φ4.5

d

50

Pressurizing

speed : 1.0mm/s

20

c

Pressurize

12 Deflection

a

R230

t : 1.6

100

Flexure=1

Dimension (mm)

LZW

Capacitance meter

45 45

(mm)

a

b

c

d

4.5Z2.0

4.5Z3.2

5.7Z5.0

3.5

4.5

7.0

8.0

2.4

3.7

5.6

(in mm)

1.0

Fig. 3

Fig. 2

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solderability of

Termination

13

14

75% of the terminations are to be soldered evenly and continuously.

Appearance

No marking defects

Capacitance

Change

Within T15%

The capacitor should be subjected to 40T2D, relative humidity of

90 to 98% for 8 hrs., and then removed in *room condition for 16

hrs. until 5 cycles.

Humidity

Insulation

D.F.

I.R.

0.05 max.

More than 1,000MΩ

Dielectric

Strength

In accordance with item No.4

No marking defects

Within T10%

Preheat the capacitor as table.

Appearance

Immerse the capacitor in eutectic solder solution at 260T5D for

10T1 sec. Let sit at *room condition for 24T2 hrs., then

measure.

Capacitance

Change

#Immersing speed : 25T2.5mm/s

D.F.

I.R.

0.025 max.

Resistance

15 to Soldering

Heat

#Pretreatment

Perform a heat treatment at 150

More than 2,000MΩ

W00

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

*Preheating

Dielectric

Strength

In accordance with item No.4

Step

1

2

Temperature

100D to 120D

170D to 200D

Time

1 min.

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Appearance

No marking defects

Capacitance

Change

Within T15%

D.F.

I.R.

0.05 max.

Let sit for 24T2 hrs. at *room condition, then measure.

Time (min.)

30T3

Temperature (D)

Min. Operating Temp.T3

Room Temp.

Step

More than 2,000MΩ

1

2

3

4

2 to 3

Max. Operating Temp.T2

Room Temp.

30T3

2 to 3

Temperature

17

16

#Pretreatment

Perform a heat treatment at 150

Cycle

W00

Y10

D for 60T5 min. and then

let sit for 24T2 hrs. at *room condition.

Dielectric

Strength

In accordance with item No.4

Solder resist

Cu

Glass Epoxy Board

Fig. 4

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

Continued on the following page.

119

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Appearance

No marking defects

Let the capacitor sit at 40T2D and relative humidity of 90 to 95%

W24

Capacitance

Change

for 500

hrs.

Within T15%

Y00

Remove and let sit for 24T2 hrs. at *room condition, then

Humidity

measure.

#Pretreatment

Perform a heat treatment at 150

17 (Steady

State)

D.F.

I.R.

0.05 max.

More than 1,000MΩ

W00

Y10

D for 60T5 min. and then

Dielectric

Strength

let sit for 24T2 hrs. at *room condition.

In accordance with item No.4

No marking defects

Within T20%

Appearance

Apply voltage and time as Table at 85T2D. Remove and let sit

for 24 T2 hrs. at *room condition, then measure. The charge /

discharge current is less than 50mA.

Capacitance

Change

Nominal Capacitance

CU10,000pF

Test voltage

AC300V (r.m.s.)

AC500V (r.m.s.)

hrs.

Test Time

W48

D.F.

I.R.

0.05 max.

1,000

hrs.

Y10

W48

*

CF10,000pF

1,500

Y10

More than 1,000MΩ

18 Life

* Except that once each hour the voltage is increased to

AC1,000V (r.m.s.) for 0.1 sec.

Dielectric

Strength

In accordance with item No.4

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

Appearance

No marking defects

Apply the rated voltage at 40T2D and relative humidity of 90 to

W24

Capacitance

Change

95% for 500

hrs.

Within T15%

Y00

Remove and let sit for 24T2 hrs. at *room condition, then

measure.

#Pretreatment

Apply test voltage for 60T5 min. at test temperature.

Remove and let sit for 24T2 hrs. at *room condition.

Humidity

19

D.F.

I.R.

0.05 max.

Loading

More than 1,000MΩ

Dielectric

Strength

In accordance with item No.4

* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

17

120

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GC (UL, IEC60384-14 Class X1/Y2)

e

g

e

■ Features

1. Chip monolithic ceramic capacitor (certified as

conforming to safety standards) for AC lines.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

L

W

3. Compared to lead type capacitors, this new

capacitor is greatly downsized and low-profiled to

1/10 or less in volume, and 1/4 or less in height.

4. The type GC can be used as an X1-class and Y2-class

capacitor, line-by-pass capacitor of UL1414.

5. +125 degree C guaranteed.

Dimensions (mm)

e min.

Part Number

L

W

T

g min.

4.0

GA355D

5.7 ±0.4 5.0 ±0.4 2.0 ±0.3

0.3

6. Only for reflow soldering.

■ Standard Recognition

■ Applications

Status of Recognition

Rated

Voltage

Standard No.

1. Ideal for use as Y capacitor or X capacitor for

various switching power supplies

2. Ideal for modem applications

Type GB

Type GC

UL

UL1414

Yꢀ

Y

BSI

VDE

SEV

SEMKO

AC250V

(r.m.s.)

EN132400

EN132400 Class

X2

X1, Y2

: Line-By-Pass only

Electrode g

Rated Voltage

(V)

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

min.

(mm)

GA355DR7GC101KY02L

GA355DR7GC151KY02L

GA355DR7GC221KY02L

GA355DR7GC331KY02L

GA355DR7GC471KY02L

GA355DR7GC681KY02L

GA355DR7GC102KY02L

GA355DR7GC152KY02L

GA355DR7GC222KY02L

GA355DR7GC332KY02L

GA355DR7GC472KY02L

AC250 (r.m.s.)

X7R (EIA)

100 ±10%

150 ±10%

220 ±10%

330 ±10%

470 ±10%

680 ±10%

1000 ±10%

1500 ±10%

2200 ±10%

3300 ±10%

4700 ±10%

5.7

5.0

2.0

4.0

0.3 min.

18

121

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GD (IEC60384-14 Class Y3)

e

g

e

■ Features

1. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

L

W

2. The type GD can be used as a Y3-class capacitor.

3. Available for equipment based on IEC/EN60950

and UL1950.

Dimensions (mm)

Part Number

L

W

T

e min. g min.

GA342D

GA342Q

GA343D

GA343Q

2.0 ±0.2*

4. +125 degree C guaranteed.

4.5 ±0.3 2.0 ±0.2

4.5 ±0.4 3.2 ±0.3

1.5 +0, -0.3

2.0 +0, -0.3

1.5 +0, -0.3

2.5

0.3

5. Only for reflow soldering.

6. The low-profile type (thickness: 1.5mm max.) is

available. Fit for use on thinner type equipment.

* GA342D1X : 2.0±0.3

■ Applications

■ Standard Recognition

1. Ideal for use on line filters and couplings for

DAA modems without transformers.

2. Ideal for use on line filters for information

equipment.

Status of Recognition

Standard

Class

Rated

Voltage

No.

Type GD

SEMKO EN132400

Y3

AC250V (r.m.s.)

Applications

Communication

network devices

such as a modem

Switching power

Size

supplies

4.5×3.2mm and under

Y

Electrode g

Rated Voltage

(V)

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

min.

(mm)

GA342D1XGD100JY02L

GA342D1XGD120JY02L

GA342D1XGD150JY02L

GA342D1XGD180JY02L

GA342D1XGD220JY02L

GA342D1XGD270JY02L

GA342D1XGD330JY02L

GA342D1XGD390JY02L

GA342D1XGD470JY02L

GA342D1XGD560JY02L

GA342D1XGD680JY02L

GA342D1XGD820JY02L

AC250 (r.m.s.)

SL (JIS)

10 ±5%

12 ±5%

4.5

2.0

3.2

2.0

1.5

2.0

2.5

0.3 min.

SL (JIS)

15 ±5%

SL (JIS)

18 ±5%

SL (JIS)

22 ±5%

SL (JIS)

27 ±5%

SL (JIS)

33 ±5%

SL (JIS)

39 ±5%

SL (JIS)

47 ±5%

SL (JIS)

56 ±5%

SL (JIS)

68 ±5%

SL (JIS)

82 ±5%

GA342QR7GD101KW01L AC250 (r.m.s.)

GA342QR7GD151KW01L AC250 (r.m.s.)

GA342QR7GD221KW01L AC250 (r.m.s.)

GA342QR7GD331KW01L AC250 (r.m.s.)

GA342QR7GD471KW01L AC250 (r.m.s.)

GA342QR7GD681KW01L AC250 (r.m.s.)

GA342QR7GD102KW01L AC250 (r.m.s.)

GA342QR7GD152KW01L AC250 (r.m.s.)

GA343QR7GD182KW01L AC250 (r.m.s.)

GA343QR7GD222KW01L AC250 (r.m.s.)

GA343DR7GD472KW01L AC250 (r.m.s.)

X7R (EIA)

100 ±10%

150 ±10%

220 ±10%

330 ±10%

470 ±10%

680 ±10%

1000 ±10%

1500 ±10%

1800 ±10%

2200 ±10%

4700 ±10%

19

122

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GF (IEC60384-14 Class Y2)

e

g

e

■ Features

1. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

L

W

2. The type GF can be used as a Y2-class capacitor.

3. Available for equipment based on IEC/EN60950

and UL1950. Besides, the GA352/355 types are

available for equipment based on IEC/EN60065,

UL1492, and UL6500.

Dimensions (mm)

Part Number

L

W

T

e min. g min.

GA342D

GA342Q

GA352Q

GA355Q

2.0 ±0.2*

4.5 ±0.3 2.0 ±0.2

2.5

0.3

4.0

1.5 +0, -0.3

2.8 ±0.3

5.7 ±0.4

5.0 ±0.4

4. +125 degree C guaranteed.

* GA342D1X : 2.0±0.3

5. Only for reflow soldering.

6. The low-profile type (thickness: 1.5mm max.) is

available. Fit for use on thinner type equipment.

■ Standard Recognition

■ Applications

Status of Recognition

Type GF

1. Ideal for use on line filters and couplings for

DAA modems without transformers.

2. Ideal for use on line filters for information

equipment.

Standard

Class

Rated

Voltage

No.

Size : 5.7×2.8mm

Size : 4.5×2.0mm

and over

UL

UL1414 X1, Y2

Y

AC250V

(r.m.s.)

3. Ideal for use as Y capacitor or X capacitor for

various switching power supplies. (GA352/355 types

only)

SEMKO EN132400

Y2

Applications

Communication

network devices

such as a modem

Switching power

Size

supplies

4.5×2.0mm

Y

5.7×2.8mm and over

Electrode g

Rated Voltage

(V)

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

min.

(mm)

GA342D1XGF100JY02L

GA342D1XGF120JY02L

GA342D1XGF150JY02L

GA342D1XGF180JY02L

GA342D1XGF220JY02L

GA342D1XGF270JY02L

GA342D1XGF330JY02L

GA342D1XGF390JY02L

GA342D1XGF470JY02L

GA342D1XGF560JY02L

GA342D1XGF680JY02L

GA342D1XGF820JY02L

AC250 (r.m.s.)

SL (JIS)

10 ±5%

12 ±5%

4.5

5.7

2.0

2.8

5.0

2.0

1.5

2.0

1.5

2.5

4.0

0.3 min.

SL (JIS)

15 ±5%

SL (JIS)

18 ±5%

SL (JIS)

22 ±5%

SL (JIS)

27 ±5%

SL (JIS)

33 ±5%

SL (JIS)

39 ±5%

SL (JIS)

47 ±5%

SL (JIS)

56 ±5%

SL (JIS)

68 ±5%

SL (JIS)

82 ±5%

GA342QR7GF101KW01L AC250 (r.m.s.)

GA342QR7GF151KW01L AC250 (r.m.s.)

X7R (EIA)

100 ±10%

150 ±10%

220 ±10%

330 ±10%

470 ±10%

680 ±10%

1000 ±10%

1500 ±10%

1800 ±10%

2200 ±10%

3300 ±10%

GA342DR7GF221KW02L

GA342DR7GF331KW02L

AC250 (r.m.s.)

GA352QR7GF471KW01L AC250 (r.m.s.)

GA352QR7GF681KW01L AC250 (r.m.s.)

GA352QR7GF102KW01L AC250 (r.m.s.)

GA352QR7GF152KW01L AC250 (r.m.s.)

GA355QR7GF182KW01L AC250 (r.m.s.)

GA355QR7GF222KW01L AC250 (r.m.s.)

GA355QR7GF332KW01L AC250 (r.m.s.)

20

123

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Chip Monolithic Ceramic Capacitors

Safety Standard Recognized Type GB (IEC60384-14 Class X2)

e

g

e

■ Features

1. Chip monolithic ceramic capacitor (certified as

conforming to safety standards) for AC lines.

2. A new monolithic structure for small, high

capacitance capable of operating at high voltage

levels.

L

W

3. Compared to lead type capacitors, this new

capacitor is greatly downsized and low-profiled to

1/10 or less in volume, and 1/4 or less in height.

4. The type GB can be used as an X2-class capacitor.

5. +125 degree C guaranteed.

Dimensions (mm)

Part Number

L

W

T

e min.

g min.

2.0 ±0.3

2.7 ±0.3

GA355D

GA355X

5.7 ±0.4 5.0 ±0.4

0.3

4.0

6. Only for reflow soldering.

■ Standard Recognition

■ Applications

Ideal for use as X capacitor for various switching

Status of Recognition

Rated

Voltage

Standard No.

power supplies.

Type GB

Type GC

UL

UL1414

Yꢀ

Y

BSI

VDE

SEV

SEMKO

AC250V

(r.m.s.)

EN132400

EN132400 Class

X2

X1, Y2

: Line-By-Pass only

Electrode g

Rated Voltage

(V)

TC Code

(Standard)

Capacitance

(pF)

Length L Width W Thickness T

Electrode e

(mm)

Part Number

min.

(mm)

GA355DR7GB103KY02L

GA355DR7GB153KY02L

GA355DR7GB223KY02L

GA355XR7GB333KY06L

AC250 (r.m.s.)

X7R (EIA)

10000 ±10%

15000 ±10%

22000 ±10%

33000 ±10%

5.7

5.0

2.0

2.7

4.0

0.3 min.

21

124

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GA3 Series Specifications and Test Methods

Specifications

No.

1

Item

Operating

Test Method

Y55 to W125D

Y

Temperature Range

Visual inspection

Using calipers

2

3

Appearance

No defects or abnormalities

Dimensions

Within the specified dimensions

No failure should be observed when voltage in table is applied

between the terminations for 60T1 sec., provided the

charge/discharge current is less than 50mA.

4

5

Dielectric Strength No defects or abnormalities

Test voltage

Type GB

DC1075V

Type GC/GD/GF

AC1500V (r.m.s.)

10 impulse of alternating polarity is subjected.

No self healing break downs or flash-overs have taken place in (5 impulse for each polarity)

Pulse Voltage

(Application: Type

GD/GF)

the capacitor.

The interval between impulse is 60 sec.

Applied Voltage : 2.5kV zero to peak

The insulation resistance should be measured with DC500T50V

and within 60T5 sec. of charging.

Insulation Resistance

(I.R.)

6

7

More than 6,000MΩ

Capacitance

Within the specified tolerance

The capacitance/Q/D.F. should be measured at 20D at a

frequency of 1T0.2kHz (SL char. : 1T0.2MHz) and a voltage of

AC1T0.2V (r.m.s.).

Char.

Specification

Dissipation

Factor (D.F.)

Q

D.F.V0.025

X7R

#Pretreatment for X7R char.

8

2

W00

Y10

QU400+20C* (CF30pF)

QU1000

Perform a heat treatment at 150

D for 60T5 min. and then

SL

(CU30pF)

1

let sit for 24T2 hrs. at * room condition.

Char.

X7R

Capacitance Change

The range of capacitance change compared with the 25D (SL

char. : 20D) value within Y55 to W125D should be within the

specified range.

Within T15%

Capacitance

Temperature

Characteristics

Temperature characteristic guarantee is Y55 to W125D

9

#Pretreatment for X7R char.

Char.

SL

Temperature Coefficient

+350 to -1000ppm/D

W00

Y10

Perform a heat treatment at 150

D for 60T5 min. and then

1

let sit for 24T2 hrs. at * room condition.

Temperature characteristic guarantee is W20 to W85D

Appearance

No defects or abnormalities

As in Fig., discharge is made 50 times at 5 sec. intervals from

the capacitor (Cd) charged at DC voltage of specified.

I.R.

More than 1,000MΩ

R3

R1

Discharge

Test

10

R2

Ct

(Application:

Type GC)

10kV

V

Dielectric

Strength

Cd

In accordance with item No.4

Ct : Capacitor under test Cd : 0.001µF

R1 : 1,000Ω R2 : 100MΩ R3 : Surge resistance

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 1 using a eutectic solder. Then apply 10N force in the

direction of the arrow. The soldering should be done either with

an iron or using the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

Adhesive Strength

of Termination

11

No removal of the terminations or other defect should occur.

10N, 10T1s

Speed : 1.0mm/s

Glass Epoxy Board

Fig. 1

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Continued on the following page.

21

125

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GA3 Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Appearance

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board).

The capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 55Hz. The

frequency range, from 10 to 55Hz and return to 10Hz, should be

traversed in approximately 1 min. This motion should be applied

for a period of 2 hrs. in each 3 mutually perpendicular directions

(total of 6 hrs.).

Capacitance

Vibration

Resistance

12

Char.

Specification

D.F.

Q

D.F.V0.025

QU400+20C* (CF30pF)

X7R

2

SL

QU1000

(CU30pF)

Solder resist

Cu

Glass Epoxy Board

No cracking or marking defects should occur.

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2 using a eutectic solder. Then apply a force in the

direction shown in Fig. 3. The soldering should be done either

with an iron or using the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such

as heat shock.

b

φ4.5

d

c

a

50

t : 1.6

Pressurizing

20

100

speed : 1.0mm/s

13 Deflection

Pressurize

Dimension (mm)

LZW

R230

(mm)

a

b

c

d

4.5Z2.0

4.5Z3.2

5.7Z2.8

5.7Z5.0

3.5

4.5

7.0

8.0

2.4

3.7

3.2

5.6

Flexure=1

1.0

Capacitance meter

45 45

(in mm)

Fig. 2

Fig. 3

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in eutectic solder solution for 2T0.5 sec. at 235T5D.

Immersing speed : 25T2.5mm/s

Solderability of

Termination

14

75% of the terminations are to be soldered evenly and continuously.

No marking defects

Preheat the capacitor as table. Immerse the capacitor in

Appearance

eutectic solder solution at 260T5D for 10T1 sec. Let sit at

1

* room condition for 24T2 hrs., then measure.

Char.

X7R

Capacitance Change

Within T10%

#Immersing speed : 25T2.5mm/s

Capacitance

Change

#Pretreatment for X7R char.

Within T2.5% or T0.25pF

(Whichever is larger)

SL

W00

Y10

Resistance

15 to Soldering

Heat

Perform a heat treatment at 150

D for 60T5 min. and then

1

let sit for 24T2 hrs. at * room condition.

I.R.

More than 1,000MΩ

*Preheating

Step

1

2

Temperature

100D to 120D

170D to 200D

Time

1 min.

Dielectric

Strength

In accordance with item No.4

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Continued on the following page.

21

126

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GA3 Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4 using a eutectic solder.

Appearance

No marking defects

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24T2 hrs. at * room condition, then measure.

Char.

X7R

Capacitance Change

Within T15%

Within T2.5% or T0.25pF

(Whichever is larger)

Capacitance

Change

1

SL

Time (min.)

30T3

2 to 3

30T3

2 to 3

Temperature (D)

Min. Operating Temp.T3

Room Temp.

Max. Operating Temp.T2

Room Temp.

Step

1

2

3

4

Char.

X7R

Specification

D.F.

Q

D.F.V0.05

2

QU400+20C* (CF30pF)

Temperature

Cycle

SL

16

QU1000

(CU30pF)

#Pretreatment for X7R char.

W00

Y10

Perform a heat treatment at 150

D for 60T5 min. and then

I.R.

More than 3,000MΩ

1

let sit for 24T2 hrs. at * room condition.

Dielectric

Strength

Solder resist

Cu

In accordance with item No.4

No marking defects

Glass Epoxy Board

Fig. 4

Appearance

Char.

Capacitance Change

Capacitance

Change

X7R

Within T15%

Within T5.0% or T0.5pF

(Whichever is larger)

Let the capacitor sit at 40T2D and relative humidity of 90 to 95%

for 500T12 hrs.

SL

1

Remove and let sit for 24T2 hrs. at * room condition, then

Humidity

measure.

#Pretreatment for X7R char.

Perform a heat treatment at 150

let sit for 24T2 hrs. at * room condition.

17 (Steady

State)

Char.

X7R

Specification

D.F.

Q

D.F.V0.05

W00

Y10

2

QU275+5/2C* (CF30pF)

D for 60T5 min. and then

SL

1

QU350

(CU30pF)

I.R.

More than 3,000MΩ

Dielectric

Strength

In accordance with item No.4

No marking defects

Impulse Voltage

Appearance

T1

=

1.2µs=1.67T

50µs

100 (%)

90

50

30

Each individual capacitor should

be subjected to a 2.5kV (Type

GC/GF : 5kV) Impulses (the

voltage value means zero to

peak) for three times. Then the

capacitors are applied to life test.

T2=

Char.

X7R

Capacitance Change

Within T20%

Capacitance

Change

0

t

T

Within T3.0% or T0.3pF

(Whichever is larger)

T2

SL

W2

Y0

Apply voltage as Table for 1,000 hrs. at 125

humidity 50% max.

D, relative

Char.

X7R

Specification

D.F.

Q

D.F.V0.05

2

18 Life

Type

Applied voltage

AC312.5V (r.m.s.), except that once each hour the

voltage is increased to AC1,000V (r.m.s.) for 0.1 sec.

QU275+5/2C* (CF30pF)

SL

QU350

(CU30pF)

GB

GC

GD

GF

I.R.

More than 3,000MΩ

AC425V (r.m.s.), except that once each hour the

voltage is increased to AC1,000V (r.m.s.) for 0.1 sec.

1

Let sit for 24T2 hrs. at * room condition, then measure.

Dielectric

Strength

In accordance with item No.4

#Pretreatment for X7R char.

W00

Y10

Perform a heat treatment at 150

D for 60T5 min. and then

1

let sit for 24T2 hrs. at * room condition.

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

Continued on the following page.

21

127

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GA3 Series Specifications and Test Methods

Continued from the preceding page.

Specifications

No.

Item

Test Method

Appearance

No marking defects

Char.

X7R

Capacitance Change

Within T15%

Capacitance

Change

Within T5.0% or T0.5pF

(Whichever is larger)

SL

Apply the rated voltage at 40T2D and relative humidity of 90 to

W24

Y00

1

95% for 500

hrs. Remove and let sit for 24T2 hrs. at * room

condition, then measure.

#Pretreatment for X7R char.

Humidity

Loading

19

Char.

X7R

Specification

D.F.

Q

D.F.V0.05

W00

Y10

Perform a heat treatment at 150

D for 60T5 min. and then

2

QU275+5/2C* (CF30pF)

1

let sit for 24T2 hrs. at * room condition.

SL

QU350

(CU30pF)

I.R.

More than 3,000MΩ

In accordance with item No.4

Dielectric

Strength

*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa

*2 "C" expresses nominal capacitance value (pF).

21

128

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM/GR4/GA2/GA3 Series Data (Typical Example)

■ Capacitance-Temperature Characteristics

GRM/GR4/GA2 Series

GA3 Series (type GB/GC)

20

30

20

10

0

15

X7R Char. Spec.(upper)

Type G C ( 681)

10

5

R

X7R

B

SL

C0G

SL

B

Type G B

0

R

Type G C (102

)

C0G

−5

−10

X7R

−15

X7R Char. Spec.(lower)

−20

−30

−20

−60 −40 −20

0

20 40 60 80 100 120 140

−60 −40 −20

0

20

40

60

80 100 120 140

Temperature [°C]

Temperature (°C)

GA3 Series (type GD/GF)

30

20

10

0

X7R Char. Spec.(upper)

-10

-20

-30

X7R Char. Spec.(lower)

-60

-40

-20

0

20

40

60

80

100

120

140

Temperature (°C)

■ Impedance-Frequency Characteristics

GRM Series (SL Characteristics)

GRM Series (R Characteristics)

10k

100k

1k

100

10

10k

100pF

220pF

10pF

22pF

1k

47pF

100

470pF

100pF

1000pF

220pF

1

10

100m

10m

1

100m

1M

10M

Frequency [Hz]

100M

1G

1M

10M

100M

Frequency [Hz]

1G

3G

Continued on the following page.

21

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM/GR4/GA2/GA3 Series Data (Typical Example)

Continued from the preceding page.

■ Impedance-Frequency Characteristics

GRM Series (X7R Char. 250V)

GRM Series (X7R Char. 630V)

1k

100

10

100

1000pF

10

10000pF

100000pF

1

100m

10m

100m

10m

1M

10M

Frequency [Hz]

100M

1G

10M

Frequency [Hz]

100M

1G

GA2 Series

GA3 Series (Type GC)

1k

100

10

1000

100

10

1

1000pF

10000pF

100000pF

1

100m

10m

0.68nF

4.7nF

0.1

0.01

1

10

100

1000

1M

10M

100M

Frequency [Hz]

1G

Frequency (MHz)

GA3 Series (Type GD)

GA3 Series (Type GF)

1K

100

10

1K

150pF

100

10

1

1000pF

2200pF

1

100m

10m

100m

10m

1M

10M

Frequency [Hz]

100M

1G

10M

Frequency [Hz]

100M

1G

Continued on the following page.

21

130

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

GRM/GR4/GA2/GA3 Series Data (Typical Example)

Continued from the preceding page.

■ Impedance-Frequency Characteristics

GA3 Series (Type GB)

1000

100

10

1

10nF

0.1

33nF

0.01

1

10

100

1000

Frequency (MHz)

■ Capacitance-AC Voltage Characteristics

GA3 Series (Type GC)

GA3 Series (Type GD/GF, X7R char.)

at Room Condition (25°C)

60

40

20

0

4.7nF

40

20

0.68nF

0

-20

-40

-60

−20

−40

−60

0

100

200

300

400

500

0

100

200

300

400

500

AC-Voltage [V(r.m.s.)]

GA3 Series (Type GB)

at Room Condition (25°C)

60

40

20

0

−20

−40

−60

0

100

200

300

400

500

AC-Voltage [V(r.m.s.)]

21

131

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Taping is standard packaging method.

■ Minimum Quantity Guide

Part Number

Quantity (pcs.)

Dimensions (mm)

φ180mm reel

L

W

T

Paper Tape

Plastic Tape

-

GRM18

GRM21

1.6

0.8

1.0

1.25

1.0

1.25

1.6

1.5

2.0

1.0

1.25

1.5

2.0

1.5

2.0

2.5

2.0

1.5

2.0

1.5

2.0

1.5

2.0

1.5

2.0

1.5

2.0

2.7

4,000

-

2.0

1.25

-

3,000

-

4,000

GRM31/GR431

GRM32/GR432

3.2

1.6

-

3,000

2,000

1,000

3,000

2,000

1,000

500

2.5

Medium-voltage

GRM42/GR442

4.5

2.0

GRM43/GR443

4.5

3.2

1,000

2,000

1,000

2,000

1,000

500

GRM55/GR455

GA242

5.7

4.5

5.0

2.0

AC250V

GA243

GA255

GA342

4.5

5.7

4.5

3.2

5.0

2.0

GA343

GA352

4.5

5.7

3.2

2.8

Safety Std.

Recognition

GA355

5.7

5.0

■ Tape Carrier Packaging

(1) Appearance of Taping

q Plastic Tape

w Paper Tape

Cover Tape : 0.06mm in thickness

Top Tape : 0.05mm in thickness

Sprocket Hole : As specified in (2)

Cavity for Chip : As specified in (2)

Sprocket Hole : As specified in (2)

Cavity for Chip : As specified in (2)

Bottom Tape : 0.05mm in thickness

Base Tape : As specified in (2)

21

Packed Chips

Chip

Packed Chips

Continued on the following page.

132

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Continued from the preceding page.

(2) Dimensions of Tape

q Plastic Tape

8mm width 4mm pitch Tape

12mm width 8mm/4mm pitch Tape

W0.1

Y0

4.0T0.05

2.0T0.05

φ1.5

1

*

8.0T0.1

2.0T0.05

4.0

W0.1

Y0

0.25T0.1

0.3T0.1

1.75T

0.1

φ1.5

4.0T0.1

1.75T0.1

T

0.1

A

Direction of Feed

2.5 max.

3.7 max.

Part Number

A*

B*

Part Number

GRM42/GR442/GA242/GA342

GRM43/GR443/GA243/GA343

GA252/GA352

A*

B*

5.1

4.9

6.1

2.5

3.6

3.2

GRM21

(TU1.25mm)

1.45

2.25

GRM31/GR431

(TU1.25mm)

2.0

2.9

3.6

GRM55/GR455/

GA255/GA355

5.4

6.1

GRM32/GR432

*Nominal Value

*1 4.0±0.1mm in case of GRM42/GR442/GA242/GA342

*Nominal Value

(in mm)

w Paper Tape

(3) Dimensions of Reel

8mm width 4mm pitch Tape

4.0T0.1

W0.1

Y0

1.1 max.

2.0T0.05

φ1.5

4.0T0.1

1.75T0.1

2.0T0.5

φ13T0.2

A

φ21T0.8

Direction of Feed

Part Number

A*

B*

9.0 ^+1.0(Tape width 8mm)

-0

1.05

1.85

GRM18

13.0 ^+1.0(Tape width 12 mm)

-0

GRM21

(T=1.0mm)

1.45

2.0

2.25

GRM31

(T=1.0mm)

3.6

*Nominal value

(in mm)

Continued on the following page.

21

133

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Package

Continued from the preceding page.

(4) Taping Method

q Tapes for capacitors are wound clockwise. The

sprocket holes are to the right as the tape is pulled

toward the user.

Vacant section Chip-mounting unit Vacant section

Leader unit

w Part of the leader and part of the empty tape shall be

attached to the end of the tape as shown at right.

e The top tape or cover tape and base tape are not

attached at the end of the tape for a minimum of 5

pitches.

40 to 200

100 to 200

250 to 560

(Top Tape or Cover Tape alone)

Direction of feed

r Missing capacitors number within 0.1% of the number

per reel or 1 pc, whichever is greater, and are not

continuous.

(in mm)

t The top tape or cover tape and bottom tape shall not

protrude beyond the edges of the tape and shall not

cover sprocket holes.

y Cumulative tolerance of sprocket holes, 10 pitches :

T0.3mm.

u Peeling off force : 0.1 to 0.7N in the direction shown at

right.

Top Tape or Cover Tape

Base Tape

21

134

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

■ Storage and Operating Conditions

Operating and storage environment

where the temperature and relative humidity do not

exceed 5 to 40 degrees centigrade and 20 to 70%.

Use capacitors within 6 months. Check the

solderability after 6 months or more.

Do not use or store capacitors in a corrosive

atmosphere, especially where chloride gas, sulfide

gas, acid, alkali, salt or the like are present. And

avoid exposure to moisture. Before cleaning, bonding

or molding this product, verify that these processes

do not affect product quality by testing the

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND CAUSE FUMING OR PARTIAL DISPERSION

WHEN THE PRODUCT IS USED.

performance of a cleaned, bonded or molded product

in the intended equipment. Store the capacitors

■ Handling

1. Vibration and impact

Do not expose a capacitor to excessive shock or

vibration during use.

2. Do not directly touch the chip capacitor, especially

the ceramic body. Residue from hands/fingers may

create a short circuit environment.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT

AND CAUSE FUMING OR PARTIAL DISPERSION

WHEN THE PRODUCT IS USED.

21

135

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Caution (Rating)

1. Operating Voltage

When DC-rated capacitors are to be used in AC or ripple

current circuits, be sure to maintain the Vp-p value of the

applied voltage or the Vo-p which contains DC bias within

the rated voltage range.

When the voltage is applied to the circuit, starting or

stopping may generate irregular voltage for a transit

period because of resonance or switching. Be sure to use

a capacitor with a rated voltage range that includes these

irregular voltages.

Voltage

DC Voltage

DC+AC Voltage

AC Voltage

Pulse Voltage (1)

Pulse Voltage (2)

Positional

Measurement

V0-p

Vp-p

2. Operating Temperature and Self-generated Heat

(1) In case of X7R char. and GA3 series SL char.

The temperature of the surface

of capacitor: 125˚C (including self-heating)

Keep the surface temperature of a capacitor below the

upper limit of its rated operating temperature range.

Be sure to take into account the heat generated by the

capacitor itself. When the capacitor is used in a high-

frequency current, pulse current or the like, it may

have the self-generated heat due to dielectric-loss.

Applied voltage should be the load such as self-

generated heat is within 20°C on the condition of

atmosphere temperature 25°C. When measuring, use a

thermocouple of small thermal capacity-K of ø0.1mm

in conditions where the capacitor is not affected by

radiant heat from other components or surrounding

ambient fluctuations. Excessive heat may lead to

deterioration of the capacitor's characteristics and

reliability. (Never attempt to perform measurement

with the cooling fan running. Otherwise, accurate

measurement cannot be ensured.)

Rated Voltage: DC630V

1000

(630)

to 1000pF

100

1

10

100 (500)1000

Frequency [kHz]

Rated Voltage: DC1kV

10000

1000

to 470pF

(2) In case of C0G/R char.

Keep the surface temperature of a capacitor below the

upper limit of its rated operating temperature range.

Be sure to take into account the heat generated by the

capacitor itself. When the capacitor is used in a high-

frequency current, pulse current or similar current, it may

self-generate heat due to dielectric loss.

100

1

10

100 (500)1000

Frequency [kHz]

Rated Voltage: DC3.15kV

The frequency of the applied sine wave voltage should be

less than 500kHz (less than 100kHz in case of rated

voltage: DC3.15kV). The applied voltage should be less

than the value shown in figure at right.

10000

to 47pF

(3150)

1000

In case of non-sine wave which include a harmonic

frequency, please contact our sales representatives or

product engineers. Excessive heat may lead to

deterioration of the capacitor's characteristics and

reliability. (Never attempt to perform measurement with

the cooling fan running.

21

1

10

100

1000

Frequency [kHz]

The sine-wave frequency VS allowable voltage

Continued on the following page.

Otherwise, accurate measurement cannot be ensured.)

136

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

(3) In case of GRM series SL char.

Keep the surface temperature of a capacitor below the

The temperature of the surface

of capacitor: 125˚C (including self-heating)

upper limit of its rated operating temperature range.

Be sure to take into account the heat generated by the

capacitor itself. When the capacitor is used in a high-

frequency current, pulse current or similar current, it may

self-generate heat due to dielectric loss.

Rated Voltage: DC2kV

10000

to 220pF

The frequency of the applied sine wave voltage should be

less than 500kHz. The applied voltage should be less

than the value shown in figure at right.

1000

In case of non-sine wave which include a harmonic

frequency, please contact our sales representatives or

product engineers. Excessive heat may lead to

deterioration of the capacitor's characteristics and

reliability. (Never attempt to perform measurement with

the cooling fan running.

100

1

10

100 (500)1000

Frequency [kHz]

Rated Voltage: DC3.15kV

10000

Otherwise, accurate measurement cannot be ensured.)

100pF

3. Test condition for AC withstanding Voltage

(1) Test Equipment

1000

100

Tests for AC withstanding voltage should be made with

equipment capable of creating a wave similar to a

50/60 Hz sine wave.

1

10

100 (500)1000

If the distorted sine wave or overload exceeding the

specified voltage value is applied, a defect may be

caused.

Frequency [kHz]

The sine-wave frequency VS allowable voltage

(2) Voltage applied method

The capacitor's leads or terminals should be firmly

connected to the output of the withstanding voltage test

equipment, and then the voltage should be raised from

near zero to the test voltage. If the test voltage is applied

directly to the capacitor without raising it from near zero,

it should be applied with the *zero cross. At the end of the

test time, the test voltage should be reduced to near zero,

and then the capacitor's leads or terminals should be

taken off the output of the withstanding voltage test

equipment. If the test voltage is applied directly to the

capacitor without raising it from near zero, surge voltage

may occur and cause a defect.

Voltage sine wave

*ZERO CROSS is the point where voltage sine wave

pass 0V.

0V

- See the figure at right -

zero cross

Continued on the following page.

21

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

4. Fail-Safe

Failure of a capacitor may result in a short circuit. Be sure

to provide an appropriate fail-safe function such as a fuse

on your product to help eliminate possible electric shock,

fire, or fumes.

FUSE

AC IN

Please consider using fuses on each AC line if the

capacitors are used between the AC input lines and earth

(line bypass capacitors), to prepare for the worst case,

such as a short circuit.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

CAUSE FUMING OR PARTIAL DISPERSION WHEN THE

PRODUCT IS USED.

21

138

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Caution (Soldering and Mounting)

1. Vibration and Impact

3. Land Layout for Cropping PC Board

Choose a mounting position that minimizes the stress

imposed on the chip during flexing or bending of the

board.

Do not expose a capacitor to excessive shock or vibration

during use.

[Component Direction]

2. Circuit Board Material

In case that chip size is 4.5g3.2mm or more, a metal-

board or metal-frame such as Aluminum board is not

available because soldering heat causes expansion and

shrinkage of a board or frame, which will cause a chip to

crack.

Locate chip

horizontal to the

direction in which

stress acts.

[Chip Mounting Close to Board Separation Point]

C

Perforation

B

Chip arrangement

Worst AGCGB~D Best

D

A

Slit

Continued on the following page.

21

139

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

!Caution

Continued from the preceding page.

4. Soldering (Prevention of the thermal shock)

If a chip component is heated or cooled abruptly during

soldering, it may crack due to the thermal shock. To

prevent this, follow our recommendations below for

adequate soldering conditions.

Carefully perform pre-heating so that temperature

difference (∆T) between the solder and component

surface is in the following range. When components

are immersed in solvent after mounting, pay special

attention to keep the temperature difference within

100˚C.

When correcting chips with a soldering iron, no

preheating is required if the chip is listed in following

table and the following conditions are met.

Preheating should be performed on chips not listed in

following table.

Item

Conditions

Chip Size

V2.0g1.25mm

300˚C max.

3.2g1.6mm

and under

3.2g2.5mm

and over

Temperature of Iron tip

Soldering Iron Wattage

Diameter of Iron tip

Soldering Time

270˚C max.

Soldering Method

Reflow Method or

Soldering Iron Method

20W max.

∆TV190˚C

∆TV150˚C

∆TV130˚C

φ 3.0mm max.

Flow Method or

Dip Soldering Method

3 sec. max.

Do not allow the iron tip to directly

touch the ceramic element.

Caution

Infrared Reflow Soldering Conditions

(Example)

Vapor Reflow Soldering (VPS)

Conditions (Example)

220 to 230D

Within 10 sec.

215D

200D

∆T

Pre-heating

60 sec. min.

Within 20 sec.

Within120 sec.

Flow Soldering Conditions

(Example)

Dip Soldering/Soldering Iron

Conditions (Example)

230 to 240D

∆

T

∆T

Pre-heating

60 to 120 sec. Within 5 sec.

60 to 120 sec. Within 20 sec.

5. Soldering Method

GR/GA products whose sizes are 3.2Z1.6mm and under

for flow and reflow soldering, and other sizes for reflow

soldering.

Be sure to contact our sales representatives or engineers

in case that GR/GA products (size 3.2Z2.5mm and over)

are to be mounted with flow soldering. It may crack due

to the thermal shock.

21

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

FUMING WHEN THE PRODUCT IS USED.

140

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

Notice (Soldering and Mounting)

1. Mounting of Chips

Mechanical shock of the chip placer

Termination Thickness of Chip Capacitor and Desirable

Thickness of Adhesives Applied

When the positioning claws and pick-up nozzle are worn,

the load is applied to the chip while positioning is

concentrated in one position, thus causing cracks,

breakage, faulty positioning accuracy, etc.

Careful checking and maintenance are necessary to

prevent unexpected trouble.

a : 20 to 70µm

b : 30 to 35µm

Chip Capacitor

c : 50 to 105µm

a

c

b

Adhesive

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. Please set the suction nozzle's

bottom dead point on the upper surface of the board.

Land

Base Board

0.3mm min. 0.3mm min.

100 to 120µm

Adhesive

Land

2. Construction of Board Pattern

After installing chips, if solder is excessively applied to

the circuit board, mechanical stress will cause destruction

resistance characteristics to lower. To prevent this, be

extremely careful in determining shape and dimension

before designing the circuit board diagram.

Construction and Dimensions of Pattern (Example)

Flow Soldering

Chip Capacitor

c

Slit

Solder Resist

LgW

1.6g0.8

2.0g1.25

3.2g1.6

a

b

c

0.6-1.0

1.0-1.2

2.2-2.6

0.8-0.9

0.9-1.0

1.0-1.1

0.6-0.8

0.8-1.1

1.0-1.4

d

a

L

e

W

Reflow Soldering

Land

b

LgW

a

b

c

d

e

1.6g0.8

2.0g1.25

3.2g1.6

3.2g2.5

4.5g2.0

4.5g3.2

5.7g2.8

5.7g5.0

0.6-0.8

1.0-1.2

2.2-2.4

2.0-2.4

2.8-3.4

4.0-4.6

0.6-0.7

0.9-1.0

0.8-0.9

1.0-1.2

1.2-1.4

1.4-1.6

0.6-0.8

0.8-1.1

1.0-1.4

1.8-2.3

1.4-1.8

2.3-3.0

2.1-2.6

3.5-4.8

-

Preparing slit helps flux

cleaning and resin coating on

the back of the capacitor.

-

1.0-2.0

1.0-2.8

1.0-4.0

3.2-3.7

4.1-4.6

3.6-4.1

4.8-5.3

4.4-4.9

6.6-7.1

(in mm)

Continued on the following page.

21

141

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

Continued from the preceding page.

Land Layout to Prevent Excessive Solder

Mounting Close to a Chassis

d1

Mounting with Leaded Components

Mounting Leaded Components Later

Soldering Iron

Lead Wire of

Component to be

Connected Later.

Lead Wire Connected

to a Part Provided

with Lead Wires.

Chassis

Solder (Ground solder)

Examples of

Arrangements to

be Avoided

Adhesive

Base board

Land Pattern

in section

d2

Solder Resist

d1<d2

Solder Resist

Examples of

Improvements

by the Land

Division

Solder Resist

in section

3. Soldering

(1) Care for minimizing loss of the terminations.

The information below illustrates the soldering conditions

needed to minimize the loss of the effective area on the

terminations.

Depending on the conditions of the soldering

temperature and/or immersion (melting time),

effective areas may be lost in some part of the

terminations.

Soldering Allowance Time

Solder : 6Z4 Eutectic Solder

270

260

250

240

230

To prevent this, be careful in soldering so that any

possible loss of the effective area on the

terminations will securely remain at a maximum of

25% on all edge length A-B-C-D-A of part with A, B,

Reflow Soldering and

Soldering Iron Methods

Flow

Soldering (Static Solder)

30 60

Time (sec.)

Dip Soldering

C, D, shown in the Figure below.

A

0

90

B

In case of repeated soldering, the accumulated

D

soldering time must be within the range shown above.

Termination

C

(2) Flux

Use rosin-type flux and do not use a highly acidic flux

(any containing a minimum of 0.2wt% chlorine).

[Solder Buildup by Flow Method and Soldering Iron Method]

Max. Buildup (T)

Min. Buildup

(3) Solder Buildup

q Flow soldering and iron soldering

When soldering, use less than the maximum and more

than the minimum solder buildup as shown in the

illustration to the right.

Adhesive

During the soldering process, insure that the solder is

securely placed.

Excessive Solder

Buildup (1.3T)

21

Continued on the following page.

142

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

Continued from the preceding page.

w Reflow soldering

When soldering, confirm that the solder is placed over

0.2mm of the surface of the terminations.

[Solder Buildup by Reflow Method]

Chip Capacitor

0.2mm min.

4. Cleaning

To perform ultrasonic cleaning, observe the following

conditions.

Rinse bath capacity : Output of 20 watts per liter or less.

Rinsing time : 5 min maximum.

Do not vibrate the PWBs.

5. Resin Coating

When selecting resin materials, select those with low

contraction and low moisture absorption coefficient

(generally epoxy resin is used).

Buffer coat can decrease the influence of the resin

shrinking (generally silicone resin).

21

143

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

Notice

■ Rating

Capacitance change of capacitor

suitable for use in a time constant circuit.

Please contact us if you need detailed information.

2. In case of C0G/R/SL char.

1. In case of X7R char.

Capacitors have an aging characteristic, whereby

the capacitor continually decreases its

capacitance slightly if the capacitor is left on

for a long time. Moreover, capacitance might change

greatly depending on the surrounding temperature

or an applied voltage. So, it is not likely to be

Capacitance might change a little depending on the

surrounding temperature or an applied voltage.

Please contact us if you intend to use this product

in a strict time constant circuit.

21

144

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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

Note

C02E10.pdf 04.1.20

ISO 9000 Certifications

Plant

Certified Date

Organization

Registration No.

Fukui Murata Manufacturing

Co., Ltd.

Apr. 2, '97

A5287

UL *1

ISO9001

Izumo Murata Manufacturing

Co., Ltd.

Jul. 25, '97

Nov. 3, '99

Jun. 24, '98

Jul. 28, '98

Mar. 7, '96

Dec. 10, '98

A5587

99-2-1085

FM 22169

SQ-480-675/98

A1734

PSB *2

ISO9001

Murata Electronics

Singapore (Pte.) Ltd.

BSI *3

ISO9001

Murata Manufacturing

(UK) Ltd.

FUNDACAO VANZOLINI

ISO9002

Murata Amazonia

Industria Comercio Ltda.

UL *1

ISO9001

Murata Electronics North America

State College Plant

UL *1

ISO9002

Beijing Murata

Electronics Co., Ltd.

A7123

*1 UL : Underwriters Laboratories Inc.

*2 PSB : Singapore Productivity and Standards Board

*3 BSI : British Standards Institution

145

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This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

!Note

C02E10.pdf 04.1.20

Note:

1. Export Control

For customers outside Japan

<

>

Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive

weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons.

For customers in Japan

<

>

For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required

for export.

2. Please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below, which require especially

high reliability for the prevention of defects which might directly damage to a third party's life, body or property, or when one of our products is intended for use

in applications other than those specified in this catalog.

q Aircraft equipment

w Aerospace equipment

e Undersea equipment

t Medical equipment

u Traffic signal equipment

o Data-processing equipment

r Power plant equipment

y Transportation equipment (vehicles, trains, ships, etc.)

i Disaster prevention / crime prevention equipment

! Application of similar complexity and/or reliability requirements to the applications listed in the above

3. Product specifications in this catalog are as of August 2003. They are subject to change or our products in it may be discontinued without advance notice.

Please check with our sales representatives or product engineers before ordering. If there are any questions, please contact our sales representatives or

product engineers.

4. Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

5. This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or

transact the approval sheet for product specifications before ordering.

6. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect

of our and/or a third party's intellectual property rights and other related rights in consideration of your use of our products and/or information described or

contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned

above under licenses without our consent.

7. No ozone depleting substances (ODS) under the Montreal Protocol are used in our manufacturing process.

http://www.murata.com/

He a d O ffice

In te rn a tio n a l Divisio n

2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone: 81-75-951-9111

3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan

Phone: 81-3-5469-6123 Fax: 81-3-5469-6155 E-mail: intl@murata.co.jp


型号：	LLL216R71E223MA01K
厂家：	muRata
描述：	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0805, CHIP 电容器
文件：	总148页 (文件大小：2328K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LLL216R71E223MA01K [MURATA]

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