LQB15NNR56M10# [MURATA]
;Spec.No.JELF243B-0045C-01
P1/8
CHIP COIL (CHIP INDUCTORS) LQB15NN□□□□10D REFERENCESPECIFICATION
1. Scope
This reference specification applies to LQB15NN_10 series, Chip coil (Chip Inductors).
2. Part Numbering
(ex.)
LQ
B
15
N
N
R56
(6)
J
(7)
1
0
D
(10)
(1)
(2)
(3) (4) (5)
(8) (9)
(1)Product ID (2)Type (3)Dimension(L×W) (4)Category (5)Applications and Characteristics
(6)Inductance (7)Tolerance (8)Features (9)Electrode (10)Packaging (D:Taping / *B:Bulk)
*Bulk packing also available.
3.Rating
・Operating temperature:-55°C to +125°C
・Storage temperature:-55°C to +125°C
Self
Inductance
Tolerance
DC
Resustance
(Ω max.)
Rating
Current
(mA)
Customer
Part Number
MURATA
Part Number
Q
(min.)
Resonant
Frequency
(MHz min.)
(nH)
220
LQB15NNR22J10D
J:±5%
K:±10%
M:±20%
J:±5%
LQB15NNR22K10D
LQB15NNR22M10D
LQB15NNR27J10D
LQB15NNR27K10D
LQB15NNR27M10D
LQB15NNR33J10D
0.35 ±25%
0.41 ±25%
0.48 ±25%
0.54 ±25%
0.64 ±25%
0.73 ±25%
380
330
300
300
300
300
K:±10%
M:±20%
J:±5%
270
330
390
470
560
K:±10%
M:±20%
J:±5%
LQB15NNR33K10D
LQB15NNR33M10D
LQB15NNR39J10D
10
80
K:±10%
M:±20%
J:±5%
LQB15NNR39K10D
LQB15NNR39M10D
LQB15NNR47J10D
LQB15NNR47K10D
LQB15NNR47M10D
LQB15NNR56J10D
LQB15NNR56K10D
LQB15NNR56M10D
K:±10%
M:±20%
J:±5%
K:±10%
M:±20%
4. Testing Conditions
< Unless otherwise specified >
Temperature : Ordinary Temp. (15 °C to 35 °C )
< In case of doubt >
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
5.Appearance and Dimensions
1.0±0.05
0.5±0.05
※No marking.
0.25±0.1
■ Unit Mass(Typical value)
: Electrode
(in mm)
0.001g
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P2/8
6.Specifications
6-1.Electrical Performance
No.
6-1-1 Inductance
6-1-2
Item
Specification
Meet item 3.
Test Method
Measuring Frequency : 25MHz
Measuring Equipment : Agilent 4291A or the equivalent
Test Fixture : Agilent 16192A or the equivalent
Q
6-1-3 SRF
6-1-4 DC
Meet item 3.
Measuring Equipment : Digital multi meter
Resistance
Rated
Current
Self temperature rise shall be
limited to 25°C max.
The rated current is applied.
6-1-5
6-2.Mechanical Performance
No. Item
Specification
Meet item 5.
Test Method
6-2-1 Appearance
And
Visual Inspection and measured with Slide Calipers.
Dimensions
6-2-2 Bonding
Strength
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Chip coil shall not be damaged
after test as test method.
Applying Direction: Parallel to the substrate.
Side view
F
F
R0.5
Substrate
Appearance: No damage
6-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Pressure jig
Keeping Time : 30s
R340
F
Deflection
45mm
45mm
Product
6-2-4 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s~90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
6-2-5 Resistance
to Soldering
Heat
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room conditionfor
48h±4h.
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P3/8
No.
Item
Specification
Test Method
6-2-6 Drop
Products shall be no failure
after test.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped :
3 direction
The number of times : 3 times for each direction
(Total 9 times)
The wetting area of the electrode
shall be at least 90% covered
with new solder coating.
6ー2-7 Solderability
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s~90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
6-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
6-3-1 Temperature
Cycle
1 cycle :
Appearance: No damage
Inductance Change: within ±50%
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition
for 48h±4h.
6-3-2 Humidity
Temperature : 40°C±2°C
Appearance: No damage
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Inductance Change: within ±30%
Then measured after exposure in the room condition
for 48h±4h.
6-3-3 Heat Resistance
6-3-4 Cold Resistance
Temperature : 125°C±3°C
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition
for 48h±4h.
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P4/8
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
2.0±0.05
4.0±0.1
2.0±0.05
1.5+0.1
φ
-0
0.8max.
0.65(Typ.)
(0.65)
(in mm)
Direction of Feed
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
7-2.Tape Strength
(1)Pull Strength
Top tape
5N min.
Top tape
Bottom tape
(2)Peeling off force of Cover tape
165 to 180 degree
F
0.1N to 0.6N (Minimum value is typical.)
Bottom tape
*Speed of Peeling off:300mm/min
Base tape
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc)
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is sticked on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(∗2) ,Quantity, etc)
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P5/8
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape
210 min.
Top tape
13.0±0.2
φ
60+1
φ
-
0
Direction of feed
21.0±0.8
φ
+1
-0
9.0
13.0±1.4
180 +0
φ
-3
(in mm)
7-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
Label
W
D
H
H
186
186
93
5
D
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
W
8. ! Caution
8-1. Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (vehicles,trains,ships,etc.)
(9)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
9.Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
• Standard land dimensions (Reflow soldering)
Chip Ferrite Bead
0.5
Solder Resist
0.4
Pattern
1.2~1.4
(in mm)
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P6/8
9-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) Soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s
245±3°C
Limit Profile
Pre-heating
Heating
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
9-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min
• Soldering iron output: 80W max.
• Tip diameter:φ3mm max.
• Times : 2times max.
• Tip temperature: 350°C max.
• Soldering time : 3(+1,-0) seconds.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P7/8
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length:a<b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2)Products location on P.C.B. separation.
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
C
B
Seam
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A>C>B ≅ D.
D
A
a
b
Slit
Length:a b
<
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7.Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8.Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
9-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
•Isopropyl alcohol (IPA)
2.Aqueous agent
•PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO.,LTD.
Spec.No.JELF243B-0045C-01
P8/8
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
10. △Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO.,LTD.
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