LQG15HH2N0S02D [MURATA]
General Purpose Inductor, 0.002uH, 15%, 1 Element, SMD, CHIP, 0402;
| 型号： | LQG15HH2N0S02D |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 0.002uH, 15%, 1 Element, SMD, CHIP, 0402 PC 测试 射频感应器 电感器 |
| 文件： | 总11页 (文件大小：213K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
SpecNo.JELF243B-9101H-01
P.1 / 11
CHIP COIL (CHIP INDUCTORS) LQG15HH□□□□02D
Murata Standard REFERENCE SPECIFICATION [AEC-Q200]
1.Scope
This reference specification applies to LQG15HH series Chip coil (Chip Inductors) for Automotive Electoronics based on AEC-Q200.
2.Part Numbering
(ex)
LQ
Product ID Struture Dimension Applications
(L×W) and
G
15
H
H
1N0
S
0
2
D
Category
for Automotive
Inductance Tolerance Features Electrode Pakaging
D:Taping
Characteristics Electoronics
3.Rating
・Operating Temperature Range.
・Storage Temperature Range.
–55°C to +125°C
–55°C to +125°C
DC
Resistance
(Ω max. )
Self Resonant
Frequency
(MHz min. )
Inductance
Tolerance
(nH)
Q
(min.)
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
ESD Rank
1C:1kV
(*1)(refer to below comment)
LQG15HH1N0B02D
LQG15HH1N0C02D
LQG15HH1N0S02D
LQG15HH1N1B02D
LQG15HH1N1C02D
LQG15HH1N1S02D
LQG15HH1N2B02D
LQG15HH1N2C02D
LQG15HH1N2S02D
LQG15HH1N3B02D
LQG15HH1N3C02D
LQG15HH1N3S02D
LQG15HH1N5B02D
LQG15HH1N5C02D
LQG15HH1N5S02D
LQG15HH1N6B02D
LQG15HH1N6C02D
LQG15HH1N6S02D
LQG15HH1N8B02D
LQG15HH1N8C02D
LQG15HH1N8S02D
LQG15HH2N0B02D
LQG15HH2N0C02D
LQG15HH2N0S02D
LQG15HH2N2B02D
LQG15HH2N2C02D
LQG15HH2N2S02D
LQG15HH2N4B02D
LQG15HH2N4C02D
LQG15HH2N4S02D
LQG15HH2N7B02D
LQG15HH2N7C02D
LQG15HH2N7S02D
LQG15HH3N0B02D
LQG15HH3N0C02D
LQG15HH3N0S02D
LQG15HH3N3B02D
LQG15HH3N3C02D
LQG15HH3N3S02D
LQG15HH3N6B02D
LQG15HH3N6C02D
LQG15HH3N6S02D
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
10000
0.07
1000
0.08
950
900
850
B:±0.1nH
C:±0.2nH
S:±0.3nH
8
1C
6000
0.09
0.11
0.12
800
750
0.125
0.14
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.2 / 11
DC
Resistance
(Ω max. )
Self Resonant
Frequency
(MHz min. )
Inductance
(nH)
Q
(min.)
Rated
Current
(mA)
Tolerance
Customer
Part Number
MURATA
ESD Rank
1C:1kV
Part Number
(*1)(refer to below comment)
LQG15HH3N9B02D
LQG15HH3N9C02D
LQG15HH3N9S02D
LQG15HH4N3B02D
LQG15HH4N3C02D
LQG15HH4N3S02D
LQG15HH4N7B02D
LQG15HH4N7C02D
LQG15HH4N7S02D
LQG15HH5N1B02D
LQG15HH5N1C02D
LQG15HH5N1S02D
LQG15HH5N6B02D
LQG15HH5N6C02D
LQG15HH5N6S02D
LQG15HH6N2B02D
LQG15HH6N2C02D
LQG15HH6N2S02D
LQG15HH6N8G02D
LQG15HH6N8H02D
LQG15HH6N8J02D
LQG15HH7N5G02D
LQG15HH7N5H02D
LQG15HH7N5J02D
LQG15HH8N2G02D
LQG15HH8N2H02D
LQG15HH8N2J02D
LQG15HH9N1G02D
LQG15HH9N1H02D
LQG15HH9N1J02D
LQG15HH10NG02D
LQG15HH10NH02D
LQG15HH10NJ02D
LQG15HH12NG02D
LQG15HH12NH02D
LQG15HH12NJ02D
LQG15HH15NG02D
LQG15HH15NH02D
LQG15HH15NJ02D
LQG15HH18NG02D
LQG15HH18NH02D
LQG15HH18NJ02D
LQG15HH22NG02D
LQG15HH22NH02D
LQG15HH22NJ02D
LQG15HH27NG02D
LQG15HH27NH02D
LQG15HH27NJ02D
LQG15HH33NG02D
LQG15HH33NH02D
LQG15HH33NJ02D
LQG15HH39NG02D
LQG15HH39NH02D
LQG15HH39NJ02D
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
0.14
750
700
650
6000
5300
4500
0.16
B:±0.1nH
C:±0.2nH
S:±0.3nH
0.18
0.20
0.22
600
550
4200
3700
0.24
0.26
8
1C
3400
500
12
0.28
0.32
0.36
0.42
0.46
0.58
0.65
3000
2500
2200
1900
1700
1600
1200
G:±2%
H:±3%
J:±5%
15
450
400
18
22
27
350
300
33
39
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.3 / 11
DC
Resistance
(Ω max. )
Self Resonant
Frequency
(MHz min. )
Inductance
(nH)
Rated
Current
Q
(min.)
Customer
Part Number
MURATA
ESD Rank
1C:1kV
Tolerance
Part Number
(mA)
(*1)(refer to below comment)
0.72
LQG15HH47NG02D
LQG15HH47NH02D
LQG15HH47NJ02D
LQG15HH56NG02D
LQG15HH56NH02D
LQG15HH56NJ02D
LQG15HH68NG02D
LQG15HH68NH02D
LQG15HH68NJ02D
LQG15HH82NG02D
LQG15HH82NH02D
LQG15HH82NJ02D
LQG15HHR10G02D
LQG15HHR10H02D
LQG15HHR10J02D
LQG15HHR12G02D
LQG15HHR12H02D
LQG15HHR12J02D
LQG15HHR15G02D
LQG15HHR15H02D
LQG15HHR15J02D
LQG15HHR18G02D
LQG15HHR18H02D
LQG15HHR18J02D
LQG15HHR22G02D
LQG15HHR22H02D
LQG15HHR22J02D
LQG15HHR27G02D
LQG15HHR27H02D
LQG15HHR27J02D
47
56
1000
800
700
600
300
0.82
0.92
1.20
1.25
250
200
150
68
82
100
120
150
180
220
270
G:±2%
H:±3%
J:±5%
8
1C
1.30
2.99
3.38
3.77
4.94
550
500
450
400
120
110
(*1) Standard Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity : 60%(RH) to 70%(RH)
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
4. Appearance and Dimensions
Polarity Marking
Electrode
0.5±0.05
■Unit Mass (Typical value)
0.001g
1.0±0.05
0.5±0.05
0.5±0.0.5
(in mm)
0.25±0.1
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.4 / 11
5.Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
Keysight 4291A or equivalent
5.1 Inductance
Measuring Frequency:100MHz
Measuring Condition:
Test signal level/about 7dBm
Electricallength/0.94cm
Weight/about 1N to 5N
Measuring Fixture: Keysight 16193A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
Polarity marking should be a topside,and polarity
marking should be in the direction of the fixture
for position of chip coil.
5.2
Q
Q shall meet item 3.
Polarity Marking
0.5mm
11.5mm
Measuring Method:See the endnote
[Electrical Performance:Measuring Method of
Inductance/Q]
5.3 DC Resistance
5.4 Self Resonant
Frequency(S.R.F)
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
Keysight 8753C or equivalent
The allowable current is applied.
5.5 Rated Current
Self temperature rise shall be
limited to 25°C max.
6.Q200 Requirement
6.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No
3
Stress
Test Method
High
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Temperature
Exposure
Appearance No damage
Inductance
Change
(at 100MHz)
Within ±10%
4
Temperature
Cycling
1000cycles
Meet Table A after testing.
-40 deg C to +125 deg C
Set for 24hours at room
temperature,then
measured.
7
8
Biased Humidity
Operational Life
1000hours at 85 deg C, 85%RH Meet Table A after testing.
unpowered.
Apply 125 deg C 1000hours
Set for 24hours at room
Meet Table A after testing.
temperature, then measured
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical DimensionMeet ITEM 4
（Style and Dimensions）
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.5 / 11
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
13 Mechanical Shock Per MIL-STD-202
Method 213
Meet Table A after testing.
Condition C : 100g’s(0.98N),
6ms, Half sine, 12.3ft/s
14 Vibration
5g's(0.049N) for 20 minutes,
12cycles each of 3 oritentations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance
No-heating
Meet Table A after testing.
to Soldering Heat Solder temperature
Pre-heating 150C +/-10 deg C, 60s to 90s
260C+/-5 deg C
Immersion time 10s
17 ESD
Per AEC-Q200-002
ESD Rank: refer to the Item3 (Rating).
Meet Table A after testing
18 Solderbility
Per J-STD-002
Method b : Not Applicable
90% of the terminations is to be soldered.
19 Electrical
Characterization
20 Flammability
Measured : Inductance
Per UL-94
No defects
Not Applicable
21 Board Flex
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
Holding time 60s
Meet Table B after testing.
Table B
Appearance No damage
DC
resistance
Change
Within ±10%
22 Terminal Strength Per AEC-Q200-006
Murata Deviation Request: 5N
No defects
A force of 17.7N
for 60s
7.Specification of Packaging
7.1 Appearance and Dimensions of paper tape (8mm-wide)
2.0±0.05
2.0±0.05
Polarity marking
1.5±0.1
4.0±0.1
φ
0
Direction of feed
0.8max.
0.62±0.04
(in mm)
7.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,and
are not continuous. The Specified quantity per reel is kept.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.6 / 11
7.3 Pull Strength
Top tape
5N min.
Bottom tape
7.4 Peeling off force of cover tape
Top tape
165 to 180 degree
Bottom tape
Speed of Peeling off
Peeling off force
300mm/min
F
0.1N to 0.6N
(minimum value is typical)
Base tape
7.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
210 min.
Empty tape
Top tape
13.0±0.2
60+1
-
0
Direction of feed
21.0±0.8
+1
-0
9.0
13.0±1.4
180 +0
-3
(in mm)
7.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking(2),
Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digi : Day
(3) Serial No.
2) <Expression of RoHS Marking>
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
7.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking(2) ,Quantity, etc ･･･
7.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
D
Label
W
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.7 / 11
!
8. △Caution
8.1 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
8.2 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
8.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9.1 Land pattern designing
Chip Coil
Land
Solder Resist
a
b
c
0.4
c
1.4 to 1.5
0.5 to 0.6
a
b
(in mm)
9.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.8 / 11
9.3 Reflow soldering conditions
・Inductance value may be changed a little due to the amount of solder.
So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.
・Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be in
such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
2 times
2 times
9.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
9.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
1/3T≦t≦T
T：thickness of product
Recommendable
t
9.6 Mount Shock
Over Mechanical stress to products at mounting process causes crack and electrical failure etc.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.9 / 11
9.7 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress due to
warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length:a＜b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommend
Screw Hole
9.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.10 / 11
9.9 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when
you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
9.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature: -10°C to 40°C
Humidity: 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be storaged under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
10．△Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243B-9101H-01
P.11 / 11
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
V1
I1
A
C
B
D
V2
I 2
Zx
Zm
V
2
V
1
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
，
(3) Thus,the relation between Zx and Zm is following;
Zm-β
1-ZmΓ
where, α= D / A =1
Zx=
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
2πf
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
Lx=
Qx=
，
f
:Measuring frequency
MURATA MFG.CO., LTD
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