LQG15H [MURATA]
General Purpose Inductor;
muRata 
RF Inductor
Soldering and Mounting
1. Standard Land Pattern Dimensions
A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip
inductor (chip coil) electrode.
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
Series
Standard Land Dimensions
LQG15H
LQG18H
LQP02T
LQP03T
LQP15M
LQP18M
LQW04A
LQW15A
LQW18A
LQW21H
LQW2BH
LQW2BA
LQW2UA
LQW31H
LQH31H
Part Number
LQG15H
LQG18H
LQP02T
a
0.4
b
1.4-1.5
1.8-2.2
0.4-0.56
0.8-0.9
1.4-1.5
1.8-2.2
1.0
c
0.5-0.6
0.6-0.8
0.2-0.23
0.2-0.3
0.5-0.6
0.7-0.9
0.40
0.6-0.8
0.16-0.2
0.2-0.3
0.4
LQP03T
LQP15M
LQP18M
LQW04A
LQW15A
LQW18A
LQW21H
LQW2BH
LQW2BA
LQW2UA
0.6-0.8
0.40
0.50
1.2
0.65
a
b
0.6-0.8
1.0
1.9-2.0
2.6
0.7-1.0
1.2
0.8
3.0
1.2
0.76
2.8
1.78
1.27
3.3
2.54
LQH31H
LQW31H
1.0
4.5
1.5
Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator.
2. Standard Soldering Conditions
(1) Soldering method
Chip inductor (Chip coils) can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
As for LQG, LQP, LQW04A/15A/18A/21H/2BA/2UA series,
please use reflow soldering.
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux: Use rosin-based flux, but not strongly acidic flux (with
chlorine content exceeding 0.2wt%).
Do not use water-soluble flux.
The flux used for LQW04/15/18/21/2BA/2UA series
should use the rosin-based flux that includes middle
activator equivalent to 0.06wt% to 0.1wt% chlorine.
For additional mounting methods, please contact Murata.
Continued on the following page.
RF Inductor
Soldering and Mounting
(2) Soldering profile
"Flow Soldering profile
(Sn-3.0Ag-0.5Cu solder)
T3
T2
t2
Limit Profile
Heating
T1
Standard Profile
Pre-heating
t1
time (s)
Standard Profile
Heating
Limit Profile
Heating
Pre-heating
Series
Cycle
Cycle
of flow
of flow
Temp. (T1)
Time. (t1)
Temp. (T2) Time. (t2)
Temp. (T3)
Time. (t2)
LQW2BH/31H
LQH31H
2 times
max.
2 times
max.
150°C
60s min.
250°C
4 to 6s
265 3°C
5s max.
"Reflow Soldering profile
(Sn-3.0Ag-0.5Cu solder)
T4
T3
T2
T1
180
150
Limit Profile
t1
t2
Pre-heating
90 30s
Standard Profile
time (s)
Standard Profile
Peak
Limit Profile
Peak
temperature
(T4)
Series
Heating
Heating
Temp. (T3) Time. (t2)
Cycle
of reflow
Cycle
of reflow
temperature
(T2)
Temp. (T1) Time. (t1)
LQG15H/18H
LQW04A/15A/18A/21H
LQW2BA/2UA
LQP02T/03T/15M/18M
LQW2BH/31H
2 times
max.
2 times
max.
220°C
30 to 60s 245 3°C
230°C
60s max. 260°C/10s
LQH31H
(3) Reworking with Soldering Iron *Except LQP02T Series
Preheating at 150°C for 1 minute is required. Do not
directly touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows:
Soldering iron power output: 80W max.
Temperature of soldering iron tip: 350°C
Diameter of soldering iron end: 3.0mm max.
Soldering time: within 3 s
Continued on the following page.
RF Inductor
Soldering and Mounting
3. Mounting Instructions
(1) Land Pattern Dimensions
Solder Resist
c
Land
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown) cause floating and
electrode leaching.
d
(2) Land Pattern Designing (LQW series)
Please follow the recommended patterns.
Otherwise, their performance which includes electrical
performance or solderability may be affected, or result to
“position shift” in soldering process.
(3) PCB Warping
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
a
b
Poor example
Good example
The electrode part of the product should be located
like the picture to the mechanical stress.
electrode
electrode
Poor example
Good example
Continued on the following page.
RF Inductor
Soldering and Mounting
(4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste as shown on the right
so that solder is applied.
LQW_H
LQP/LQG
" Guideline of solder paste thickness
· LQP (Except LQP02T), LQG, LQW15A/18A/
21H/2BA/2UA: 100 to 150μm
· LQP02T: 50 to 80μm
LQW_A/21H
· LQW04A: 80 to 100μm
· LQW_H: 200 to 300μm
LQW15A Series:
Stencil Pattern
Land Pattern
0.65
0.35
0.50
0.30
a
b
c
d
Too much solder may cause slant or rotation of chip at the
time of solder melting. Please reduce the amount of solder
by using smaller solder area than land pattern, as shown in
figure at right.
b
c
b
1.2
d
a
Solder Resist
1.2
Stencil Pattern
Land Pattern
b
c
b
b
c
b
1.2
a
(in mm)
d
(5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the conditions shown in
chart.
LQW_H
Typical Application Amount (in:mg)
Part Number
IR-100
LQW2BH
0.15-0.20
LQH31H
LQW31H
0.20-0.25
4. Cleaning
The following conditions should be observed when
cleaning chip inductors (chip coils):
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol cleaning agents)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
(2) Ultrasonic
For additional cleaning methods, please contact Murata.
Output: 20W/l max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
Care should be taken not to cause resonance of the
PCB and mounted products.
(3) Cleaning agent
The following cleaning agents have been tested on
individual components. Evaluation in complete assembly
should be done prior to production.
(a) Alcohol cleaning agents
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agents
Pine Alpha ST-100S
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