LQG18HH8N2J00D [MURATA]
General Purpose Inductor, 0.0082uH, 5%, 1 Element, SMD, CHIP, 0603;
| 型号： | LQG18HH8N2J00D |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 0.0082uH, 5%, 1 Element, SMD, CHIP, 0603 测试 射频感应器 电感器 |
| 文件： | 总9页 (文件大小：171K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec No. JELF243B-9102F-01
P.1/9
CHIP COIL (CHIP INDUCTORS) LQG18HH□□□□00D SPECIFICATION
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to LQG18HH_00 series Chip coil (Chip inductors) for Automotive Electronics
based on AEQ-Q200.
2. Part Numbering
(ex)
LQ
Product ID Structure Dimension Applications Category
(L×W) and for Automotive
Characteristics Electronics
G
18
H
H
1N2
S
0
0
D
Inductance Tolerance Features Electrode Packaging
D: Taping
*B: BULK
*Bulk packing (B) also available
3. Rating
・Operating Temperature Range
・Storage Temperature Range
–55°C to +125°C
–55°C to +125°C
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Inductance
Tolerance
(nH)
Q
(min.)
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
ESD Rank
1C:1kV
(*1) Refer to below comment
LQG18HH1N2S00D
LQG18HH1N5S00D
LQG18HH1N8S00D
LQG18HH2N2S00D
LQG18HH2N7S00D
LQG18HH3N3S00D
LQG18HH3N9S00D
LQG18HH4N7S00D
LQG18HH5N6S00D
LQG18HH6N2S00D
LQG18HH6N8J00D
LQG18HH8N2J00D
LQG18HH10NJ00D
LQG18HH12NJ00D
LQG18HH15NJ00D
LQG18HH18NJ00D
LQG18HH22NJ00D
LQG18HH27NJ00D
LQG18HH33NJ00D
LQG18HH39NJ00D
LQG18HH47NJ00D
LQG18HH56NJ00D
LQG18HH68NJ00D
LQG18HH82NJ00D
LQG18HHR10J00D
LQG18HHR12J00D
LQG18HHR15J00D
LQG18HHR18J00D
LQG18HHR22J00D
LQG18HHR27J00D
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.2
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
6000
5000
4000
0.10
1100
0.13
0.14
0.15
0.16
0.17
1000
900
±0.3nH
3000
2800
800
0.18
0.20
0.25
0.30
2600
2400
2200
12
700
600
0.35
0.50
0.54
0.60
0.70
1800
1C
1600
1400
1200
1000
900
500
400
±5%
800
0.80
0.85
0.90
1.10
1.20
1.30
1.50
1.90
700
600
550
300
200
14
500
450
400
(*1) Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
/ 25% (RH) to 85% (RH) Humidity : 60% (RH) to 70% (RH)
Atmospheric Pressure : 86kPa to 106 kPa
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.2/9
4. Appearance and Dimensions
Polarity Marking
Electrode
0.8±0.15
0.8±0.15
1.6±0.15
■ Unit Mass (Typical value)
0.003g
（in mm）
0.3±0.2
5. Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
5.1 Inductance
Measuring Equipment:
KEYSIGHT 4291A or equivalent
Measuring Frequency: 100MHz
Measuring Condition:
Test signal level/ about 7dBm
Electrical length/ 0.94cm
Weight/ about 1N to 5N
Measuring Fixture: KEYSIGHT 16193A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
Polarity marking should be a topside,and polarity
marking should be in the direction of the fixture
for position of chip coil.
5.2
Q
Q shall meet item 3.
1mm
Polarity Marking
6.97mm
Measuring Method: the endnote
[Electrical Performance: Measuring Method of
Inductance/ Q]
5.3 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment: Digital multi meter
5.4 Self Resonant
Frequency (S.R.F)
5.5 Rated Current
Measuring Equipment:
KEYSIGHT 8753C or equivalent
The rated current is applied.
Self temperature rise shall be
limited to 25°C max.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.3/9
6. Q200 Requirement
6.1. Performance (based on Table 5 for Magnetics (Inductors / Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Appearance No damage
Inductance
Change
(at 100MHz)
Within ±10%
4
Temperature
Cycling
1000cycles
Meet Table A after testing.
-40 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
7
8
9
Biased Humidity
Operational Life
External Visual
1000hours at 85 deg C, 85%RH
unpowered.
Meet Table A after testing.
Meet Table A after testing.
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Visual inspection
No abnormalities
No defects
10 Physical DimensionMeet ITEM 4
（Style and Dimensions）
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock Per MIL-STD-202
Method 213
Meet Table A after testing.
Meet Table A after testing.
Condition C : 100g’s(0.98N), 6ms,
Half sine, 12.3ft/s
14 Vibration
5g's (0.049N) for 20 minutes,
12cycles each of 3 oritentations
Test from 10-2000Hz.
No-heating
15 Resistance
Meet Table A after testing.
to Soldering Heat Solder temperature
Pre-heating 150C +/-10 deg C, 60s to 90s
260C+/-5 deg C
Immersion time 10s
17 ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: refer to the Item3 (Rating).
18 Solderbility
19 Electrical
Characterization
20 Flammability
Per J-STD-002
Measured: Inductance
Per UL-94
Method b: Not Applicable
90% of the terminations is to be soldered.
No defects
Not Applicable
21 Board Flex
Epoxy-PCB (1.6mm)
Deflection 2mm (min)
Holding time 60s
Meet Table B after testing.
Table B
Appearance
No damage
DC Resistance
Change
Within ±10%
22 Terminal Strength Per AEC-Q200-006
No defects
A force of 17.7N
for 60s
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.4/9
7. Specification of Packaging
7.1 Appearance and Dimensions of paper tape (8mm-wide)
Polarity marking
2.0±0.05
1.5± 0.1
4.0±0.1
4.0±0.1
φ
0
1.75±0.1
1.05±0.1
Direction of Feed
1.1max
(in mm)
7.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous.The Specified quantity per reel is kept.
7.3 Pull Strength
Top tape
5N min.
Bottom tape
7.4 Peeling off force of cover tape
Top tape
165 to 180 degree
Bottom tape
Speed of Peeling off
Peeling off force
300mm/min
F
0.1N to 0.6N
(minimum value is typical)
Base tape
7.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
210 min.
Empty tape
Top tape
13.0±0.2
60+1
-
0
Direction of feed
21.0±0.8
+1
-0
9.0
13.0±1.4
180 +0
-3
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.5/9
7.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS marking (2),
Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS marking>
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
7.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(2), Quantity, etc ･･･
7.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
D
Label
W
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
!
8. △Caution
8.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
8.2 Caution (Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
8.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.6/9
9. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9.1 Land pattern designing
Chip Coil
Land
Solder Resist
a
B
c
0.6 to 0.8
1.8 to 2.2
0.6 to 0.8
c
a
b
(in mm)
9.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
9.3 Reflow soldering conditions
・Inductance value may be changed a little due to the amount of solder.
So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.
・Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s～60s
245°C±3°C
above 230°C, 60s max.
260°C, 10s
2 times
2 times
9.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.7/9
9.5 Solder Volume
・ Solder shall be used not to be exceeded the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
1/3T≦t≦T
T： thickness of product
Recommendable
t
9.6 Mount Shock
Over Mechanical stress to products at mounting process causes crack and electrical failure etc.
9.7 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length: a＜b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommend
Screw Hole
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.8/9
9.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
9.9 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress
of resin to be used for coating / molding products. So please pay your careful attention when you select
resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
9.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting
to the substrate when cropping the substrate, inserting and removing a connector from the substrate or
tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and
so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-9102F-01
P.9/9
!
10. △Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before
ordering.
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
V1
I1
A
C
B
D
V2
I 2
Zx
Zm
V
2
V
1
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
，
(3) Thus,the relation between Zx and Zm is following;
Zm-β
1-ZmΓ
where, α= D / A =1
Zx=
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
2πf
Im(Zx)
Re(Zx)
Lx : Inductance of chip coil
Qx: Q of chip coil
Lx=
Qx=
，
f
: Measuring frequency
MURATA MFG.CO., LTD
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