LQH2HPN1R0MGR#

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LQH2HPN1R0MGR# 数据手册

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Spec No.: JELF243A_0103S-01  
P1/9  
CHIP COILS (CHIP INDUCTORS) LQH2HPN□□□□GRREFERENCE SPECIFICATION  
1. Scope  
This reference specification applies to chip coils (chip inductors) LQH2HPN_GR series for general electronic equipment.  
2. Part Numbering  
(Ex.)  
LQ  
H
2H  
P
N
1R0  
M
G
R
L
Product ID Structure Dimension Application and Category Inductance Tolerance Dimension Other  
Packaging  
L: ø180 taping  
*B: bulk  
(L × W)  
*B: Bulk packing is also available.  
3. Part Number and Rating  
characteristic  
(T)  
Operating  
temperature  
range  
(ambient temperature not including self-temperature rise)  
(product temperature including self-temperature rise)  
(ambient temperature not including self-temperature rise)  
(product temperature including self-temperature rise)  
-40°C to +105°C (except LQH2HPN101MGR)  
-40°C to +125°C (except LQH2HPN101MGR)  
-40°C to +85°C (only LQH2HPN101MGR)  
-40°C to +105°C (only LQH2HPN101MGR)  
-40°C to +105°C (except LQH2HPN101MGR)  
-40°C to +85°C (only LQH2HPN101MGR)  
Storage temperature range  
Rated current  
(mA)  
Inductance  
DC  
resistance  
(Ω)  
Self-resonant  
frequency  
(MHz min.)  
Based on temperature  
rise*2  
Customer  
Part number  
Murata  
Part number  
Nominal  
value  
(μH)  
Based on  
inductance  
change*1  
Tolerance  
(%)  
Ambient  
Ambient  
temperature temperature  
85°C*3  
2520  
2330  
2100  
1850  
1470  
1100  
1000  
860  
105°C*4  
1470  
1350  
1200  
1110  
850  
LQH2HPNR47MGRL  
LQH2HPNR68MGRL  
LQH2HPN1R0MGRL  
LQH2HPN1R5MGRL  
LQH2HPN2R2MGRL  
LQH2HPN3R3MGRL  
LQH2HPN4R7MGRL  
LQH2HPN6R8MGRL  
LQH2HPN100MGRL  
LQH2HPN150MGRL  
LQH2HPN220MGRL  
LQH2HPN101MGRL  
0.47  
0.68  
1.0  
1.5  
2.2  
3.3  
4.7  
6.8  
10  
±20  
±20  
±20  
±20  
±20  
±20  
±20  
±20  
±20  
±20  
±20  
±20  
0.045±20%  
0.055±20%  
0.068±20%  
0.087±20%  
0.134±20%  
0.225±20%  
0.300±20%  
0.395±20%  
0.560±20%  
0.925±20%  
1.360±20%  
5.900±20%  
120  
110  
100  
90  
80  
70  
50  
40  
30  
20  
15  
5
2900  
2430  
2130  
1700  
1550  
1230  
1090  
830  
660  
570  
490  
700  
710  
430  
15  
570  
560  
310  
22  
460  
430  
250  
100  
210  
150  
-
*1 When rated current is applied to the products, inductance will be within ±30% of initial inductance value range.  
*2 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C (except LQH2HPN101MGR)  
Keep the temperature (ambient temperature plus self-generation of heat) under 105°C (only LQH2HPN101MGR)  
*3 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max  
(except LQH2HPN101MGR)  
When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 20°C max  
(only LQH2HPN101MGR)  
*4 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 20°C max.  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P2/9  
4. Testing Conditions  
Unless otherwise specified  
Temperature: ordinary temperature (15°C to 35°C)  
Humidity: ordinary humidity [25% to 85% (RH)]  
In case of doubt  
Temperature: 20°C±2°C  
Humidity: 60% to 70% (RH)  
Atmospheric pressure: 86 kPa to 106 kPa  
5. Appearance and Dimensions  
Unit mass (typical value): 0.019 g  
6. Marking  
No marking.  
7. Electrical Performance  
No.  
Item  
Specification  
Meet chapter 3 ratings.  
Test method  
7.1 Inductance  
Measuring equipment: Keysight 4192A or the  
equivalent  
Measuring frequency: 1 MHz  
7.2 DC resistance  
Meet chapter 3 ratings.  
Meet chapter 3 ratings.  
Measuring equipment: digital multimeter  
7.3 Self-resonant  
frequency  
Measuring equipment: Keysight E4991A or the  
equivalent  
8. Mechanical Performance  
No.  
Item  
Specification  
Test method  
8.1 Shear test  
No significant mechanical damage or no Test substrate: glass-epoxy substrate  
sign of electrode peeling off shall be  
observed.  
Force application direction:  
Applying force: 5 N  
Holding time: 5 s±1 s  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
No. Item  
P3/9  
Specification  
Test method  
8.2 Bending test  
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40  
sign of electrode peeling off shall be  
observed.  
mm × 0.8 mm)  
Pressurizing speed: 0.5 mm/s  
Deflection: 2 mm  
Holding time: 5 s  
8.3 Vibration  
Appearance shall have no significant  
mechanical damage.  
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for  
approx. 20 min  
Total amplitude: total amplitude of 1.5 mm or  
acceleration amplitude of 98 m/s2, whichever is smaller  
Test time: 3 directions perpendicular to each other, 2 h  
for each direction (6 h in total)  
8.4 Solderability  
90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content  
be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s  
Solder: Sn-3.0Ag-0.5Cu solder  
Pre-heating: 150°C±10°C/60 s to 90 s  
Solder temperature: 240°C±5°C  
Immersion time: 3 s±1 s  
8.5 Resistance to  
soldering heat  
Appearance: No significant mechanical  
damage shall be observed.  
Flux: immersed in ethanol solution with a rosin content  
of 25(wt)% for 5 s to 10 s  
Inductance change rate: within ±20%  
Solder: Sn-3.0Ag-0.5Cu solder  
Pre-heating: 150°C±10°C/60 s to 90 s  
Solder temperature: 270°C±5°C  
Immersion time: 10 s±1 s  
Post-treatment: left at a room condition for 24 h±2 h  
9. Environmental Performance  
The product is soldered on a substrate for test.  
No.  
Item  
Specification  
Test method  
9.1 Heat resistance  
Appearance: No significant mechanical  
damage shall be observed.  
Inductance change rate: within ±10%  
Temperature: maximum operating temperature  
(ambient temperature not including self-temperature  
rise) ±2°C  
DC resistance change rate: within ±10% Test time: 1000 h (+48 h, -0 h)  
Post-treatment: left at a room condition for 24 h±2 h  
Temperature: -40°C±2°C  
9.2 Cold resistance  
9.3 Humidity  
Appearance: No significant mechanical  
damage shall be observed.  
Test time: 1000 h (+48 h, -0 h)  
Inductance change rate: within ±10%  
DC resistance change rate: within ±10%  
Post-treatment: left at a room condition for 24 h±2 h  
Appearance: No significant mechanical  
damage shall be observed.  
Inductance change rate: within ±10%  
Temperature: 85°C±2°C  
Humidity: 80% (RH) to 85% (RH)  
Test time: 1000 h (+48 h, -0 h)  
DC resistance change rate: within ±10% Post-treatment: left at a room condition for 24 h±2 h  
9.4 Temperature cycle Appearance: No significant mechanical  
damage shall be observed.  
Single cycle conditions:  
Step 1: minimum operating temperature (ambient  
temperature not including self-temperature rise)  
±2°C/30 min±3 min  
Inductance change rate: within ±10%  
DC resistance change rate: within ±10%  
Step 2: ordinary temperature/10 min to 15 min  
Step 3: maximum operating temperature (ambient  
temperature not including self-temperature rise)  
±2°C/30 min±3 min  
Step 4: ordinary temperature/10 min to 15 min  
Number of testing: 100 cycles  
Post-treatment: left at a room condition for 24 h±2 h  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P4/9  
10. Specification of Packaging  
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)  
A
B
t
2.3±0.1  
2.8±0.1  
1.1±0.1  
(0.25)  
t'  
(in mm)  
* The dimensions of the cavity are measured at its bottom.  
10.2 Taping specifications  
Packing quantity  
3000 pcs/reel  
(Standard quantity)  
Packing method  
Feed hole position  
Joint  
The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.  
The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.  
The plastic tape and the cover tape are seamless.  
Number of missing  
products  
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and  
are not continuous. The specified quantity per reel is kept.  
10.3 Break down force of tape  
Break down force of plastic tape  
Break down force of cover tape  
10 N min.  
10 N min.  
10.4 Peeling off force of cover tape  
Speed of peeling off  
300 mm/min  
Peeling off force  
0.2 N to 0.7 N (The lower limit is for typical value.)  
Cover tape  
165 to 180 degree  
F
Plastic tape  
10.5 Dimensions of leader section, trailer section and reel  
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader  
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P5/9  
10.6 Marking for reel  
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.  
*1 Expression of inspection No.: (1) Factory code  
  
□□  
(1)  
○○○○  
(2)  
(2) Date  
First digit: year/last digit of year  
(3)  
Second digit: month/Jan. to Sep.1 to 9, Oct. to Dec.O, N, D  
Third, Fourth digit: day  
(3) Serial No.  
*2 Expression of RoHS marking: (1) RoHS regulation conformity  
ROHS-  
Y
()  
(2) Murata classification number  
(1)  
(2)  
10.7 Marking on outer box (corrugated box)  
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.  
10.8 Specification of outer box  
Dimensions of outer box  
Standard reel quantity  
(mm)  
Label  
in outer box (reel)  
W
D
H
H
186  
186  
93  
5
D
* Above outer box size is typical. It depends on a  
quantity of an order.  
W
11.  
Caution  
11.1 Restricted applications  
Please contact us before using our products for the applications listed below which require especially high reliability for the  
prevention of defects which might directly cause damage to the third party's life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea  
equipment  
(4) Power plant  
control equipment  
(5) Medical equipment  
(6) Transportation equipment (vehicles, (7) Traffic signal  
trains, ships, etc.) equipment  
(8) Disaster/crime  
prevention  
equipment  
(9) Data-processing  
equipment  
(10) Applications of similar complexity and/or reliability  
requirements to the applications listed in the above  
11.2 Precautions on rating  
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.  
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.  
11.3 Inrush current  
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,  
overheating could occur, resulting in wire breakage, burning, or other serious fault.  
11.4 Corrosive gas  
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,  
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated  
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of  
product electrode, etc. We will not bear any responsibility for use under these environments.  
12. Precautions for Use  
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other  
mounting method, for example, using a conductive adhesive, please consult us beforehand.  
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal  
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.  
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and  
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P6/9  
12.1 Land dimensions  
The following diagram shows the recommended land dimensions for reflow soldering.  
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land  
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional  
shift. If you use other land pattern, consider it adequately.  
(in mm)  
12.2 Flux and solder used  
Flux  
• Use a rosin-based flux.  
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).  
• Do not use a water-soluble flux.  
Solder  
• Use Sn-3.0Ag-0.5Cu solder.  
• Standard thickness of solder paste: 100 μm to 150 μm  
If you want to use a flux other than the above, please consult our technical department.  
12.3 Soldering conditions (reflow)  
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to  
100°C max.  
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.  
• Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of  
product quality.  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard profile  
Limit profile  
Pre-heating  
150°C to 180°C/90 s±30 s  
Above 220°C/30 s to 60 s  
245°C±3°C  
150°C to 180°C/90 s±30 s  
Above 230°C/60 s max.  
260°C/10 s  
Heating  
Peak temperature  
Number of reflow cycles  
2 times  
2 times  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P7/9  
12.4 Reworking with soldering iron  
The following requirements must be met to rework a soldered product using a soldering iron.  
Item  
Requirement  
150°C/approx. 1 min  
350°C max.  
Pre-heating  
Tip temperature of soldering iron  
Power consumption of soldering iron  
Tip diameter of soldering iron  
Soldering time  
80 W max.  
ø3 mm max.  
3 s (+1 s, -0 s)  
1 time max.  
Number of reworking operations  
* Avoid a direct contact of the tip of the soldering iron with the product. Such a  
direction contact may cause cracks in the ceramic body due to thermal shock.  
12.5 Solder volume  
Solder shall be used not to increase the volume too much.  
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of  
mechanical or electrical performance.  
12.6 Product's location  
The following shall be considered when designing and laying out PCBs.  
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.  
[Products direction]  
Products shall be located in the sideways direction to the mechanical stress.  
Electrode  
(Good example)  
(Poor example)  
Electrode  
(2) Components location on PCB separation  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce  
stress.  
Contents of measures  
Stress level  
A > D*1  
A > B  
(1) Turn the mounting direction of the component parallel to the  
board separation surface.  
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from the  
board separation surface.  
A > C  
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.  
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.  
C
Perforation  
B
Electrode  
D
A
Slit  
Electrode  
(3) Mounting components near screw holes  
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the  
tightening of the screw.  
Mount the component in a position as far away from the screw holes as possible.  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P8/9  
Recommended  
Screw Hole  
12.7 Handling of substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate  
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
12.8 Cleaning  
The product shall be cleaned under the following conditions.  
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C  
max.  
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in  
mounted products and the PCB.  
Item  
Power  
Requirement  
20 W/L max.  
Time  
5 min max.  
Frequency  
(3) Cleaner  
28 kHz to 40 kHz  
Alcohol-based cleaner: IPA  
Aqueous agent: PINE ALPHA ST-100S  
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water  
adequately and completely dry it so that no cleaner is left.  
* For other cleaning, consult our technical department.  
12.9 Storage and transportation  
Storage period  
Use the product within 12 months after delivery.  
If you do not use the product for more than 12 months, check solderability before using it.  
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.  
The recommended temperature range is -10°C to +40°C. The recommended relative humidity  
range is 15% to 85%.  
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the  
electrode, resulting in poor solderability or corrosion of the coil wire of the product.  
• Do not keep products in bulk packaging. Doing so may cause collision between the products or  
between the products and other products, resulting in core chipping or wire breakage.  
• Do not place the products directly on the floor; they should be placed on a palette so that they are  
not affected by humidity or dust.  
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.  
Transportation  
Excessive vibration and impact reduces the reliability of the products. Exercise caution when  
handling the products.  
12.10 Resin coating  
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.  
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating  
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some  
operating condition may cause corrosion of wire of coil, leading to wire breakage.  
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.  
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your  
board.  
MURATA MFG CO., LTD  
Spec No.: JELF243A_0103S-01  
P9/9  
12.11 Handling of product  
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the  
winding portion to prevent the breaking of wire.  
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.  
12.12 Heat-resistant temperature of substrate and peripheral components  
A rated current applied to the product (based on a rise in temperature) increases the product temperature up to 40°C. Pay  
attention to the heat-resistant temperature of the substrate and peripheral components.  
13.  
Note  
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to  
your product.  
(2) You are requested not to use our product deviating from the reference specifications.  
(3) The contents of this reference specification are subject to change without advance notice. Please approve our  
product specifications or transact the approval sheet for product specifications before ordering.  
MURATA MFG CO., LTD  

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