LQH31HN54NK03# [MURATA]

;


型号：	LQH31HN54NK03#
厂家：	muRata
描述：
文件：	总9页 (文件大小：316K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

CHIP COIL（CHIP INDUCTORS）LQH31HN□□□□03L REFERENCE SPECIFICATION

Spec No. JELF243A-0034S-01

P.1/9

1.Scope

This reference specification applies to LQH31HN series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

54N

and

L:Taping

Characteristics

3.Rating

・Operating Temperature Range.

– 40 °C to + 85 °C

・Storage Temperature Range.

– 40 °C to + 85 °C

Resistance

(Ω)

Self Resonant

Frequency

(MHz min)

Rated

Current

(mA)

Inductance

Customer

Part Number

MURATA

Part Number

(min)

(nH)

Tolerance

LQH31HN54NK03L

LQH31HN95NK03L

LQH31HNR14J03L

LQH31HNR14K03L

LQH31HNR21J03L

LQH31HNR21K03L

LQH31HNR29J03L

LQH31HNR29K03L

LQH31HNR39J03L

LQH31HNR39K03L

LQH31HNR50J03L

LQH31HNR50K03L

LQH31HNR61J03L

LQH31HNR61K03L

LQH31HNR75J03L

LQH31HNR75K03L

LQH31HNR88J03L

LQH31HNR88K03L

0.035±30%

0.047±30%

800

650

920

790

K:±10%

145

215

290

390

500

610

750

880

0.061±30%

0.11±30%

0.17±30%

0.26±30%

0.44±30%

0.48±30%

0.79±30%

0.86±30%

500

430

360

300

270

240

220

200

700

520

420

330

260

250

190

180

J: ± 5 %

K:±10 %

4. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)

《In case of doubt》

Temperature

Humidity

: 20 ± 2°C

: 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106 kPa

5. Appearance and Dimensions

2.3±0.2

1.6±0.2

■Unit Mass (Typical value)

0.029g

3.2±0.3

1.6±0.2

* No Marking.

0.7 0.7

min min

0.7

min

(in mm)

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

P.2/9

6. Electrical Performance

No.

Item

Specification

Inductance shall meet item 3.

Test Method

Measuring Equipment :

KEYSIGHT E4991A or equivalent

Measuring Frequency : 1MHz

6.1 Inductance

Measuring Method:See P.8

<Electrical Performance:Measuring

Method of Inductance>

6.2

Q shall meet item 3.

Measuring Equipment : KEYSIGHT E4991A or equivalent

Measuring Frequency : 100MHz

6.3 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment : Digital multi meter

6.4 Self Resonant

Frequency(S.R.F)

Measuring Equipment : KEYSIGHT E4991A or equivalent

6.5 Rated Current

Self temperature rise shall be

limited to 20 °C max.

The rated Current is applied.

Inductance Change : within ± 10 %

7. Mechanical Performance

No. Item

Specification

Test Method

7.1 Shear Test

Chip coil shall not be damaged after Substrate : Glass-epoxy substrate

tested as test method.

Chip Ciol

4.5

Pattern

Solder resist

Substrate

1.5

(in mm)

Applied Direction :

Chip Coil

Substrate

Force : 10 N

Hold Duration : 5s ± 1s

7.2 Bending Test

Substrate : Glass-epoxy substrate

(100mm×40mm×1.6mm)

Speed of Applying Force : 1mm / s

Deflection : 2mm

Hold Duration : 30 s

Pressure jig

R340

Deflection

(in mm)

Product

7.3 Vibration

Oscillation Frequency :10Hz ~ 55Hz ~ 10Hz

for 1 min

Total Amplitude : 1.5mm

Testing Time :

A period of 2 hours in each of 3 mutually

perpendicular directions.(Total 6 hours)

7.4 Solderability

The wetting area of the electrode shall Flux: Ethanol solution of rosin,25(wt)%

be at least 90% covered with

new solder coating.

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating : 150±10°C / 60 to 90seconds

Solder Temperature : 240±5°C

Immersion Time : 3±1 s

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

No. Item

P.3/9

Specification

Test Method

7.5 Resistance to

Soldering Heat

Appearance : No damage

Inductance Change : within ± 5 %

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating:150±10°C / 60 to 90seconds

Solder Temperature:270±5°C

Immersion Time:10±1 s

Then measured after exposure in the room

condition for 24±2 hours.

8.Environmental Performance (It shall be soldered on the substrate.)

No.

8.1

Item

Specification

Test Method

Temperature : 85 °C ± 2 °C

Heat Resistance

Appearance : No damage

Inductance Change : within ± 5 %

Q Change : within ± 20 %

Time : 1000 h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.2

8.3

Cold Resistance

Humidity

Temperature : - 40 °C ± 2 °C

Time : 1000 h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

Temperature : 40 °C ± 2 °C

Humidity : 90 %(RH) to 95 %(RH)

Time : 1000 h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.4

Temperature

Cycle

1 cycle :

1 step : - 40 °C ± 2 °C / 30 min ± 3 min

2 step : Ordinary temp. / 10 min to 15 min

3 step : + 85 °C ± 2 °C / 30 min ± 3 min

4 step : Ordinary temp. / 10 min to 15 min

Total of 10 cycles

Then measured after exposure in the room condition

for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

+0.1

_※Lead-in / out wire



1.5

-0

1.75±0.1

(

)

0.2

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

4.0±0.1

2.0±0.05

1.9±0.1

2.0±0.1

(in mm)

Direction of feed

Dimension of the Cavity is measured at the bottom side.

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

9.3 Pull Strength

Plastic tape

P.4/9

10N min.

Cover tape

9.4 Peeling off force of cover tape

165 to 180 degree

Speed of Peeling off

Peeling off force

300mm / min

Cover tape

Plastic tape

0.2N to 0.7N

(minimum value is typical)

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1) (2) (3

)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (2) ,Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity

of an order

10.

Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

P.5/9

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration

due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

1.0

4.5

1.5

Recommended land patterns for flow and reflow

It has been designed for Electric characteristics and

Please follow the recommended patterns. Otherwise,

includes electrical performance or solderability may

"position shift" in soldering process.

soldering are as follows:

solderability.

their performance which

be affected, or result to

Chip Coil

Land

Solder resist

(in mm)

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

11.3 Flow soldering / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is

limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature

difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the

deterioration of product quality.

Soldering profile

(1)Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150°C、60s min.

250°C、4s～6s

265°C±3°C、5s

Cycle of flow

2 times

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

(2)Reflow soldering profile

P.6/9

Temp.

(℃)

260℃

245℃±3℃

230℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2 times

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on

the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

1/3T≦t≦T

T: Lower flange thickness

Recommendable

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a

stress.

<b) to the mechanical

Poor example

〈

〉

Good example

〈

〉

MURATA MFG.CO., LTD

Reference Only

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

Spec No. JELF243A-0034S-01

P.7/9

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D 1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit



Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,

or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine

by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted

on your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

P.8/9

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening

crew to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.11 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 °C to 40 °C

Humidity

: 15 % to 85 % relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases

such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in

poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the

breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243A-0034S-01

P.9/9

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

V₁

I₁

V₂

I ₂

Test Head

Test fixture

Product

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

V₁

I ₁

V₂

I ₂

Zm=

，

Zx=

(3) Thus,the relation between Zx and Zm is following;

Zm-β

where, α= D / A =1

Zx= α

1-ZmΓ

β= B / D =Zsm-(1-Yom Zsm)Zss

Γ= C / A =Yom

Zsm : measured impedance of short chip

Zssa: residual impedance of short chip (0.771nH)

Yom: measured admittance when opening the fixture

(4) Lx shall be calculated with the following equation.

Im(Zx)

Lx : Inductance of chip coil

Qx : Q of chip coil

Lx=

Qx =

2πf

Re(Zx)

: Measuring frequency

MURATA MFG.CO., LTD

LQH31HN54NK03# [MURATA]

相关型号：

LQH31HN54NK03B

LQH31HN54NK03K

LQH31HN54NK03L

LQH31HN95NK03

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LQH31HN95NK03K

LQH31HN95NK03L

LQH31HNR14J03

LQH31HNR14J03#

LQH31HNR14J03B

LQH31HNR14J03L