LQH32CH100K33# [MURATA]
;
| 型号： | LQH32CH100K33# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总8页 (文件大小：326K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SpecNo.JELF243A-9121B-01
P1/7
Reference Only
CHIP COIL（CHIP INDUCTORS）LQH32CH□□□□33L
Murata Standard Reference Specification【AEC-Q200】
1.Scope
This reference specification applies to LQH32CH_33L series, Chip coil (Chip Inductors) for automotive Electronics
based on AEC-Q200.
2.Part Numbering
(ex)
LQ
H
32
C
H
1R0
M
3
3
L
Product ID Structure Dimension Applications
Category
Inductance Tolerance Features Electrode Packaging
(L×W)
and
(For Automotive)
L:Taping
Characteristics
3.Rating
Operating Temperature Range:
Storage Temperature Range:
–40 to +85°C
–40 to +105°C
Self
DC
Resistance
(Ω)
Rated
Current
(mA)
ESD
Rank
5A: 8kV
Inductance
Customer
MURATA
Resonant
Frequency
(MHz min)
Part Number
Part Number
(µH)
Tolerance
LQH32CHR15M33L
LQH32CHR27M33L
LQH32CHR47M33L
LQH32CH1R0M33L
LQH32CH2R2M33L
LQH32CH4R7M33L
LQH32CH100K33L
0.15
0.27
0.47
1.0
0.028±30%
0.034±30%
0.042±30%
0.060±30%
0.097±30%
0.15±30%
0.30±30%
400
250
150
100
64
1450
1250
1100
1000
790
±20%
±10%
5A
2.2
4.7
43
650
10
26
450
When applied Rated current to the Products , self temperature rise shall be limited to 20℃max and Inductance will be
within ±10% of initial Inductance value.
4.Testing Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature : 20 ± 2°C
Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity
(25 to 85 %(RH))
5.Appearance and Dimensions
Fig.1
2.5±0.2
2.5±0.2
2.5±0.2
A
2.5±0.2
2.5±0.2
2.8 max.
A :
3.2±0.3
Please refer to the dimention A for
2R2M,4R7M,100K types. (See Fig.1)
*
*
■Unit Mass (Typical value)
0.060g
No marking.
(in mm)
0.9 0.3
±
0.9 0.3
±
1.3 0.2
±
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P2/7
Reference Only
6.Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment :
KEYSIGHT 4192A or equivalent
Measuring Frequency : 1MHz
6.1 Inductance
6.2 DC
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment : Digital multi meter
Resistance
6.3 Self Resonant
Frequency(S.R.F)
Measuring Equipment :
KEYSIGHT E4991A or equivalent
7. AEC-Q200 Requirement
7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
Meet Table A after testing.
No
Stress
Test Method
1000hours at 85 deg C
Set for 24hours at room
temperature, then measured.
3
High
Temperature
Exposure
Table A
Appearance
No damage
Inductance change Within ±5%
DC Resistance
Within ±5%
Change
4
Temperature
Cycling
1000cycles
Meet Table A after testing.
-40 deg C to + 85deg C
Set for 24hours at room
temperature,then
measured.
7
8
Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table A after testing.
unpowered.
Operational Life
Apply 85 deg C 1000 hours
Set for 24hours at room
Meet Table A after testing.
temperature, then measured
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical
Dimension
Meet ITEM 5
（Style and Dimensions）
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock Per MIL-STD-202
Method 213
Meet Table A after testing.
Condition C:
100g’s/6ms/Half sine
14 Vibration
5g's for 20 minutes,
No defects
12cycles eah of 3 orientations
Test from 10-2000Hz.
15 Resistance
No-heating
Murata deviation request :
to Soldering Heat Solder temperature
260C+/-5 deg C
Pre-heating: 150C+/-5C, 60s+/-5s
Meet Table A after testing.
Immersion time 10s
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P3/7
Reference Only
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
17 ESD
Per AEC-Q200-002
ESD Rank: Refer to Item 3. Rating.
No defects
18 Solderbility
Per J-STD-002
Method b : Not Applicable
90% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Measured : Inductance
Per UL-94
No defects
Characterization
20 Flammability
21 Board Flex
Not Applicable
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Murata deviation request: 30s
No defects
22 Terminal Strength Per AEC-Q200-006
A force of 17.7N for 60s
No defects
8.Specification of Packaging
8.1 Appearance and Dimensions of plastic tape
1.5+0.1
Lead-in/out wire
※
-0
(0.2)
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
※
Dimension of the Cavity is measured
at the bottom side.
4.0±0.1
4.0±0.1
(in mm)
2.1±0.1
2.9±0.2
2.0±0.05
Direction of feed
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
8.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm/min
0.2 to 0.7N
Peeling off force
(minimum value is typical)
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P4/7
Reference Only
8.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape) and trailer-tape (empty tape) as follows
8.6 Marking for reel
Customer part number; MURATA part number; Inspection number(1) , RoHS marking(2); Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
: Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ･･･
8.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
Label
(Reel)
W
D
H
H
186
186
93
5
D
W
Above Outer Case size is typical. It depends on a quantity of an order.
9.
Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
9.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from
deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these
environments.
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P5/7
Reference Only
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Flow Soldering
5.5
Reflow Soldering
5.5
Chip Coil
Land
Solder Resist
1.0 1.3 1.0
1.3
(in mm)
Applicable to flow soldering.
10.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Solder
Other flux (except above) Please contact us for details, then use.
10.3 Flow soldering conditions / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
･Soldering profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
150°C、60s min.
250°C、4s～6s
265°C±3°C、5s
Cycle of flow
2 times
1 time
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P6/7
Reference Only
(2)Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s above 230°C、60s max.
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
245±3°C
2 times
260°C,10s
1 time
10.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
10.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
(T: Lower flange thickness)
T
t
10.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Electrode
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(Good example)
(Poor example)
Electrode
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P7/7
Reference Only
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D *1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
*1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Perforation
B
Electrode
D
A
Slit
Electrode
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible
Recommended
Screw Hole
10.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
10.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
10.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
MURATA MFG.CO., LTD
SpecNo.JELF243A-9121B-01
P8/7
Reference Only
10.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the
substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as
sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD
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