LQH32MN3R3K23# 概述
LQH32MN3R3K23# 数据手册
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PDF下载Reference Onl
SpecNo.JELF243A-0163C-01
P1/10
CHIP COIL(CHIP INDUCTORS)LQH32MN□□□□23L REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQH32MN Series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
H
32
M
N
1R0
Applications Category Inductance Tolerance Features
and
K
2
3
L
Product ID
Structure Dimension
Electrode Packaging
(L×W)
L:Taping
Characteristics
3. Rating
・Operating Temperature Range
・Storage Temperature Range.
-40 to +85°C
-40 to +85°C
Self
Inductance
DC
Resistance
( max)
Rated
Customer
MURATA
Q
(min.)
Resonant
Current
Frequency
(mA)
Tolerance
Part Number
Part Number
(H)
(%)
(MHz min)
LQH32MN1R0M23L
LQH32MN1R2M23L
LQH32MN1R5K23L
LQH32MN1R8K23L
LQH32MN2R2K23L
LQH32MN2R7K23L
LQH32MN3R3K23L
LQH32MN3R9K23L
LQH32MN4R7K23L
LQH32MN5R6K23L
LQH32MN6R8K23L
LQH32MN8R2K23L
LQH32MN100K23L
LQH32MN100J23L
LQH32MN120K23L
LQH32MN120J23L
LQH32MN150K23L
LQH32MN150J23L
LQH32MN180K23L
LQH32MN180J23L
LQH32MN220K23L
LQH32MN220J23L
LQH32MN270K23L
LQH32MN270J23L
LQH32MN330K23L
LQH32MN330J23L
LQH32MN390K23L
LQH32MN390J23L
LQH32MN470K23L
LQH32MN470J23L
LQH32MN560K23L
LQH32MN560J23L
LQH32MN680K23L
LQH32MN680J23L
LQH32MN820K23L
LQH32MN820J23L
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
0.5
0.6
445
M:±20
100
425
75
60
50
43
38
35
31
28
25
23
400
390
370
320
300
290
270
250
240
225
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.5
1.6
20
35
40
K:±10
10
12
15
18
22
27
33
39
47
56
68
82
1.8
2.0
2.2
2.5
2.8
3.1
3.5
3.9
4.3
4.9
5.5
6.2
20
18
16
15
14
13
12
190
180
170
165
150
125
115
110
100
85
K:±10
J:± 5
11
10
9.0
8.5
80
70
MURATA MFG.CO., LTD
Reference Onl
Inductance
SpecNo.JELF243A-0163C-01
P2/10
Self
DC
Rated
Customer
Part Number
MURATA
Q
Resonant
Frequency
(MHz min)
Resistance
Current
(mA)
Tolerance
(%)
Part Number
(min.)
(H)
( max)
LQH32MN101K23L
LQH32MN101J23L
LQH32MN121K23L
LQH32MN121J23L
LQH32MN151K23L
LQH32MN151J23L
LQH32MN181K23L
LQH32MN181J23L
LQH32MN221K23L
LQH32MN221J23L
LQH32MN271K23L
LQH32MN271J23L
LQH32MN331K23L
LQH32MN331J23L
LQH32MN391K23L
LQH32MN391J23L
LQH32MN471K23L
LQH32MN471J23L
LQH32MN561K23L
LQH32MN561J23L
100
7.0
8.0
8.0
7.5
7.0
6.0
5.5
80
75
70
120
150
180
220
270
330
390
470
560
9.3
40
10.2
11.8
12.5
13.0
22.0
25.0
28.0
K:±10
J:± 5
65
5.0
50
45
40
50
4. Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temperature (15 to 35°C)
In case of doubt
Temperature : 20 ± 2°C
Humidity
: Ordinary Humidity
(25 to 85 %(RH))
2.5±0.2
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5. Appearance and Dimensions
2.5±0.2
2.5±0.2
3.2±0.3
■Unit Mass (Typical value)
0.060g
No marking.
※
(in mm)
0.9
±0.3
1.3
±0.2
0.9
±0.3
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0163C-01
P3/10
6. Electrical Performance
No.
Item
Specification
Test Method
6.1 Inductance
Inductance shall meet item 3.
Measuring Equipment : KEYSIGHT 4192A or equivalent
Measuring Frequency : 1MHz / 1.0 to 390 μH
1kH / 470 to 560 μH
6.2
Q
Q shall meet item 3.
Measuring Equipment : KEYSIGHT 4192A or equivalent
Measuring Frequency : 1MHz / 1.0 to 82μH
796kHz / 100 to 560μH
6.3 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment : Digital multi meter
6.4 Self Resonant
Frequency(S.R.F)
Measuring Equipment : KEYSIGHT 4291A or equivalent
6.5 Rated Current
Self temperature rise shall be limited to The rated current is applied.
20°C max.
Inductance Change : within ± 10%
6.6 Temperature
Characteristics
Temperature Coefficient
220 to 1400 PPM/°C
Temperature coefficient on the basis of step 3 shall meet
specification after tested as follows.It shall be subjected to
the condition of Table 1, and its inductanse shall be
measured at each step after reaching the thermal
equilibrium and be calculated.
Table 1
Step1 / +20±2°C
Step2 / -25±2°C
Step3 / +20±2°C
Step4 / +85±2°C
Step5 / +20±2°C
7. Mechanical Performance
No.
Item
Specification
Test Method
Substrate : Glass-epoxy substrate
7.1 Shear Test
Chip coil shall not be damaged.
Applied Direction
:
Chip Coil
F
Substrate
Force : 10N
Hold Duration : 5±1s
7.2 Bending Test
Chip coil shall not be damaged.
Substrate : Glass-epoxy substrate
(100 40 1.6mm)
Speed of Applying Force : 1mm / s
Deflection : 2mm
Hold Duration : 30 s
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
7.3 Vibration
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6 hours)
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0163C-01
No. Item
P4/10
Specification
Test Method
Flux : Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
7.4 Solderability
The wetting area of the electrode shall
be at least 90% covered with new solder
coating.
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 240±5°C
Immersion Time : 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ± 5%
Flux : Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 270±5°C
Immersion Time : 10±1 s
Then measured after exposure in the room condition
for 24±2 hours.
8. Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
Temperature : 85±2°C
Time : 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Appearance:No damage
Inductance Change : within ±5%
Q-factor Change : within ±20%
Temperature : -40±2°C
Time : 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature : 40±2°C
Humidity : 90 to 95%(RH)
Time : 1000h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle :
1 step : -40±2°C / 30±3 min
2 step : Ordinary temp. / 10 to 15 min
3 step : +85±2°C / 30±3 min
4 step : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
Lead-in/out wire
※
1.5
-0
0.2
(
)
The packing directions of the chip coil
※
in taping are unified with the in/out
positions of the lead wire.
Dimension of the Cavity is measured
at the bottom side.
4.0±0.1
4.0±0.1
(in mm)
2.1±0.1
2.9±0.2
2.0±0.05
Direction of feed
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0163C-01
P5/10
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
10N min.
5N min.
Cover tape
9.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm/min
0.2 to 0.7N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.>
□□OOOO
(1) (2) (3
)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,
Quantity, etc ・・・
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0163C-01
P6/10
9.8. Specification of Outer Case
Outer Case Dimensions(mm)
Label
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
10.
Caution
10.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
10.2 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.],
chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas
environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc.
We will not bear any responsibility for use under these environments.
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability
may be affected, or result to "position shift" in soldering process.
Flow Soldering
Reflow Soldering
5.5
5.5
Chip Coil
Land
Solder Resist
1.0 1.3 1.0
1.3
(in mm)
Applicable to flow soldering.
11.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Solder
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Reference Onl
SpecNo.JELF243A-0163C-01
11.3 Flow soldering conditions / Reflow soldering conditions
P7/10
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to
100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Soldering profile
(1)Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
150°C、60s min.
250°C、4s~6s
265°C±3°C、5s
Cycle of flow
2 times
1 time
(2)Reflow soldering profile
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150~180°C 、90s±30s
Heating
above 220°C、30s~60s
245±3°C
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
1 time
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0163C-01
P8/10
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
1/3T≦t≦T
Recommendable
(T: Lower flange thickness)
T
t
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
Products shall be located in the sideways direction
(Length: a b) to the mechanical stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D 1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
B
Seam
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
D
A
a
b
Slit
Length:a b
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0163C-01
P9/10
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted
products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
1. Alternative cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition
etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition
may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas
or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and
the breaking of winding wire caused by the collision between the products.
・
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
・
12. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your
product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD
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