LQH3ERN1R0J01 [MURATA]
General Purpose Inductor, 1uH, 5%, 1 Element, Ferrite-Core, SMD;型号: | LQH3ERN1R0J01 |
厂家: | muRata |
描述: | General Purpose Inductor, 1uH, 5%, 1 Element, Ferrite-Core, SMD |
文件: | 总25页 (文件大小:306K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
CHIP COILS
for General Use Magnetic Shielded Type LQH3ER Series
LQH3ER Series
■ Features
The LQH3ER series consists of magnetically shielded chip
+0.3
-0.2
+0.3
3.5
inductors. Its tight inductance tolerance of +-2%
3.2
-0.2
enables no adjustment of circuit. The shielding
structure eliminates external interference and
facilitates high mounting density.
(in mm)
0.7min 0.7min 0.7min
Inductance
Rated Current Max. of DC resistance
Q
(min.)
Self Resonance Frequency
Part Number
(µH)
(mA)
(ohm)
(MHz)
LQH3ERN1R0G01
LQH3ERN1R2G01
LQH3ERN1R5G01
LQH3ERN1R8G01
LQH3ERN2R2G01
LQH3ERN2R7G01
LQH3ERN3R3G01
LQH3ERN3R9G01
LQH3ERN4R7G01
LQH3ERN5R6G01
LQH3ERN6R8G01
LQH3ERN8R2G01
LQH3ERN100G01
LQH3ERN120G01
LQH3ERN150G01
LQH3ERN180G01
LQH3ERN220G01
LQH3ERN270G01
LQH3ERN330G01
LQH3ERN390G01
LQH3ERN470G01
LQH3ERN560G01
LQH3ERN680G01
LQH3ERN820G01
LQH3ERN101G01
LQH3ERN1R0J01
LQH3ERN1R2J01
LQH3ERN1R5J01
LQH3ERN1R8J01
LQH3ERN2R2J01
LQH3ERN2R7J01
LQH3ERN3R3J01
LQH3ERN3R9J01
LQH3ERN4R7J01
LQH3ERN5R6J01
LQH3ERN6R8J01
1 ±2%
1.2 ±2%
1.5 ±2%
1.8 ±2%
2.2 ±2%
2.7 ±2%
3.3 ±2%
3.9 ±2%
4.7 ±2%
5.6 ±2%
6.8 ±2%
8.2 ±2%
10 ±2%
12 ±2%
15 ±2%
18 ±2%
22 ±2%
27 ±2%
33 ±2%
39 ±2%
47 ±2%
56 ±2%
68 ±2%
82 ±2%
100 ±2%
1 ±5%
70
70
70
70
50
50
50
50
30
30
30
30
15
15
15
15
10
10
10
10
10
10
10
10
10
70
70
70
70
50
50
50
50
30
30
30
0.247
0.286
0.338
0.364
0.429
0.507
0.559
0.585
0.676
0.728
0.806
0.897
1.222
1.43
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
60 at 7.96MHz
120 min.
100 min.
80 min.
70 min.
60 min.
8
55 min.
50 min.
45 min.
40 min.
37 min.
35 min.
32 min.
30 min.
27 min.
1.56
25 min.
1.69
23 min.
1.95
20 min.
2.21
18 min.
3.12
16 min.
3.38
15 min.
3.9
14 min.
4.29
13 min.
6.89
12 min.
7.54
11 min.
8.58
10 min.
0.247
0.286
0.338
0.364
0.429
0.507
0.559
0.585
0.676
0.728
0.806
120 min.
100 min.
80 min.
1.2 ±5%
1.5 ±5%
1.8 ±5%
2.2 ±5%
2.7 ±5%
3.3 ±5%
3.9 ±5%
4.7 ±5%
5.6 ±5%
6.8 ±5%
70 min.
60 min.
55 min.
50 min.
45 min.
40 min.
37 min.
35 min.
Continued on the following page.
29
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Continued from the preceding page.
Inductance
Rated Current Max. of DC resistance
Q
(min.)
Self Resonance Frequency
Part Number
(µH)
(mA)
(ohm)
(MHz)
LQH3ERN8R2J01
LQH3ERN100J01
LQH3ERN120J01
LQH3ERN150J01
LQH3ERN180J01
LQH3ERN220J01
LQH3ERN270J01
LQH3ERN330J01
LQH3ERN390J01
LQH3ERN470J01
LQH3ERN560J01
LQH3ERN680J01
LQH3ERN820J01
LQH3ERN101J01
8.2 ±5%
10 ±5%
12 ±5%
15 ±5%
18 ±5%
22 ±5%
27 ±5%
33 ±5%
39 ±5%
47 ±5%
56 ±5%
68 ±5%
82 ±5%
100 ±5%
30
15
15
15
15
10
10
10
10
10
10
10
10
10
0.897
1.222
1.43
1.56
1.69
1.95
2.21
3.12
3.38
3.9
60 at 7.96MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
70 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
80 at 2.52MHz
32 min.
30 min.
27 min.
25 min.
23 min.
20 min.
18 min.
16 min.
15 min.
14 min.
13 min.
12 min.
11 min.
10 min.
4.29
6.89
7.54
8.58
Min. of Operating Temp. : -25°C to 85°C
■ Q-Frequency Characteristics
■ Inductance-Current Characteristics
500
120
100µH
100
10µH
1.0µH
80
100µH
100
60
40
47µH
Q
50
22µH
8
20
0
10µH
10
4.7µH
5
0.1
0.5
1
5
10
50
100
Frequency (MHz)
2.2µH
1.0µH
1
1
5
10
50
100
500 1000
Current (mA)
■ Coupling Coefficient
10
8
6
4
2
1mm
0
1
5
10
Inductance (µH)
50
100
30
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
The structure of the "Global Part Numbers" that will be adopted from June 2001 and the meaning of each code are described herein.
If you have any questions about details, inquire at your usual Murata sales office or distributor.
o Part Numbering
(
)
Chip Coils (SMD)
(Global Part Number) LQ
H
32
M
N
331
K
2
1 L
q
w
e
r
t
y
u
i o !0
qProduct ID
tCategory
Product ID
Code
Category
LQ
Chip Coils
N
Standard Type
wStructure
yInductance
Expressed by three figures. The unit is micro-henry (µH). The first
and second figures are significant digits, and the third figure
expresses the number of zero which follow the two figures. If
there is a decimal point, it is expressed by capital letter "R". In
this case, all figures are significant digits. If inductance is less
than 0.1µH, the inductance code is expressed by combination of
two figures are capital letter "N", and the unit of inductance is
nano-henry (nH).
Code
G
Structure
Monolithic Type (Air-core Coil)
Winding Type (Ferrite Core)
Monolithic (Ferriet Core)
Film Type
H
M
P
W
Winding Type (Air-core Coil)
Capital letter "N" indicates the unit of "nH", and also expresses a
decimal point. In this case, all figure are significant digits.
eDimension (LgW)
Code
03
Dimension (LgW)
0.60g0.30mm
1.00g0.50mm
1.60g0.80mm
2.00g1.25mm
2.00g1.50mm
3.20g1.60mm
3.20g2.50mm
3.50g3.20mm
3.30g3.30mm
4.50g3.20mm
5.70g5.00mm
6.30g6.30mm
uInductance Tolerance
15
Code
B
Inductance Tolerance
18
±0.1nH
±0.2nH
±0.5nH
±2%
21
C
2B
31
D
G
32
H
±3%
3E
3K
43
J
±5%
K
±10%
±20%
±30%
±0.3nH
M
N
55
66
S
rApplications and Characteristics
iFeatures
Expressed by a figure from "0" to "2".
Code
H
Series
Applications and Characteristics
Monolithic Air-core
Ex.)
LQG
Code
Fetures
N
for Resonant Circuit
0
Standard Type
for Choke
(Low-current DC Power Supplies)
D
LQM
oElectrode
F
M
T
for Choke (DC Power Supplies)
Film Type
Code
Electrode
Solder Plating
Sputtering
0
1
2
LQP
Film Type (Low DC Resistance Type)
High Q Type (UFH-SHF)
A
H
N
M
Sn Plating
LQW
High Q Type (VHF-UHF)
!Pakaging
for Resonant Circuit
for Resonant Circuit (Coating Type)
Code
Pakaging
K
L
B
J
Plastic Taping (ø330mm Reel)
Plastic Taping (ø180mm Reel)
Bulk
for Resonant Circuit
(Magnetically Shielded Type)
R
LQH
D
C
S
H
for Choke
for Choke (Coating Type)
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
for Choke (Magnetically Shielded Type)
for High-frequency Resonant Circuit
D
2
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Monolithic And Film Type Notice(Soldering and Mounting)
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
Land Pattern
Solder Resist
c
b
Part Number
LQG15H
a
b
c
0.5-0.6
0.6-0.8
1.4-1.5
1.8-2.2
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
0.8-0.9
1.4-1.5
0.4
LQG18H
0.6-0.8
Flow
LQM18N
0.7
0.7
Reflow
LQM21N/21D/21F
LQM31F
1.0
1.2
1.2
2.0
LQP03T
0.2-0.3
0.5-0.6
0.2-0.3
0.4
LQP15M
in mm
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Allowable Flow Soldering Temperature and Time
Chip coils can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
Solder : H60A
280
260
240
The volume of solder can cause minor fluctuations in
inductance value. Therefore, carefully control the amount
of solder when soldering the LQG15H/18H, LQP03T and
LQP15M series.
220
LQM18N
LQM21N/21D/21F
LQM31F
2) Soldering Temperature and Time
200
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
180
0
10
20
30
Time (sec.)
Allowable Reflow Soldering Temperature and Time
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Use solder paste equivalent to H60A for
LQP03T/15M and LQG15H/18H.
Solder : H60A
LQG18H
280
12
260
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
240
220
LQM21N/21D/21F
LQP03T/15M
LQG15H, LQM18N
LQM31F
200
180
0
20
40
60
80
100
Time (sec.)
Continued on the following page.
42
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Monolithic And Film Type Notice(Soldering and Mounting)
Continued from the preceding page.
3) Standard Soldering Conditions
Flow Solder
Gradual cooling
(in air)
Preheating (in air) Soldering
240°C
200
100
0
One minute min.
3sec.max.
Reflow Solder
Gradual cooling
(in air)
Preheating (in air) Soldering
230°C
200
100
0
One minute min.
10sec.max.*
LQG15H/18H,LQP03T/15M : 20sec.max
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time
: within 3 second
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Solder Resist
Land
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
c
d
12
2) Magnetic Coupling
Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQG and LQM series have a magnetically shielded
structure. The structure makes their coupling coefficient
smaller than that of conventional chip coils.
Continued on the following page.
43
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Monolithic And Film Type Notice(Soldering and Mounting)
Continued from the preceding page.
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Fig.2
Fig.1
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown in the right.
LQP/LQG/LQM
Standard thickness of solder paste : 100 to 150µm
5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderabillity.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
Typical Application Amount (in:mg)
MR-8153RA NF-3000 UVS-50R-2
0.05-0.06 0.06-0.07 0.06-0.07
adhesive in accordance with the following conditions.
Part Number
LQM18N
LQM21N/21D/21F 0.15-0.20 0.20-0.25 0.20-0.25
LQM31F 0.20-0.25 0.25-0.30 0.25-0.30
12
44
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding Type Notice(Soldering and Mounting)
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
Land Pattern
Solder Resist
a
2.5min.
2.0 min. (LQW15A/18A)
Part Number
LQH31M/31C/31H
LQW31H
a
b
c
d
1.5
4.5
1.75
1.0
LQW2BH
1.2
3.0
1.1
0.8
LQW18A
0.7-1.0 1.8-2.0 0.6-0.7 0.6-0.8
LQW15A
0.65
1.2
0.35
0.50
in mm
If mounted at 2.5 (2.0) mm intervals as indicated in the diagram,
attention should be paid to potential magnetic coupling effects when
using the coil as a resonator.
LQH43M
LQH43N
LQH43C
Land Pattern
Solder Resist
7.5
1.5 1.5 1.5
in mm
Continued on the following page.
12
45
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding Type Notice(Soldering and Mounting)
Continued from the preceding page.
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Allowable Flow Soldering Temperature and Time
Chip coils can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
Solder : H60A
280
260
240
Reflow soldering should be applied for LQW15A/18A.
2) Soldering Temperature and Time
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
220
200
180
LQW2BH
LQH31M/31C/31H
LQH43M/43N/43C
LQW31H
0
10
20
30
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
Time (sec.)
Allowable Reflow Soldering Temperature and Time
Solder : H60A
280
260
240
220
LQW2BH/31H
LQH31H
LQH43N
LQW18A
LQW15A
LQH31M/31C
LQH43M/43C
200
180
0
10
20
30
40
50
60
Time (sec.)
3) Standard Soldering Conditions
Flow Solder
Gradual cooling
(in air)
Preheating (in air) Soldering
240°C
200
100
0
One minute min.
3sec.max.
12
Reflow Solder
Gradual cooling
(in air)
Preheating (in air) Soldering
230°C
200
100
0
One minute min.
10sec.max.
Continued on the following page.
46
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding Type Notice(Soldering and Mounting)
Continued from the preceding page.
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time
: within 3 second
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Solder Resist
Land
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
c
d
2) Magnetic Coupling
Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQH series have a magnetically shielded structure.
The structure makes their coupling coefficient smaller
than that of conventional chip coils.
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Fig.2
Fig.1
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown in the right.
12
LQH_C/H/M/N
LQW_H
LQW_A
Standard thickness of solder paste: 200µm to 300µm
(LQW15A/18A : 100 to 150µm)
Continued on the following page.
47
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding Type Notice(Soldering and Mounting)
Continued from the preceding page.
5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderabillity.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the following conditions.
Typical Application Amount (in:mg)
MR-8153RA NF-3000 UVS-50R-2
Part Number
LQW2BH
0.16-0.18 0.20-0.25 0.21-0.23
LQH31M/31C/31H
LQW31H
0.18-0.20 0.20-0.25 0.20-0.25
LQH43M(N)
LQH43C
0.45-0.50 0.60-0.80 0.60-0.80
12
48
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
LQH32M_11/32C_11
LQH3ER
Land Pattern
Solder Resist
5.5
1.0 1.0 1.0
LQH32M_21/32C_21/32C_51
LQH3KS
5.5
1.0 1.3 1.0
in mm
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Allowable Flow Soldering Temperature and Time
Chip coils can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
Solder : H60A
280
260
Reflow soldering should be applied for LQH3ER/3KS.
240
2) Soldering Temperature and Time
LQH32M/32C
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
220
200
180
0
10
20
30
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
Time (sec.)
Allowable Reflow Soldering Temperature and Time
Solder : H60A
12
280
260
240
220
LQH32M/32C
LQH3ER/3KS
200
180
0
10
20
30
40
50
60
Time (sec.)
Continued on the following page.
49
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)
Continued from the preceding page.
3) Standard Soldering Conditions
Flow Solder
Gradual cooling
Preheating (in air) Soldering
(in air)
240°C
200
100
0
One minute min.
3sec.max.
Reflow Solder
Gradual cooling
(in air)
Preheating (in air) Soldering
230°C
200
100
0
One minute min.
10sec.max.
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time
: within 3 second
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Solder Resist
Land
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
c
d
12
2) Magnetic Coupling
Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQH_R/S series have a magnetically shielded
structure. The structure makes their coupling coefficient
smaller than that of conventional chip coils. In particular,
the LQH3ER series has a very small coupling coefficient.
Continued on the following page.
50
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)
Continued from the preceding page.
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Fig.2
Fig.1
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown in the right.
LQH_C/D/H/M/N
LQH_R/S
Standard thickness of solder paste: 200µm to 300µm
5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderabillity.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the following conditions.
Typical Application Amount (in:mg)
MR-8153RA NF-3000 UVS-50R-2
0.20-0.23 0.27-0.35 0.27-0.35
Part Number
LQH32M/32C
12
51
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Larege-current Type Notice(Soldering and Mounting)
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
LQH55D
LQH66S
pattern is designed so that it does not project beyond the
chip coil electrode.
Land Pattern
Solder Resist
8.0
2.0
3.0
3.0
in mm
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Allowable Reflow Soldering Temperature and Time
Reflow soldering should be applied for LQH55D/66S.
Solder : H60A
280
2) Soldering Temperature and Time
260
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
LQH66S
240
220
200
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
LQH55D
180
0
20
40
60
80
100
Time (sec.)
3) Standard Soldering Conditions
Reflow Solder
Gradual cooling
(in air)
Preheating (in air) Soldering
230°C
200
100
0
One minute min.
10sec.max.
12
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time
: within 3 second
Continued on the following page.
52
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Larege-current Type Notice(Soldering and Mounting)
Continued from the preceding page.
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Solder Resist
Land
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
c
d
2) Magnetic Coupling
Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQH_S series have a magnetically shielded structure.
The structure makes their coupling coefficient smaller
than that of conventional chip coils.
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Fig.2
Fig.1
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown bellow
LQH_D
LQH_S
Standard thickness of solder paste: 200µm to 300µm
12
53
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Notice
■ Notice (Storage and Operating Conditions)
< OPERATING ENVIRONMENT >
Do not use products in chemical atmosphere such as
chlorine gas, acid or sulfide gas.
Humidity : 30 to 70% (relative humidity)
Do not subject products to rapid changes in
temperature and humidity.
< STORAGE REQUIREMENTS >
1. Storage Period
Do not store them in chemical atmosphere such as
one containing sulfurous acid gas or alkaline gas.
This will prevent electrode oxidation which causes
poor solderability and possible corrosion of coils.
b) Do not store products in bulk packaging to prevent
collision among coils which causes core chipping
and wire breakage.
Products should be used within 12 months reckon
from the date of our out-going inspection.
Solderability should be verified if this period is
exceeded. (LQH3ER/3KS series should be used within
6 months.)
2. Storage conditions
c) Store products on pallets to protect from humidity,
dust, etc.
a) Store products in a warehouse in compliance with
the following conditions :
d) Avoid heat shock, vibration, direct sunlight, etc.
Temperature : -10 to 40C.
■ Notice (Soldering and Mounting)
< CLEANING >
• HCFC-225
The following conditions should be observed when
cleaning chip coils.
b) Aqueous cleaning agents
• Surface active agent ( Clean Thru 750H )
• High grade alcohol ( Pine Alpha ST-100S )
• Hydrocarbon ( Techno Cleaner 335 )
• Alkaline Saponifier ( Aqua Cleaner 240 -cleaner
should be diluted to 20% using deionized water. )
LQH_R/S series : Aqueous agents should not be used
because they may cause quality deterioration.
LQH series : Surface active agent and high grade
alcohol can be used.
1. Cleaning Temperature : 60C. max. (40C. max. for
CFC alternatives and alcohol cleaning agents)
2. Ultrasonic
Output : 20W/l max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
Care should be taken not to cause resonance of
the PCB and mounted products.
3. Cleaning agent
4. Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact
Murata.
The following cleaning agents have been tested on
individual components. Evaluation in complete
assembly should be done prior to production.
a) CFC alternatives and alcohol cleaning agents
• Isopropyl alcohol ( IPA )
12
54
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Notice
■ Notice (Handling)
This item is designed to have sufficient strength,
but handle with care not to make it chipped or
broken due to its ceramic structure.
substance and so on.
LQM series
• There is possibility that the inductance value
LQW_A series
change due to magnetism. Do not use a magnet or
tweezers with magnetism when chip coil are
handled. ( The tip of the tweezers should be
molded with resin or pottery.)
• Sharp material, such as tweezers, shall not touch
to the winding portion to prevent the breaking of wire.
• Do not give excessive Mechanical shock should not be
applied to the products mounted on the board to prevent
thebreaking of the core.
< HANDLING >
1. Avoid applying excessive stress to products to
prevent damage.
• In some mounting machines,when picking up
components,support pin pushes up the components
from the bottom of base tape. In this case,please
remove the support pin. The support pin may damage
the components and break wire.
2. Do not touch winding with sharp objects such as
tweezers to prevent wire breakage.
3. Do not apply excessive force to products
mounted on boards to prevent core breakage.
< TRANSPORTATIONS >
LQH_C/D/H/M/N, LQW_H series
• Sharp material, such as tweezers, shall not touch
to the winding portion to prevent the breaking of wire.
• Do not give excessive Mechanical shock should
not be applied to the products mounted on the
board to prevent thebreaking of the core.
LQP series
Do not apply excessive vibration or mechanical
shock to products.
< RESIN COATING >
When coating products with resin, the relatively
high resin curing stress may change inductance
values.
• The pattern of the chip coil is covered with the
protection film. But the handling the chip coil
shall be taken care so that the chip coil would
not be damaged with the pick-up nozzle, the sharp
For exterior coating, select resin carefully so that
electrical and mechanical performance of the product
is not affected.
12
55
This is the PDF file of catalog No.O05E-6
Packaging
O05E6.pdf 01.5.9
Minimum Quantity and 8mm Width Taping Dimension
<Plastic>
<Paper>
1
+0.1
φ1.5
0.2
-0
4.0±0.1
2.0±0.1
4.0±0.1
a
c
c
Direction of feed
LQW2BH
1 : 0.3
Paper Tape
Dimensions (in mm)
Minimum QTY. (pcs.)
Part Number
a
b
c
φ180mm reel φ330mm reel
Bulk
1000
-
LQM21NN (0.1-2.2µH)
LQM21DN (1-10µH)
LQM21FN (1-2.2µH)
LQG18H
1.45
2.25
1.1
4000
10000
1.0
1.1
1.05
1.00
1.85
1.80
LQM18N
0.95
LQW18A
Plastic Tape
Dimensions (in mm)
Minimum QTY. (pcs.)
Part Number
a
b
c
φ180mm reel φ330mm reel
Bulk
LQM21NN (2.7-4.7µH)
LQM21DN (22-47µH)
LQM21FN (4.7-47µH)
LQM31F
1.45
2.25
1.3
4000
10000
1000
1.9
1.9
3.5
3.6
2.3
1.3
2.0
3000
LQH31M/31C/31H, LQW31H
LQW2BH
1.75
2000
7500
-
2.1
1.7
LQH32M/LQH32C
LQH32CN_51
2.9
3.6
(in mm)
Continued on the following page.
12
56
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Packaging
Continued from the preceding page.
Minimum Quantity and 8mm Width Taping Dimension
2.0±0.05
+0.1
-0
2.0±0.05
4.0±0.1
ø1.5
c
a
Direction of feed
Paper Tape
Dimensions (in mm)
Minimum QTY. (pcs.)
Part Number
a
b
c
φ180mm reel φ330mm reel
Bulk
1000
-
0.62
0.38
1.12
0.68
50000
LQG15H
LQP03T
LQP15M
LQW15A
1.0
0.8
10000
-
0.70
1.20
500
(in mm)
Minimum Quantity and 12mm Width Plastic Taping Dimension
2.0±0.1
d
4.0±0.1
+0.1
-0
8.0±0.1
φ1.5
a
c
Direction of feed
Dimensions (in mm)
Minimum QTY. (pcs.)
Part Number
a
b
c
d
φ180mm reel φ330mm reel
3.9
3.7
1.9
1000
-
LQH3ER, LQH3KS
LQH43M(N)
LQH43C
0.3
2500
3.6
4.9
2.7
500
-
1500
-
5.4
6.7
6.1
6.7
5.0
5.6
LQH55D
0.4
350
LQH66S
12
(in mm)
57
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Design Kits
oEKLM12UB (High-frequency Winding Type)
No.
1
Part Number
LQW2BHN3N3D01
LQW2BHN6N8D01
LQW2BHN8N2D01
LQW2BHN10NJ01
LQW2BHN12NJ01
LQW2BHN15NJ01
LQW2BHN18NJ01
LQW2BHN22NJ01
LQW2BHN27NJ01
LQW2BHN33NJ01
LQW2BHN39NJ01
LQW2BHN47NJ01
LQW2BHN56NJ01
LQW2BHN68NJ01
LQW2BHN82NJ01
LQW2BHNR10J01
LQW2BHNR12J01
LQW2BHNR15J01
LQW2BHNR18J01
LQW2BHNR22J01
LQW2BHNR27K01
LQW2BHNR33K01
LQW2BHNR39K01
LQW2BHNR47K01
LQW2BHN2N7D11
LQW2BHN3N1D11
LQW2BHN3N3D11
LQW2BHN5N6D11
LQW2BHN6N8D11
LQW2BHN8N6D11
LQW2BHN10NJ11
LQW2BHN12NK11
LQW2BHN15NK11
LQW2BHN18NK11
LQW2BHN21NK11
LQW2BHN27NK11
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T0.5nH
T0.5nH
T0.5nH
T5%
Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
3.3
6.8
8.2
10
910
680
2
630
3
1320
680
4
12
T5%
5
15
T5%
630
6
18
T5%
690
7
22
T5%
720
8
27
T5%
540
9
33
T5%
570
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
39
T5%
730
47
T5%
450
56
T5%
430
68
T5%
460
82
T5%
320
100
120
150
180
220
270
330
390
470
2.7
3.1
3.3
5.6
6.8
8.6
10
T5%
350
T5%
320
T5%
390
T5%
250
T5%
240
T10%
T10%
T10%
T10%
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T5%
190
180
170
160
1900
1800
1700
1500
1400
1300
1320
1100
1000
1000
950
12
T10%
T10%
T10%
T10%
T10%
15
18.8
21
27
900
58
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Design Kits
oEKLM13UB (High-frequency Monolithic Type)
No.
1
Part Number
LQG18HN1N2S00
LQG18HN1N5S00
LQG18HN1N8S00
LQG18HN2N2S00
LQG18HN2N7S00
LQG18HN3N3S00
LQG18HN3N9S00
LQG18HN4N7S00
LQG18HN5N6S00
LQG18HN6N8J00
LQG18HN8N2J00
LQG18HN10NJ00
LQG18HN12NJ00
LQG18HN15NJ00
LQG18HN18NJ00
LQG18HN22NJ00
LQG18HN27NJ00
LQG18HN33NJ00
LQG18HN39NJ00
LQG18HN47NJ00
LQG18HN56NJ00
LQG18HN68NJ00
LQG18HN82NJ00
LQG18HNR10J00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T5%
Rated Current (mA)
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
T5%
T5%
12
T5%
15
T5%
18
T5%
22
T5%
27
T5%
33
T5%
39
T5%
47
T5%
56
T5%
68
T5%
82
T5%
100
T5%
oEKLM14UC (High-frequency Flim Type)
No.
1
Part Number
LQP15MN1N0B00
LQP15MN1N1B00
LQP15MN1N2B00
LQP15MN1N3B00
LQP15MN1N5B00
LQP15MN1N6B00
LQP15MN1N8B00
LQP15MN2N0B00
LQP15MN2N2B00
LQP15MN2N4B00
LQP15MN2N7B00
LQP15MN3N0B00
LQP15MN3N3B00
LQP15MN3N6B00
LQP15MN3N9B00
LQP15MN4N3B00
LQP15MN4N7B00
LQP15MN5N1B00
LQP15MN5N6B00
LQP15MN6N2B00
LQP15MN6N8B00
LQP15MN7N5B00
LQP15MN8N2B00
LQP15MN9N1B00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
Rated Current (mA)
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
400
390
390
280
280
220
280
220
220
220
220
190
190
170
170
160
160
140
140
130
130
110
110
100
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Continued on the following page.
59
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Design Kits
Continued from the preceding page.
No.
25
26
27
28
29
30
31
Part Number
LQP15MN10NG00
LQP15MN12NG00
LQP15MN15NG00
LQP15MN18NG00
LQP15MN22NG00
LQP15MN27NG00
LQP15MN33NG00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
Rated Current (mA)
20
20
20
20
20
20
20
10
12
15
18
22
27
33
T2%
T2%
T2%
T2%
T2%
T2%
T2%
100
90
90
80
70
70
60
oEKLM15UB (High-frequency Monolithic Type)
No.
1
Part Number
LQG15HN1N2S00
LQG15HN1N5S00
LQG15HN1N8S00
LQG15HN2N2S00
LQG15HN2N7S00
LQG15HN3N3S00
LQG15HN3N9S00
LQG15HN4N7S00
LQG15HN5N6S00
LQG15HN6N8J00
LQG15HN8N2J00
LQG15HN10NJ00
LQG15HN12NJ00
LQG15HN15NJ00
LQG15HN18NJ00
LQG15HN22NJ00
LQG15HN27NJ00
LQG15HN33NJ00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T5%
Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
T5%
T5%
12
T5%
15
T5%
18
T5%
22
T5%
27
T5%
33
T5%
oEKLM16UB (High-frequency Winding Type)
No.
1
Part Number
LQW18AN3N6C00
LQW18AN3N9C00
LQW18AN4N3C00
LQW18AN5N6C00
LQW18AN6N2C00
LQW18AN6N8C00
LQW18AN10NG00
LQW18AN11NG00
LQW18AN12NG00
LQW18AN13NG00
LQW18AN15NG00
LQW18AN16NG00
LQW18AN18NG00
LQW18AN20NG00
LQW18AN22NG00
LQW18AN24NG00
LQW18AN27NG00
LQW18AN30NG00
LQW18AN33NG00
LQW18AN36NG00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T0.2nH
T0.2nH
T0.2nH
T0.2nH
T0.2nH
T0.2nH
T2%
Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
3.6
3.9
4.3
5.6
6.2
6.8
10
11
12
13
15
16
18
20
22
24
27
30
33
36
850
850
850
750
750
750
650
650
600
600
600
550
550
550
500
500
440
420
420
400
2
3
4
5
6
7
T2%
8
T2%
9
T2%
10
11
12
13
14
15
16
17
18
19
20
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
Continued on the following page.
60
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Design Kits
Continued from the preceding page.
No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Part Number
LQW18AN39NG00
LQW18AN43NG00
LQW18AN47NG00
LQW18AN51NG00
LQW18AN56NG00
LQW18AN62NG00
LQW18AN68NG00
LQW18AN72NG00
LQW18AN75NG00
LQW18AN82NG00
LQW18AN91NG00
LQW18ANR10G00
LQW18ANR11G00
LQW18ANR12G00
LQW18ANR13G00
LQW18ANR15G00
LQW18ANR16G00
LQW18ANR18G00
LQW18ANR20G00
LQW18ANR22G00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T2%
Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
39
43
400
380
380
370
360
280
340
270
270
250
230
220
200
180
170
160
150
140
120
120
T2%
47
T2%
51
T2%
56
T2%
62
T2%
68
T2%
72
T2%
75
T2%
82
T2%
91
T2%
100
110
120
130
150
160
180
200
220
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
oEKLM17UB (High-frequency Winding Type)
No.
1
Part Number
LQW18AN2N2D00
LQW18AN3N6D00
LQW18AN3N9D00
LQW18AN4N3D00
LQW18AN4N7D00
LQW18AN5N6D00
LQW18AN6N2D00
LQW18AN6N8D00
LQW18AN7N5D00
LQW18AN8N2D00
LQW18AN8N7D00
LQW18AN9N1D00
LQW18AN9N5D00
LQW18AN10NJ00
LQW18AN11NJ00
LQW18AN12NJ00
LQW18AN13NJ00
LQW18AN15NJ00
LQW18AN16NJ00
LQW18AN18NJ00
LQW18AN20NJ00
LQW18AN22NJ00
LQW18AN24NJ00
LQW18AN27NJ00
LQW18AN30NJ00
LQW18AN33NJ00
LQW18AN36NJ00
LQW18AN39NJ00
LQW18AN43NJ00
LQW18AN47NJ00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T5%
Rated Current (mA)
2.2
3.6
3.9
4.3
4.7
5.6
6.2
6.8
7.5
8.2
8.7
9.1
9.5
10
700
850
850
850
850
750
750
750
750
650
650
650
650
650
650
600
600
600
550
550
550
500
500
440
420
420
400
400
380
380
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
11
T5%
12
T5%
13
T5%
15
T5%
16
T5%
18
T5%
20
T5%
22
T5%
24
T5%
27
T5%
30
T5%
33
T5%
36
T5%
39
T5%
43
T5%
47
T5%
Continued on the following page.
61
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Design Kits
Continued from the preceding page.
No.
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
Part Number
LQW18AN51NJ00
LQW18AN56NJ00
LQW18AN62NJ00
LQW18AN68NJ00
LQW18AN72NJ00
LQW18AN75NJ00
LQW18AN82NJ00
LQW18AN91NJ00
LQW18ANR10J00
LQW18ANR11J00
LQW18ANR12J00
LQW18ANR13J00
LQW18ANR15J00
LQW18ANR16J00
LQW18ANR18J00
LQW18ANR20J00
LQW18ANR22J00
Quantiy (pcs.)
Inductance (nH)
Inductance Tolerance
Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
51
56
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
370
360
280
340
270
270
250
230
220
200
180
170
160
150
140
120
120
62
68
72
75
82
91
100
110
120
130
150
160
180
200
220
oEKLM21UB (for General Use/ for Choke Monolithic Type)
No.
1
Part Number
LQM21NNR10K10
LQM21NNR12K10
LQM21NNR15K10
LQM21NNR18K10
LQM21NNR22K10
LQM21NNR27K10
LQM21NNR33K10
LQM21NNR39K10
LQM21NNR47K10
LQM21NNR56K10
LQM21NNR68K10
LQM21NNR82K10
LQM21NN1R0K10
LQM21NN1R2K10
LQM21NN1R5K10
LQM21NN1R8K10
LQM21NN2R2K10
LQM21NN2R7K10
LQM21NN3R3K10
LQM21NN3R9K10
LQM21NN4R7K10
LQM21DN1R0N00
LQM21DN2R2N00
LQM21DN4R7N00
LQM21DN100N00
LQM21DN220N00
LQM21DN470N00
LQM21FN1R0N00
LQM21FN2R2N00
LQM21FN4R7N00
LQM21FN100N00
LQM21FN220N00
LQM21FN470N00
Quantiy (pcs.)
Inductance (nH)
0.1
Inductance Tolerance (% )
Rated Current (mA)
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T30
T30
T30
T30
T30
T30
T30
T30
T30
T30
T30
T30
250
250
250
250
250
250
250
200
200
150
150
150
50
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
50
1.2
50
1.5
50
1.8
30
2.2
30
2.7
30
3.3
30
3.9
30
4.7
60
1.0
40
2.2
30
4.7
15
10
13
22
7
47
220
150
80
1.0
2.2
4.7
60
10
13
22
7
47
62
This is the PDF file of catalog No.O05E-6
O05E6.pdf 01.5.9
Information
1. Land Area and Q-F Characteristics
PCB : Ag-Pb printed land formed on 0.6mm-thick alumina plate
Solder : H60A
Soldering : Reflow soldering
Solder layer : Sections shown by oblique lines in figure
LQH32MN680K21
100
A : Characteristic of coil itself
80
60
40
B :
C :
Characteristic of chip mounted on land
A
1
1
1.3
5.5
Characteristic of chip mounted on land
B
Q
2.5 2.5
1
(in mm)
C
20
0
10k
50k
100k
500k
Frequency (Hz)
1M
5M
2. Coupling coefficient versus Coil-to-coil Spacing
LQH32M Series
14
Coil-to-coil Spacing
12
10
8
6
4
330µH
1µH
2
0
0
1
2
3
4
5
6
Coil-to-coil Spacing (mm)
63
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