LQH3NPH220MME# [MURATA]
;
| 型号： | LQH3NPH220MME# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总8页 (文件大小：427K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec No. JELF243A-9148D-01
P1/9
CHIP COIL（CHIP INDUCTORS）LQH3NPH□□□□MEL SPECIFICATION
Murata Standard Reference Specification【AEC-Q200】
1.Scope
This reference specification applies to Chip coil (Chip Inductors) LQH3NPH_ME series for Automotive Electronics based on
AEC-Q200.
2.Part Numbering
LQ
Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Others Packaging
(L×W) and Characteristics (T) L: Φ180Taping
H
3N
P
H
1R0
M
M
E
L
3.Rating
・Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included) -40 to +105°C
(Product temperature; Self- temperature rise is included)
-40 to +125°C
・Storage Temperature Range.
-40 to +125°C
Inductance
Rated Current(mA)
*2 Based on
Temperature rise
Self
DC
Resistance
(Ω)
*1
Customer
Murata
Resonant
ESD
Tolerance
(%)
(Based on
inductance
change)
Part Number
Part Number
(µH)
Frequency
(MHz min)
*3
*4
2: 2kV
Ambient
temperature
Ambient
temperature
(85°C)
(105°C)
0.025±20%
0.065±20%
0.084±20%
0.10±20%
0.14±20%
0.19±20%
0.29±20%
0.40±20%
0.55±20%
0.82±20%
1.0±20%
100
60
55
40
30
20
15
10
8
2350
1800
1520
1300
1040
810
LQH3NPH1R0MMEL
LQH3NPH2R2MMEL
LQH3NPH3R3MMEL
LQH3NPH4R7MMEL
LQH3NPH6R8MMEL
LQH3NPH100MMEL
LQH3NPH150MMEL
LQH3NPH220MMEL
LQH3NPH330MMEL
LQH3NPH470MMEL
LQH3NPH560MMEL
LQH3NPH680MMEL
LQH3NPH101MMEL
1.0
2.2
3.3
4.7
6.8
10
3000
1600
2100
1900
1700
1450
1280
1020
860
1220
1150
1000
900
800
620
540
460
380
320
300
270
660
15
M:±20%
2
570
22
440
33
760
5
380
47
610
5
350
56
500
1.15±20%
1.59±20%
5
310
68
470
3
260
100
430
*1:When applied Rated current to the Products , Inductance will be within ±30% of initial inductance value range.
*2:Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.
*3:When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 40°C max.
(Ambient temperature 85°C).
*4:When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 20°C max.
(Ambient temperature 85 to 105°C).
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature (15 to 35°C)
Temperature : 20 ± 2°C
Humidity
: Ordinary Humidity
(25 to 85 %(RH)
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
P2/9
5.Appearance and Dimensions
3.0±0.2
0 1 R
■Unit Mass (Typical value)
0.051g
0.8±0.3
0.8±0.3
6.Product Marking
Inductance
(Three digists : 0.47μH → R47)
1.0μH
10μH
→
→
1R0)
100)
7.Electrical Performance
No.
Item
Specification
Test Method
7.1 Inductance
Inductance shall meet item 3.
Measuring Equipment : KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
7.2 DC Resistance
7.3 Self Resonant
Frequency(S.R.F)
DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent
8. AEC-Q200 Requirement
8.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Test Method
1000hours at 125 deg C
Murata Specification / Deviation
Meet Table A after testing.
No
Stress
3
High
Temperature
Exposure
Set for 24hours at room temperature, then
measured.
Table A
Appearance
No damage
Within ±10%
Within ±10%
Inductance(at 1MHz)
DC Resistance
Change
4
Temperature Cycling 1000cycles
-40 deg C to + 125deg C
Meet Table A after testing.
Set for 24hours at room temperature,then
measured.
7
8
Biased Humidity
Operational Life
1000hours at 85 deg C, 85%RH
unpowered.
Meet Table A after testing.
Meet Table A after testing.
Apply Rated Current 85 deg C 1000 hours
Set for 24hours at room temperature, then
measured
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
AEC-Q200
P3/9
Murata Specification / Deviation
No abnormalities
No
Stress
Test Method
9
External Visual
Visual inspection
10 Physical Dimension
Meet ITEM 5
No defects
（Style and Dimensions）
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock
Per MIL-STD-202
Method 213
Condition C
100g’s/6ms/Half sine
5g's for 20 minutes,
12cycles eah of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
Meet Table A after testing.
14 Vibration
15 Resistance
to Soldering Heat
No-heating
Pre-heating: 150 to 180C /90±30s
Meet Table B after testing.
Table B
Solder temperature
260C+/-5 deg C
Immersion time 10s
Appearance
No damage
Within ±20%
Within ±10%
Inductance(at 1MHz)
DC Resistance
Change
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD Rank: Refer to Item 3. Rating
No defects
18 Solderbility
Method b : Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Characterization
20 Flammability
Measured : Inductance
Per UL-94
No defects
Not Applicable
21 Board Flex
Epoxy-PCB(1.6mm)
Holding time: 5s
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
No defect
A force of 17.7N for 60s
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured
at the bottom side.
(in mm)
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
P4/9
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
9.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm/min
0.2 to 0.7N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2), Quantity etc ･･･
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ･･･
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
P5/9
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer
Case (Reel)
Label
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
10.
Caution
10.1 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
10.2 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
10.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (trains, ships, etc.)
(4) Power plant control equipment (9) Applications of similar complexity and /or reliability
(5) Medical equipment requirements to the applications listed in the above.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide,
sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with
the previously stated corrosive gas environment will result in deterioration of product quality or an open from
deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these
environments.
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
2.7mm
1.4 mm
3.0 mm
(in mm)
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
P6/9
11.2 Flux, Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Flux
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 100μm to 150μm
Solder
Other flux (except above) Please contact us for details, then use.
11.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max
90s±30s
Time(s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
Limit Profile
Pre-heating
Heating
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3 (+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
P7/9
11.5 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Electrode
Products shall be located in the sideways
direction (Length:a
stress.
b) to the mechanical
(Good example)
Poor example）
Electrode
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
A
A
A
>
>
>
D *1
B
(3) Keep the mounting position of the component away from the board separation surface.
C
C
B
*1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Seam
A
Electrode
D
Slit
Electrode
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
11.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD
Spec No. JELF243A-9148D-01
P8/9
11.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating
resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
11.8 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
11.9 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12．
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
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