LQH3NPN680MGRL [MURATA]
FIXED IND 68UH 280MA 2.52 OHM;
| 型号： | LQH3NPN680MGRL |
| 厂家： | 
muRata |
| 描述： | FIXED IND 68UH 280MA 2.52 OHM 测试 射频感应器 电感器 |
| 文件： | 总8页 (文件大小：280K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SpecNo.JELF243A-0121E-01
P.1/8
Reference Only
CHIP COIL（CHIP INDUCTORS）LQH3NPN□□□□GRL REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQH3NPN_GR series, Chip coil (Chip Inductors).
2. Part Numbering
(ex) LQ
Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging
H
3N
(L×W)
P
N
220
M
G
R
L
and
(T)
L:Φ180Taping
Characteristics
3. Rating
・Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
-40 to + 105°C
(except LQH3NPN680/101/151/181/221/251MGR)
-40 to + 125°C
(except LQH3NPN680/101/151/181/221/251MGR)
-40 to + 85°C
(only LQH3NPN680/101/151/181/221/251MGR)
-40 to + 105°C
(only LQH3NPN680/101/151/181/221/251MGR)
・Storage Temperature Range.
-40 to +105°C (except LQH3NPN680/101/151/181/221/251MGR)
-40 to +85°C (only LQH3NPN680/101/151/181/221/251MGR)
Inductance
Rated Current(mA)
∗2 Based on
Self
DC
Resistance
(Ω)
Temperature rise
∗1
Customer
Part Number
Murata
Part Number
Resonant
Frequency
(MHz min)
Tolerance
Based on
∗4
∗3 Ambient
Ambient
(µH)
(%)
inductance
change
temperature
(85℃)
temperature
(105℃)
LQH3NPNR47NGRL 0.47
N:±30
0.047±20%
0.062±20%
0.074±20%
0.087±20%
0.12±20%
0.14±20%
0.23±20%
0.28±20%
0.39±20%
0.53±20%
0.86±20%
1.4±20%
180
100
80
50
30
27
25
20
15
10
8
2820
1700
1400
1180
1050
850
720
570
480
390
320
260
220
190
160
130
120
110
2540
2080
2040
1730
1580
1520
1140
1120
900
1520
LQH3NPN1R0MGRL
LQH3NPN1R5MGRL
LQH3NPN2R2MGRL
LQH3NPN3R3MGRL
LQH3NPN4R7MGRL
LQH3NPN6R8MGRL
LQH3NPN100MGRL
LQH3NPN150MGRL
LQH3NPN220MGRL
LQH3NPN330MGRL
LQH3NPN470MGRL
LQH3NPN680MGRL
LQH3NPN101MGRL
LQH3NPN151MGRL
LQH3NPN181MGRL
LQH3NPN221MGRL
LQH3NPN251MGRL
1.0
1.5
2.2
3.3
4.7
6.8
10
1240
1220
1030
940
910
680
670
540
450
360
270
-
15
22
M:±20
750
33
600
47
5
460
68
2.1±20%
6
280
100
150
180
220
250
3.2±20%
5
220
-
4.9±20%
3
180
-
6.4±20%
2
160
-
7.5±20%
2
150
-
8.0±20%
2
140
-
∗1: When applied Rated current to the Products , Inductance will be within ±30% of initial inductance value range.
∗2: Keep the temperature (ambient temperature plus self-generation of heat) under 125℃.
(except LQH3NPN680/101/151/181/221/251MGR)
Keep the temperature(ambient temperature plus self-generation of heat) under 105℃.
(only LQH3NPN680/101/151/181/221/251MGR)
∗3: When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 40℃ max.
(except LQH3NPN680/101/151/181/221/251MGR)
When applied rated current to the Products, temperature rise caused by self-generated heat shall be limited to 20℃ max.
(only LQH3NPN680/101/151/181/221/251MGR)
∗4: When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to 20℃max.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
P.2/8
Reference Only
4. Testing Conditions
<Unless otherwise specified>
Temperature : Ordinary Temperature (15 to 35°C)
Humidity : Ordinary Humidity (25 to 85 %(RH))
<In case of doubt>
Temperature
: 20 ± 2°C
Humidity
Atmospheric Pressure
: 60 to 70 %(RH)
: 86 to 106 kPa
5. Appearance and Dimensions
3.0±0.1
0 1 R
■Unit Mass (Typical value)
0.034g
(in mm)
0.9±0.2
0.9±0.2
6. Product Marking
Inductance
Three digists : 0.47μH
→
→
→
R47
1R0
100
1.0μH
10μH
7. Electrical Performance
No. Item
Specification
Inductance shall meet item 3.
Test Method
7.1 Inductance
Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
7.2 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment: Digital multi meter
7.3 Self Resonant
Frequency(S.R.F)
Measuring Equipment: KEYSIGHT E4991A or equivalent
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
P.3/8
Reference Only
8. Mechanical Performance
No.
Item
Specification
Chip coil shall not be damaged.
Test Method
Substrate: Glass-epoxy substrate
8.1 Shear Test
Force: 10N
Hold Duration: 5±1s
Chip coil
Ｆ
Substrate
8.2 Bending Test
Substrate: Glass-epoxy substrate (100×40×1.0mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5seconds.
Pressure jig
R230
F
Deflection
Product
45
45
(in mm)
8.3 Vibration
Chip coil shall not be damaged.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes
Total amplitude : 1.5 mm or Acceleration amplitude
98m/s2 whichever is smaller.
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.(Total 6 hours)
8.4 Solderability
The wetting area of the electrode Flux:Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s)
shall be at least 90% covered
with new solder coating.
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90seconds
Solder Temperature:240±5°C
Immersion Time:3±1 s
8.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±20% Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Flux: Ethanol solution of rosin,25(wt)% (Immersed for 5s to 10s)
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
9. Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
9.1 Heat Resistance
Appearance:No damage
Temperature: Maximum Operating temperature
Inductance Change : within ±10%
(Self-temperature rise is not included) ±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
9.2 Cold Resistance
Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
No. Item
P.4/8
Reference Only
Specification
Test Method
9.3 Humidity
Appearance:No damage
Inductance Change : within ±10%
Temperature: 85±2°C
Humidity: 80~85%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
9.4 Temperature
Cycle
1 cycle:
1 step: - Minimun Operating temperature
(Self-temperature rise is not included)±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: Maximum Operating temperature
(Self-temperature rise is not included)±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 100 cycles
Then measured after exposure in the room condition for
24±2 hours.
10. Specification of Packaging
10.1 Appearance and Dimensions of plastic tape
(in mm)
Dimension of the Cavity is measured at the bottom side.
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
10.3 Pull Strength
Embossed carrier tape
10N min.
5N min.
Cover tape
10.4 Peeling off force of cover tape
165 to 180 degree
F
Speed of Peeling off
300mm/min
Cover tape
Plastic tape
0.2 to 0.7N
(minimum value is typical)
Peeling off force
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
P.5/8
Reference Only
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
Trailer
2.0±0.5
:
160 min.
Leader
190 min
Empty tape
210 min
Label
Cover tape
φ
13.0±0.2
1
0
φ
60±
1
φ
21.0±0.8
Direction of feed
9±
0
13±1.4
0
180
±
3
(in mm)
φ
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,
Quantity, etc ･･･
10.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
Label
W
D
H
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
D
W
11.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
P.6/8
Reference Only
12. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability
may be affected, or result to "position shift" in soldering process.
12.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 100μm to 150μm
Solder
Other flux (except above) Please contact us for details, then use.
12.3 soldering conditions (Reflow)
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C
max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C
max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
Heating
above 220°C、30s～60s
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
245±3°C
2 times
2 time
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
P.7/8
Reference Only
12.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
products due to the thermal shock.
12.5 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Electrode
Products shall be located in the sideways
direction to the mechanical stress.
(Good example)
（Poor example）
Electrode
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D ∗1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
C
Seam
A
B
Electrode
D
Slit
Electrode
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
SpecNo.JELF243A-0121E-01
P.8/8
Reference Only
12.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
・
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
12.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
12.8 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.9 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.10 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas
or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of
winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your
product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD
相关型号：
LQH3NPN680NG0L
General Purpose Inductor, 68uH, 30%, 1 Element, Ferrite-Core, SMD, 1212, CHIP, 0805
MURATA
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