LQH3NPZ3R3MGRL [MURATA]
General Purpose Inductor,;
| 型号： | LQH3NPZ3R3MGRL |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 测试 射频感应器 电感器 |
| 文件： | 总8页 (文件大小：251K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec No.JELF243A-9130B-01
Reference Only
CHIP COIL（CHIP INDUCTORS）LQH3NPZ□□□□GRL SPECIFICATION
P1/8
Murata Standard Reference Specification【AEC-Q200】
1. Scope
This reference specification applies to Chip coil (Chip Inductors) LQH3NPZ_GR series for Automotive Electronics based on
AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex)
LQ
H
3N
P
Z
220
M
G
R
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L: Φ180Taping
Characteristics
3. Rating
Operating Temperature Range.
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
-40 to +105°C
-40 to +125°C
Storage Temperature Range.
-40 to +105°C
Inductance
Rated Current(mA)
Self
∗2 (Based on
DC
Resistance
(Ω)
∗1
Customer
Part Number
MURATA
Part Number
Resonant
Frequency
(MHz min)
ESD
5A:8kV
Temperature rise)
Tolerance
(Based on
(μH)
∗3 Ambient ∗4 Ambient
temperature temperature
(%)
Inductance
change)
(85℃)
(105℃)
LQH3NPZR47NGRL
LQH3NPZ1R0MGRL
LQH3NPZ1R5MGRL
LQH3NPZ2R2MGRL
LQH3NPZ3R3MGRL
LQH3NPZ4R7MGRL
LQH3NPZ6R8MGRL
LQH3NPZ100MGRL
LQH3NPZ150MGRL
LQH3NPZ220MGRL
LQH3NPZ330MGRL
LQH3NPZ470MGRL
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
N:±30% 0.047±20%
0.062±20%
180
100
80
50
30
27
25
20
15
10
8
2820
1700
1400
1180
1050
850
2540
1520
2080
2040
1730
1580
1520
1140
1120
900
1240
1220
1030
940
910
680
670
540
450
360
270
0.074±20%
0.087±20%
0.12±20%
0.14±20%
5A
M:±20%
0.23±20%
0.28±20%
0.39±20%
0.53±20%
0.86±20%
1.4±20%
720
570
15
480
22
390
750
33
320
600
47
5
260
460
∗1:When applied Rated current to the Products , Inductance will be within ±30% of initial inductance value range.
∗2:Keep the temperature (ambient temperature plus self-generation of heat) under 125℃.
∗3:When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited
to 40℃ max. (Ambient temperature 85℃).
∗4:When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited
to 20℃max. (Ambient temperature 85 to 105℃).
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
Humidity : Ordinary Humidity (25 to 85 %(RH))
《In case of doubt》
Temperature : 20 ± 2°C
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
Reference Only
P2/8
5. Appearance and Dimensions
3.0±0.1
0 1 R
■Unit Mass (Typical value)
0.034g
(in mm)
0.9±0.2
0.9±0.2
6. Product Marking
Inductance
Three digists : 0.47μH → R47
1.0μH → 1R0
10μH → 100
7. Electrical Performance
No. Item
Specification
Test Method
6.1 Inductance
Inductance shall meet item 3.
Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC Resistance
DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent
6.3 Self Resonant
Frequency(S.R.F)
8. AEC-Q200 Requirement
8.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Appearance
No damage
Within ±10%
Within ±10%
Inductance(at 1MHz)
DC Resistance Change
4
Temperature
Cycling
1000cycles
Meet Table A after testing.
-40 deg C to + 105deg C
Set for 24hours at room
temperature,then measured.
7
8
Biased Humidity
Operational Life
1000hours at 85 deg C, 85%RH Meet Table A after testing.
unpowered.
Apply Rated Current 85 deg C
1000 hours
Meet Table A after testing.
Set for 24hours at room
temperature, then measured
9
External Visual
Visual inspection
No abnormalities
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
AEC-Q200
Reference Only
P3/8
Murata Specification / Deviation
No
10 Physical Dimension Meet ITEM 5
(Style and Dimensions)
Stress
Test Method
No defects
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock Per MIL-STD-202
Method 213
Meet Table A after testing.
Meet Table A after testing.
Condition C
100g’s/6ms/Half sine
14 Vibration
5g's for 20 minutes,
12cycles eah of 3 orientations
Test from 10-2000Hz.
15 Resistance
No-heating
Pre-heating: 150 to 180C /90±30s
Meet Table B after testing.
Table B
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
Appearance
No damage
Within ±20%
Within ±10%
Inductance(at 1MHz)
DC Resistance Change
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD Rank: Refer to Item 3. Rating
No defects
18 Solderbility
Method b : Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Measured : Inductance
Per UL-94
No defects
Characterization
20 Flammability
21 Board Flex
Not Applicable
Epoxy-PCB(1.6mm)
Holding time: 5s
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal Strength Per AEC-Q200-006
A force of 17.7N for 60s
No defect
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured
at the bottom side.
(in mm)
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
Reference Only
P4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
9.4 Peeling off force of cover tape
165 to 180 degree
F
Speed of Peeling off
300mm/min
0.2 to 0.7N
Cover tape
Plastic tape
Peeling off force
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer
2.0±0.5
:
160 min.
Leader
190 min
Empty tape
210 min
Label
Cover tape
φ
13.0±0.2
1
φ
60±
1
0
φ
21.0±0.8
Direction of feed
9±
0
13±1.4
0
180±
3
(in mm)
φ
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking » ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
Label
W
D
H
H
186
186
93
5
∗Above Outer Case size is typical. It depends on a quantity of an order
D
W
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
Reference Only
P5/8
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (trains, ships, etc.)
(4) Power plant control equipment (9) Applications of similar complexity and /or reliability
(5) Medical equipment requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
2.7mm
1.4 mm
(in mm)
3.0 mm
11.2 Flux, Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion
Flux
value).
・ Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
Solder
・Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
Reference Only
P6/8
11.3 Reflow soldering conditions
･ Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
above 220°C、30s～60s above 230°C、60s max.
Heating
Peak temperature
Cycle of reflow
245±3°C
2 times
260°C,10s
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Product's location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length:a
stress.
<b) to the mechanical
b
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
Reference Only
P7/8
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D *1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
*1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
11.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
･ Isopropyl alcohol (IPA)
2. Aqueous agent
･ PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.8 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
11.9 Caution for use
･ Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
･ Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
MURATA MFG.CO., LTD
Spec No.JELF243A-9130B-01
Reference Only
P8/8
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
･ Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
･ Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
･ Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
･ Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
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