LQH5BPB3R3NT0L_技术文档

SpecNo.JELF243A-0108D-01

P1/8

Reference Only

CHIP COIL(CHIP INDUCTORS) LQH5BPB□□□□T0□ REFERENCE SPECIFICATION

1.Scope

This reference specification applies to LQH5BPB_T0 Series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Packaging

H

5B

(L×W)

P

B

R47

N

T0

L

and

(T)

L:Taping(φ180mm/reel)

K:Taping (φ330mm/reel)

Characteristics

3.Rating

・Operating Temperature Range.

(Ambient temperature; Self-temperature rise is not included)

(Product temperature; Self- temperature rise is included)

・Storage Temperature Range.

-40 to +105°C

-40 to +125°C

∗3 Rated Current (A)

Self

Resonant

Frequency

(MHz min)

∗2 Based on

DC

Resistance

∗1

Tolerance

(%)

Customer

Part Number

MURATA

Part Number

Inductance

(µH)

Temperature rise

Based on

Inductance

change

Ambient

()

temperature temperature

85℃

105℃

LQH5BPBR47NT0L

LQH5BPBR47NT0K

LQH5BPB1R0NT0L

LQH5BPB1R0NT0K

LQH5BPB1R2NT0L

LQH5BPB1R2NT0K

LQH5BPB1R5NT0L

LQH5BPB1R5NT0K

LQH5BPB2R2NT0L

LQH5BPB2R2NT0K

LQH5BPB2R7NT0L

LQH5BPB2R7NT0K

LQH5BPB3R3NT0L

LQH5BPB3R3NT0K

LQH5BPB4R7NT0L

LQH5BPB4R7NT0K

LQH5BPB6R8NT0L

LQH5BPB6R8NT0K

LQH5BPB100MT0L

LQH5BPB100MT0K

LQH5BPB150MT0L

LQH5BPB150MT0K

LQH5BPB220MT0L

LQH5BPB220MT0K

0.47

1.0

1.2

1.5

2.2

2.7

3.3

4.7

6.8

10

0.012±20%

0.019±20%

0.024±20%

0.030±20%

0.035±20%

0.044±20%

0.058±20%

0.083±20%

0.106±20%

0.187±20%

0.259±20%

220

90

70

55

50

40

30

25

18

15

7.7

5.8

5.4

5.0

4.0

3.8

3.5

3.0

2.5

2.0

1.6

1.4

4.0

2.05

3.1

1.68

1.63

1.37

1.23

1.21

1.09

0.96

0.87

0.62

0.55

3.0

N:±30

2.6

2.5

2.3

2.0

1.65

1.60

1.20

1.05

15

M:±20

22

∗1: When applied Rated current to the Products, Inductance will be within ±30% of nominal Inductance value.

∗2: When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited

to 40℃ max.

∗3: Keep the temperature（ambient temperature plus self-generation of heat) under 125℃.

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

P2/8

Reference Only

4. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 % (RH))

《In case of doubt》

Temperature

Humidity

: 20 ± 2°C

: 60 to 70 % (RH)

Atmospheric Pressure : 86 to 106 kPa

5. Appearance and Dimensions

5.0±0.2

2.0±0.2

5.0±0.2

（0.2）

5.0±0.2

※No Marking.

■Unit Mass (Typical value)

0.22ｇ

(in mm)

1.5±0.2

6.Electrical Performance

No. Item

Specification

Inductance shall meet item 3.

Test Method

6.1 Inductance

Measuring Equipment : KEYSIGHT 4284A or equivalent

Measuring Frequency: 100kHz

6.2 DC Resistance

DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter

6.3 Self Resonant

Frequency(S.R.F)

S.R.F shall meet item 3.

Measuring Equipment: KEYSIGHT E4991A or equivalent

7.Mechanical Performance

No.

Item

Specification

Test Method

7.1 Shear Test

Chip coil shall not be damaged.

Substrate: Glass-epoxy substrate

Applied Direction :

Chip coil

Ｆ

Substrate

Force: 10N

Hold Duration: 5±1s

7.2 Bending Test

Substrate:Glass-epoxy substrate

(100×40×1.6mm)

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 5seconds.

Pressure jig

R230

F

Deflection

45

Product

(in mm)

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

No. Item

P3/8

Reference Only

Specification

Test Method

7.3 Vibration

Chip coil shall not be damaged.

Oscillation Frequency: 10~2000~10Hz for 20minutes

Total Amplitude: 1.5mm or acceleration amplitude

98mm/s2 (The lesser of two values)

Testing Time: A period of 2 hours in each of 3 mutually

perpendicular directions.

(Total 6 hours)

7.4 Solderability

The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature: 240±5°C

Immersion Time: 3±1 s

7.5 Resistance

to Soldering Heat

Appearance:No damage

Inductance Change: within ±10%

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature: 270±5°C

Immersion Time: 10±1 s

Then measured after exposure in the room condition

for 24±2 hours.

8.Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

Temperature: 105±2°C

Time: 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance:No damage

Inductance Change: within ± 10%

DC Resistance Change:

within ± 10%

Temperature: -40±2°C

Time: 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

Temperature: 85±2°C

Humidity: 80～85%(RH)

Time: 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.4 Temperature Cycle

1 cycle:

1 step: -40±2°C / 30±3 minutes

2 step: Ordinary temp. / 10 to15 minutes

3 step: +105±2°C / 30±3 min

4 step: Ordinary temp. / 10 to 15 minutes

Total of 100 cycles

Then measured after exposure in the room condition

for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

+0.1

-0

φ1.5

2.0±0.05 4.0±0.1

(0.3)

Dimension of the Cavity is measured

at the bottom side.

8.0±0.1

2.4±0.1

*Lead-in/out wire

Direction of feed

(in mm)

5.3±0.1

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

P4/8

Reference Only

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

φ180 mm reel : 500 pcs. / reel

φ330 mm reel : 3000 pcs. / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

9.4 Peeling off force of cover tape

165 to 180 degree

F

Cover tape

Plastic tape

Speed of Peeling off

300mm/min

0.2 to 0.7N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

« Packaging Code : L (φ180mm reel) »

Trailer : 160 min.

2.0±0.5

Leader

190 min

Empty tape Cover tape

Label

210 min

φ

13.0±0.2

φ

60±¹₀

13.0±¹₀

17.0±1.4

φ

21.0±0.8

Direction of feed

(in mm)

φ

180± ⁰₃

« Packaging Code : K (φ330mm reel) »

Trailer

160min.

Leader

2.0±0.5

210min.

190min.

Empty Tape

Label

Cover tape

φ50min.

φ

13.0±0.2

13.5±1.0

21.0±0.8

Direction of feed

17.5±1.0

(in mm)

φ330±2.0

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

P5/8

Reference Only

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,

Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Reel

Label

W

D

H

φ180mm

φ330mm

186

340

186

340

93

95

4

D

W

∗Above Outer Case size is typical. It depends on a quantity of an order.

10.

Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing (Reflow Soldering)

Recommended land patterns for reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Land

Chip Colil

5.5

Solder Resist

4.1

(in mm)

1.8

1.85

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

P6/8

Reference Only

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 100μm to 150μm

Solder

11.3 Soldering conditions (Reflow)

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2 times

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

380°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Excessively

Recommendable

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

P7/8

Reference Only

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Electrode

Products shall be located in the sideways

direction to the mechanical stress.

(Good example)

（Poor example）

Electrode

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

A

>

D ∗1

B

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

C

Seam

B

∗1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Electrode

D

A

Slit

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open

circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under

some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful

attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,

please make sure no reliability issue is observed by evaluating products mounted on your board.

MURATA MFG.CO., LTD

SpecNo.JELF243A-0108D-01

P8/8

Reference Only

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw

to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as

sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the

breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD


型号：	LQH5BPB3R3NT0L
厂家：	muRata
描述：	General Purpose Inductor, 测试射频感应器电感器
文件：	总8页 (文件大小：260K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQH5BPB3R3NT0L [MURATA]

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