LQM18NN1R0K00# [MURATA]
;
| 型号： | LQM18NN1R0K00# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总9页 (文件大小：152K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec No. JELF243B-0003S-01
P.1/10
CHIP COIL (CHIP INDUCTORS) LQM18NN□□□□00D REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQM18NN series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
M
18
N
N
47N
M
0
0
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
Characteristics
D: Taping
*B: BULK
*Bulk packing (B) also available
3. Rating
・Operating Temperature Range
– 40°C to + 85°C
・Storage Temperature Range
– 55°C to +125°C
Self
DC
Customer
Part Number
MURATA
Part Number
Rated
Current
Inductance
Q
Resonant
Resistance
Frequency
(nH)
47
Tolerance
±20%
(min.)
(Ω max.)
0.30
0.30
0.30
0.50
0.50
0.60
0.60
0.80
0.80
0.85
1.00
1.35
1.55
1.70
2.10
0.60
0.80
0.80
0.95
1.15
(MHz min.)
260
250
245
240
205
180
165
150
136
125
110
105
95
(mA)
LQM18NN47NM00D
LQM18NN68NM00D
LQM18NN82NM00D
LQM18NNR10K00D
LQM18NNR12K00D
LQM18NNR15K00D
LQM18NNR18K00D
LQM18NNR22K00D
LQM18NNR27K00D
LQM18NNR33K00D
LQM18NNR39K00D
LQM18NNR47K00D
LQM18NNR56K00D
LQM18NNR68K00D
LQM18NNR82K00D
LQM18NN1R0K00D
LQM18NN1R2K00D
LQM18NN1R5K00D
LQM18NN1R8K00D
LQM18NN2R2K00D
10
68
82
100
50
120
150
180
220
270
15
330
390
±10%
470
35
560
680
90
820
85
1.0µH
1.2µH
1.5µH
1.8µH
2.2µH
75
65
25
15
35
60
55
50
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity : 60%(RH) to 70%(RH)
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)
Atmospheric Pressure : 86kPa to 106kPa
5. Appearance and Dimensions
0.35±0.15
Ferrite
Electrode
■Unit Mass (Typical value)
0.005g
0.8±0.15
1.6±0.15
(in mm)
0.8±0.15
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
P.2/10
6. Electrical Performance
No.
Item
Specification
Test Method
6.1 Inductance
Inductance shall meet item 3.
Measuring Equipment:
KEYSIGHT 4291A or equivalent (1mA)
Measuring Frequency:
6.2
Q
Q shall meet item 3.
50MHz / 47nH to 82nH
25MHz / 100nH to 820nH
10MHz / 1.0µH to 2.2µH
6.3 DC
Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after
putting chip coil between the terminal 2
under the condition of opening between
a and b.
Every measurement the terminal 1 shall
be shorted between a and b when
changing chip coil.
6.4 Self Resonant
Frequency (S.R.F)
6.5 Rated Current
S.R.F shall meet item 3.
Measuring Equipment:
Agilent 4291A or equivalent (1mA)
The rated current is applied.
Self temperature rise shall be
limited to 25°C max.
Inductance Change: within ±10%
7. Mechanical Performance
No.
Item
Specification
Chip coil shall not be damaged after
tested as follows.
Test Method
7.1 Shear Test
Applied Direction
Chip Coil
F
Substrate
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
Substrate: Glass-epoxy substrate
7.2 Bending Test
Chip coil shall not be damaged after
tested as follows.
(100mm×40mm×1.6mm)
Pressure jig
R340
F
Deflection
Product
45
45
(in mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30 s
7.3 Vibration
Appearance: No damage
Oscillation Frequency :
Inductance Change: within ±10%
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude: 1.5mm
Testing Time:
A period of 2 h in each of 3 mutually
perpendicular directions.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
No. Item
P.3/10
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Test Method
7.4 Solderability
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance: No damage
Inductance Change: within ±10%
Q Change: within ±20%
Test Method
Temperature: 85°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.
Temperature: -40°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: +85°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 48h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
2.0±0.05
0.1
0
1.5±
φ
4.0±0.1 4.0±0.1
Direction of feed
1.1 max.
1.05±0.1
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
P.4/10
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Top tape
5N min.
Bottom tape
9.4 Peeling off force of top tape
Top tape
165 to 180 degree
Bottom tape
F
Speed of Peeling off
Peeling off force
300mm/ min
0.1 to 0.6N
(minimum value is typical)
Base tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
210 min.
Empty tape
Top tape
13.0±0.2
60+1
-
0
Direction of feed
21.0±0.8
+1
-0
9.0
13.0±1.4
180 +0
-3
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity
etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
Second digit
Third, Fourth digit : Day
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
P.5/10
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS
Marking (2), Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
(mm)
Label
in Outer Case (Reel)
W
D
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Chip Coil
Land
Solder Resist
c
Soldering
Flow
Reflow
a
b
c
2.2 to 2.6
1.8 to 2.0
0.7
0.7
a
b
(in mm)
11.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste:100μm to 150μm.
11.3 Flow soldering / Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
Soldering profile
P.6/10
(1) Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
150℃, 60s min.
Limit Profile
Pre-heating
Heating
Cycle of flow
250℃, 4s～6s
2 times
265℃±3℃, 5s
2 times
(2) Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s～60s
above 230°C, 60s max.
260°C, 10s
245°C±3°C
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1, -0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
t
1/3T≦t≦T
T： thickness of product
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
P.7/10
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
b
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes
as possible.
Recommended
Screw Hole
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
(3) Cleaner
P.8/10
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or
pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to
magnetism.
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0003S-01
P.9/10
12．! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
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