LQM18PH1R0MFR# [MURATA]
;型号: | LQM18PH1R0MFR# |
厂家: | muRata |
描述: | |
文件: | 总9页 (文件大小:458K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Spec No.: JELF243B_9126D-01
P1/9
CHIP COILS (CHIP INDUCTORS) LQM18PH□□□□FR□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to chip coils (chip inductors) LQM18PH_FR series for automotive electronics based on
AEC-Q200.
2. Part Numbering
(Ex.)
LQ
M
18
P
H
R22
M
F
R
L
Product ID Structure Dimension Application and Category Inductance Tolerance Dimension Other Packaging
(L × W)
characteristic
(T)
L: taping
*B: bulk
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +150°C
-55°C to +150°C
Rated current
(mA)
Based on temperature rise*2
Inductance
DC resistance
ESD
Rank
4: 6 kV
to < 8 kV
(Ω)
Self-resonant
frequency
(MHz min.)
Customer
Murata
Nominal
value
(μH)
Based on
inductance
change*1
Part number
Part number
Tolerance
(%)
Ambient
Ambient
Ambient
Typ.
Max.
temperature temperature temperature
85°C*3
1250
1100
950
125°C*3
850
150°C*3
10
LQM18PHR22MFRL
LQM18PHR47MFRL
LQM18PH1R0MFRL
LQM18PH1R5MFRL
LQM18PH2R2MFRL
LQM18PH3R3MFRL
LQM18PH4R7MFRL
0.22
0.47
1.0
±20
±20
±20
±20
±20
±20
±20
0.11 0.138
0.15 0.188
0.20 0.250
0.23 0.288
0.30 0.375
0.35 0.438
0.44 0.550
100
100
100
100
70
1500
1200
360
240
150
80
4
4
4
4
4
4
4
730
10
630
10
1.5
800
570
10
2.2
750
500
10
3.3
60
700
470
10
4.7
40
70
620
420
10
*1 When rated current is applied to the products, inductance will be within ±30% of initial inductance value range.
*2 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max.
*3 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P2/9
5. Appearance and Dimensions
Unit mass (typical value): 0.005 g
6. Marking
No marking.
7. Electrical Performance
No.
Item
Specification
Meet chapter 3 ratings.
Test method
7.1 Inductance
Measuring equipment: Keysight 4294A or the equivalent
(1 mA)
Measuring frequency: 1 MHz
7.2 DC resistance Meet chapter 3 ratings.
Measuring equipment: digital multimeter
Measuring circuit:
Measure with the product set to terminal 2 and the switch
pressed (open between a and b). When setting or
removing the product, press the switch to short between a
and b.
7.3 Self-resonant Meet chapter 3 ratings.
frequency
Measuring equipment: Keysight 4294A or the equivalent
8. AEC-Q200 Requirement
8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1,
2010]
AEC-Q200
Murata specification/deviation
No.
3
Stress
Test method
High
1000 h at 150°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
Table A
temperature
exposure
Appearance
No damage
Within ±50%
Inductance change (at 1 MHz)
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P3/9
AEC-Q200
Murata specification/deviation
Meet table A after testing.
No.
4
Stress
Test method
Temperature
cycling
1000 cycles
-55°C to +150°C
Set for 24 h at room condition, then
measured.
7
8
Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Meet table A after testing.
Operational life Apply 150°C 1000 h
Set for 24 h at room condition, then
Meet table A after testing.
measured.
9
External visual Visual inspection
No abnormalities
No defects
10 Physical
dimension
Meet chapter 5, "Appearance and
Dimensions".
12 Resistance to
solvents
Per MIL-STD-202
Method 215
Not applicable
13 Mechanical
shock
Per MIL-STD-202
Method 213
Meet table A after testing.
100 g's/6 ms/half sine
14 Vibration
5 g's for 20 min, 12 cycles each of 3
orientations
Meet table A after testing.
Test from 10 Hz to 2000 Hz
15 Resistance to
soldering heat
No-heating
Solder temperature
260°C±5°C
Pre-heating: 150°C to 180°C/90 s±30 s
Meet table A after testing.
Immersion time 10 s
17 ESD
Per AEC-Q200-002
Per J-STD-002
Meet chapter 3 ratings.
No defects
18 Solderbility
Method b: not applicable
95% of the terminations is to be soldered.
19 Electrical
Measured: inductance
Per UL-94
No defects
characterization
20 Flammability
21 Board flex
Not applicable
Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
60 s minimum holding time
Murata deviation request: 30 s
Meet table A after testing.
22 Terminal
strength
Per AEC-Q200-006
A force of 17.7 N for 60 s
Murata deviation request: 10 N for 10 s
No defects
9. Specification of Packaging
9.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
B
t
1.0±0.1
1.8±0.1
1.0 max.
0.30±0.05
t'
(in mm)
* The dimensions of the cavity are measured at its bottom.
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P4/9
9.2 Taping specifications
Packing quantity
4000 pcs/reel
(Standard quantity)
Packing method
Feed hole position
Joint
The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Break down force of tape
Break down force of plastic tape
Break down force of cover tape
10 N min.
5 N min.
9.4 Peeling off force of cover tape
Speed of peeling off
300 mm/min
0.1 N to 0.7 N (The lower limit is for typical value.)
Peeling off force
165 to 180 degree
F
Cover tape
Plastic tape
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P5/9
9.8 Specification of outer box
Dimensions of outer box
(mm)
Standard reel quantity
in outer box (reel)
Label
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
10.
Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Disaster/crime prevention equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Transportation equipment (trains, ships, etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
10.2 Precautions on rating
Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in short
circuit between inner electrodes, wire breakage, or melted solder, which may cause dropping of parts.
10.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
11. Precautions for Use
This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a
conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the
heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for flow and reflow soldering.
a
b
c
0.7
2.0
0.7
(in mm)
11.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P6/9
11.3 Soldering conditions (flow, reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
(1) Flow
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard profile
150°C/60 s min.
250°C/4 s to 6 s
2 times
Limit profile
Pre-heating
Heating
150°C/60 s min.
265°C±3°C/5 s
2 times
Number of flow cycles
(2) Reflow
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P7/9
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
11.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P8/9
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Power
Requirement
20 W/L max.
Time
5 min max.
Frequency
(3) Cleaner
28 kHz to 40 kHz
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
11.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor
solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be
used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make
the reliability evaluation with the product mounted in your application set.
MURATA MFG CO., LTD
Spec No.: JELF243B_9126D-01
P9/9
11.11 Handling of product
Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools
when handling the product (instead, use tweezers with resin or ceramic tips).
11.12 Magnetic saturation
A current exceeding the rated current could cause the inductance value to drop due to magnetic saturation.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before order
MURATA MFG CO., LTD
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