LQM18PN2R2MFC# [MURATA]
;
| 型号： | LQM18PN2R2MFC# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总9页 (文件大小：565K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec No.: JELF243B-0094-01
P1/9
Chip Coil (Chip Inductor) LQM18PN□□□□FC□ Reference Specification
1. Scope
This reference specification applies to chip coil (chip inductor) LQM18PN□□□□FC□ series for general electronic
equipment.
2. Part Numbering
(Ex.)
LQ
M
18
PN
1R0
M
FC
L
Product ID
Type
Dimension
(L × W)
Application and
characteristic
Inductance Tolerance
Category
Packaging
*: taping
*B: bulk
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range -55°C to +125°C
Storage temperature range -55°C to +125°C
Rated current
(mA)
Inductance
DC
resistance
Self-
resonant
frequency
(MHz
Based on
temperature
(Ω)
Customer
Murata
rise*
Nominal
value
Based on
inductance
change
Part number
Part number
Tolerance
(%)
Ambient Ambient
tempera tempera
min.)
(μH)
Typ. Max.
ture
ture
85°C
125°C
LQM18PN1R0MFCL
LQM18PN1R5MFCL
LQM18PN2R2MFCL
LQM18PN3R3MFCL
LQM18PN4R7MFCL
1.0
1.5
2.2
3.3
4.7
±20
±20
±20
±20
±20
0.39 0.49
0.50 0.63
0.58 0.73
0.83 1.04
1.05 1.31
115
100
90
850
600
360
330
230
580
540
500
420
370
450
400
360
300
270
60
50
* As shown in the diagram below, derating is applied to the rated current based on the operating temperature
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P2/9
5. Appearance and Dimensions
■ Equivalent Circuit
Unit mass (typical value): 0.005 g
6. Marking
No marking.
7. Electrical Performance
No.
Item
Specification
Test method
7.1 Inductance
Meet chapter 3 ratings.
Measuring equipment: Keysight 4294A or the
equivalent
Measuring current: 1 mA
Measuring frequency: 1 MHz
7.2 DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
Measuring circuit:
Measure with the product set to terminal 2 and the
switch pressed (open between a and b). When
setting or removing the product, press the switch to
short between a and b.
7.3 Self-resonant
frequency
Meet chapter 3 ratings.
Measuring equipment: Keysight 4294A or the
equivalent
7.4 Rated current
(Based on
When rated current is applied to the
products, inductance will be within
±30% of initial inductance value range.
Apply the rated current specified in chapter 3 at
ordinary temperature.
inductance
change)
7.5 Rated current
(Based on
Temperature rise caused by self-
generated heat shall be limited to 40°C ordinary temperature.
Apply the rated current specified in chapter 3 at
temperature rise) max.
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P3/9
8. Mechanical Performance
The product is soldered on a substrate for test.(Except Drop, Resistance to soldering heat, Solderability)
(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
8.1 Shear test
No significant mechanical damage or
Applying force: 10 N
no sign of electrode peeling off shall be Holding time: 5 s
observed.
Force application direction:
8.2 Bending test
No significant mechanical damage or
Test substrate: glass-epoxy substrate (100 mm × 40
no sign of electrode peeling off shall be mm × 1.6 mm)
observed.
Pressurizing speed: 1.0 mm/s
Pressure jig: R230
Amount of bending: 2 mm
Holding time: 20 s
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz/20
min
Total amplitude: 3.0 mm or acceleration amplitude of
196 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other, 2
h for each direction (6 h in total)
8.4 Resistance to
soldering heat
Appearance: No significant mechanical Flux: Ethanol solution of rosin, 25(wt)%
damage shall be observed.
Pre-heating: 150°C/60 s
Inductance change rate: within ±30%
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 260°C±5°C
Immersion time: 10 s
Post-treatment: left for 4 hours to 48 hours at room
temperature.
8.5 Solderability
95% or more of the outer electrode shall Flux: Ethanol solution of rosin, 25(wt)%
be covered with new solder seamlessly. Pre-heating: 150°C/60 s
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 245°C±3°C
Immersion time: 3 s
9. Environmental Performance
The product is soldered on a substrate for test.
(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being
specified special condition.)
No.
Item
Specification
Test method
9.1 Heat resistance Appearance: No significant mechanical Temperature: 125°C±2°C
damage shall be observed.
Inductance change rate: within ±50%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
9.2 Cold resistance
9.3 Humidity
Appearance: No significant mechanical Temperature: -55°C±2°C
damage shall be observed.
Inductance change rate: within ±50%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Humidity: 90% to 95% (RH)
Inductance change rate: within ±50%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
No. Item
P4/9
Specification
Test method
9.4 Temperature
cycle
Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -55°C (+0℃,-3℃)/30 min (+3 min,-0 min)
Inductance change rate: within ±30%
Step 2: ordinary temperature/ max 3 min
Step 3: +125°(+0℃,-3℃)/30 min (+3 min,-0 min)
Step 4: ordinary temperature/ max. 3 min
Number of testing: 100 cycles
Post-treatment: left at a room temperature for 24 h±2
h
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
B
t
(0.95)
(1.8)
(1.0 max)
(0.30)
t'
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
4000 pcs/reel
(Standard quantity)
Packing method
Feed hole position
Joint
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and
bottom tape when the cavities of the carrier tape are punched type).
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)
are seamless.
Number of missing Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater,
products and are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Cover tape (or top tape)
5 N min.
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
10.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.7 N (The lower limit is for typical value.)
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P5/9
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements to
the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P6/9
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
12. Precautions for Use
This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a
conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of
thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is
assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for flow and reflow soldering:
a
b
c
0.7
2.0
0.7
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (flow, reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C
max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P7/9
(1) Flow
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard profile
150°C/60 s min.
250°C/4 s to 6 s
2 times
Limit profile
Pre-heating
150°C/60 s min.
265°C±3°C/5 s
2 times
Heating
Number of flow cycles
(2) Reflow
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
60 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure
of mechanical or electrical performance.
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P8/9
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to
reduce stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the
substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade
this product.
MURATA MFG CO., LTD
Spec No.: JELF243B-0094-01
P9/9
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor
solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials,
leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up
errors, misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so
that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
12.14 Handling of product
Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar
tools when handling the product (instead, use tweezers with resin or ceramic tips).
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
相关型号：
LQM18PN2R2MFRL
General Purpose Inductor, 2.2uH, 20%, 1 Element, Ferrite-Core, SMD, 0603, CHIP, 0603
MURATA
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