LQM21DN470M70# [MURATA]
;
| 型号： | LQM21DN470M70# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总9页 (文件大小：338K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec No. JELF243B-0083B-01
P.1/9
CHIP COIL (CHIP INDUCTORS)
LQM21DN□□□□70L REFERENCE SPECIFICATION
1. Scope
This reference specification applies to Chip Coil (Chip Inductors) LQM21DN_70 series.
2. Part Numbering
(ex)
LQ
M
21
D
N
100
M
7
0
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
Characteristics
L: Taping
*B: BULK
*B: Bulk packing also available
3. Rating
・Operating Temperature Range.
・Storage Temperature Range.
– 55°C to +125°C
– 55°C to +125°C
DC Resistance
Rated Current
(mA)
Inductance
(Ω)
Self
Customer
Part Number
MURATA
Part Number
Resonant
Frequency
(MHz min.)
*1 (Based on
*2(Based on
Typ.
Inductance
change)
Max.
(μH)
Tolerance
Temperature rise)
LQM21DN100M70L
LQM21DN150M70L
LQM21DN220M70L
LQM21DN330M70L
LQM21DN470M70L
LQM21DN101M70L
10
15
±20%
±20%
±20%
±20%
±20%
±20%
0.65
0.95
1.25
2.30
2.30
3.15
0.845
1.235
1.625
2.99
27
24
19
16
12
8
250
140
100
80
300
250
220
200
200
160
22
33
47
2.99
50
100
4.095
20
*1: When applied Rated current to the Products, Inductance will be within ±50% of initial inductance value range.
*2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to 40℃ max.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity : 60%(RH) to 70%(RH)
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Atmospheric Pressure : 86kPa to 106kPa
5. Appearance and Dimensions
0.5±0.3
■
Unit Mass (Typical value)
0.016g
1.25±0.2
(in mm)
2.0±0.2
1.25±0.2
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.2/9
6. Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT 4294A or equivalent (1mA)
Measuring Frequency: 1MHz
6.1 Inductance
6.2 DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after
putting chip coil between the terminal 2
under the condition of opening between
a and b.
Every measurement the terminal 1 shall
be shorted between a and b when
changing chip coil.
6.3 Self Resonant
Frequency (S.R.F)
S.R.F shall meet item 3.
Measuring Equipment:
KEYSIGHT 4294A or equivalent
7. Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear ｔest
No significant mechanical damage or The product is soldered on a substrate for test.
no sign of electrode peeling off shall be Applying force: 10 N
observed.
Holding time: 5 s
No significant mechanical damage or The product is soldered on a substrate for test.
no sign of electrode peeling off shall be Test substrate: glass-epoxy substrate (100 mm × 40
7.2 Bending ｔest
observed.
mm × 1.6 mm)
Pressurizing speed: 1.0 mm/s
Pressure jig: R230
Amount of bending: 2 mm
Holding time: 20 s
7.3 Vibration
Appearance shall have no significant The product is soldered on a substrate for test.
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz/20
min
Amplitude: total amplitude of 3.0 mm or acceleration
amplitude of 196 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other,
h for each direction (6h in total)
2
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.3/9
No. Item
7.4 Resistance
to soldering heat
Specification
Appearance:
Test Method
Flux: Ethanol solution of rosin, 25(wt)%
No significant mechanical damage Pre-heating: 150°C/60 s
shall be observed.
Inductance change rate: within ±50%
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 260°C±5°C
Immersion time: 10 s
Post-treatment: left for 4 hours to 48 hours at room
temperature.
7.5 Solderability
95% or more of the outer electrode Flux: Ethanol solution of rosin, 25(wt)%
shall be covered with new solder Pre-heating: 150°C/60 s
seamlessly.
Solder: Sn-3.0Ag-0.5Cu solder
Solder temperature: 245°C±3°C
Immersion time: 3 s
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
Temperature: 125°C±2°C
Appearance:
8.1 Heat Life
No significant mechanical damage
shall be observed.
Inductance change rate: within ±50%
(for LQM21DN101M70L +40%-60%)
Applying Current: Rated Current
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
Appearance:
8.2 Heat resistance
Temperature: 125°C±2°C
No significant mechanical damage
shall be observed.
Inductance change rate: within ±50%
(for LQM21DN101M70L +40%-60%)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
Appearance:
No significant mechanical damage
shall be observed.
8.3 Cold resistance
8.4 Humidity
Temperature: -55°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
Inductance change rate: within ±50%
Appearance:
Temperature: 40°C±2°C
No significant mechanical damage
shall be observed.
Inductance change rate: within ±50%
(for LQM21DN101M70L +40%-60%)
Humidity: 90% to 95% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left for 4 hours to 48 hours at room
temperature.
Appearance:
No significant mechanical damage
shall be observed.
8.5 Temperature
Cycle
Single cycle conditions:
Step 1: -55°C (+0°C, -3°C), 30 min (+3 min, -0 min)
Step 2: ordinary temperature, 3 min max.
Step 3:+150°C (+3°C, -0°C), 30 min (+3 min, -0 min)
Step 4: ordinary temperature, 3 min max.
Number of testing: 100 cycles
Inductance change rate: within ±50%
Post-treatment: left for 4 hours to 48 hours at room
temperature.
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.4/9
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide)
2.0±0.05
0.1
0
4.0±0.1
4.0±0.1
φ1.5±
1.45±0.1
0.2±0.05
1.75±0.1
(in mm)
引き出し方向
Dimension of the Cavity is measured at the bottom side.
1.45±0.1
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
Cover tape
10N min.
5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off
165 to 180 degree
F
Cover tape
Plastic tape
300mm / min
Plastic tape: 0.1N to 0.7N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.5/9
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1) ,RoHS marking (2), Quantity
etc ･･･
1) <Expression of Inspection No.>
(1) Factory Code
□□ OOOO
(1)
(2)
(3)
(2) Date
First digit
Second digit
Third, Fourth digit : Day
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) <Expression of RoHS marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking
(2), Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
(mm)
Label
in Outer Case (Reel)
W
D
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
10. ! Caution
10.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal
expansion from a mounting board when heat stress like heat cycle, etc. are repeatedly given to them.
11.1 Land pattern designing
Chip Coil
Land
Solder Resist
c
a
b
c
1.2
3.0 to 4.0
1.0
a
b
(in mm)
11.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste: 100μm to 150μm.
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.6/9
11.3 Flow soldering / Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Soldering profile
(1) Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
150℃, 60s min.
Limit Profile
Pre-heating
Heating
Cycle of flow
250℃, 4s～6s
2 times
265℃±3℃, 5s
2 times
(2) Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s～60s
above 230°C, 60s max.
260°C, 10s
245°C±3°C
2 times
2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1, -0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.7/9
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
t
T： thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
b
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
A
>
D *1
B
A
>
>
(3) Keep the mounting position of the component away from the board separation surface.
A
C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes
as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.8/9
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress
of resin to be used for coating/molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers
with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to magnetism.
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
MURATA MFG.CO., LTD
Spec No. JELF243B-0083B-01
P.9/9
12．! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before
order
MURATA MFG.CO., LTD
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