LQM21FN470N00# [MURATA]

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型号：	LQM21FN470N00#
厂家：	muRata
描述：
文件：	总9页 (文件大小：157K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

Spec No. JELF243B-0006R-01

P.1/9

CHIP COIL (CHIP INDUCTORS) LQM21FN□□□□00□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to LQM21FN_00 series, Chip coil (Chip Inductors).

2. Part Numbering

(ex)

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W) and D: Taping

Characteristics (Paper tape)

L: Taping

(Plastic tape)

*B: BULK

1R0

*B: Bulk packing also available

3. Rating

・Operating Temperature Range

・Storage Temperature Range

– 40°C to + 85°C

– 55°C to +125°C

Self

Inductance

Resistance

(Ω)

Rated

Current

(mA)

Customer

MURATA

Resonant

Frequency

(MHz min.)

Part Number

(μH)

Tolerance

LQM21FN1R0N00D

LQM21FN2R2N00D

LQM21FN4R7N00L

LQM21FN100N00L

LQM21FN220N00L

LQM21FN470N00L

1.0

2.2

4.7

0.20±30%

0.28±30%

0.30±30%

0.50±30%

0.35±30%

0.60±30%

105

220

150

±30%

7.5

4. Appearance and Dimensions

0.5±0.3

Ferrite

Electrode

2.0±0.2

1.25±0.2

(in mm)

Inductance: 1.0μH to 2.2μH

Inductance: 4.7μH to 47μH

0.85mm±0.2mm

1.25mm±0.2mm

Dimension of T

Unit Mass

Inductance: 1.0μH to 2.2μH

Inductance: 4.7μH to 47μH

0.010g

0.016g

(Typical value)

5. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)

《In case of doubt》

Temperature : 20°C ± 2°C

Humidity : 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106kPa

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.2/9

6. Electrical Performance

No.

Item

Specification

Inductance shall meet item 3.

Test Method

Measuring Equipment:

6.1 Inductance

KEYSIGHT 4291A or equivalent (1mA)

Measuring Frequency: 1MHz

6.2 DC Resistance

DC Resistance shall meet item 3.

Measuring Equipment: Digital multi meter

Digital multi meter

(TR6846 or equivalent)

terminal1

terminal2

DC resistance shall be measured after

putting chip coil between the terminal 2

under the condition of opening between

a and b.

Every measurement the terminal 1 shall

be shorted between a and b when

changing chip coil.

6.3 Self Resonant

Frequency (S.R.F)

6.4 Rated Current

S.R.F shall meet item 3.

Measuring Equipment:

KEYSIGHT 4195A or equivalent (1mA)

The rated current is applied.

Self temperature rise shall be limited

to 25°C max.

Inductance Change: within ±50%

7. Mechanical Performance

No.

Item

Specification

Chip coil shall not be damaged after

tested as follows.

Test Method

7.1 Shear Test

Applied Direction

Chip Coil

Substrate

Force: 10N

Hold Duration: 5s±1s

Applied Direction: Parallel to PCB

Substrate: Glass-epoxy substrate

(100mm×40mm×1.6mm)

Pressure jig

7.2 Bending Test

R340

Deflection

Product

(in mm)

Speed of Applying Force: 1mm / s

Deflection: 1mm

Hold Duration: 30s

7.3 Vibration

Oscillation Frequency:

10Hz to 55Hz to 10Hz for 1 minute

Total Amplitude: 1.5mm

Testing Time:

A period of 2h in each of 3 mutually

perpendicular directions.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.3/9

No.

Item

Specification

Test Method

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

7.4 Solderability

The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 240°C±5°C

Immersion Time: 3s±1s

7.5 Resistance to

Soldering Heat

Appearance: No damage

Inductance Change: within ±20%

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 270°C±5°C

Immersion Time: 10s±1s

Then measured after exposure in the room

condition for 24h±2h.

8. Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Test Method

Temperature: 85°C±2°C

8.1 Heat Resistance

Appearance: No damage

Inductance Change: within ±20%

Time: 1000h (+48h,-0h)

Then measured after exposure in the room

condition for 24h±2h.

8.2 Humidity

Temperature: 40°C±2°C

Humidity: 90%(RH) to 95%(RH)

Time: 1000h (+48h, -0h)

Then measured after exposure in the room

condition for 24h±2h.

8.3 Temperature

Cycle

1 cycle:

1 step: -40°C±2°C / 30 min±3 min

2 step: Ordinary temp. / 10 min to 15 min

3 step: 85°C±2°C / 30 min to 3 min

4 step: Ordinary temp. / 10 min to15 min

Total of 10 cycles

Then measured after exposure in the room

condition for 24 h±2 h.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.4/9

9. Specification of Packaging

9.1 Appearance and Dimensions of paper tape / plastic tape

P/N

Type

Dimensions (in mm)

2.0±0.05

4.0±0.1 4.0±0.1

0.1

1.5±

LQM21FN

1R0N00D

2R2N00D

8mm-wide

Paper tape

Direction of feed

1.1 max.

1.45±0.1

2.0±0.05

1.3±0.1

0.2±0.1

4.0±0.1 4.0±0.1

0.1

1.5±

LQM21FN

4R7N00L

100N00L

220N00L

470N00L

8mm-wide

Plastic tape

Direction of feed

・Dimension of the Cavity is measured at the bottom side.

1.45±0.1

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

・Inductance : 1.0μH to 2.2μH (Paper tape)

・Inductance : 4.7μH to 47μH (Plastic tape)

(2) Packing Method

(Paper tape)

4,000 pcs / reel

3,000 pcs / reel

Products shall be packed in the cavity of the base tape continuously and sealed by top tape and

bottom tape.

(Plastic tape)

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

(Paper tape)

Base tape and Top tape has no spliced point.

(Plastic tape)

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The Specified quantity per reel is kept.

9.3 Pull Strength

【Case of Paper tape】

【Case of Plastic tape】

Plastic tape

Top tape

Bottom tape

10N min.

5N min.

Cover tape

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.5/9

9.4 Peeling off force of cover tape

【Case of Paper tape】

【Case of Plastic tape】

Top tape

165 to 180 degree

Cover tape

Plastic tape

Bottom tape

Base tape

Speed of Peeling off

300mm / min

Paper tape: 0.1N to 0.6N

Plastic tape: 0.2N to 0.7N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape ( top tape / cover tape and empty tape) and trailer-tape (empty tape) as follows.

Trailer

160 min.

Leader

2.0±0.5

Label

190 min.

210 min.

Empty tape

13.0±0.2



Top tape:Paper tape

60⁺¹



Cover tape:Plastic tape

Direction of feed

21.0±0.8



-0

9.0

13.0±1.4

180 ⁺⁰



-3

(in mm)

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity

etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

Third, Fourth digit : Day

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

(3) Serial No.

2) <Expression of RoHS Marking >

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS

Marking (2), Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions

Standard Reel Quantity

(mm)

Label

in Outer Case (Reel)

186



Above Outer Case size is typical. It depends on a quantity of an order.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.6/9

10. ！ Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Chip coil

1.2

3.0 to 4.0

1.0

Solder Resist

Land

(in mm)

11.2 Flux, Solder

･ Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

･ Use Sn-3.0Ag-0.5Cu solder.

･ Standard thickness of solder paste: 100m to 150m.

11.3 Flow soldering / Reflow soldering conditions

･ Pre-heating should be in such a way that the temperature difference between solder and product

surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that

the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products

quality.

･Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the

deterioration of product quality.

Soldering profile

(1) Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

150℃, 60s min.

Limit Profile

Pre-heating

Heating

250℃, 4s～6s

265℃±3℃, 5s

Cycle of flow

2 times

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

(2) Reflow soldering profile

P.7/9

Temp.

260℃

(℃)

245℃±3℃

230℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C, 90s±30s

Heating

Peak temperature

Cycle of reflow

above 220°C, 30s～60s

245°C±3°C

above 230°C, 60s max.

260°C, 10s

2 times

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C, 1 min

350°C max.

80W max.

φ3mm max.

3(+1, -0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Time

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

11.5 Solder Volume

･ Solder shall be used not to be exceeded the upper limits as shown below.

･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

T： thickness of product

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the

board.

［Products direction］

Products shall be located in the sideways

^{direction (Length: a}b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.8/9

(2)Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

D *1

(3) Keep the mounting position of the component away from the board separation surface.

Perforation

Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component in a position as far away from the screw holes

as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,

products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.

(5) Other cleaning Please contact us.

11.8 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high

cure-stress of resin to be used for coating/molding products. So please pay your careful attention when

you select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0006R-01

P.9/9

11.9 Caution for use

There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of

tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or

pottery.)

11.10 Magnetic Saturation

When the excessive current over rated current is applied, the inductance value may change due to

magnetism.

11.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.12 Storage and Handing Requirements

(1) Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization

of electrode, resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so

on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Products should be stored under the airtight packaged condition.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

12．! Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product

being mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD

LQM21FN470N00# [MURATA]

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