LQP02HV3N4C02# [MURATA]
;Reference Only
Spec No. JELF243C-0034G-01
P.1/12
CHIP COIL (CHIP INDUCTORS) LQP02HV□□□□02□ Reference Specification
1.Scope
This reference specification applies to LQP02HV□□□□02□ series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
02
H
V
0N4
B
0
2
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features
Electrode Packaging
L:4mm-wide / plastic tape
*B:Bulk
(L×W)
and
Characteristics
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature.
・Storage Temperature.
–55°C to +125°C
–55°C to +125°C
Inductance
(nH)
(@500MHz)
Q
(min)
(@500MHz)
DC
Resistance
(Ω max)
Self Resonant
Frequency
(GHz Min.)
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
Tolerance
LQP02HV0N4B02L
0.4
B:±0.1nH
17
0.03
18.0
1000
LQP02HV0N4C02L
LQP02HV0N5B02L
LQP02HV0N5C02L
LQP02HV0N6B02L
LQP02HV0N6C02L
LQP02HV0N7B02L
LQP02HV0N7C02L
LQP02HV0N8B02L
LQP02HV0N8C02L
LQP02HV0N9B02L
LQP02HV0N9C02L
LQP02HV1N0B02L
LQP02HV1N0C02L
LQP02HV1N1B02L
LQP02HV1N1C02L
LQP02HV1N2B02L
LQP02HV1N2C02L
LQP02HV1N3B02L
LQP02HV1N3C02L
LQP02HV1N4B02L
LQP02HV1N4C02L
LQP02HV1N5B02L
LQP02HV1N5C02L
LQP02HV1N6B02L
LQP02HV1N6C02L
LQP02HV1N7B02L
LQP02HV1N7C02L
LQP02HV1N8B02L
LQP02HV1N8C02L
LQP02HV1N9B02L
LQP02HV1N9C02L
LQP02HV2N0B02L
LQP02HV2N0C02L
LQP02HV2N1B02L
LQP02HV2N1C02L
LQP02HV2N2B02L
LQP02HV2N2C02L
LQP02HV2N3B02L
LQP02HV2N3C02L
LQP02HV2N4B02L
LQP02HV2N4C02L
LQP02HV2N5B02L
LQP02HV2N5C02L
0.4
0.5
0.5
0.6
0.6
0.7
0.7
0.8
0.8
0.9
0.9
1.0
1.0
1.1
1.1
1.2
1.2
1.3
1.3
1.4
1.4
1.5
1.5
1.6
1.6
1.7
1.7
1.8
1.8
1.9
1.9
2.0
2.0
2.1
2.1
2.2
2.2
2.3
2.3
2.4
2.4
2.5
2.5
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
16
16
16
16
16
16
0.03
0.03
0.03
0.03
0.03
0.03
0.03
0.03
0.03
0.04
0.04
0.04
0.04
0.05
0.05
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.07
0.07
0.07
0.07
0.07
0.07
0.08
0.08
0.09
0.09
0.09
0.09
0.09
0.09
0.11
0.11
0.18
0.18
0.19
0.19
18.0
18.0
18.0
18.0
18.0
18.0
18.0
16.6
16.6
16.6
16.6
16.6
16.6
16.6
16.6
16.6
16.6
13.9
13.9
13.9
13.9
13.9
13.9
12.2
12.2
12.2
12.2
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
11.9
1000
1000
1000
1000
1000
1000
1000
1000
1000
900
900
900
900
800
800
730
730
730
730
730
730
730
730
680
680
680
680
680
680
640
640
600
600
600
600
600
600
540
540
420
420
410
410
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.2/12
Inductance
Q
(min)
(@500MHz)
DC
Resistance
(Ω max)
Self Resonant
Frequency
(GHz Min.)
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
(nH)
Tolerance
(@500MHz)
2.6
2.6
2.7
2.7
2.8
2.8
2.9
2.9
3.0
3.0
3.1
3.1
3.2
3.2
3.3
3.3
3.4
3.4
3.5
3.5
3.6
3.6
3.7
3.7
3.8
3.8
3.9
3.9
4.0
4.0
4.0
4.0
4.1
4.1
4.2
4.2
4.3
4.3
4.7
4.7
5.1
5.1
5.6
5.6
6.2
6.2
6.8
6.8
7.5
7.5
8.2
8.2
9.1
9.1
10
LQP02HV2N6B02L
LQP02HV2N6C02L
LQP02HV2N7B02L
LQP02HV2N7C02L
LQP02HV2N8B02L
LQP02HV2N8C02L
LQP02HV2N9B02L
LQP02HV2N9C02L
LQP02HV3N0B02L
LQP02HV3N0C02L
LQP02HV3N1B02L
LQP02HV3N1C02L
LQP02HV3N2B02L
LQP02HV3N2C02L
LQP02HV3N3B02L
LQP02HV3N3C02L
LQP02HV3N4B02L
LQP02HV3N4C02L
LQP02HV3N5B02L
LQP02HV3N5C02L
LQP02HV3N6B02L
LQP02HV3N6C02L
LQP02HV3N7B02L
LQP02HV3N7C02L
LQP02HV3N8B02L
LQP02HV3N8C02L
LQP02HV3N9B02L
LQP02HV3N9C02L
LQP02HV4N0B02L
LQP02HV4N0C02L
LQP02HV4N0B02E
LQP02HV4N0C02E
LQP02HV4N1B02L
LQP02HV4N1C02L
LQP02HV4N2B02L
LQP02HV4N2C02L
LQP02HV4N3H02L
LQP02HV4N3J02L
LQP02HV4N7H02L
LQP02HV4N7J02L
LQP02HV5N1H02L
LQP02HV5N1J02L
LQP02HV5N6H02L
LQP02HV5N6J02L
LQP02HV6N2H02L
LQP02HV6N2J02L
LQP02HV6N8H02L
LQP02HV6N8J02L
LQP02HV7N5H02L
LQP02HV7N5J02L
LQP02HV8N2H02L
LQP02HV8N2J02L
LQP02HV9N1H02L
LQP02HV9N1J02L
LQP02HV10NH02L
LQP02HV10NJ02L
LQP02HV11NH02L
LQP02HV11NJ02L
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
B:±0.1nH
C:±0.2nH
H:±3%
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
0.19
0.19
0.21
0.21
0.21
0.21
0.21
0.21
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.24
0.25
0.25
0.46
0.46
0.46
0.46
0.46
0.46
0.53
0.53
0.57
0.57
0.57
0.57
0.57
0.57
0.65
0.65
11.9
11.9
11.9
11.9
11.3
11.3
11.3
11.3
10.2
10.2
10.2
10.2
10.2
10.2
10.2
10.2
9.4
410
410
390
390
390
390
390
390
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
360
260
260
260
260
260
260
240
240
230
230
230
230
230
230
220
220
9.4
9.4
9.4
9.4
9.4
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
7.1
7.1
7.1
7.1
7.1
J:±5%
7.1
H:±3%
7.1
J:±5%
H:±3%
7.1
7.1
J:±5%
7.1
H:±3%
7.1
J:±5%
7.1
H:±3%
7.1
J:±5%
7.1
H:±3%
7.1
J:±5%
7.1
H:±3%
7.1
J:±5%
7.1
H:±3%
7.1
J:±5%
7.1
H:±3%
5.5
J:±5%
5.5
H:±3%
5.5
J:±5%
10
5.5
H:±3%
11
5.5
J:±5%
11
5.5
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.3/12
Rated
Current
(mA)
Inductance
Q
(min)
DC
Resistance
(Ω max)
Self Resonant
Frequency
Customer
MURATA
(nH)
Part Number
Part Number
Tolerance
(@500MHz)
(GHz Min.)
(@500MHz)
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
H:±3%
J:±5%
LQP02HV12NH02L
LQP02HV12NJ02L
LQP02HV13NH02L
LQP02HV13NJ02L
LQP02HV15NH02L
LQP02HV15NJ02L
LQP02HV16NH02L
LQP02HV16NJ02L
LQP02HV18NH02L
LQP02HV18NJ02L
LQP02HV20NH02L
LQP02HV20NJ02L
LQP02HV22NH02L
LQP02HV22NJ02L
LQP02HV24NH02L
LQP02HV24NJ02L
LQP02HV27NH02L
LQP02HV27NJ02L
12
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
0.65
0.65
0.75
0.75
0.97
0.97
1.08
1.08
1.08
1.08
1.48
1.48
1.48
1.48
2.00
2.00
2.00
2.00
5.2
5.2
5.0
5.0
5.0
5.0
4.8
4.8
4.8
4.8
4.5
4.5
4.5
4.5
3.2
3.2
3.2
3.2
220
220
200
200
180
180
170
170
170
170
140
140
140
140
120
120
120
120
12
13
13
15
15
16
16
18
18
20
20
22
22
24
24
27
27
*
Typical value is actual performance.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)
Temperature : 20°C ± 2°C
Humidity
: 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
0.4±0.02mm
0.2±0.02mm
■Unit Mass (Typical value)
Top view
End view
0.085mg
0.3±0.02mm
Side view
0.14±0.03mm
Bottom view
0.14±0.03mm
6. Marking
Side surface identification marking :Blue
Both side surface
Blue
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.4/12
7.Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991B or equivalent
7.1 Inductance
Measuring Frequency: 500MHz
Measuring Fixture: KEYSIGHT 16198A
Contact board: (KEYSIGHT
:
Guide PCA0201,
100 m gap between electrode:60
μ
μ
m)
.
Measuring Condition:
Test signal level / about 0dBm
Electrical length /0mm
Weight: about 250g
<Measuring example>
7.2
Q
Q shall meet item 3.
Measuring Method:See the endnote
<Electrical Performance:Measuring
Method of Inductance/Q>
7.3 DC Resistance
7.4 Self Resonant
Frequency(S.R.F)
7.5 Rated
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT N5230A or equivalent
The rated current is applied.
Self temperature rise shall be
limited to 25°C max.
Current
8.Mechanical Performance
No.
Item
Specification
Test Method
8.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
Land
0.16
0.2
0.56
(in mm)
Force:1N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB
Chip coil
F
Substrate
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
No. Item
P.5/12
Specification
Test Method
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
8.2 Bending Test
Chip coil shall not be damaged
after tested as test method.
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
Pressure jig
R340
F
Deflection
45
45
Product
(in mm)
8.3 Vibration
Appearance:No damage
Substrate: Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:A period of 2h in each of
3 mutually perpendicular directions.
8.4 Solderability
The electrode shall be at least 90% Flux: Ethanol solution of rosin 25(wt)%
covered with new solder coating.
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
8.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
9.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance:No damage
Inductance Change: within ±10%
Test Method
Substrate: Glass-epoxy substrate
Temperature:125°C±2°C
9.1 Heat Resistance
9.2 Cold Resistance
9.3 Humidity
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
Temperature:-55°C±3°C
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
1 cycle:
9.4 Temperature
Cycle
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step:125°C±2°C / 30±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.6/12
10.Specification of Packaging
10.1 Appearance and Dimensions
【
4mm-wide / plastic tape
】
2.0±0.04
0.20±0.05
1.0±0.02
φ0.8±0.04
(0.46)
(in mm)
(0.34)
1.0±0.02
(0.24)
10.2 Specification of Taping
4mm-wide / plastic tape
【
】
(1) Packing quantity (standard quantity)
30,000 pcs. / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
10.3 Pull Strength
Cover tape
5N min
10.4 Peeling off force of cover tape
165 to 180 degree
F
Speed of Peeling off
300mm/min
Cover tape
0.1N to 0.6N
(minimum value is typical)
Peeling off force
Plastic tape
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.7/12
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
【4mm-wide / plastic tape】
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
9.0 +1
4.4±0.5
7.0±0.5
+0
φ
180
-3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2),
Quantity etc ・・・
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2), Quantity, etc ・・・
10.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
Label
(mm)
D
H
W
H
186
186
93
10(4mm-wide / plastic tape)
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.8/12
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the
product, overheating could occur, resulting in wire breakage, burning, or other serious fault.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the
heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land pattern designing
Land
Solder resist
Chip Coil
c
a
b
c
0.20
0.56
0.16
(in mm)
a
b
12.2 Flux, Solder
・
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・
・
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 50μm ~65μm.
12.3 Reflow soldering conditions
・
Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.9/12
・Reflow soldering profile
Temp.
260℃
(℃)
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
150°C
above 220°C 30s
245°C 3°C
2 times
Limit Profile
±30s
above 230°C、60s max.
Pre-heating
Heating
Peak temperature
Cycle of reflow
~
180°C
、
90s
、
~
60s
±
260°C,10s
2 times
12.4 Reworking with soldering iron
Reworking with soldering iron is disapproved.
12.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
・
1/3T
≦t≦T
Upper Limit
T : thickness of product
Recommendable
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance and become easy to tilt.
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[
Products direction]
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
a
b
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
P.10/12
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
A
>
D *1
B
A
>
>
(3) Keep the mounting position of the component away from the board separation surface.
A
C
C
B
Seam
D
A
a
b
Slit
Length:a b
<
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
12.8 Resin coating
When products are coated with resin, please contact us in advance.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.11/12
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending
Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C ~ 40°C
Humidity
: 15% to 85% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up
errors, misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0034G-01
P.12/12
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product
quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a
manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the
rated operating temperature for the product.
13.
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
Zx
Zm
V
2
V
1
V1
I1
A
C
B
D
V2
I 2
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
,
(3) Thus,the relation between Zx and Zm is following;
Zm- where,
1-Zm
β
Γ
α
β
Γ
= D / A =1
= B / D =Zsm-(1-Yom Zsm)Zss
= C / A =Yom
Zx=
α
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.19nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
Qx=
Lx=
2π
f
,
f
:Measuring frequency
MURATA MFG.CO., LTD
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