LQP02TN0N9B02D [MURATA]
General Purpose Inductor, 0.0009uH, 01005,;
| 型号： | LQP02TN0N9B02D |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 0.0009uH, 01005, 测试 射频感应器 电感器 |
| 文件： | 总14页 (文件大小：249K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
CHIP COIL (CHIP INDUCTORS) LQP02TN□□□□02□ Reference Specification
Spec No. JELF243C-0014AA-01
P.1/14
1.Scope
This reference specification applies to LQP02TN series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
02
T
N
0N4
B
0
2
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
Characteristics
D：8mm-wide / paper tape
L：4mm-wide / plastic tape
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range.
–55°C to +125°C
(Ambient temperature : Rated current can be handled in this temperature range.)
・Storage Temperature Range.
–55°C to +125°C
Inductance
Self
Resonant
Frequency
(MHz)
DC
Resistance
(Ω max)
Rated
Current
(mA)
Customer
MURATA
Part Number
Q
(min)
Part Number
(nH)
0.2
Tolerance
Min.
*Typ.
LQP02TN0N2B02D
LQP02TN0N2B02L
LQP02TN0N2C02D
LQP02TN0N2C02L
LQP02TN0N3B02D
LQP02TN0N3B02L
LQP02TN0N3C02D
LQP02TN0N3C02L
LQP02TN0N4B02D
LQP02TN0N4B02L
LQP02TN0N4C02D
LQP02TN0N4C02L
LQP02TN0N5B02D
LQP02TN0N5B02L
LQP02TN0N5C02D
LQP02TN0N5C02L
-
20000
0.3
0.4
0.5
18000
20000
0.50
320
LQP02TN0N6B02D
LQP02TN0N6B02L
LQP02TN0N6C02D
LQP02TN0N6C02L
LQP02TN0N7B02D
LQP02TN0N7B02L
LQP02TN0N7C02D
LQP02TN0N7C02L
LQP02TN0N8B02D
LQP02TN0N8B02L
LQP02TN0N8C02D
LQP02TN0N8C02L
LQP02TN0N9B02D
LQP02TN0N9B02L
LQP02TN0N9C02D
LQP02TN0N9C02L
LQP02TN1N0B02D
LQP02TN1N0B02L
LQP02TN1N0C02D
B:±0.1nH
C:±0.2nH
0.6
0.7
0.8
0.9
17000
16500
8
16100
15900
13000
1.0
0.60
220
LQP02TN1N0C02L
MURATA MFG.CO., LTD
Reference Only
DC
Spec No. JELF243C-0014AA-01
P.2/14
Self
Resonant
Frequency
Rated
Current
(mA)
Customer
MURATA
Part Number
Inductance
Q
Resistance
(Ω max)
Part Number
(min)
(MHz min)
Min.
*Typ.
(nH)
1.1
Tolerance
LQP02TN1N1B02D
LQP02TN1N1B02L
LQP02TN1N1C02D
LQP02TN1N1C02L
LQP02TN1N2B02D
LQP02TN1N2B02L
LQP02TN1N2C02D
LQP02TN1N2C02L
LQP02TN1N3B02D
LQP02TN1N3B02L
LQP02TN1N3C02D
LQP02TN1N3C02L
LQP02TN1N4B02D
LQP02TN1N4B02L
LQP02TN1N4C02D
LQP02TN1N4C02L
LQP02TN1N5B02D
LQP02TN1N5B02L
12500
15300
1.2
1.3
1.4
1.5
14800
14400
11700
11500
0.60
220
LQP02TN1N5C02D
LQP02TN1N5C02L
LQP02TN1N6B02D
LQP02TN1N6B02L
LQP02TN1N6C02D
LQP02TN1N6C02L
LQP02TN1N7B02D
LQP02TN1N7B02L
LQP02TN1N7C02D
LQP02TN1N7C02L
9500
1.6
12000
B:±0.1nH
C:±0.2nH
8
1.7
1.8
1.9
2.0
2.1
2.2
2.3
11800
11300
12000
11100
11200
10000
9700
0.70
LQP02TN1N8B02D
LQP02TN1N8B02L
LQP02TN1N8C02D
LQP02TN1N8C02L
LQP02TN1N9B02D
LQP02TN1N9B02L
LQP02TN1N9C02D
LQP02TN1N9C02L
LQP02TN2N0B02D
LQP02TN2N0B02L
LQP02TN2N0C02D
LQP02TN2N0C02L
LQP02TN2N1B02D
LQP02TN2N1B02L
LQP02TN2N1C02D
LQP02TN2N1C02L
LQP02TN2N2B02D
LQP02TN2N2B02L
LQP02TN2N2C02D
LQP02TN2N2C02L
LQP02TN2N3B02D
LQP02TN2N3B02L
LQP02TN2N3C02D
LQP02TN2N3C02L
9000
200
0.75
7500
MURATA MFG.CO., LTD
Reference Only
Self
Spec No. JELF243C-0014AA-01
P.3/14
Resonant
Frequency
DC
Resistance
(Ω max)
Rated
Current
Customer
Part Number
MURATA
Part Number
Inductance
Q
(min)
(MHz)
(mA)
Min.
*Typ.
9500
(nH)
2.4
Tolerance
LQP02TN2N4B02D
LQP02TN2N4B02L
LQP02TN2N4C02D
LQP02TN2N4C02L
LQP02TN2N5B02D
LQP02TN2N5B02L
LQP02TN2N5C02D
LQP02TN2N5C02L
LQP02TN2N6B02D
LQP02TN2N6B02L
LQP02TN2N6C02D
LQP02TN2N6C02L
LQP02TN2N7B02D
LQP02TN2N7B02L
LQP02TN2N7C02D
LQP02TN2N7C02L
LQP02TN2N8B02D
LQP02TN2N8B02L
LQP02TN2N8C02D
LQP02TN2N8C02L
LQP02TN2N9B02D
LQP02TN2N9B02L
LQP02TN2N9C02D
LQP02TN2N9C02L
LQP02TN3N0B02D
LQP02TN3N0B02L
LQP02TN3N0C02D
LQP02TN3N0C02L
LQP02TN3N1B02D
LQP02TN3N1B02L
LQP02TN3N1C02D
LQP02TN3N1C02L
LQP02TN3N2B02D
LQP02TN3N2B02L
LQP02TN3N2C02D
LQP02TN3N2C02L
LQP02TN3N3B02D
LQP02TN3N3B02L
LQP02TN3N3C02D
LQP02TN3N3C02L
LQP02TN3N4B02D
LQP02TN3N4B02L
LQP02TN3N4C02D
LQP02TN3N4C02L
LQP02TN3N5B02D
LQP02TN3N5B02L
LQP02TN3N5C02D
LQP02TN3N5C02L
LQP02TN3N6B02D
LQP02TN3N6B02L
0.75
2.5
2.6
2.7
2.8
2.9
3.0
9300
9100
9200
12000
0.80
200
1.10
11800
B:±0.1nH
C:±0.2nH
8
7500
3.1
3.2
3.3
3.4
12000
10400
10400
1.30
180
3.5
3.6
10200
10100
LQP02TN3N6C02D
LQP02TN3N6C02L
MURATA MFG.CO., LTD
Reference Only
DC
Spec No. JELF243C-0014AA-01
P.4/14
Self
Resonant
Frequency
Rated
Current
Customer
MURATA
Inductance
Q
Resistance
(Ω max)
Part Number
(min)
Part Number
(MHz)
(mA)
(nH)
3.7
Tolerance
Min.
*Typ.
LQP02TN3N7B02D
LQP02TN3N7B02L
LQP02TN3N7C02D
LQP02TN3N7C02L
LQP02TN3N8B02D
LQP02TN3N8B02L
LQP02TN3N8C02D
LQP02TN3N8C02L
10300
3.8
3.9
4.0
4.1
4.2
4.3
4.7
5.1
5.6
6.2
6.8
7.5
10100
9700
9800
9600
8700
8800
8600
8300
7500
7400
7100
6500
LQP02TN3N9B02D
LQP02TN3N9B02L
LQP02TN3N9C02D
LQP02TN3N9C02L
LQP02TN4N0B02D
LQP02TN4N0B02L
LQP02TN4N0C02D
LQP02TN4N0C02L
LQP02TN4N1B02D
LQP02TN4N1B02L
LQP02TN4N1C02D
LQP02TN4N1C02L
LQP02TN4N2B02D
LQP02TN4N2B02L
LQP02TN4N2C02D
LQP02TN4N2C02L
LQP02TN4N3H02D
LQP02TN4N3H02L
LQP02TN4N3J02D
LQP02TN4N3J02L
LQP02TN4N7H02D
LQP02TN4N7H02L
LQP02TN4N7J02D
LQP02TN4N7J02L
LQP02TN5N1H02D
LQP02TN5N1H02L
LQP02TN5N1J02D
LQP02TN5N1J02L
LQP02TN5N6H02D
LQP02TN5N6H02L
LQP02TN5N6J02D
LQP02TN5N6J02L
LQP02TN6N2H02D
LQP02TN6N2H02L
LQP02TN6N2J02D
LQP02TN6N2J02L
LQP02TN6N8H02D
LQP02TN6N8H02L
LQP02TN6N8J02D
LQP02TN6N8J02L
LQP02TN7N5H02D
LQP02TN7N5H02L
LQP02TN7N5J02D
LQP02TN7N5J02L
7500
B:±0.1nH
C:±0.2nH
1.30
180
7000
8
1.50
1.80
2.00
6500
6000
5500
4500
160
H:±3%
J:±5%
140
MURATA MFG.CO., LTD
Reference Only
Self
Spec No. JELF243C-0014AA-01
P.5/14
Resonant
Frequency
DC
Resistance
(Ω max)
Rated
Current
Customer
MURATA
Inductance
Q
Part Number
(min)
Part Number
(MHz)
(mA)
(nH)
8.2
Tolerance
Min.
*Typ.
6200
LQP02TN8N2H02D
LQP02TN8N2H02L
LQP02TN8N2J02D
LQP02TN8N2J02L
LQP02TN9N1H02D
LQP02TN9N1H02L
LQP02TN9N1J02D
LQP02TN9N1J02L
4500
4000
2.10
9.1
10
5600
5300
4400
8
LQP02TN10NH02D
LQP02TN10NH02L
LQP02TN10NJ02D
LQP02TN10NJ02L
2.50
2.80
LQP02TN11NH02D
LQP02TN11NH02L
LQP02TN11NJ02D
LQP02TN11NJ02L
LQP02TN12NH02D
LQP02TN12NH02L
LQP02TN12NJ02D
LQP02TN12NJ02L
LQP02TN13NH02D
LQP02TN13NH02L
LQP02TN13NJ02D
LQP02TN13NJ02L
LQP02TN15NH02D
LQP02TN15NH02L
LQP02TN15NJ02D
LQP02TN15NJ02L
LQP02TN16NH02D
LQP02TN16NH02L
LQP02TN16NJ02D
LQP02TN16NJ02L
11
12
13
15
16
3500
3000
2500
140
4200
3.20
7
H:±3%
J:±5%
3800
3600
3.50
LQP02TN18NH02D
LQP02TN18NH02L
LQP02TN18NJ02D
LQP02TN18NJ02L
18
3400
LQP02TN20NH02D
LQP02TN20NH02L
LQP02TN20NJ02D
LQP02TN20NJ02L
LQP02TN22NH02D
LQP02TN22NH02L
LQP02TN22NJ02D
LQP02TN22NJ02L
20
22
24
27
3100
3000
2800
2500
5.00
2300
6
120
LQP02TN24NH02D
LQP02TN24NH02L
LQP02TN24NJ02D
LQP02TN24NJ02L
LQP02TN27NH02D
LQP02TN27NH02L
LQP02TN27NJ02D
LQP02TN27NJ02L
5.50
2000
MURATA MFG.CO., LTD
Reference Only
DC
Spec No. JELF243C-0014AA-01
P.6/14
Self
Resonant
Frequency
Rated
Current
Customer
MURATA
Inductance
Q
Resistance
(Ω max)
Part Number
(min)
Part Number
(MHz)
(mA)
(nH)
30
Tolerance
Min.
*Typ
LQP02TN30NH02D
LQP02TN30NH02L
LQP02TN30NJ02D
LQP02TN30NJ02L
LQP02TN33NH02D
LQP02TN33NH02L
LQP02TN33NJ02D
LQP02TN33NJ02L
LQP02TN36NH02D
LQP02TN36NH02L
LQP02TN36NJ02D
LQP02TN36NJ02L
LQP02TN39NH02D
LQP02TN39NH02L
LQP02TN39NJ02D
LQP02TN39NJ02L
6
2600
6.50
1800
33
36
H:±3%
J:±5%
2300
2100
90
4
7.00
1600
39
＊Typical value is actual performance.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)
Temperature : 20°C ± 2°C
Humidity
: 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
0.2±0.02
0.4±0.02
0.2±0.02
■Unit Mass (Typical value)
0.05mg
(in mm)
0.095±0.025
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
P.7/14
6. Marking
Polarity Marking :white
Coloring side
Polarity Marking
7.Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency:
7.1 Inductance
(0.2nH～30nH) 500MHz
(33nH～39nH) 300MHz
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 27.3mm
Weight / about 3N
Measuring Fixture: KEYSIGHT 16196D
Insert Chip coil in the hole in order that the
polarity marking is at the top of the side
surface.
Contact coil with each terminal by adding
the weigh cover.
See diagram below.
7.2
Q
Q shall meet item 3.
Polarity
Marking
Chip coil placement hole: φ0.3mm
Measuring Method:See P.14
<Electrical Performance:Measuring
Method of Inductance/Q>
7.3 DC Resistance
7.4 Self Resonant
Frequency(S.R.F)
7.5 Rated
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT 8753C or equivalent
The rated current is applied.
Self temperature rise shall be
limited to 25°C max.
Current
8.Mechanical Performance
No.
Item
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
Land
8.1 Shear Test
0.23
0.2
0.56
(in mm)
Force:1N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
No. Item
P.8/14
Specification
Test Method
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
8.2
Bending Test
Chip coil shall not be damaged
after tested as test method.
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
Pressure jig
R340
F
Deflection
Product
45
45
(in mm)
8.3 Vibration
Appearance:No damage
Substrate:Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:A period of 2h in each of
3 mutually perpendicular directions.
8.4 Solderability
The electrode shall be at least 90% Flux: Ethanol solution of rosin 25(wt)%
covered with new solder coating.
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
8.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
9.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance:No damage
Inductance Change: within ±10%
Test Method
Substrate:Glass-epoxy substrate
Temperature:125°C±2°C
9.1 Heat Resistance
9.2 Cold Resistance
9.3 Humidity
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate:Glass-epoxy substrate
Temperature:-55°C±3°C
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate:Glass-epoxy substrate
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate:Glass-epoxy substrate
1 cycle:
9.4 Temperature
Cycle
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step:125°C±2°C / 30±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
P.9/14
10.Specification of Packaging
10.1 Appearance and Dimensions of paper tape
【8mm-wide / paper tape】
+0.1
-0
2.0±0.05
φ1.5
2.0±0.05
4.0±0.1
1.75±0.1
Polarity
Marking
(0.24)
0.39 max.
Direction of feed
(in mm)
【4mm-wide / plastic tape】
2.0±0.04
1.0±0.02
(0.2)
φ0.8±0.04
Polarity
Marking
(0.23)
1.0±0.02
(0.21)
Dimension of the Cavity is measured at the bottom side.
10.2 Specification of Taping
【8mm-wide / paper tape】
(1) Packing quantity (standard quantity)
20,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
【4mm-wide / plastic tape】
(1) Packing quantity (standard quantity)
40,000 pcs. / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
Sprocket hole shall be located on the left-hand side toward the direction of feed.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
P.10/14
10.3 Pull Strength
Cover tape
5N min
10.4 Peeling off force of cover tape
Speed of Peeling off
300mm/min
0.1N to 0.6N
(minimum value is typical)
Peeling off force
【8mm-wide / paper tape】
【4mm-wide / plastic tape】
Cover tape
165 to 180 degree
F
F
Cover tape
Plastic tape
165 to 180
°
゜
Base tape
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
【8mm-wide / paper tape】
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
(in mm)
+0
φ
180
-3
【4mm-wide / plastic tape】
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
9.0 +1
4.4±0.5
7.0±0.5
+0
φ
180
-3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking(∗2),
Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
P.11/14
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ･･･
10.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
Label
(mm)
D
H
W
H
186
186
93
5(8mm-wide / paper tape)
10(4mm-wide / plastic tape)
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing
Chip Coil
Land
c
a
b
c
0.16~0.20
0.40~0.56
0.20~0.23
Solder resist
(in mm)
ａ
ｂ
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 50μm to 80μm.
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
・Reflow soldering profile
P.12/14
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
2 times
2 times
12.4 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
1/3T≦t≦T
Recommendable
T : thickness of product
t
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
Products shall be located in the sideways
a
direction (Length:ａ＜b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation
C
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
B
Seam
Because they may be subjected the mechanical
stress in order of A＞C＞B ≅ D.
D
A
a
b
Slit
Length:a b
<
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
P.13/14
12.6 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
12.7 Resin coating
When products are coated with resin, please contact us in advance.
12.8 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself..
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending
Twisting
12.9 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C ~ 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243C-0014AA-01
(3) Handling Condition
P.14/14
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13．! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
Zx
Zm
V
2
V
1
V1
I1
A
C
B
D
V2
I 2
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
，
(3) Thus,the relation between Zx and Zm is following;
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Zx= α
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.110nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
2πf
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
Qx=
Lx=
，
f
:Measuring frequency
MURATA MFG.CO., LTD
相关型号：
LQP02TN0N9S02B
General Purpose Inductor, 0.0009uH, 1 Element, SMD, 01005, CHIP, 01005, ROHS COMPLIANT
MURATA
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