LQP03HQ2N4C02D [MURATA]
General Purpose Inductor,;
| 型号： | LQP03HQ2N4C02D |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 测试 射频感应器 电感器 |
| 文件： | 总11页 (文件大小：266K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
CHIP COIL (CHIP INDUCTORS) LQP03HQ□□□□02D Reference Specification
Spec No.JELF243C-0021E-01
P.1/11
1.Scope
This reference specification applies to LQP03HQ_02 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
03
H
Q
0N6
B
0
2
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features
Electrode Packaging
D:Taping
(L×W)
and
Characteristics
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range. –55°C to +125°C
(Ambient temperature: Rated current can be handled in this temperature range.)
・Storage Temperature Range. –55°C to +125°C
Self
Resonant
Frequency
(MHz)
DC
Resistance
(Ω max)
Rated
Current
(mA)
Inductance
Customer
Part Number
MURATA
Part Number
Q
(min)
(nH)
0.6
Tolerance
Min.
*Typ
LQP03HQ0N6W02D
LQP03HQ0N6B02D
LQP03HQ0N6C02D
LQP03HQ0N7W02D
LQP03HQ0N7B02D
LQP03HQ0N7C02D
LQP03HQ0N8W02D
LQP03HQ0N8B02D
LQP03HQ0N8C02D
LQP03HQ0N9W02D
LQP03HQ0N9B02D
LQP03HQ0N9C02D
LQP03HQ1N0W02D
LQP03HQ1N0B02D
LQP03HQ1N0C02D
LQP03HQ1N1W02D
LQP03HQ1N1B02D
LQP03HQ1N1C02D
LQP03HQ1N2W02D
LQP03HQ1N2B02D
LQP03HQ1N2C02D
LQP03HQ1N3B02D
LQP03HQ1N3C02D
LQP03HQ1N4B02D
LQP03HQ1N4C02D
LQP03HQ1N5B02D
LQP03HQ1N5C02D
LQP03HQ1N6B02D
LQP03HQ1N6C02D
LQP03HQ1N7B02D
LQP03HQ1N7C02D
LQP03HQ1N8B02D
LQP03HQ1N8C02D
LQP03HQ1N9B02D
LQP03HQ1N9C02D
LQP03HQ2N0B02D
LQP03HQ2N0C02D
LQP03HQ2N1B02D
LQP03HQ2N1C02D
LQP03HQ2N2B02D
LQP03HQ2N2C02D
LQP03HQ2N3B02D
LQP03HQ2N3C02D
20000
18000
0.7
0.8
0.9
1.0
1.1
1.2
>20000
W:±0.05ｎH
B:±0.1ｎH
C:±0.2ｎH
0.04
1100
16000
14000
20000
18000
17000
13000
12000
20
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
20000
18500
0.05
1000
800
0.07
0.08
16000
10000
B:±0.1ｎH
C:±0.2ｎH
14700
15900
0.12
600
9000
14300
13800
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.2/11
Self
DC
Rated
Current
(mA)
Resonant
Frequency
(MHz)
Inductance
Customer
MURATA
Q
(min)
Resistance
(Ω max)
Part Number
Part Number
(nH)
2.4
Tolerance
Min.
*Typ
LQP03HQ2N4B02D
LQP03HQ2N4C02D
LQP03HQ2N5B02D
LQP03HQ2N5C02D
LQP03HQ2N6B02D
LQP03HQ2N6C02D
LQP03HQ2N7B02D
LQP03HQ2N7C02D
LQP03HQ2N8B02D
LQP03HQ2N8C02D
LQP03HQ2N9B02D
LQP03HQ2N9C02D
LQP03HQ3N0B02D
LQP03HQ3N0C02D
LQP03HQ3N1B02D
LQP03HQ3N1C02D
LQP03HQ3N2B02D
LQP03HQ3N2C02D
LQP03HQ3N3B02D
LQP03HQ3N3C02D
LQP03HQ3N4B02D
LQP03HQ3N4C02D
LQP03HQ3N5B02D
LQP03HQ3N5C02D
LQP03HQ3N6B02D
LQP03HQ3N6C02D
LQP03HQ3N7B02D
LQP03HQ3N7C02D
LQP03HQ3N8B02D
LQP03HQ3N8C02D
LQP03HQ3N9B02D
LQP03HQ3N9C02D
LQP03HQ4N0B02D
LQP03HQ4N0C02D
LQP03HQ4N1B02D
LQP03HQ4N1C02D
LQP03HQ4N2B02D
LQP03HQ4N2C02D
LQP03HQ4N3H02D
LQP03HQ4N3J02D
LQP03HQ4N7H02D
LQP03HQ4N7J02D
LQP03HQ5N1H02D
LQP03HQ5N1J02D
LQP03HQ5N6H02D
LQP03HQ5N6J02D
LQP03HQ6N2H02D
LQP03HQ6N2J02D
LQP03HQ6N8H02D
LQP03HQ6N8J02D
LQP03HQ7N5H02D
LQP03HQ7N5J02D
LQP03HQ8N2H02D
LQP03HQ8N2J02D
LQP03HQ9N1H02D
LQP03HQ9N1J02D
LQP03HQ10NH02D
LQP03HQ10NJ02D
LQP03HQ11NH02D
LQP03HQ11NJ02D
LQP03HQ12NH02D
LQP03HQ12NJ02D
13000
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
9000
11600
0.12
600
8000
7500
10500
B:±0.1ｎH
C:±0.2ｎH
0.17
500
7000
20
9500
0.25
7700
7300
6400
5500
400
H:±3%
J:±5%
0.3
0.4
0.5
4500
4000
5900
5200
300
11
12
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.3/11
Self
DC
Resistance
(Ω max)
Rated
Current
(mA)
Resonant
Frequency
(MHz)
Inductance
Customer
Part Number
MURATA
Part Number
Q
(min)
(nH)
13
Tolerance
Min.
*Typ
LQP03HQ13NH02D
LQP03HQ13NJ02D
LQP03HQ15NH02D
LQP03HQ15NJ02D
LQP03HQ16NH02D
LQP03HQ16NJ02D
LQP03HQ18NH02D
LQP03HQ18NJ02D
LQP03HQ20NH02D
LQP03HQ20NJ02D
LQP03HQ22NH02D
LQP03HQ22NJ02D
LQP03HQ24NH02D
LQP03HQ24NJ02D
LQP03HQ27NH02D
LQP03HQ27NJ02D
LQP03HQ30NH02D
LQP03HQ30NJ02D
LQP03HQ33NH02D
LQP03HQ33NJ02D
LQP03HQ36NH02D
LQP03HQ36NJ02D
LQP03HQ39NH02D
LQP03HQ39NJ02D
LQP03HQ43NH02D
LQP03HQ43NJ02D
LQP03HQ47NH02D
LQP03HQ47NJ02D
LQP03HQ51NH02D
LQP03HQ51NJ02D
LQP03HQ56NH02D
LQP03HQ56NJ02D
LQP03HQ62NH02D
LQP03HQ62NJ02D
LQP03HQ68NH02D
LQP03HQ68NJ02D
LQP03HQ75NH02D
LQP03HQ75NJ02D
LQP03HQ82NH02D
LQP03HQ82NJ02D
LQP03HQ91NH02D
LQP03HQ91NJ02D
LQP03HQR10H02D
LQP03HQR10J02D
LQP03HQR11H02D
LQP03HQR11J02D
LQP03HQR12H02D
LQP03HQR12J02D
LQP03HQR13H02D
LQP03HQR13J02D
LQP03HQR15H02D
LQP03HQR15J02D
0.5
0.7
4000
5100
300
250
170
150
15
16
3500
20
4200
18
0.8
20
3000
2000
1700
1500
1300
1200
22
0.82
1.6
3950
2900
24
15
27
30
2700
2600
2400
33
2.0
36
39
2200
2000
43
H:±3%
J:±5%
12
47
2.5
130
51
56
62
1800
1500
68
1100
1000
5.0
7.0
8.0
100
75
1400
1300
1100
82
91
10
100
110
120
130
150
900
800
700
80
960
880
7
＊Typical value is actual performance.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity : 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.4/11
5. Appearance and Dimensions
0.6±0.03mm
Top view
0.3±0.03mm
End view
Side view
0.4±0.02mm
0.2±0.03mm
Bottom view
■Unit Mass (Typical value)
0.22mg
0.15±0.03mm
6. Marking
Side distinguishing marking : Blue
Coloring side
(blue)
7.Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT E4991A or equivalent
7.1 Inductance
Measuring Frequency: (0.6nH～30nH) 500MHz
(33nH～120nH）300MHz
(130nH～150nH）100MHz
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 10mm
Weight / about 1N to 5N
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below
and contact coil with each terminal by
adding weight. Bottom side should be
a bottom, and should be in the direction of
the fixture for position of chip coil.
7.2
Q
Q shall meet item 3.
TOP
BOTTOM
Measuring Method:See P.11
<Electrical Performance:Measuring
Method of Inductance/Q>
7.3 DC Resistance
7.4 Self Resonant
Frequency(S.R.F)
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:
KEYSIGHT N5230A or equivalent
The rated current is applied.
7.5 Rated Current
Self temperature rise shall be
limited to 25°C max.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.5/11
8.Mechanical Performance
No.
8.1
Item
Shear Test
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
Land
0.3
0.3
0.9
(in mm)
Force:2N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB.
Chip coil
F
Substrate
8.2
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
Pressure jig
R340
F
Deflection
Product
45
45
(in mm)
8.3
Vibration
Appearance:No damage
Inductance Change: within ±10%
Substrate: Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:
A period of 2h in each of
3 mutually perpendicular directions.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
8.4
8.5
Solderability
The electrode shall be at least 90%
covered with new solder coating.
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
9.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance:No damage
Inductance Change: within ±10%
Test Method
Substrate: Glass-epoxy substrate
Temperature:125°C
9.1 Heat Resistance
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
No. Item
P.6/11
Specification
Test Method
Substrate: Glass-epoxy substrate
Temperature:-55°C
9.2 Cold Resistance
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
Temperature:40°C±2°C
9.3 Humidity
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
Substrate: Glass-epoxy substrate
1 cycle:
9.4 Temperature
Cycle
1 step: -55°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step: 125°C / 30min±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
10.Specification of Packaging
10.1 Appearance and Dimensions of paper tape (8mm-wide)
2.0±0.05
+0.1
-0
φ1.5
2.0±0.05
4.0±0.1
1.75±0.1
Product
（0.36）
0.55 max.
(in mm)
Direction of feed
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
15,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
10.3 Pull Strength
Cover tape
5N min
10.4 Peeling off force of cover tape
Speed of Peeling off
Cover tape
F
300mm/min
165 to 180
°
゜
0.1N to 0.6N
(minimum value is typical)
Peeling off force
Base tape
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.7/11
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
(in mm)
+0
φ
180
-3
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2),
Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) <Expression of RoHS Marking>
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ･･･
10.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
Label
(mm)
D
H
W
H
186
186
93
5
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.8/11
12.1 Land pattern designing
Chip Coil Land
c
a
b
c
0.3
0.9
Solder resist
0.25~0.30
(in mm)
ａ
ｂ
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 100μm
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
2 times
2 times
12.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.9/11
12.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
1/3T≦t≦1/2T
Recommendable
T : thickness of product
t
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
Products shall be located in the sideways
a
direction (Length:ａ＜b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation
C
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A＞C＞B ≅ D.
B
Seam
D
A
a
b
Slit
Length:a b
<
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
12.8 Resin coating
When products are coated with resin, please contact us in advance.
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.10/11
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending
Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C ~ 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13．! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243C-0021E-01
P.11/11
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
Zx
Zm
V
2
V
1
V1
I1
A
C
B
D
V2
I 2
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
，
(3) Thus,the relation between Zx and Zm is following;
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Zx= α
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.480nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
2πf
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
Qx=
Lx=
，
f
:Measuring frequency
MURATA MFG.CO., LTD
相关型号：
©2020 ICPDF网 联系我们和版权申明