LQP03TG3N8B02# [MURATA]
;型号: | LQP03TG3N8B02# |
厂家: | muRata |
描述: | |
文件: | 总13页 (文件大小:605K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Spec No.: JELF243C_0016K-01
P1/13
CHIP COILS (CHIP INDUCTORS) LQP03TG□□□□02□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQP03TG_02 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
P
03
T
G
0N1
B
0
2
D
Product Structure Dimension Application Category Inductance Tolerance Performance Electrode
Packaging
D: taping
*B: bulk
ID
(L × W)
and
specification
characteristic
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Self-resonant
frequency
(MHz)
Inductance
Nominal
DC
resistance
(Ω max.)
Rated
current
(mA)
Customer
Part number
Murata
Part number
Q
(Min.)
Lower *Typical
value
(nH)
Tolerance
limit
value
LQP03TG0N1B02D
LQP03TG0N2B02D
LQP03TG0N2C02D
LQP03TG0N3B02D
LQP03TG0N3C02D
LQP03TG0N4B02D
LQP03TG0N4C02D
LQP03TG0N5B02D
LQP03TG0N5C02D
LQP03TG0N6B02D
LQP03TG0N6C02D
LQP03TG0N7B02D
LQP03TG0N7C02D
LQP03TG0N8B02D
LQP03TG0N8C02D
LQP03TG0N9B02D
LQP03TG0N9C02D
LQP03TG1N0B02D
LQP03TG1N0C02D
LQP03TG1N1B02D
LQP03TG1N1C02D
LQP03TG1N2B02D
LQP03TG1N2C02D
LQP03TG1N3B02D
LQP03TG1N3C02D
LQP03TG1N4B02D
LQP03TG1N4C02D
LQP03TG1N5B02D
LQP03TG1N5C02D
0.1
0.2
0.2
0.3
0.3
0.4
0.4
0.5
0.5
0.6
0.6
0.7
0.7
0.8
0.8
0.9
0.9
1.0
1.0
1.1
1.1
1.2
1.2
1.3
1.3
1.4
1.4
1.5
1.5
B: ±0.1 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
-
0.07
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.08
0.10
0.10
0.10
0.10
0.12
0.12
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
20000
20000
20000
18000
18000
18000
18000
18000
18000
18000
18000
18000
18000
18000
18000
18000
18000
17000
17000
17000
17000
15000
15000
15000
15000
14000
14000
13500
13500
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
20000
18100
18100
18200
18200
17800
17800
16400
16400
850
850
850
850
850
850
850
850
850
850
850
750
750
750
750
700
700
600
600
600
600
600
600
600
600
600
600
600
600
-
-
-
-
-
-
11
11
11
11
12
12
12
12
12
12
12
12
12
12
13
13
13
13
13
13
13
13
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P2/13
Self-resonant
frequency
(MHz)
Inductance
Nominal
DC
resistance
(Ω max.)
Rated
current
(mA)
Customer
Part number
Murata
Part number
Q
(Min.)
Lower *Typical
value
(nH)
Tolerance
limit
value
LQP03TG1N6B02D
LQP03TG1N6C02D
LQP03TG1N7B02D
LQP03TG1N7C02D
LQP03TG1N8B02D
LQP03TG1N8C02D
LQP03TG1N9B02D
LQP03TG1N9C02D
LQP03TG2N0B02D
LQP03TG2N0C02D
LQP03TG2N1B02D
LQP03TG2N1C02D
LQP03TG2N2B02D
LQP03TG2N2C02D
LQP03TG2N3B02D
LQP03TG2N3C02D
LQP03TG2N4B02D
LQP03TG2N4C02D
LQP03TG2N5B02D
LQP03TG2N5C02D
LQP03TG2N6B02D
LQP03TG2N6C02D
LQP03TG2N7B02D
LQP03TG2N7C02D
LQP03TG2N8B02D
LQP03TG2N8C02D
LQP03TG2N9B02D
LQP03TG2N9C02D
LQP03TG3N0B02D
LQP03TG3N0C02D
LQP03TG3N1B02D
LQP03TG3N1C02D
LQP03TG3N2B02D
LQP03TG3N2C02D
LQP03TG3N3B02D
LQP03TG3N3C02D
LQP03TG3N4B02D
LQP03TG3N4C02D
LQP03TG3N5B02D
LQP03TG3N5C02D
LQP03TG3N6B02D
LQP03TG3N6C02D
LQP03TG3N7B02D
LQP03TG3N7C02D
1.6
1.6
1.7
1.7
1.8
1.8
1.9
1.9
2.0
2.0
2.1
2.1
2.2
2.2
2.3
2.3
2.4
2.4
2.5
2.5
2.6
2.6
2.7
2.7
2.8
2.8
2.9
2.9
3.0
3.0
3.1
3.1
3.2
3.2
3.3
3.3
3.4
3.4
3.5
3.5
3.6
3.6
3.7
3.7
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
13
0.15
0.15
0.20
0.20
0.20
0.20
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.32
0.32
0.32
0.32
0.32
0.32
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.35
13000
13000
12500
12500
12500
12500
12500
12500
12500
12500
12000
12000
12000
12000
11500
11500
11000
11000
11000
11000
11000
11000
11000
11000
9500
16100
16100
16400
16400
15000
15000
15900
15900
14800
14800
14800
14800
14300
14300
14100
14100
13700
13700
13800
13800
13900
13900
13100
13100
12200
12200
12200
12200
11500
11500
11800
11800
11600
11600
11200
11200
10300
10300
10000
10000
9400
600
600
500
500
500
500
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
450
400
400
400
400
400
400
350
350
350
350
350
350
350
350
9500
9500
9500
9500
9500
9500
9500
9500
9500
9500
9500
8000
8000
8000
8000
8000
8000
9400
7000
8600
7000
8600
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P3/13
Self-resonant
frequency
(MHz)
Inductance
Nominal
DC
resistance
(Ω max.)
Rated
current
(mA)
Customer
Part number
Murata
Part number
Q
(Min.)
Lower *Typical
value
(nH)
Tolerance
limit
value
LQP03TG3N8B02D
LQP03TG3N8C02D
LQP03TG3N9B02D
LQP03TG3N9C02D
LQP03TG4N3H02D
LQP03TG4N3J02D
LQP03TG4N7H02D
LQP03TG4N7J02D
LQP03TG5N1H02D
LQP03TG5N1J02D
LQP03TG5N6H02D
LQP03TG5N6J02D
LQP03TG6N2H02D
LQP03TG6N2J02D
LQP03TG6N8H02D
LQP03TG6N8J02D
LQP03TG7N5H02D
LQP03TG7N5J02D
LQP03TG8N2H02D
LQP03TG8N2J02D
LQP03TG9N1H02D
LQP03TG9N1J02D
LQP03TG10NH02D
LQP03TG10NJ02D
LQP03TG11NH02D
LQP03TG11NJ02D
LQP03TG12NH02D
LQP03TG12NJ02D
LQP03TG13NH02D
LQP03TG13NJ02D
LQP03TG15NH02D
LQP03TG15NJ02D
LQP03TG16NH02D
LQP03TG16NJ02D
LQP03TG18NH02D
LQP03TG18NJ02D
LQP03TG20NH02D
LQP03TG20NJ02D
LQP03TG22NH02D
LQP03TG22NJ02D
LQP03TG24NH02D
LQP03TG24NJ02D
LQP03TG27NH02D
LQP03TG27NJ02D
3.8
3.8
3.9
3.9
4.3
4.3
4.7
4.7
5.1
5.1
5.6
5.6
6.2
6.2
6.8
6.8
7.5
7.5
8.2
8.2
9.1
9.1
10
B: ±0.1 nH
C: ±0.2 nH
B: ±0.1 nH
C: ±0.2 nH
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
H: ±3%
J: ±5%
13
13
13
13
13
13
12
12
12
12
12
12
12
12
12
12
12
12
12
12
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
11
9
0.35
0.35
0.35
0.35
0.58
0.58
0.72
0.72
0.72
0.72
0.88
0.88
1.15
1.15
1.15
1.15
1.22
1.22
1.40
1.40
1.40
1.40
1.52
1.52
1.65
1.65
1.78
1.78
1.82
1.82
1.90
1.90
2.03
2.03
2.28
2.28
2.57
2.57
2.85
2.85
3.17
3.17
3.65
3.65
7000
7000
6500
6500
6500
6500
6500
6500
6500
6500
6000
6000
6000
6000
5400
5400
4800
4800
4800
4800
4500
4500
4500
4500
4100
4100
3700
3700
3400
3400
3100
3100
2900
2900
2800
2800
2600
2600
2500
2500
2000
2000
1700
1700
8600
8600
8100
8100
8000
8000
7800
7800
7800
7800
7500
7500
7400
7400
6300
6300
5600
5600
6200
6200
5200
5200
5200
5200
4700
4700
4400
4400
3800
3800
3600
3600
3300
3300
3200
3200
2900
2900
2900
2900
2400
2400
2200
2200
350
350
350
350
300
300
250
250
250
250
250
250
200
200
200
200
200
200
200
200
200
200
190
190
180
180
180
180
170
170
170
170
160
160
160
160
140
140
140
140
120
120
120
120
10
11
11
12
12
13
13
15
15
16
16
18
18
20
20
9
22
9
22
9
24
7
24
7
27
7
27
7
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P4/13
Self-resonant
frequency
(MHz)
Inductance
Nominal
DC
resistance
(Ω max.)
Rated
current
(mA)
Customer
Part number
Murata
Part number
Q
(Min.)
Lower *Typical
value
(nH)
Tolerance
limit
value
LQP03TG33NJ02D
LQP03TG39NJ02D
LQP03TG47NJ02D
LQP03TG56NJ02D
LQP03TG68NJ02D
LQP03TG82NJ02D
LQP03TGR10J02D
LQP03TGR12J02D
33
39
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
7
7
7
7
6
6
6
6
4.25
4.60
5.20
5.60
6.25
7.15
8.05
8.75
1600
1500
1300
1200
1100
1000
900
2000
2000
1700
1500
1400
1300
1200
1000
110
110
100
100
90
47
56
68
82
90
100
120
80
800
80
* Typical value is actual performance.
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.2 mg
6. Marking
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P5/13
7. Electrical Performance
No.
Item
Specification
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Test method
Measuring equipment: Keysight E4991A or the
equivalent
7.1 Inductance
7.2 Q
Measuring frequency:
500 MHz
300 MHz
0.1 nH to 27 nH
33 nH to 120 nH
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 0.2 mm
Electrical length: 10 mm
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the Appendix.
Measuring equipment: digital multimeter
Measuring equipment: Keysight 8753C or the
equivalent
7.3 DC resistance
7.4 Self-resonant
frequency
Meet chapter 3 ratings.
Meet chapter 3 ratings.
7.5 Rated current
Product temperature rise: 25°C max.
Apply the rated current specified in chapter 3.
8. Mechanical Performance
No.
Item
Specification
Test method
8.1 Shear test
No significant mechanical damage or no Test substrate: glass-epoxy substrate
sign of electrode peeling off shall be
observed.
Applying force: 2 N
Holding time: 5 s±1 s
Force application direction:
8.2 Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be
observed.
mm × 0.8 mm)
Pressurizing speed: 1 mm/s
Pressure jig: R340
Deflection: 1 mm
Holding time: 30 s
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P6/13
No. Item
Specification
Test method
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
approx. 20 min
Inductance change rate: within ±10%
Total amplitude: total amplitude of 1.5 mm or
acceleration amplitude of 196 m/s2, whichever is
smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.4 Solderability
90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content
be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to
soldering heat
Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin content
damage shall be observed.
of 25(wt)% for 5 s to 10 s
Inductance change rate: within ±10%
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 260°C±5°C
Immersion time: 5 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a glass-epoxy substrate for test.
No.
Item
Specification
Test method
9.1 Heat resistance
9.2 Cold resistance
9.3 Humidity
Appearance: No significant mechanical Temperature: 125°C±2°C
damage shall be observed.
Test time: 1000 h (+48 h, -0 h)
Inductance change rate: within ±10%
Post-treatment: left at a room condition for 24 h±2 h
Appearance: No significant mechanical Temperature: -55°C±3°C
damage shall be observed.
Test time: 1000 h (+48 h, -0 h)
Inductance change rate: within ±10%
Post-treatment: left at a room condition for 24 h±2 h
Appearance: No significant mechanical Temperature: 40°C±2°C
damage shall be observed.
Humidity: 90% (RH) to 95% (RH)
Inductance change rate: within ±10%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4 Temperature cycle
Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -55°C±2°C/30 min±3 min
Inductance change rate: within ±10%
Step 2: ordinary temperature/10 min to 15 min
Step 3: +125°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/paper tape)
A
B
t
(0.35)
(0.67)
0.55 max.
(in mm)
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P7/13
10.2 Taping specifications
Packing quantity
15000 pcs/reel
(Standard quantity)
Packing method
Feed hole position
Joint
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Cover tape (or top tape)
5 N min.
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
10.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P8/13
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
equipment
(4) Power plant control
equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, (7) Traffic signal
trains, ships, etc.) equipment
(8) Disaster/crime
prevention
equipment
(9) Data-processing
equipment
(10) Applications of similar complexity and/or reliability
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting
method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the
heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P9/13
12.1. Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering:
a
b
c
0.2 to 0.3
0.8 to 0.9
0.2 to 0.3
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P10/13
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P11/13
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
(1) The stress applied to the chip varies depending on the material and construction of the mounted substrate.
If the coefficients of thermal expansion for the substrate and chip vary significantly, the difference in thermal expansion and
shrinkage could cause cracks to form in the chip.
We assume that the products are mounted on glass-epoxy substrate. Assessment has not been conducted on substrates
where the coefficient of thermal expansion varies significantly from glass-epoxy substrates. If mounting on these
substrates, be sure to conduct full assessments before use.
(2) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the
substrate.
Excessive mechanical stress may cause cracking in the product.
Also, if mounting on flexible substrates, excessive mechanical stress could be applied to the chip by even slight bending or
twisting when handling this substrate, and so please conduct full assessments before use.
Bending
Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Power
Requirement
20 W/L max.
Time
5 min max.
Frequency
(3) Cleaner
28 kHz to 40 kHz
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P12/13
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor
solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
Before applying any resin coating, please consult our technical department.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
Spec No.: JELF243C_0016K-01
P13/13
Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included
in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
V1
I1
V2
I2
Zm=
Zx=
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zm-β
Zx=α
1-ZmΓ
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0 nH)
Yom: measured admittance when measuring
terminal is open
(4) Calculate inductance Lx and Qx using the equations shown below.
Im(Zx)
Lx: inductance of chip coil
Qx: Q of chip coil
Lx=
2πf
Im(Zx)
Qx=
f: measuring frequency
Re(Zx)
MURATA MFG CO., LTD
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