LQP18MN1N5C02D [MURATA]
General Purpose Inductor, 0.0015uH, 13.334%, 1 Element, SMD, 0603, CHIP, 0603;
| 型号： | LQP18MN1N5C02D |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 0.0015uH, 13.334%, 1 Element, SMD, 0603, CHIP, 0603 测试 射频感应器 电感器 |
| 文件： | 总9页 (文件大小：167K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Re erence Only
Spec No.JELF243C-0009J-01
P.1/9
CHIP COIL (CHIP INDUCTORS) LQP18MN□□□□02D Reference Specification
1.Scope
This reference specification applies to LQP18MN_02 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
P
18
M
N
1N3
C
0
2
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
Characteristics
D:Taping
*B:Bulk
Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range.
(Ambient temperature : Rated current can be handled in this temperature range.)
–40°C to +85°C
・Storage Temperature Range.
–40°C to +85°C
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
Customer
Part Number
MURATA
Part Number
Inductance
Q
(nH)
Tolerance
(min.)
(mA)
LQP18MN1N3C02D
LQP18MN1N5C02D
LQP18MN1N8C02D
LQP18MN2N2C02D
LQP18MN2N7C02D
LQP18MN3N3C02D
LQP18MN3N9C02D
LQP18MN4N7C02D
LQP18MN5N6C02D
LQP18MN6N8C02D
LQP18MN8N2C02D
LQP18MN10NG02D
LQP18MN12NG02D
LQP18MN15NG02D
LQP18MN18NG02D
LQP18MN22NG02D
LQP18MN27NG02D
LQP18MN33NG02D
LQP18MN39NG02D
LQP18MN47NG02D
LQP18MN56NG02D
LQP18MN68NG02D
LQP18MN82NG02D
LQP18MNR10G02D
1.3
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
0.3
0.4
0.5
300
6000
250
200
150
±0.2nH
5900
5200
4700
4300
3600
3400
3000
2700
2300
2100
1900
1700
1400
1200
1000
900
0.6
0.7
0.8
17
1.0
12
15
1.3
1.5
1.9
2.4
18
22
27
100
50
33
±2%
2.8
39
47
2.2
3.4
3.5
4.6
6.1
56
68
82
800
100
700
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
Humidity : 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH)
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.2/9
5. Appearance and Dimensions
■Unit Mass (Typical value)
1.6±0.15
0.002g
*The pattern of the coil differs in each
inductance value.
(in mm)
0.2 min.
0.2 min.
6.Electrical Performance
No. Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
Agilent4291A or equivalent
Measuring Frequency:
500MHz / 1.3nH to 39nH
300MHz / 47nH to 100nH
Measuring Condition:
6.1 Inductance
Test signal level / about 7dBm
Electrical length / 0.94cm
Weight / about 1N to 5N
Measuring Fixture: Agilent 16193A
Position coil under test as shown
in below and contact coil with each
terminal by adding weight.
Coil pattern should be a topside,
and inner end of the coil should be
in the direction of the fixture for
position of chip coil.
6.2
Q
Q shall meet item 3.
1mm
Inner end of the coil.
6.97mm
Measuring Method: See P.9
<Electrical Performance: Measuring
Method of Inductance/Q>
6.3 DC Resistance
6.4 Self Resonant
Frequency(S.R.F)
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment: Digital multi meter
Measuring Equipment:
Agilent 8753C or equivalent
6.5 Rated Current
Self temperature rise shall be
limited to 25°C max.
The rated current is applied.
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.3/9
7.Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate: Glass-epoxy substrate
Land
0.7
(in mm)
1.0
1.0
0.6
Force:10N
Hold Duration:5s±1s
Applied Direction: Parallel to PCB.
Chip Coil
F
Substrate
7.2 Bending Test
Chip coil shall not be damaged
after tested as test method.
Substrate: Glass-epoxy substrate
(100mm×40mm×1.6mm)
40
0.6
2.6
100
Solder resist
(in mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:30s
Pressure jig
R340
F
Deflection
Product
45
45
(in mm)
7.3 Vibration
Appearance: No damage
Oscillation Frequency:
Inductance Change:±10% within
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude:1.5mm
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
7.4 Solderability
The wetting area of the electrode
shall be at least 95% covered with
new solder coating.
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
Pattern side
Chip coil
The wetting area of the electrode
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
No. Item
P.4/9
Specification
Test Method
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change:±10% within
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance: No damage
Inductance Change:±10% within
Test Method
Temperature:85°C±2°C
Time:1000h (+48h.-0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature:-40°C±2°C
Time:1000h (+48h.-0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature:40°C±2°C
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Humidity:90%(RH) to 95%(RH)
Time:1000h (+48h.-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step:-40°C±2°C / 30min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step:+85°C±2°C / 30min±3 min
4 step: Ordinary temp. / 10min to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
9.Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
Electrode which is connected to the inner end of the coil.
2.0±0.1
4.0±0.1
φ 1.5±00.1
1.75±0.1
4.0±0.1
1.19±0.1
(in mm)
Direction of feed
0.8max
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.5/9
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Top tape
Bottom tape
5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off
Top tape
165 to 180 degree
Bottom tape
F
300mm/min
0.1N to 0.6N
(minimum value is typical)
Peeling off force
Base tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
210 min.
Empty tape
Top tape
13.0±0.2
φ
60+1
φ
-
0
Direction of feed
21.0±0.8
φ
+1
-0
9.0
13.0±1.4
180 +0
φ
(in mm)
-3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2),
Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
Second digit
Third, Fourth digit : Day
: Year / Last digit of year
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
(3) Serial No.
∗2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
D
Label
W
H
H
186
186
93
5
D
∗ Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.6/9
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Chip coil
c
a
b
c
0.7~0.9
1.8~2.2
0.6~0.8
a
b
Solder Resist
Land
(in mm)
11.2 Flux, Solder
･Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
･Use Sn-3.0Ag-0.5Cu solder.
･Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
･Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
･Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Temp.
260℃
230℃
Limit Profile
(℃)
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
2 times
2 times
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.7/9
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
Φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
1/3T≦t≦T
Recommendable
T : thickness of product
t
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
11.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length: a＜b) to the mechanical
b
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation
C
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A＞C＞B≅D.
B
Seam
D
A
a
b
Slit
Length:a b
<
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.8/9
11.8 Resin coating
Inductance value may be changed due to the large cure-stress of the resin when products are coated
with resin. In this case, take care when you select resin to prevent the deterioration of the product quality.
11.9 Caution for use
The pattern of the chip coil is covered with the protection film. But the handing the chip coil shall be
taken care so that the chip coil would not be damaged with the pick-up nozzle, the sharp substance
and so on.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C ~ 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12．! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO.,LTD
Re erence Only
Spec No.JELF243C-0009J-01
P.9/9
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
Zx
Zm
V
2
V
1
V1
I1
A
C
B
D
V2
I 2
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
Zx=
，
(3) Thus,the relation between Zx and Zm is following;
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Zx= α
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.771nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
2πf
Im(Zx)
Re(Zx)
Lx :Inductance of chip coil
Qx:Q of chip coil
Qx=
Lx=
，
f:Measuring frequency
MURATA MFG.CO.,LTD
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