LQW18AN94NJ8ZD [MURATA]

General Purpose Inductor,;
LQW18AN94NJ8ZD
型号: LQW18AN94NJ8ZD
厂家: muRata    muRata
描述:

General Purpose Inductor,

测试 射频感应器 电感器
文件: 总12页 (文件大小:258K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Reference Only  
CHIP COIL (CHIP INDUCTORS) LQW18AN□□□□8ZD  
SpecNo.JELF243A-9133-01  
P.1/12  
Murata Standard Reference Specification AEC-Q200】  
1.Scope  
This reference specification applies to LQW18AN_8ZD series, Chip coil(Chip Inductors) for automotive Electronics  
based on AEC-Q200 except for Power train and Safety.  
2.Part Numbering  
(ex)  
LQ  
W
18  
A
N
2N2  
C
8
Z
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Application  
Packaging  
(L×W)  
and  
Z:Automotive D:Taping  
Characteristics  
3.Rating  
Operating Temperature Range.  
–55°C to +125°C  
Storage Temperature Range.  
–55°C to +125°C  
Self  
Rated  
DC  
Resistance  
(max.)  
ESD  
Rank  
6: 25kV  
Inductance  
Customer  
Part Number  
MURATA  
Part Number  
Q
(min.)  
Resonant  
Current  
Frequency  
(mA)  
(nH)  
Tolerance  
C:±0.2nH  
(MHz min.)  
LQW18AN2N2C8ZD  
LQW18AN2N4C8ZD  
LQW18AN3N0C8ZD  
LQW18AN3N9B8ZD  
LQW18AN3N9C8ZD  
LQW18AN3N9G8ZD  
LQW18AN4N1B8ZD  
LQW18AN4N1C8ZD  
LQW18AN4N1G8ZD  
LQW18AN4N2B8ZD  
LQW18AN4N2C8ZD  
LQW18AN4N2G8ZD  
LQW18AN4N3B8ZD  
LQW18AN4N3C8ZD  
LQW18AN4N3G8ZD  
LQW18AN4N7B8ZD  
LQW18AN4N7C8ZD  
LQW18AN4N7G8ZD  
LQW18AN4N9B8ZD  
LQW18AN4N9C8ZD  
LQW18AN4N9G8ZD  
LQW18AN5N6C8ZD  
LQW18AN5N6G8ZD  
LQW18AN6N0C8ZD  
LQW18AN6N0G8ZD  
LQW18AN6N5C8ZD  
LQW18AN6N5G8ZD  
LQW18AN6N8C8ZD  
LQW18AN6N8G8ZD  
LQW18AN7N2C8ZD  
LQW18AN7N2C8ZD  
2.2  
2.4  
3.0  
24  
18  
13  
0.018  
0.026  
0.17  
3200  
15000  
2400  
670  
3.9  
4.1  
4.2  
4.3  
4.7  
4.9  
30  
0.028  
10000  
2200  
B:±0.1nH  
C:±0.2nH  
G:±2%  
35  
25  
0.036  
0.054  
0.081  
11600  
10400  
7300  
2100  
1500  
1200  
6
23  
38  
5.6  
6
C:±0.2nH  
G:±2%  
6.5  
6.8  
7.2  
40  
38  
0.040  
6650  
1900  
C:±0.2nH  
G:±2%  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.2/12  
Self  
Inductance  
DC  
Rated  
Current  
(mA)  
ESD  
Rank  
6: 25kV  
Customer  
MURATA  
Q
Resonant  
Frequency  
(MHz min.)  
Resistance  
(max.)  
Part Number  
Part Number  
(min.)  
(nH)  
Tolerance  
LQW18AN7N5C8ZD  
LQW18AN7N5G8ZD  
LQW18AN8N2C8ZD  
LQW18AN8N2G8ZD  
LQW18AN8N4C8ZD  
LQW18AN8N4G8ZD  
LQW18AN8N7C8ZD  
LQW18AN8N7G8ZD  
LQW18AN9N1C8ZD  
LQW18AN9N1G8ZD  
LQW18AN9N5C8ZD  
LQW18AN9N5G8ZD  
LQW18AN9N9C8ZD  
LQW18AN9N9G8ZD  
LQW18AN10NG8ZD  
LQW18AN10NJ8ZD  
LQW18AN11NG8ZD  
LQW18AN11NJ8ZD  
LQW18AN12NG8ZD  
LQW18AN12NJ8ZD  
LQW18AN13NG8ZD  
LQW18AN13NJ8ZD  
7.5  
35  
38  
40  
0.048  
7000  
1500  
8.2  
8.4  
8.7  
9.1  
9.5  
9.9  
10  
C:±0.2nH  
G:±2%  
0.052  
4750  
1600  
11  
12  
37  
38  
0.064  
5000  
1500  
13  
6
LQW18AN15NG8ZD  
LQW18AN15NJ8ZD  
15  
16  
LQW18AN16NG8ZD  
LQW18AN16NJ8ZD  
LQW18AN17NG8ZD  
17  
18  
19  
22  
23  
24  
25  
27  
28  
30  
LQW18AN17NJ8ZD  
LQW18AN18NG8ZD  
LQW18AN18NJ8ZD  
LQW18AN19NG8ZD  
LQW18AN19NJ8ZD  
LQW18AN22NG8ZD  
LQW18AN22NJ8ZD  
LQW18AN23NG8ZD  
LQW18AN23NJ8ZD  
LQW18AN24NG8ZD  
LQW18AN24NJ8ZD  
LQW18AN25NG8ZD  
LQW18AN25NJ8ZD  
LQW18AN27NG8ZD  
LQW18AN27NJ8ZD  
LQW18AN28NG8ZD  
LQW18AN28NJ8ZD  
LQW18AN30NG8ZD  
LQW18AN30NJ8ZD  
0.075  
4600  
1400  
G:±2%  
J:±5%  
0.086  
3450  
1300  
40  
0.098  
0.12  
3600  
2880  
1200  
1100  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.3/12  
Self  
Inductance  
DC  
Rated  
Current  
(mA)  
ESD  
Rank  
6: 25kV  
Customer  
MURATA  
Q
Resonant  
Frequency  
(MHz min.)  
Resistance  
(max.)  
Part Number  
Part Number  
(min.)  
(nH)  
Tolerance  
LQW18AN31NG8ZD  
LQW18AN31NJ8ZD  
LQW18AN33NG8ZD  
LQW18AN33NJ8ZD  
LQW18AN34NG8ZD  
LQW18AN34NJ8ZD  
LQW18AN36NG8ZD  
LQW18AN36NJ8ZD  
LQW18AN37NG8ZD  
LQW18AN37NJ8ZD  
LQW18AN39NG8ZD  
LQW18AN39NJ8ZD  
LQW18AN41NG8ZD  
LQW18AN41NJ8ZD  
LQW18AN43NG8ZD  
LQW18AN43NJ8ZD  
LQW18AN44NG8ZD  
LQW18AN44NJ8ZD  
LQW18AN47NG8ZD  
LQW18AN47NJ8ZD  
LQW18AN48NG8ZD  
LQW18AN48NJ8ZD  
LQW18AN51NG8ZD  
LQW18AN51NJ8ZD  
LQW18AN52NG8ZD  
LQW18AN52NJ8ZD  
LQW18AN56NG8ZD  
LQW18AN56NJ8ZD  
LQW18AN58NG8ZD  
LQW18AN58NJ8ZD  
LQW18AN68NG8ZD  
LQW18AN68NJ8ZD  
LQW18AN69NG8ZD  
LQW18AN69NJ8ZD  
LQW18AN72NG8ZD  
LQW18AN72NJ8ZD  
LQW18AN73NG8ZD  
LQW18AN73NJ8ZD  
LQW18AN75NG8ZD  
LQW18AN75NJ8ZD  
LQW18AN78NG8ZD  
LQW18AN78NJ8ZD  
LQW18AN82NG8ZD  
LQW18AN82NJ8ZD  
LQW18AN83NG8ZD  
LQW18AN83NJ8ZD  
LQW18AN91NG8ZD  
LQW18AN91NJ8ZD  
31  
0.11  
0.15  
0.20  
3150  
3000  
1100  
1050  
910  
33  
34  
36  
37  
39  
41  
43  
44  
47  
48  
51  
52  
56  
58  
68  
69  
72  
73  
75  
78  
82  
83  
91  
40  
37  
0.16  
0.21  
3280  
2780  
1000  
840  
40  
32  
0.23  
2700  
830  
G:±2%  
J:±5%  
6
35  
38  
35  
0.27  
0.26  
0.30  
2750  
2600  
2400  
750  
770  
700  
37  
34  
0.38  
0.47  
2380  
2330  
630  
560  
28  
0.41  
2280  
590  
34  
33  
0.5  
2230  
1900  
550  
520  
0.54  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.4/12  
Self  
Inductance  
DC  
Rated  
Current  
(mA)  
ESD  
Rank  
6: 25kV  
Customer  
MURATA  
Q
Resonant  
Frequency  
(MHz min.)  
Resistance  
(max.)  
Part Number  
Part Number  
(min.)  
(nH)  
Tolerance  
LQW18AN94NG8ZD  
LQW18AN94NJ8ZD  
LQW18ANR10G8ZD  
LQW18ANR10J8ZD  
LQW18ANR11G8ZD  
LQW18ANR11J8ZD  
LQW18ANR12G8ZD  
LQW18ANR12J8ZD  
LQW18ANR15G8ZD  
LQW18ANR15J8ZD  
LQW18ANR18G8ZD  
LQW18ANR18J8ZD  
LQW18ANR20G8ZD  
LQW18ANR20J8ZD  
LQW18ANR21G8ZD  
LQW18ANR21J8ZD  
LQW18ANR22G8ZD  
LQW18ANR22J8ZD  
LQW18ANR25G8ZD  
LQW18ANR25J8ZD  
LQW18ANR27G8ZD  
LQW18ANR27J8ZD  
LQW18ANR30G8ZD  
LQW18ANR30J8ZD  
LQW18ANR33G8ZD  
LQW18ANR33J8ZD  
LQW18ANR36G8ZD  
LQW18ANR36J8ZD  
94  
34  
0.63  
1750  
490  
450  
100  
110  
120  
150  
180  
200  
210  
220  
250  
270  
300  
330  
360  
390  
0.7  
1730  
1650  
1580  
1380  
1350  
32  
28  
25  
0.72  
0.87  
1.65  
1.74  
1.98  
2.08  
2.28  
2.42  
3.12  
3.84  
3.98  
4.23  
420  
310  
290  
G:±2%  
J:±5%  
27  
25  
6
280  
1330  
250  
260  
220  
24  
1250  
1200  
1100  
1050  
1100  
25  
190  
LQW18ANR39G8ZD  
LQW18ANR39J8ZD  
100  
50  
0
0
85  
Temperature ()  
125  
.
Derating of Rated Current depend on Operating Temperature  
4. Testing Conditions  
Unless otherwise specified》  
In case of doubt》  
Temperature : Ordinary Temperature / 15°C to 35°C  
Temperature : 20°C±2°C  
Humidity : 60%(RH) to 70%(RH)  
Atmospheric Pressure : 86kPa to 106 kPa  
Humidity  
: Ordinary Humidity  
/ 25%(RH) to 85%(RH)  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
5. Appearance and Dimensions  
1.65 ± 0.1  
P.5/12  
Unit Mass (Typical value)  
0.0034g  
0.90 ± 0.1  
0.99 ± 0.1  
0.2 ± 0.1  
(in mm)  
0.26 ± 0.1  
6.Electrical Performance  
No.  
Item  
Specification  
Inductance shall meet item 3.  
Test Method  
Measuring Equipment:  
Agilent 4287A or equivalent  
Measuring Frequency:  
<Inductance> 100MHz  
<Q> 250MHz/ 2.2nH~44nH  
6.1 Inductance  
200MHz/ 47nH~69nH  
150MHz/ 72nH~150nH  
100MHz/ 180nH~390nH  
Measuring Condition:  
Test signal level / about 10mA  
Electrical length / 0.94 cm  
Measuring Fixture: Agilent 16197A  
Position coil under test as shown in below  
and contact coil with each terminal by  
adding weight.  
6.2  
Q
Q shall meet item 3.  
1608 Size Guide  
Measuring Method:See P.11  
<Electrical Performance:Measuring  
Method of Inductance/Q>  
6.3 DC Resistance  
DC Resistance shall meet item 3.  
S.R.F shall meet item 3.  
Measuring Equipment:Digital multi meter  
6.4 Self Resonant  
Frequency(S.R.F)  
Measuring Equipment:  
Agilent 5230A or equivalent  
6.5 Rated Current  
Self temperature rise shall be  
limited to 40°C max.  
The rated current is applied.  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.6/12  
7. Q200 Requirement  
7.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)  
AEC-Q200 Rev.D issued June 1. 2010  
AEC-Q200  
Murata Specification / Deviation  
Meet Table A after testing.  
No  
3
Stress  
Test Method  
1000hours at 125 deg C  
Set for 24hours at room  
temperature, then  
measured.  
High  
Temperature  
Exposure  
Table A  
Appearance  
No damage  
Inductance  
(at 100MHz)  
Within ±5%  
4
Temperature  
Cycling  
1000cycles  
Meet Table A after testing.  
-40 deg C to +125 deg C  
Set for 24hours at room  
temperature,then  
measured.  
7
8
Biased Humidity 1000hours at 85 deg C,  
Meet Table A after testing.  
Meet Table A after testing.  
85%RH  
unpowered..  
Operational Life Apply Rated Current 125  
deg C 1000hours  
Set for 24hours at room  
temperature, then  
measured  
9
External Visual  
Visual inspection  
No abnormalities  
No defects  
10 Physical  
Dimension  
Meet ITEM 4  
Style and Dimensions)  
12 Resistance  
to Solvents  
Per  
MIL-STD-202  
Method 215  
Not Applicable  
13 Mechanical  
Shock  
Per MIL-STD-202  
Method 213  
Meet Table A after testing.  
Condition C : 100g’s(0.98N),  
6ms, Half sine, 12.3ft/s  
14 Vibration  
5g's(0.049N) for 20 minutes, Meet Table A after testing.  
12cycles each of 3  
orientations  
Test from 10-2000Hz.  
15 Resistance  
to Soldering  
Heat  
No-heating  
Pre-heating: 150C +/-10 deg C, 60s to 90s  
Meet Table A after testing.  
Solder temperature  
260C+/-5 deg C  
Immersion time 10s  
17 ESD  
Per AEC-Q200-002  
Per J-STD-002  
ESD Rank: Refer to Item 3. Rating.  
Meet Table A after testing.  
18 Solderbility  
Method b : Not Applicable  
95% of the terminations is to be soldered.  
(Except exposed wire)  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.7/12  
AEC-Q200  
Murata Specification / Deviation  
No  
19 Electrical  
Characterization  
Stress  
Test Method  
Measured : Inductance  
No defects  
20 Flammability  
21 Board Flex  
Per UL-94  
Not Applicable  
Epoxy-PCB(1.6mm)  
Deflection 2mm(min)  
Holding time 60s  
Meet Table B after testing.  
Table B  
Appearance  
No damage  
DC resistance  
change  
Within ±10%  
22 Terminal Strength Per AEC-Q200-006  
Murata Deviation Request: 10N/5s  
No defect  
A force of 17.7N  
for 60s  
8.Specification of Packaging  
8.1 Appearance and Dimensions of paper tape (8mm-wide)  
2.0±0.05  
4.0±0.1  
1.5±0.1  
0
1.75±0.1  
φ
4.0±0.1  
1.1±0.05  
(in mm)  
Direction of feed  
1.1max  
1.15±0.05  
8.2 Specification of Taping  
(1) Packing quantity (standard quantity)  
4,000 pcs. / reel  
(2) Packing Method  
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.  
(3) Sprocket hole  
The sprocket holes are to the right as the tape is pulled toward the user.  
(4) Spliced point  
Base tape and Top tape has no spliced point.  
(5) Missing components number  
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,  
and are not continuous. The Specified quantity per reel is kept.  
8.3 Pull Strength  
Top tape  
5N min.  
Bottom tape  
8.4 Peeling off force of cover tape  
Top tape  
165 to 180 degree  
Bottom tape  
F
Speed of Peeling off  
300mm/min  
0.1N to 0.6N  
(minimum value is typical)  
Peeling off force  
Base tape  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.8/12  
8.5 Dimensions of Leader-tape,Trailer and Reel  
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.  
Trailer  
160 min.  
Leader  
2.0±0.5  
Label  
190 min.  
210 min.  
Empty tape  
Top tape  
13.0±0.2  
φ
60+1  
φ
-
0
Direction of feed  
21.0±0.8  
φ
+1  
-0  
9.0  
(in mm)  
13.0±1.4  
180 +0  
φ
-3  
8.6 Marking for reel  
Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking (2),  
Quantity etc ・・・  
1) <Expression of Inspection No.>  
□□ OOOO ×××  
(1)  
(2)  
(3)  
(1) Factory code  
(2) Date  
First digit: Year / Last digit of year  
Second digit: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D  
Third, Fourth digit : Day  
(3) Serial No.  
2) <Expression of RoHS Marking >  
ROHS – Y ()  
(1) (2)  
(1) RoHS regulation conformity parts.  
(2) MURATA classification number  
8.7 Marking for Outside package (corrugated paper box)  
Customer name, Purchasing order number, Customer part number, MURATA part number,  
RoHS Marking (2) ,Quantity, etc ・・・  
8.8. Specification of Outer Case  
Outer Case Dimensions  
(mm)  
Standard Reel Quantity  
in Outer Case (Reel)  
Label  
W
D
H
H
186  
186  
93  
5
D
W
Above Outer Case size is typical. It depends on a quantity of an order.  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.9/12  
9. Caution  
9.1 Rating  
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and  
short/open circuit of the product or falling off the product may be occurred.  
9.2 Surge current  
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may  
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.  
Please contact us in advance in case of applying the surge current.  
9.3 Fail-safe  
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be  
caused by the abnormal function or the failure of our product.  
9.4 Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially  
high reliability for the prevention of defects which might directly cause damage to the third party's life,  
body or property.  
(1) Aircraft equipment  
(6) Transportation equipment (trains, ships, etc.)  
(7) Traffic signal equipment  
(8) Disaster prevention / crime prevention equipment  
(9) Data-processing equipment  
(10) Applications of similar complexity and /or reliability  
requirements to the applications listed in the above  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
10. Notice  
Products can only be soldered with reflow.  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
10.1 Land pattern designing  
Recommended land patterns for reflow soldering are as follows:  
These have been designed for Electric characteristics and solderability.  
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance  
or solderability may be affected, or result to "position shift" in soldering process.  
Chip Coil  
Land  
c
Solder resist  
a
b
c
0.86  
2.00  
1.15  
a
(in mm)  
b
10.2 Flux, Solder  
Use rosin-based flux.  
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.  
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).  
Don’t use water-soluble flux.  
Use Sn-3.0Ag-0.5Cu solder.  
Standard thickness of solder paste : 100μm to 150μm.  
10.3 Reflow soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and product  
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that  
the temperature difference is limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting  
in the deterioration of product quality.  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
Reflow soldering profile  
P.10/12  
Temp.  
(℃)  
260℃  
245℃±3℃  
230℃  
220℃  
Limit Profile  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
Limit Profile  
Pre-heating  
150°C180°C 90s±30s  
Heating  
above 220°C30s60s  
245°C±3°C  
above 230°C60s max.  
260°C,10s  
Peak temperature  
Cycle of reflow  
2 times  
2 times  
10.4 Reworking with soldering iron  
The following conditions must be strictly followed when using a soldering iron.  
Pre-heating  
150°C,1 min  
350°C max.  
80W max.  
φ3mm max.  
3(+1,-0)s  
Tip temperature  
Soldering iron output  
Tip diameter  
Soldering time  
Time  
2 times  
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the  
crack on the products due to the thermal shock.  
10.5 Solder Volume  
Solder shall be used not to be exceeded the upper limits as shown below.  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
Upper Limit  
1/3TtT  
Recommendable(t)  
T
Tthickness of product  
10.6 Product’s location  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to  
warping the board.  
Products direction]  
a
Products shall be located in the sideways  
direction (Length:ab) to the mechanical  
b
stress.  
Poor example  
Good example  
(2) Products location on P.C.B. separation  
C
Products (A,B,C,D) shall be located carefully  
so that products are not subject to the  
mechanical stress due to warping the board.  
Because they may be subjected the mechanical  
stress in order of ACB D.  
B
Seam  
D
A
a
b
Slit  
Length:a b  
<
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.11/12  
10.7 Cleaning Conditions  
Products shall be cleaned on the following conditions.  
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)  
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance  
phenomenon at the mounted products and P.C.B.  
Power : 20 W / l max.  
(3) Cleaner  
Frequency : 28kHz to 40kHz  
Time : 5 min max.  
1. Alcohol type cleaner  
Isopropyl alcohol (IPA)  
2. Aqueous agent  
PINE ALPHA ST-100S  
(4) There shall be no residual flux and residual cleaner after cleaning.  
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized  
water in order to remove the cleaner.  
(5) Other cleaning  
Please contact us.  
10.8 Resin coating  
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.  
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or  
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by  
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.  
So, please pay your careful attention in when you select resin in case of coating/molding the products  
with the resin.  
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products  
mounted on your board.  
10.9 Caution for use  
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to  
the winding portion to prevent the breaking of wire.  
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.  
10.10 Notice of product handling at mounting  
In some mounting machines,when picking up components support pin pushes up the components from the  
bottom of base tape. In this case, please remove the support pin. The support pin may damage the components  
and break wire.  
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser  
recognition. (There is no problem with the permeation and reflection type.)  
10.11 Handling of a substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the  
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw  
to the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
MURATA MFG.CO., LTD  
Reference Only  
SpecNo.JELF243A-9133-01  
P.12/12  
10.12 Storage and Handing Requirements  
(1) Storage period  
Use the products within 12 months after delivered.  
Solderability should be checked if this period is exceeded.  
(2) Storage conditions  
Products should be stored in the warehouse on the following conditions.  
Temperature -10°C to 40°C  
Humidity  
15% to 85% relative humidity No rapid change on temperature and humidity  
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause  
oxidization of electrode, resulting in poor solderability.  
Products should not be stored on bulk packaging condition to prevent the chipping of the  
core and the breaking of winding wire caused by the collision between the products.  
Products should be stored on the palette for the prevention of the influence from humidity,  
dust and so on.  
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.  
(3) Handling Condition  
Care should be taken when transporting or handling product to avoid excessive vibration or  
mechanical shock.  
11. ! Note  
(1)Please make sure that your product has been evaluated in view of your specifications with our product being  
mounted to your product.  
(2)You are requested not to use our product deviating from the reference specifications.  
(3)The contents of this reference specification are subject to change without advance notice.  
Please approve our product specifications or transact the approval sheet for product specifications  
before ordering.  
<Electrical Performance:Measuring Method of Inductance / Q>  
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.  
2
1
I
I
A
C
B
D
A
C
B
D
V1  
I1  
V2  
I 2  
=
Zx  
Zm  
V
2
V
1
Test Head  
Test fixture  
Product  
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.  
V1  
I 1  
V2  
I 2  
Zm=  
Zx=  
(3) Thus,the relation between Zx and Zm is following;  
Zm-β  
where, α= D / A =1  
Zx= α  
1-ZmΓ  
β= B / D =Zsm-(1-Yom Zsm)Zss  
Γ= C / A =Yom  
Zsm : measured impedance of short chip  
Zssa: residual impedance of short chip (0.771nH)  
Yom: measured admittance when opening the fixture  
(4) Lx shall be calculated with the following equation.  
Im(Zx)  
Im(Zx)  
Re(Zx)  
Lx : Inductance of chip coil  
Qx : Q of chip coil  
Lx=  
,
Qx =  
2πf  
f
: Measuring frequency  
MURATA MFG.CO., LTD  

相关型号:

LQW18AN94NJ8ZJ

Inductance
MURATA

LQW18AN9N1C00

Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
MURATA

LQW18AN9N1C00B

Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
MURATA

LQW18AN9N1C00D

Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
MURATA

LQW18AN9N1C00J

Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
MURATA

LQW18AN9N1C00p

Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
MURATA

LQW18AN9N1C0Z

Inductance
MURATA

LQW18AN9N1C0ZB

Inductance
MURATA

LQW18AN9N1C0ZD

Inductance
MURATA

LQW18AN9N1C0ZJ

Inductance
MURATA