LQW18ANR18G00D_技术文档

Reference Only

SpecNo.JELF243A-0024Y-01

P.1/11

CHIP COIL (CHIP INDUCTORS) LQW18AN□□□□00D REFERENCE SPECIFICATION

1.Scope

This reference specification applies to LQW18AN_00 series, Chip coil (Chip Inductors).

2.Part Numbering

(ex)

LQ

W

18

A

N

2N2

D

0

D

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

and

Characteristics

D:Taping

*B:Bulk

*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)

3.Rating

・Operating Temperature Range.

・Storage Temperature Range.

–55°C to +125°C

DC

Resistance

(Ω max.)

Self Resonant

Frequency

(MHz min.)

Rated

Current

(mA)

Inductance

Customer

Part Number

MURATA

Part Number

Q

(min.)

(nH)

2.2

Tolerance

LQW18AN2N2D00D

LQW18AN3N6C00D

LQW18AN3N6D00D

LQW18AN3N9C00D

LQW18AN3N9D00D

LQW18AN4N3C00D

LQW18AN4N3D00D

LQW18AN4N7D00D

LQW18AN5N6C00D

LQW18AN5N6D00D

LQW18AN6N2C00D

LQW18AN6N2D00D

LQW18AN6N8C00D

LQW18AN6N8D00D

LQW18AN7N5C00D

LQW18AN7N5D00D

LQW18AN8N2C00D

LQW18AN8N2D00D

LQW18AN8N7C00D

LQW18AN8N7D00D

LQW18AN9N1C00D

LQW18AN9N1D00D

LQW18AN9N5D00D

LQW18AN10NG00D

LQW18AN10NJ00D

LQW18AN11NG00D

LQW18AN11NJ00D

LQW18AN12NG00D

LQW18AN12NJ00D

LQW18AN13NG00D

LQW18AN13NJ00D

LQW18AN15NG00D

LQW18AN15NJ00D

LQW18AN16NG00D

LQW18AN16NJ00D

LQW18AN18NG00D

LQW18AN18NJ00D

LQW18AN20NG00D

LQW18AN20NJ00D

LQW18AN22NG00D

LQW18AN22NJ00D

D:±0.5nH

16

25

0.042

700

3.6

3.9

C:±0.2nH

D:±0.5nH

0.059

850

4.3

4.7

5.6

D:±0.5nH

6.2

6.8

7.5

8.2

8.7

0.082

750

C:±0.2nH

D:±0.5nH

6000

35

9.1

9.5

10

0.11

650

D:±0.5nH

11

12

13

15

16

18

20

22

0.13

600

G:±2%

J:±5%

5500

40

0.16

0.17

550

500

4900

4600

MURATA MFG.CO., LTD

Reference Only

DC

SpecNo.JELF243A-0024Y-01

P.2/11

Self Resonant

Frequency

(MHz min.)

Rated

Current

(mA)

Inductance

Customer

Part Number

MURATA

Q

Resistance

(Ω max.)

Part Number

(min.)

(nH)

Tolerance

LQW18AN24NG00D

LQW18AN24NJ00D

LQW18AN27NG00D

LQW18AN27NJ00D

LQW18AN30NG00D

LQW18AN30NJ00D

LQW18AN33NG00D

LQW18AN33NJ00D

LQW18AN36NG00D

LQW18AN36NJ00D

LQW18AN39NG00D

LQW18AN39NJ00D

LQW18AN43NG00D

LQW18AN43NJ00D

LQW18AN47NG00D

LQW18AN47NJ00D

LQW18AN51NG00D

LQW18AN51NJ00D

LQW18AN56NG00D

LQW18AN56NJ00D

LQW18AN62NG00D

LQW18AN62NJ00D

LQW18AN68NG00D

LQW18AN68NJ00D

LQW18AN72NG00D

LQW18AN72NJ00D

LQW18AN75NG00D

LQW18AN75NJ00D

LQW18AN82NG00D

LQW18AN82NJ00D

LQW18AN91NG00D

LQW18AN91NJ00D

LQW18ANR10G00D

LQW18ANR10J00D

LQW18ANR11G00D

LQW18ANR11J00D

LQW18ANR12G00D

LQW18ANR12J00D

LQW18ANR13G00D

LQW18ANR13J00D

LQW18ANR15G00D

LQW18ANR15J00D

LQW18ANR16G00D

LQW18ANR16J00D

LQW18ANR18G00D

LQW18ANR18J00D

LQW18ANR20G00D

LQW18ANR20J00D

LQW18ANR22G00D

LQW18ANR22J00D

LQW18ANR27G00D

LQW18ANR27J00D

LQW18ANR33G00D

LQW18ANR33J00D

LQW18ANR39G00D

LQW18ANR39J00D

LQW18ANR47G00D

LQW18ANR47J00D

24

27

3800

3700

3300

3200

2900

2800

2700

2600

2500

2400

2300

2200

2100

2050

2000

1900

1800

1700

1600

1450

1400

1350

1300

1250

1200

960

500

440

0.21

0.23

0.26

0.29

30

420

400

380

33

40

36

39

43

47

51

0.33

0.35

0.51

0.38

370

360

280

340

56

38

34

32

62

68

72

0.56

270

75

G:±2%

J:±5%

82

0.60

0.64

0.68

1.2

1.3

1.4

1.5

2.1

2.2

2.4

2.5

3.4

5.5

6.2

7.0

250

230

220

200

180

170

160

150

140

91

100

110

120

130

150

160

180

200

220

270

330

390

470

25

30

120

110

85

800

700

80

75

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.3/11

4. Testing Conditions

《Unless otherwise specified》

《In case of doubt》

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)

Temperature : 20°C±2°C

Humidity : 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106 kPa

5. Appearance and Dimensions

1.6±0.2

■Unit Mass (Typical value)

0.003g

(in mm)

0.3±0.1

6.Electrical Performance

No.

Item

Specification

Inductance shall meet item 3.

Test Method

6.1 Inductance

Measuring Equipment:

KEYSIGHT E4991A or equivalent

Measuring Frequency:

<Inductance> 100MHz

<Q> 250MHz/ 2.2nH~39nH

200MHz/ 43nH~68nH

150MHz/ 72nH~160nH

100MHz/ 180nH~470nH

Measuring Condition:

Test signal level / about 0dBm

Electrode spaces / 1.0mm

Electrical length / 0.94cm

Measuring Fixture: KEYSIGHT 16193A

Position coil under test as shown in below

and contact coil with each terminal by

adding weight.

6.2

Q

Q shall meet item 3.

1mm

6.97mm

Measuring Method:See the endnote.

<Electrical Performance:Measuring

Method of Inductance/Q>

6.3 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment:Digital multi meter

6.4 Self Resonant

Frequency(S.R.F)

Measuring Equipment:

KEYSIGHT N5230A or equivalent

6.5 Rated Current

Self temperature rise shall be

limited to 20°C max.

The rated current is applied.

Inductance Change: within ±10%

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.4/11

7.Mechanical Performance

No.

Item

Specification

Chip coil shall not be damaged

after tested as test method.

Test Method

Substrate:Glass-epoxy substrate

Chip Coil

7.1 Shear Test

2.2

Pattern

Solder resist

Substrate

0.7

(in mm)

F

0.7

Applied Direction:

Chip Coil

Substrate

Force:5N

Hold Duration:5s±1s

7.2 Bending Test

Substrate:Glass-epoxy substrate

(100mm×40mm×1.6mm)

Speed of Applying Force:1mm / s

Deflection:2mm

Hold Duration:30s

Pressure jig

R340

F

Deflection

(in mm)

45

Product

7.3 Vibration

Chip coil shall not be damaged

after tested as test method.

Oscillation Frequency:

10Hz~55Hz~10Hz for 1 min

Total Amplitude:1.5mm

Testing Time:

A period of 2 hours in each of 3 mutually

perpendicular directions.

7.4 Solderability

The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux:Ethanol solution of rosin,25(wt)%

Includes activator equivalent to 0.06(wt)%

chlorine.(immersed for 5s to 10s)

Solder:Sn-3.0Ag-0.5Cu

Pre-Heating:150°C±10°C / 60s to 90s

Solder Temperature:240°C±5°C

Immersion Time:3s±1s

7.5 Resistance to

Soldering Heat

Appearance:No damage

Inductance Change: within ±5%

Flux:Ethanol solution of rosin,25(wt)%

Includes activator equivalent to 0.06(wt)%

Chlorine.(immersed for 5s to 10s)

Solder:Sn-3.0Ag-0.5Cu

Pre-Heating:150°C±10°C / 60s to 90s

Solder Temperature:270°C±5°C

Immersion Time:10s±1s

Then measured after exposure in the room

condition for 24h±2h.

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.5/11

8.Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Appearance:No damage

Inductance Change: within ±5%

Q Change: within ±20%

Test Method

Temperature:125°C±2°C

Time:1000h (+48h,0h)

Then measured after exposure in the room

condition for 24h±2h.

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance:No damage

Inductance Change: within ±5%

Q Change: within ±20%

Temperature:-55°C±2°C

Time:1000h (+48h,-0h)

Then measured after exposure in the room

condition for 24h±2h.

Temperature:40°C±2°C

Humidity:90%(RH) to 95%(RH)

Time:1000h (+48h,-0h)

Then measured after exposure in the room

condition for 24h±2h.

8.4 Temperature

Cycle

1 cycle:

1 step:-55°C±2°C / 30min±3 min

2 step:Ordinary temp. / 10min to 15 min

3 step:+125°C±2°C / 30min±3 min

4 step:Ordinary temp. / 10min to15 min

Total of 10 cycles

Then measured after exposure in the room

condition for 24h±2h.

9.Specification of Packaging

9.1 Appearance and Dimensions of paper tape (8mm-wide)

2.0±0.05

4.0±0.1

φ

1.5±^0.1

0

1.75±0.1

4.0±0.1

(in mm)

1.0±0.05

Direction of feed

1.1 max.

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

4,000 pcs. / reel

(2) Packing Method

Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Base tape and Top tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,

and are not continuous. The Specified quantity per reel is kept.

9.3 Pull Strength

Top tape

5N min.

Bottom tape

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.6/11

9.4 Peeling off force of cover tape

Top tape

165 to 180 degree

Speed of Peeling off

300mm/min

F

0.1N to 0.6N

(minimum value is typical)

Peeling off force

Bottom tape

Base tape

9.5 Dimensions of Leader-tape,Trailer and Reel

There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.

Trailer

160 min.

Leader

2.0±0.5

Label

190 min.

210 min.

Empty tape

Top tape

13.0±0.2

φ

60⁺¹

φ

-

0

Direction of feed

21.0±0.8

φ

+1

-0

9.0

(in mm)

13.0±1.4

180 ⁺⁰

φ

-3

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking (∗2),

Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□ OOOO ×××

(1)

(2)

(3)

(1) Factory code

(2) Date

First digit: Year / Last digit of year

Second digit: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) <Expression of RoHS Marking >

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking (∗2) ,Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions

Standard Reel Quantity

in Outer Case (Reel)

(mm)

Label

W

D

H

186

93

5

D

∗ Above Outer Case size is typical. It depends on a quantity of an order.

W

10. ！ Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.7/11

11. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land patterns for reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance

or solderability may be affected, or result to "position shift" in soldering process.

Chip Coil

Land

c

Solder resist

A

B

C

0.6 to 0.8

1.9 to 2.0

0.7 to 1.0

a

(in mm)

b

11.2 Flux, Solder

・Use rosin-based flux.

Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 100μm to 150μm.

11.3 Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product

surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that

the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

・Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C 、90s±30s

Heating

above 220°C､30s～60s

245°C±3°C

above 230°C､60s max.

260°C,10s

Peak temperature

Cycle of reflow

2 times

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.8/11

11.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Time

2 times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable(t)

1/3T≦t≦T

T

T：thickness of product

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

a

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical

stress.

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

A > D *1

A > B

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the board separation surface.

A > C

C

B

Seam

D

A

a

b

Slit

Length:a b

<

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

(3) Mounting Components Near Screw Holes

P.9/11

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention in when you select resin in case of coating/molding the products

with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products

mounted on your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

11.10 Notice of product handling at mounting

In some mounting machines,when picking up components support pin pushes up the components from the

bottom of base tape. In this case, please remove the support pin. The support pin may damage the components

and break wire.

In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser

recognition. (There is no problem with the permeation and reflection type.)

11.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw

to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.10/11

11.12 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause

oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the

core and the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity,

dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or

mechanical shock.

12．! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0024Y-01

P.11/11

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

2

1

I

A

C

B

D

A

C

B

D

V₁

I₁

V₂

I ₂

=

Zx

Zm

V

2

V

1

Test Head

Test fixture

Product

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

V₁

I ₁

V₂

I ₂

Zm=

，

Zx=

(3) Thus,the relation between Zx and Zm is following;

Zm-β

where, α= D / A =1

β= B / D =Zsm-(1-Yom Zsm)Zss

Zx= α

1-ZmΓ

Γ= C / A =Yom

Zsm : measured impedance of short chip

Zssa: residual impedance of short chip (0.771nH)

Yom: measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx)

Re(Zx)

Lx : Inductance of chip coil

Qx : Q of chip coil

Lx=

,

Qx =

2πf

f

: Measuring frequency

MURATA MFG.CO., LTD


型号：	LQW18ANR18G00D
厂家：	muRata
描述：	General Purpose Inductor, 0.18uH, 2%, 1 Element, Air-Core, SMD, 0603, CHIP, 0603 测试射频感应器电感器
文件：	总11页 (文件大小：278K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQW18ANR18G00D [MURATA]

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