LQW2BAN22NG00L [MURATA]
General Purpose Inductor,;
| 型号： | LQW2BAN22NG00L |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 测试 射频感应器 电感器 |
| 文件： | 总11页 (文件大小：356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec No.JELF243A-0115B-01
P.1/11
CHIP COIL (CHIP INDUCTORS) LQW2BAN□□□□00L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQW2BAN_00 Series Chip coil(Chip Inductors).
2.Part Numbering
(ex)
LQ
W
2B
A
N
47N
G
0
0
L
Product ID Structure Dimension
Applications
Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
Characteristics
L:Taping
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
・Operating Temperature Range.
・Storage Temperature Range.
–55°C ~ +125°C (includes self-heating)
–55°C ~ +125°C
Self
*1,*2
Rated
Current
(mA)
DC
Resistance
(Ω max.)
Inductance
Customer
Part Number
MURATA Part
Number
Q
(min.)
Resonant
Frequency
(MHz min.)
(nH)
Tolerance
LQW2BAN3N2J00L
LQW2BAN3N6J00L
LQW2BAN6N8J00L
LQW2BAN7N5J00L
LQW2BAN8N2G00L
LQW2BAN8N2J00L
LQW2BAN11NG00L
LQW2BAN11NJ00L
LQW2BAN12NG00L
LQW2BAN12NJ00L
LQW2BAN13NG00L
LQW2BAN13NJ00L
LQW2BAN15NG00L
LQW2BAN15NJ00L
LQW2BAN18NG00L
LQW2BAN18NJ00L
LQW2BAN20NG00L
LQW2BAN20NJ00L
LQW2BAN22NG00L
LQW2BAN22NJ00L
LQW2BAN24NG00L
LQW2BAN24NJ00L
LQW2BAN27NG00L
LQW2BAN27NJ00L
LQW2BAN30NG00L
LQW2BAN30NJ00L
LQW2BAN33NG00L
LQW2BAN33NJ00L
LQW2BAN36NG00L
LQW2BAN36NJ00L
LQW2BAN39NG00L
LQW2BAN39NJ00L
LQW2BAN43NG00L
LQW2BAN43NJ00L
LQW2BAN47NG00L
LQW2BAN47NJ00L
3.2
3.6
6.8
7.5
95
75
90
85
0.02
0.05
0.03
0.04
13800
11800
6200
3800
2000
3000
2400
J：±5%
3900
8.2
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
0.09
3200
4700
4300
3500
1940
3620
2960
1850
1970
2750
2000
1500
80
0.04
2400
70
85
0.12
0.05
1500
2200
0.07
0.15
0.07
0.08
0.12
1900
1400
G：±2%
J：±5%
75
85
80
2000
1500
1900
75
1900
0.08
75
70
0.12
0.20
1720
1500
1550
1250
MURATA MFG.CO., LTD
Reference Only
DC
Spec No.JELF243A-0115B-01
P.2/11
Self
*1,*2
Inductance
Customer
MURATA Part
Q
Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
Resistance
(Ω max.)
Part Number
Number
(min.)
(nH)
Tolerance
LQW2BAN51NG00L
LQW2BAN51NJ00L
LQW2BAN56NG00L
LQW2BAN56NJ00L
LQW2BAN62NG00L
LQW2BAN62NJ00L
LQW2BAN68NG00L
LQW2BAN68NJ00L
LQW2BAN75NG00L
LQW2BAN75NJ00L
LQW2BAN82NG00L
LQW2BAN82NJ00L
LQW2BAN91NG00L
LQW2BAN91NJ00L
LQW2BANR10G00L
LQW2BANR10J00L
LQW2BANR11G00L
LQW2BANR11J00L
LQW2BANR12G00L
LQW2BANR12J00L
LQW2BANR13G00L
LQW2BANR13J00L
LQW2BANR15G00L
LQW2BANR15J00L
LQW2BANR16G00L
LQW2BANR16J00L
LQW2BANR18G00L
LQW2BANR18J00L
LQW2BANR20G00L
LQW2BANR20J00L
51
56
75
70
0.11
0.18
0.12
0.20
0.28
0.24
0.21
0.35
1100
1600
1800
1250
1650
1250
1100
1200
1300
1050
62
1470
68
75
68
70
66
57
1450
1330
1140
82
91
G：±2%
J：±5%
100
110
120
130
150
160
180
200
1200
1000
0.38
0.42
0.46
970
950
930
56
58
920
53
0.58
0.63
800
750
*1 Derating of rated current shown by Figure 1 should be applied.
*2: When applied Rated current to the Products, self temperature rise shall be limited to 40℃ max..
100
50
0
0
85
Temperature (℃)
125
.
Figure 1. Derating curve
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C±2°C
Humidity
: Ordinary Humidity
/ 25%(RH) to 85%(RH)
Humidity
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.3/11
5. Appearance and Dimensions
2.09±0.2
1.53±0.2
■Unit Mass (Typical value)
0.014g
1.5±0.2
(in mm)
0.5±0.1
6.Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
KEYSIGHT 4287A or equivalent
Measuring Frequency:
6.1 Inductance
6.2
Q
Q shall meet item 3.
<Inductance> 250MHz/3.2nH～39nH
200MHz/43nH～75nH
150MHz/82nH～130nH
100MHz/150nH～200nH
<Q>
1500MHz/3.2nH,3.6nH
1000MHz/6.8nH～8.2nH
500MHz/11nH～100nH
250MHz/110nH～200nH
Measuring Condition:
Test signal level / about 0dBm
Electrode spaces / 1.5 mm
Electrical length / 10.0mm
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below and
contact coil with each terminal by adding weight.
1.5mm
Measuring Method:See the endnote.
<Electrical Performance:Measuring
Method of Inductance/Q>
6.3 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
6.4 Self Resonant
Frequency(SRF)
Measuring Equipment: KEYSIGHT 8753C
or equivalent
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.4/11
7.Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
Pattern
Chip Coil
2.8
Solder resist
Substrate
1.78
0.76
(in mm)
F
Applied Direction:
Chip Coil
Substrate
Force:10N
Hold Duration:5s±1s
7.2 Bending Test
Substrate:Glass-epoxy substrate
(100mm×40mm×1.0mm)
Speed of Applying Force:1mm / s
Deflection:3mm
Hold Duration:5s
Pressure jig
R230
F
Deflection
(in mm)
45
45
Product
7.3 Vibration
Oscillation Frequency:
10Hz~2000Hz~10Hz for 15 min
Total amplitude 3 mm or Acceleration
amplitude 196m/s2 whichever is smaller.
Time : A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6hours)
7.4 Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux:Ethanol solution of rosin,25(wt)%
Includes activator equivalent to 0.06(wt)%
Chlorine.(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.5/11
8.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance:No damage
Inductance Change: within ±5%
Q Change: within ±20%
Test Method
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room
condition for 24h±2h.
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Temperature:-55°C±2°C
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24±2 h.
Temperature:85°C±2°C
Humidity:85%(RH)
Time:1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10min to 15 min
3 step:+125°C±2°C / 30min±3 min
4 step:Ordinary temp. / 30min±3 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
9.Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide, 4mm-pitch)
+0.1
φ
1.5
-0
1.75±0.1
0.25 0.05
±
4.0±0.1
4.0±0.1
(in mm)
1.55±0.1
1.8±0.1
2.0±0.05
1.1±0.1
1.65±0.1
Direction of feed
・Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the plastic tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
Cover tape
5N min.
10N min.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.6/11
9.4 Peeling off force of cover tape
165 to 180 degree
Speed of Peeling off
300mm/min
F
Cover tape
Plastic tape
0.1N to 0.6N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
φ
13.0±0.2
φ
60+1
-
0
Direction of feed
φ
21.0±0.8
(in mm)
+1
-0
9.0
13.0±1.4
+0
φ
180
-3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) , RoHS Marking (2),
Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
Label
W
D
H
H
186
186
93
5
D
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.7/11
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance
or solderability may be affected, or result to "position shift" in soldering process.
Pattern
Chip Coil
2.8
Solder resist
Substrate
1.78
(in mm)
0.76
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way
that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
･Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.8/11
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
Φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
1/2T≦t≦T
Recommendable(t)
T
T：thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
a
Products shall be located in the sideways
b
direction (Length:a＜b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
A > D *1
A > B
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A > C
C
B
Seam
D
A
a
b
Slit
Length:a b
<
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
(3) Mounting Components Near Screw Holes
P.9/11
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be
touched to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of plastic tape. In this case, please remove the support pin. The support pin may damage the
components and break wire.
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.10/11
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
12． ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
Reference Only
Spec No.JELF243A-0115B-01
P.11/11
<Electrical Performance:Measuring Method of Inductance/Q>
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
A
C
B
D
V1
I1
V2
I 2
=
Zx
Zm
V
2
V
1
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
，
Zx=
(3) Thus,the relation between Zx and Zm is following;
Zm-β
where, α= D / A =1
Zx= α
1-ZmΓ
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm : measured impedance of short chip
Zssa: residual impedance of short chip (0.771nH)
Yom: measured admittance when opening the fixture
(4) Lx shall be calculated with the following equation.
Im(Zx)
Im(Zx)
Re(Zx)
Lx : Inductance of chip coil
Qx : Q of chip coil
Lx=
,
Qx =
2πf
f
: Measuring frequency
MURATA MFG.CO., LTD
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