LQW2BAS24NJ00L [MURATA]
General Purpose Inductor, 0.024uH, 5%, 1 Element, Ferrite-Core, SMD, 0806, CHIP, 0806;
| 型号： | LQW2BAS24NJ00L |
| 厂家： | 
muRata |
| 描述： | General Purpose Inductor, 0.024uH, 5%, 1 Element, Ferrite-Core, SMD, 0806, CHIP, 0806 测试 射频感应器 电感器 |
| 文件： | 总11页 (文件大小：362K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SpecNo.JELF243A-0084N-01
P.1/11
Reference Onl
CHIP COIL (CHIP INDUCTORS) LQW2BAS□□□□00L REFERENCE SPECIFICATION
1. Scope
This Reference specification applies to LQW2BAS_00 series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
W
2B
A
S
2N8
J
0
0
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
∗B:Bulk
∗Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3. Rating
・Operating Temperature Range
・Storage Temperature Range.
–55°C ~ +125°C
–55°C ~ +125°C
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
Inductance
Customer
Part Number
MURATA Part
Q
(min.)
Number
(nH)
Tolerance
LQW2BAS2N7J00L
LQW2BAS2N8J00L
LQW2BAS3N0J00L
LQW2BAS5N6J00L
LQW2BAS6N0J00L
LQW2BAS6N8J00L
LQW2BAS7N5J00L
LQW2BAS8N2G00L
LQW2BAS8N2J00L
LQW2BAS10NG00L
LQW2BAS10NJ00L
LQW2BAS12NG00L
LQW2BAS12NJ00L
LQW2BAS15NG00L
LQW2BAS15NJ00L
LQW2BAS18NG00L
LQW2BAS18NJ00L
LQW2BAS22NG00L
LQW2BAS22NJ00L
LQW2BAS24NG00L
LQW2BAS24NJ00L
LQW2BAS27NG00L
LQW2BAS27NJ00L
LQW2BAS33NG00L
LQW2BAS33NJ00L
LQW2BAS36NG00L
LQW2BAS36NJ00L
LQW2BAS39NG00L
LQW2BAS39NJ00L
LQW2BAS43NG00L
LQW2BAS43NJ00L
LQW2BAS47NG00L
LQW2BAS47NJ00L
LQW2BAS56NG00L
LQW2BAS56NJ00L
LQW2BAS68NG00L
LQW2BAS68NJ00L
LQW2BAS82NG00L
LQW2BAS82NJ00L
LQW2BAS91NG00L
LQW2BAS91NJ00L
LQW2BASR10G00L
LQW2BASR10J00L
2.7
2.8
3.0
5.6
6.0
6.8
7.5
0.03
15000
910
80
0.06
12200
800
65
70
J：±5%
0.08
0.03
0.11
0.14
5900
4500
5600
4800
50
60
8.2
10
12
15
18
22
24
27
33
36
39
43
47
56
68
82
91
100
0.12
0.10
0.15
0.17
0.20
4400
4300
4000
3200
3100
2600
2400
2580
2150
1900
2000
1800
1700
1600
1500
600
50
G：±2%
J：±5%
55
50
55
60
55
0.22
0.25
0.27
500
0.29
0.34
0.31
0.34
0.38
0.42
0.48
0.46
60
G：±2%
J：±5%
1330
1250
65
400
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.2/11
Rated
Current
(mA)
Reference Onl
Q
DC
Resistance
(Ω max.)
Self Resonant
Frequency
Inductance
Customer
Part Number
MURATA Part
Number
(min.)
(nH)
Tolerance
(MHz min.)
LQW2BASR11G00L
LQW2BASR11J00L
LQW2BASR12G00L
LQW2BASR12J00L
LQW2BASR15G00L
LQW2BASR15J00L
LQW2BASR18G00L
LQW2BASR18J00L
LQW2BASR22G00L
LQW2BASR22J00L
LQW2BASR24G00L
LQW2BASR24J00L
LQW2BASR27G00L
LQW2BASR27J00L
LQW2BASR33G00L
LQW2BASR33J00L
LQW2BASR39J00L
LQW2BASR47J00L
LQW2BASR56J00L
LQW2BASR68J00L
LQW2BASR82J00L
LQW2BAS1R0J00L
110
120
150
180
220
240
270
330
0.48
0.51
0.56
0.64
0.70
1100
920
50
400
G：±2%
J：±5%
820
770
730
650
44
48
1.00
350
310
1.40
390
470
560
680
820
1000
1.50
1.76
1.90
2.20
2.35
2.40
600
300
270
250
230
200
290
250
230
190
180
170
33
23
J：±5%
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》
Temperature
Humidity
: 20°C±2°C
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
2.09±0.2
1.53±0.2
■Unit Mass (Typical value)
0.014g
1.5±0.2
(in mm)
0.5±0.1
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.3/11
Reference Onl
6. Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
6.1 Inductance
Measuring Equipment：KEYSIGHT 4287A or equivalent
Measuring Frequency：
<Inductance> 250MHz / 2.7nH～ 39nH
200MHz / 43nH～ 68nH
150MHz / 82nH～ 120nH
100MHz / 150nH～ 390nH
50MHz / 470nH
25MHz / 560nH～1000nH
<Q>
1500MHz / 2.7nH～ 3.0nH
1000MHz / 5.6nH～ 8.2nH
500MHz / 10nH～ 100nH
250MHz / 110nH～ 390nH
100MHz / 470nH
50MHz / 560nH～1000nH
Measuring Condition：Test signal level / about 0dBm
Electrode spaces / 2.0 mm
Electrical length / 10.0mm
Weight / about 1N~3N
6.2
Q
Q shall meet item 3.
Measuring Fixture：KEYSIGHT 16197A
Position coil under test as shown in below and contact coil
with each terminal by adding weight.
1.5mm
Measuring Method：See the endnote.
<Electrical Performance：Measuring
Method of Inductance / Q>
6.3 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment：Digital multi meter
Measuring Equipment：KEYSIGHT 8753C or equivalent
The rated current is applied.
6.4 Self Resonant
Frequency(SRF)
6.5 Rated Current
Self temperature rise shall be
limited to 40°C max.
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.4/11
Reference Only
7. Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Substrate：Glass-epoxy substrate
Pattern
Chip Coil
2.8
Solder resist
Substrate
1.78
(in mm)
0.76
Applied Direction：
Chip Coil
F
Substrate
Force：10N
Hold Duration：5s±1s
7.2 Bending Test
Substrate：Glass-epoxy substrate
(100mm×40mm×1.0mm)
Speed of Applying Force：1mm / s
Deflection：3mm
Hold Duration：5s
Pressure jig
F
R230
Deflection
(in mm)
45
45
Product
7.3 Vibration
Oscillation Frequency：10Hz~2000Hz~10Hz
for 15 min
Total amplitude 3 mm or Acceleration amplitude
2
196m/s whichever is smaller.
Time：A period of 2 hours in each of 3 mutually
perpendicular directions.(Total 6hours)
7.4 Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux：Ethanol solution of rosin, 25(wt)% Includes
activator equivalent to 0.06(wt)% chlorine.
(immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150°C±10°C / 60s to 90s
Solder Temperature：240°C±5°C
Immersion Time：3s±1s
7.5 Resistance to
Soldering Heat
Appearance：No damage
Inductance Change：within ±5%
Flux：Ethanol solution of rosin, 25(wt)% Includes
activator equivalent to 0.06(wt)% chlorine.
(immersed for 5s to 10s)
Solder：Sn-3.0Ag-0.5Cu
Pre-Heating：150°C±10°C / 60s to 90s
Solder Temperature：270°C±5°C
Immersion Time：10s±1s
Then measured after exposure in the room condition
for 24h±2h.
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.5/11
Reference Onl
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Appearance：No damage
Inductance Change：within ±5%
Q Change：within ±20%
Temperature：125°C±2°C
Time：1000h (+48h,0h)
Then measured after exposure in the room condition
for 24h±2h.
Temperature：-55°C±2°C
Time：1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24±2 h.
Temperature：85°C±2°C
Humidity：85%(RH)
Time：1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24h±2h.
8.4 Temperature
Cycle
1 cycle：
1 step：-55°C±2°C / 30min±3 min
2 step：Ordinary temp. / 10min to 15 min
3 step：+125°C±2°C / 30min±3 min
4 step：Ordinary temp. / 30min±3 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide, 4mm-pitch)
+0.1
φ
1.5
-0
1.75±0.1
0.25 0.05
±
(in mm)
4.0±0.1
4.0±0.1
1.8±0.1
2.0±0.05
1.1±0.1
1.65±0.1
Direction of feed
・Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
Sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
Cover tape
5N min.
10N min.
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.6/11
Reference Onl
165 to 180 degree
9.4 Peeling off force of cover tape
F
Speed of Peeling off
300mm / min
Cover tape
Plastic tape
0.1N to 0.6N
(minimum value is typical)
Peeling off force
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
Empty tape Cover tape
210 min.
13.0±0.2
φ
60+1
φ
-
0
Direction of feed
21.0±0.8
φ
+1
-0
9.0
13.0±1.4
180 +0
φ
(in mm)
-3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,
Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
Label
186
186
93
5
H
∗ Above Outer Case size is typical. It depends on a quantity
of an order.
D
W
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.7/11
Reference Onl
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Pattern
Chip Coil
2.8
Solder resist
Substrate
1.78
(in mm)
0.76
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
･Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C 、90s±30s
Heating
above 220°C､30s～60s
245°C±3°C
above 230°C､60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.8/11
Reference Only
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3(+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable(t)
1/2T≦t≦T
T
T：thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length:a＜b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D ∗1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
B
Seam
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
D
A
a
b
Slit
<
Length:a b
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Screw Hole
Recommended
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.9/11
Reference Onl
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the bottom of plastic
tape. In this case, please remove the support pin. The support pin may damage the components and break wire.
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.13 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature
Humidity
: -10°C to 40°C
: 15% to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.10/11
Reference Onl
12. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
< Electrical Performance:Measuring Method of Inductance / Q >
To keep compatibility to other vender’s product, Inductance and Q value shall be measured in following method.
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
2
1
I
I
A
C
B
D
Zx
Zm
V
2
A
C
B
D
V1
I1
V2
I 2
V
1
=
Test Head
Test fixture
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V1
I 1
V2
I 2
Zm=
，
Zx=
(3) Thus,the relation between Zx and Zm is following；
Zm-β
where, α= D / A =1
Zx= α
1-ZmΓ
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm ： measured impedance of short chip
Zss ： residual impedance of short chip (=equivalent series Inductance X)
Yom： measured admittance when opening the fixture
Important：X：Zss shall be defined as correction value to fit nominal inductance of other venders’ products.
Please input X value instead of equivalent series Inductance (Short L) on test equipment calibration.
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx)
Im(Zx)
Re(Zx)
Lx=
,
Qx =
f： Measuring frequency
2πf
Inductance and Q value shall be measured after this calibration setting.
In addition, Q value should be measured under our standard calibration setting of residual impedance, 0.771nH.
MURATA MFG.CO.,LTD
SpecNo.JELF243A-0084N-01
P.11/11
Reference Onl
Chart. equivalent series Inductance to fit nominal inductance of other venders’ products.
Inductance
MURATA
X [nH]
equivalent series
Inductance
Part Number
Measuring
Frequency
LQW2BAS2N7_00
LQW2BAS2N8_00
LQW2BAS3N0_00
LQW2BAS5N6_00
LQW2BAS6N0_00
LQW2BAS6N8_00
LQW2BAS7N5_00
LQW2BAS8N2_00
LQW2BAS10N_00
LQW2BAS12N_00
LQW2BAS15N_00
LQW2BAS18N_00
LQW2BAS22N_00
LQW2BAS24N_00
LQW2BAS27N_00
LQW2BAS33N_00
LQW2BAS36N_00
LQW2BAS39N_00
LQW2BAS43N_00
LQW2BAS47N_00
LQW2BAS56N_00
LQW2BAS68N_00
LQW2BAS82N_00
LQW2BAS91N_00
LQW2BASR10_00
LQW2BASR11_00
LQW2BASR12_00
LQW2BASR15_00
LQW2BASR18_00
LQW2BASR22_00
LQW2BASR24_00
LQW2BASR27_00
LQW2BASR33_00
LQW2BASR39_00
LQW2BASR47_00
LQW2BASR56_00
LQW2BASR68_00
LQW2BASR82_00
LQW2BAS1R0_00
0.121
0.171
0.131
-0.009
0.031
0.301
-0.299
0.271
-0.229
0.371
0.051
-0.029
0.491
-0.389
0.931
0.481
0.531
0.771
-0.689
1.091
0.331
0.811
-0.839
-1.339
0.171
1.371
-1.629
-0.029
4.071
0.771
3.071
-1.429
4.071
0.971
-8.829
-8.229
-2.229
-8.029
-6.329
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