LQW2BASR47J00# [MURATA]
;型号: | LQW2BASR47J00# |
厂家: | muRata |
描述: | |
文件: | 总13页 (文件大小:560K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Spec No.: JELF243A_0084Q-01
P1/13
CHIP COILS (CHIP INDUCTORS) LQW2BAS□□□□00□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQW2BAS_00 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
W
2B
A
S
2N8
J
0
0
L
Product Structure Dimension Application Category Inductance Tolerance Performance Electrode Packaging
ID
(L × W)
and
characteristic
specification L: taping
*B: bulk
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Inductance
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
Customer
Murata
Q
(Min.)
Nominal
value
Part number
Part number
Tolerance
(nH)
LQW2BAS2N7J00L
LQW2BAS2N8J00L
LQW2BAS3N0J00L
LQW2BAS5N6J00L
LQW2BAS6N0J00L
LQW2BAS6N8J00L
LQW2BAS7N5J00L
LQW2BAS8N2G00L
LQW2BAS8N2J00L
LQW2BAS10NG00L
LQW2BAS10NJ00L
LQW2BAS12NG00L
LQW2BAS12NJ00L
LQW2BAS15NG00L
LQW2BAS15NJ00L
LQW2BAS18NG00L
LQW2BAS18NJ00L
LQW2BAS22NG00L
LQW2BAS22NJ00L
LQW2BAS24NG00L
LQW2BAS24NJ00L
LQW2BAS27NG00L
LQW2BAS27NJ00L
LQW2BAS33NG00L
LQW2BAS33NJ00L
LQW2BAS36NG00L
LQW2BAS36NJ00L
LQW2BAS39NG00L
LQW2BAS39NJ00L
LQW2BAS43NG00L
2.7
2.8
3.0
5.6
6.0
6.8
7.5
8.2
8.2
10
10
12
12
15
15
18
18
22
22
24
24
27
27
33
33
36
36
39
39
43
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
80
80
65
65
70
50
50
50
50
60
60
50
50
50
50
50
50
55
55
50
50
55
55
60
60
55
55
60
60
60
0.03
0.06
0.06
0.08
0.03
0.11
0.14
0.12
0.12
0.10
0.10
0.15
0.15
0.17
0.17
0.20
0.20
0.22
0.22
0.22
0.22
0.25
0.25
0.27
0.27
0.27
0.27
0.29
0.29
0.34
15000
12200
12200
5900
4500
5600
4800
4400
4400
4300
4300
4000
4000
3200
3200
3100
3100
2600
2600
2400
2400
2580
2580
2150
2150
1900
1900
2000
2000
1800
910
800
800
600
600
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
500
500
500
500
500
500
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
Customer
P2/13
Rated
current
(mA)
Inductance
Nominal
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Murata
Q
(Min.)
Part number
Part number
value
(nH)
Tolerance
LQW2BAS43NJ00L
LQW2BAS47NG00L
LQW2BAS47NJ00L
LQW2BAS56NG00L
LQW2BAS56NJ00L
LQW2BAS68NG00L
LQW2BAS68NJ00L
LQW2BAS82NG00L
LQW2BAS82NJ00L
LQW2BAS91NG00L
LQW2BAS91NJ00L
LQW2BASR10G00L
LQW2BASR10J00L
LQW2BASR11G00L
LQW2BASR11J00L
LQW2BASR12G00L
LQW2BASR12J00L
LQW2BASR15G00L
LQW2BASR15J00L
LQW2BASR18G00L
LQW2BASR18J00L
LQW2BASR22G00L
LQW2BASR22J00L
LQW2BASR24G00L
LQW2BASR24J00L
LQW2BASR27G00L
LQW2BASR27J00L
LQW2BASR33G00L
LQW2BASR33J00L
LQW2BASR39J00L
LQW2BASR47J00L
LQW2BASR56J00L
LQW2BASR68J00L
LQW2BASR82J00L
LQW2BAS1R0J00L
43
47
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
G: ±2%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
J: ±5%
60
60
60
60
60
60
60
65
65
65
65
65
65
50
50
50
50
50
50
50
50
50
50
44
44
48
48
48
48
48
33
23
23
23
23
0.34
0.31
0.31
0.34
0.34
0.38
0.38
0.42
0.42
0.48
0.48
0.46
0.46
0.48
0.48
0.51
0.51
0.56
0.56
0.64
0.64
0.70
0.70
1.00
1.00
1.00
1.00
1.40
1.40
1.50
1.76
1.90
2.20
2.35
2.40
1800
1700
1700
1600
1600
1500
1500
1330
1330
1330
1330
1250
1250
1100
1100
1100
1100
920
500
500
500
500
500
500
500
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
350
350
350
350
310
310
290
250
230
190
180
170
47
56
56
68
68
82
82
91
91
100
100
110
110
120
120
150
150
180
180
220
220
240
240
270
270
330
330
390
470
560
680
820
1000
920
920
920
820
820
770
770
730
730
650
650
600
300
270
250
230
200
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P3/13
5. Appearance and Dimensions
Unit mass (typical value): 0.014 g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P4/13
7. Electrical Performance
No.
Item
Specification
Meet chapter 3 ratings.
Test method
7.1 Inductance
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency:
Inductance
250 MHz 2.7 nH to 39 nH
200 MHz 43 nH to 68 nH
150 MHz 82 nH to 120 nH
100 MHz 150 nH to 390 nH
50 MHz
25 MHz
470 nH
560 nH to 1000 nH
Q
1500 MHz 2.7 nH to 3.0 nH
1000 MHz 5.6 nH to 8.2 nH
500 MHz 10 nH to 100 nH
250 MHz 110 nH to 390 nH
100 MHz 470 nH
50 MHz
Measuring conditions:
560 nH to 1000 nH
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 1.5 mm
Electrical length: 10.0 mm
7.2
Q
Meet chapter 3 ratings.
Weight: Approx. 1 N to 3 N
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the chapter
"16. Appendix".
7.3 DC resistance
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.4 Self-resonant
frequency
Measuring equipment: Keysight N5230A or the
equivalent
7.5 Rated current
Product temperature rise: 40°C max.
Apply the rated current specified in chapter 3.
8. Mechanical Performance
No.
Item
Specification
Test method
8.1 Shear test
No significant mechanical damage or no Test substrate: glass-epoxy substrate
sign of electrode peeling off shall be
observed.
Force application direction:
Applying force: 10 N
Holding time: 5 s±1 s
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
No. Item
P5/13
Specification
Test method
8.2 Bending test
No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be
observed.
mm × 1.0 mm)
Pressurizing speed: 1 mm/s
Deflection: 3 mm
Holding time: 5 s
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
approx. 15 min
Total amplitude: total amplitude of 3.0 mm or
acceleration amplitude of 196 m/s2, whichever is
smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.4 Solderability
90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an
be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to
soldering heat
Appearance: No significant mechanical Flux: immersed in ethanol solution [including an
damage shall be observed.
activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Inductance change rate: within ±5%
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No.
Item
Specification
Test method
9.1 Heat resistance
9.2 Cold resistance
9.3 Humidity
Appearance: No significant mechanical Temperature: 125°C±2°C
damage shall be observed.
Test time: 1000 h (+48 h, -0 h)
Inductance change rate: within ±5%
Q change rate: within ±20%
Post-treatment: left at a room condition for 24 h±2 h
Appearance: No significant mechanical Temperature: -55°C±2°C
damage shall be observed.
Test time: 1000 h (+48 h, -0 h)
Inductance change rate: within ±5%
Q change rate: within ±20%
Post-treatment: left at a room condition for 24 h±2 h
Appearance: No significant mechanical Temperature: 85°C±2°C
damage shall be observed.
Humidity: 85% (RH)
Inductance change rate: within ±5%
Q change rate: within ±20%
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:
damage shall be observed.
Step 1: -55°C±2°C/30 min±3 min
Inductance change rate: within ±5%
Q change rate: within ±20%
Step 2: ordinary temperature/10 min to 15 min
Step 3: +125°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P6/13
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
B
t
1.8±0.1
2.3±0.1
1.65±0.1
0.25±0.05
t'
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
2000 pcs/reel
(Standard quantity)
Packing method
Feed hole position
Joint
The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of cover tape
10 N min.
10.4 Peeling off force of cover tape
Speed of peeling off
300 mm/min
Peeling off force
0.1 N to 0.6 N (The lower limit is for typical value.)
Cover tape
165 to 180 degree
F
Plastic tape
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P7/13
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control
equipment
(5) Medical equipment
(6) Transportation equipment
(vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster/crime
prevention equipment
(9) Data-processing
equipment
(10) Applications of similar complexity and/or reliability
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P8/13
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P9/13
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P10/13
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Power
Requirement
20 W/L max.
Time
5 min max.
Frequency
(3) Cleaner
28 kHz to 40 kHz
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P11/13
12.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.12 Handling with mounting equipment
With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape
when the product is sucked with the pick-up nozzle.
When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P12/13
14. Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction to ensure that the inductance value is
compatible with inductors of other manufacturers.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
V1
I1
V2
I2
Zm=
Zx=
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Zm-β
Γ = C/A = Yom
Zx=α
1-ZmΓ
Zsm: measured impedance when measuring terminal is shorted
Zss: residual impedance of short chip (= Equivalent series inductance X*1)
Yom: measured admittance when measuring terminal is open
*1 Important
X: In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit
nominal inductance of other venders' products.
When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL) for
each L value.
Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard
measurement method.
(4) Calculate inductance Lx and Qx using the equations shown below.
Im (Zx)
Lx: inductance of chip coil
Qx: Q of chip coil
Lx=
2πf
Im (Zx)
Re (Zx)
Qx=
f: measuring frequency
MURATA MFG CO., LTD
Spec No.: JELF243A_0084Q-01
P13/13
Table: Equivalent series inductance to fit nominal inductance of other venders' products
Inductance
X (nH)
Equivalent series
inductance
Part number
Measuring frequency
(MHz)
LQW2BAS2N7_00
LQW2BAS2N8_00
LQW2BAS3N0_00
LQW2BAS5N6_00
LQW2BAS6N0_00
LQW2BAS6N8_00
LQW2BAS7N5_00
LQW2BAS8N2_00
LQW2BAS10N_00
LQW2BAS12N_00
LQW2BAS15N_00
LQW2BAS18N_00
LQW2BAS22N_00
LQW2BAS24N_00
LQW2BAS27N_00
LQW2BAS33N_00
LQW2BAS36N_00
LQW2BAS39N_00
LQW2BAS43N_00
LQW2BAS47N_00
LQW2BAS56N_00
LQW2BAS68N_00
LQW2BAS82N_00
LQW2BAS91N_00
LQW2BASR10_00
LQW2BASR11_00
LQW2BASR12_00
LQW2BASR15_00
LQW2BASR18_00
LQW2BASR22_00
LQW2BASR24_00
LQW2BASR27_00
LQW2BASR33_00
LQW2BASR39_00
LQW2BASR47_00
LQW2BASR56_00
LQW2BASR68_00
LQW2BASR82_00
LQW2BAS1R0_00
0.121
0.171
0.131
-0.009
0.031
0.301
-0.299
0.271
-0.229
0.371
0.051
-0.029
0.491
-0.389
0.931
0.481
0.531
0.771
-0.689
1.091
0.331
0.811
-0.839
-1.339
0.171
1.371
-1.629
-0.029
4.071
0.771
3.071
-1.429
4.071
0.971
-8.829
-8.229
-2.229
-8.029
-6.329
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
200
150
150
150
150
150
100
100
100
100
100
100
100
50
25
25
25
25
MURATA MFG CO., LTD
相关型号:
LQW2BASR47J00L
General Purpose Inductor, 0.47uH, 5%, 1 Element, Ferrite-Core, SMD, 0806, CHIP, 0806
MURATA
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