LQW43FT220M0H# [MURATA]
PoC [Power over Coax];
| 型号： | LQW43FT220M0H# |
| 厂家： | 
muRata |
| 描述： | PoC [Power over Coax] |
| 文件： | 总9页 (文件大小：610K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec No.:JELF243A-9156-01
P1/9
Chip Coil (Chip Inductor) LQW43FT□□□□0H□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Coil (Chip Inductor) LQW43FT□□□□0H□ series for automotive electronics
based on AEC-Q200.
2. Part Numbering
(Ex.)
LQ
W
43
FT
100
M
0H
L
Product ID
Type
Dimension Application and Inductance Tolerance
(L × W) characteristic
Category
(H: for automotive
electronics)
Packaging
L: ø180 taping
K: ø330 taping
*B: bulk
*B: Bulk packing is also available.(The product sealed on the carrier tape is stored in a plastic bag.)
3. Part Number and Rating
Operating temperature range -40°C to +125°C
Storage temperature range
-40°C to +125°C
Rated current
Inductance
Nominal
(mA)
Self-
DC
resistance
(Ω max.)
Customer
Murata
resonant
frequency
(MHz min.)
Based on temperature rise * ESD
rank
Ambient
Based on
inductance
change
Part number
Part number
Tolerance
value
Ambient
(%)
(μH)
temperature temperature
105°C
1000
125°C
710
±20
±20
±20
±20
±20
±20
LQW43FT100M0HL
LQW43FT100M0HK
LQW43FT180M0HL
LQW43FT180M0HK
LQW43FT220M0HL
LQW43FT220M0HK
10
10
18
18
22
22
0.13
0.13
0.16
0.16
0.18
0.18
60
60
40
40
30
30
1000
1000
800
5A
5A
5A
5A
5A
5A
1000
845
845
700
700
710
600
600
500
500
800
700
700
* As shown in the diagram below, derating is applied to the rated current based on the operating temperature
ESD Rank
5A
Maximum Withstand Voltage
8000 V (DC) to < 12,000 V (AD)
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P2/9
5. Appearance and Dimensions
■ Equivalent Circuit
Unit mass (typical value): 0.209g
6. Marking
No marking.
7. Electrical Performance
No.
Item
Specification
Test method
7.1 Inductance
Meet chapter 3 ratings.
Measuring equipment: Keysight E4990 or the
equivalent
Measuring frequency: 1 MHz
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
7.2 DC resistance
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.3 Self-resonant
frequency
Measuring equipment: Keysight E4991A or the
equivalent
7.4 Rated current
When rated current is applied to the
products, inductance will be within
±30% of nominal inductance value.
Temperature rise caused by self-
generated heat shall be limited to 40°C
max.
Apply the rated current specified in chapter 3.
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P3/9
8. Q200 Requirement
Performance(based on Table 5 for Magnetics Inductors/Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
Appearance: No damage
No.
Stress
Test Method
3 High temperature
exposure
1000 h at 125°C
Set for 24 h at room condition, Inductance change rate: within ±10%
then measured.
4 Temperature cycling 1000 cycles
-40°C to +125°C
Appearance: No damage
Inductance change rate: within ±10%
Set for 24 h at room condition,
then measured.
7 Biased humidity
8 Operational life
1000 h at 85°C, 85% (RH).
Unpowered.
Set for 24 h at room condition,
then measured.
Appearance: No damage
Inductance change rate: within ±10%
Apply 125°C 1000 h
Appearance: No damage
Set for 24 h at room condition, Inductance change rate: within ±10%
then measured.
9 External visual
Visual inspection
No abnormalities
10 Physical dimension
Meet chapter 5, "Appearance
and Dimensions".
Per MIL-STD-202
Method 215
No defects
12 Resistance to
solvents
Not applicable
13 Mechanical shock
Per MIL-STD-202
Method 213
Appearance: No damage
Inductance change rate: within ±10%
Condition C:
100 g's/6 ms/half sine
14 Vibration
5 g's for 20 min, 12 cycles each Appearance: No damage
of 3 orientations
Test from 10 Hz to 2000 Hz
No-heating
Inductance change rate: within ±10%
15 Resistance
Appearance: No damage
to Soldering Heat
Solder temperature
260°C±5°C
Inductance change rate: within ±10%
Immersion time 10 s
Deviation for AEC-Q200
Pre-heating: 150°C/60s
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD Rank: Refer to chapter 3, "Part Number and Rating".
Appearance: No damage
Inductance change rate: within ±10%
95% or more of the outer electrode shall be covered
with new solder seamlessly.
18 Solderability
(except exposed wire)
Deviation for AEC-Q200
Method b: Not applicable
Pre-heating: 150°C/60s
No defects
19 Electrical
Characterization
20 Flammability
Measured: inductance
Per UL-94
Not applicable
21 Board Flex
Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
60 s minimum holding time
Per AEC-Q200-006
Appearance:No damage
Inductance change rate: within ±10%
22 Terminal Strength
Appearance: No damage
A force of 17.7 N for 60 s
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P4/9
9. Specification of Packaging
9.1 Appearance and dimensions of tape (12 mm width/plastic tape)
A
B
t
(3.6)
(4.9)
(3.8)
(0.4)
t'
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
(Standard quantity)
400 pcs/reel (ø180 mm reel)
1500 pcs/reel (ø330 mm reel)
Packing method
Feed hole position
Joint
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and
bottom tape when the cavities of the carrier tape are punched type).
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)
are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Break down force of tape
Cover tape (or top tape)
5 N min.
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched type)
9.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.7 N (The lower limit is for typical value.)
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P5/9
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
• Packaging: L (ø180 mm reel)
• Packaging: K (ø330 mm reel)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS-
Y
()
(2) Murata classification number
(1)
(2)
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity,
etc.
10.8 Specification of outer box
Dimensions of outer box
(mm)
Standard reel
quantity in outer box
(reel)
Reel
Label
W
D
H
ø180 mm
ø330 mm
186
340
186
340
93
85
4
4
H
D
* Above outer box size is typical. It depends on a quantity of
an order.
W
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P6/9
10.
Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
10.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
10.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the
product, overheating could occur, resulting in wire breakage, burning, or other serious fault.
10.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
11. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of
thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume,
and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is
assumed.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
a
b
c
2.94
4.90
3.20
(in mm)
11.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 150 μm
If you want to use a flux other than the above, please consult our technical department.
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P7/9
11.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C
max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
350°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
11.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the
failure of mechanical or electrical performance.
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P8/9
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to
reduce stress.
Contents of measures
Stress level
A > D*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade
this product.
株式会社 村田製作所
Spec No.:JELF243A-9156-01
P9/9
11.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials,
leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up
errors, misalignment, or damage to the product.
11.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
11.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product
quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a
manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the
rated operating temperature for the product.
11.14 Handling of product
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion and electrode to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
株式会社 村田製作所
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