LXDC2XQ10A-251 [MURATA]
Low EMI noise using an inductor-embedded ferrite substrate;
| 型号： | LXDC2XQ10A-251 |
| 厂家： | 
muRata |
| 描述： | Low EMI noise using an inductor-embedded ferrite substrate |
| 文件： | 总25页 (文件大小：1450K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LXDC2XQ series
New Power Module
1. Features
Small footprint Buck converter for up to 1.5A output current application
(Output Voltage 2.5V and 3.3V: 800mA output current)
Low EMI noise using an inductor-embedded ferrite substrate
High efficiency using synchronous rectifier technology at 3MHz operation
Fixed output voltage : 1.0, 1.1, 1.2, 1.35, 1.5, 1.8, 2.5, 3.3V
(Other output voltage : 50mV step adjustable, factory setting)
Selectable control mode : PFM/PWM auto mode / Forced PWM mode
2.5% DC voltage accuracy over full load current range with PWM mode.
Wide input voltage range : 2.7~5.5V
Over current protection, Over temperature protection
2. Description
The LXDC2XQ series is a step-down DC-DC converter suitable for space-limited or noise-sensitive applications.
The device utilizes an inductor-embedded ferrite substrate that reduces radiated EMI noise and conduction noise.
By adding input/output capacitors, it can be used as an LDO replacement. Its low noise and easy-to-assemble
features assure reliable power supply quality.
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The device works in PFM mode at light load for extended battery life. At heavy load, it changes to PMW mode
automatically and maintains high efficiency using synchronous rectifying technology.
The device provides good output voltage accuracy even in PFM mode. It maintains 2.5% DC voltage accuracy
over the full current range (0-1,500mA), and shows very smooth mode transition between PFM mode and PWM
mode.
3. Typical Application Circuit
Cout :
10uF/6.3V MLCC (muarta:GRM155B30J106)
4.
Mechanical Details 4-1. Outline
unit:mm
Mark
W
Dimension
Mark
Dimension
2.6 +/- 0.2
2.8 +/- 0.2
a
b
0.2 +/- 0.2
0.55 +/- 0.1
L
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T
1.14 MAX
c
0.5 +/- 0.1
0.5 +/- 0.1
d
4-2. Pin configuration
Pin No.
Symbol
I/O
Description
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown
mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
EN=H: Device ON, EN=L: Device OFF
7
EN
Input
Regulated voltage output pin.
2,3
Vout
Output
Apply output load between this pin and GND.
4,8,9
5,6
GND
Vin
-
Ground pin
Input
Vin pin supplies current to the LXDC2XQ internal regulator
This is the operation mode select pin. This pin must not be left
floating and must be terminated.
Mode=H: Low-noise mode enabled, frequency PWM operation
is forced.
Mode=L: This device is operating in pulse frequency
modulation mode (PFM) at light load currents, and in
regulated frequency pulse width mode (PWM) at high-load
currents.
1
MODE
Input
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4-3. Functional Block Diagram
5. Ordering Information
Part number
Output Voltage
1.0V
Device Specific Feature
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
Standard Type
MOQ
LXDC2XQ10A-251
LXDC2XQ11A-298
LXDC2XQ12A-252
LXDC2XQ1DA-299
LXDC2XQ15A-277
LXDC2XQ18A-253
LXDC2XQ25A-300
LXDC2XQ33A-254
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
T/R, 3000pcs/R
1.1V
1.2V
1.35V
1.5V
1.8V
2.5V
3.3V
6.
Electrical Specification
6-1 Absolute maximum ratings
Parameter
symbol
rating
Unit
V
Maximum input voltage
Vin
6.2
6.2
6.2
Maximum EN pin voltage
Maximum MODE pin voltage
VEN
V
VMODE
V
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o
Operating Ambient temperature
Operating Case Temperature
Ta
-40 to +105
C
o
Tc
-40 to +105
C
6-2 Electrical characteristics (Ta=25℃)
Parameter
Input voltage
Symbol
Vin
Condition
Min.
2.7
Typ.
3.7
Max.
5.5
Unit
V
Input leak current
Iin-off
Vin=3.7V, EN=0V
2
uA
LXDC2XQ10A-251
0.975
1.072
1.170
1.316
1.462
1.755
2.437
3.218
1.0
1.1
1.2
1.35
1.5
1.8
2.5
3.3
1.035
1.139
1.242
1.397
1.553
1.863
2.588
3.416
LXDC2XQ11A-298
LXDC2XQ12A-252
LXDC2XQ1DA-299
LXDC2XQ15A-277
LXDC2XQ18A-253
LXDC2XQ25A-300
LXDC2XQ33A-254
PFM Mode
Vin-Vout>0.7V
Output voltage
Vout
V
LXDC2XQ10A-251
LXDC2XQ11A-298
0.975
1.072
1.0
1.1
1.025
1.128
LXDC2XQ12A-252
LXDC2XQ1DA-299
LXDC2XQ15A-277
LXDC2XQ18A-253
LXDC2XQ25A-300
LXDC2XQ33A-254
1.170
1.316
1.462
1.755
2.473
3.218
1.35
1.2
1.35
1.5
1.8
2.5
3.3
2.0
1.230
1.384
1.538
1.845
2.563
3.383
2.68
PWM Mode
Vin-Vout>0.7V
UVLO
UVLO
Iout
V
Vout=1.0V, 1.1V, 1.2V,
1.35V, 1.5V, 1.8V
Vout=2.5V, 3.3V
0
0
1500
800
Load current range
mA
mA
Over current
protection
OCP
Auto-recovery
1500
LXDC2XQ10A-251
15
15
15
15
15
15
LXDC2XQ11A-298
LXDC2XQ12A-252
LXDC2XQ1DA-299
LXDC2XQ15A-277
LXDC2XQ18A-253
Vin=3.7V,
Ripple voltage
Vrpl
Iout=1500mA,
BW=150MHz
mV
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Vin=3.7V,
Iout=800mA
BW=150MHz
Vin=5.0V,
LXDC2XQ25A-300
LXDC2XQ33A-254
15
15
Iout=800mA,
BW=150MHz
Parameter
Symbol
Condition
Min.
Typ.
85
85
86
87
88
90
93
Max.
Unit
LXDC2XQ10A-251
LXDC2XQ11A-298
LXDC2XQ12A-252
LXDC2XQ1DA-299
LXDC2XQ15A-277
LXDC2XQ18A-253
LXDC2XQ25A-300
Vin=3.7V,
Iout=300mA
Efficiency
EFF
%
Vin=5.0V,
LXDC2XQ33A-254
93
Iout=300mA
VENH
VENL
ON ; Enable
1.4
0
Vin
0.3
V
V
EN control voltage
OFF ; Disable
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6-3 Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are measured
on Murata’s evaluation board of this device at no air-flow condition.
Io-Loss
characteristics(Vin=3.7V,Vout=1.8V)
800
700
600
500
400
300
200
100
0
0
500
1000
1500
Io(mA)
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
especially be taken in applications where the device temperature exceeds 85oC.
o
The IC temperature of the device must be kept lower than the maximum rating of 105 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher
temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the
Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure
shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in
MLCC capacitor is not reversible but cumulative over time.
Vin= 3.7~5.5V, Vout= 1.0, 1.1, 1.2, 1.35, 1.5, 1.8V
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Capacitor B1 Life vs Capacitor Case
temperature
100000
10000
1000
100
Vin=5.5V
Vin=5.0V
Vin=4.0V
Vin=3.7V
10
1
20
40
60
80
100
120
Capacitor Case Temprature (oC )
Vin= 5.0~5.5V, Vout=3.3V, 2.5V
Capacitor B1 Life vs Capacitor Case
temperature
100000
0000
1000
100
Vout=3.3V
Vout=2.5V
10
1
20
40
60
80
100
120
Capacitor Case Temprature (oC )
The following steps should be taken before the design fix of user’s set for reliable operation.
1. The ambient temperature of the device should be kept below 105 oC
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
kept below 105 oC. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the above
figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
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7.
Detailed Description PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates
in discontinuous current mode with a sporadic switching pulse to keep high efficiency at light load.
The device uses constant on-time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing the output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is dependent on Vin, Vout and other factors, but the approximate
threshold is about 100-200mA.
PFM mode at light load
PWM mode at heavy load
Nominal output voltage
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (2.0Vtyp) before the device begins the start up
sequence even when the EN pin is kept high. The UVLO function protects against unstable operation at low Vin
levels .
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because of
this function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 0.3msec.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must
be terminated to logic high and must not be left floating.
Pulling the EN pin to logic low forces the device into shutdown. The device does not have a discharge function
when it turns off. If you prefer a discharge function, please contact a Murata representative.
100% Duty Cycle Operation
The device can operate in 100% duty cycle mode, in which the high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout become close and the duty cycle approaches 100%, the switching pulse will skip the nominal
switching period and the output voltage ripple may be larger than other conditions. It should be noted that this
condition does not mean a failure of the device.
Thermal Shutdown
As soon as internal IC’s junction temperature exceeds 150oC(typ), the device goes into thermal shutdown.
The device returns to its normal operation when the internal IC’s junction temperature again falls below
120OC(typ).
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8. Test Circuit
9. Reference Land Pattern
unit (mm)
Mark
Dimension
0.65
0.3
a
b
c
d
e
0.6
0.6
0.3
*Reference purpose only
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10. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0244)
Measurement setup
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stops operation and remains in shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin floats and an external voltage can be applied to the EN
terminal pin on the EVB. If you don’t apply an external voltage to EN pin, the enable switch should not to be
set to the middle position.
The mode switch has three states.
1. When it is toggled to “H” side, the device operates PWM forced mode.
2. When it is toggled to “L” side, the device operates PFM/PWM automatic mode.
3. When it is set to middle of “H”and “OFF”, the mode pin float and an external voltage can be applied to the
Mode terminal pin on the EVB. If you don’t apply an external voltage to Mode pin, the mode switch should not
to be set to the middle position.
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Typical Measurement Data (reference purpose only)
(Ta=25℃)
Efficiency
・Vin=5.0V, Vout=3.3V
・Vin=3.7V, Vout=1.8V
・Vin=3.7V, Vout=1.2V
・Vin=3.7V, Vout=1.0V
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Typical Measurement Data (reference purpose only)
(Ta=25℃)
Load Regulation
・Vin=5.0V, Vout=3.3V
・Vin=3.7V, Vout=1.8V
Load Regulation
Load Regulation
1.836
3.366
3.333
3.3
1.818
1.8
1.782
1.764
3.267
3.234
0
200
400
600
800
0
500
1000
1500
Iout [mA]
Iout [mA]
・Vin=3.7V, Vout=1.2V
・Vin=3.7V, Vout=1.0V
Load Regulation
Load Regulation
1.02
1.01
1
1.224
1.212
1.2
0.99
0.98
1.188
1.176
0
500
1000
1500
0
500
1000
1500
Iout [mA]
Iout [mA]
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Typical Measurement Data (reference purpose only)
Output Ripple-Noise
・Vin=5.0V, Vout=3.3V, BW : 150MHz
・Vin=3.7V, Vout=1.8V, BW: 150MHz
Output Ripple Noise
Output Ripple Noise
50
40
30
20
10
0
50
40
30
20
10
0
0
200
400
600
800
0
500
1000
Iout [mA]
1500
Iout [mA]
・Vin=3.7V, Vout=1.2V, BW: 150MHz
・Vin=3.7V, Vout=1.0V, BW: 150MHz
Output Ripple Noise
Output Ripple Noise
50
40
30
20
10
0
50
40
30
20
10
0
0
500
1000
Iout [mA]
1500
0
500
1000
Iout [mA]
1500
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Typical Measurement Data (reference purpose only) (Ta=25℃)
Load Transient Response
・Vin=5.0V, Vout=3.3V
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・Vin=3.7V, Vout=1.8V
・Vin=3.7V, Vout=1.2V
・Vin=3.7V, Vout=1.0V
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Result
Number
No
9
Items
Condition
(Fail)
Temperature: 85°C
Humidity: 85%RH
Period : 1000h
G
Humidity （Steady State）
18
(0)
G
(0)
C：200pF、R：0Ω
10 ESD (Machine Model)
18
TEST Voltage ：+/-200V
ESD (Human Body Model)
11
C：100pF、R：1500Ω
G
(0)
18
TEST Voltage ：+/-2000V
ESD (Charged Machine Model)
12
Confirming to JEITA4701 300-2
G
(0)
18
TEST Voltage ：+/-500V
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12.Tape and Reel Packing
1）Dimensions of Tape (Paper tape)
Feeding direction
2）Dimensions of Reel
(Unit : mm)
±
2 0.5
Φ60
Φ180
φ
±
13 0.2
(9.0)
13.0±1.4
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3）Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
: 50um in thickness
[4] Base tape : As specified in (1)
[3]
[1]
[2]
[3]
[4]
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Symbol
Items
No components at trailer
No components at leader
Whole leader
Ratings(mm)
A
B
C
min 160
min 100
min 400
5） The tape for chips are wound clockwise and the feeding holes are to the right side as the tape is pulled
toward the user.
6） Packaging unit: 3,000 pcs./ reel
7） Material：
Base Tape
Reel
Antistatic coating for both base tape and reel
… Plastic
… Plastic
）
8
Peeling of force
0.1~1.0N
165 to 180 °
Cover Tape
BaseTape
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this period is
exceeded
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020).
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability.
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3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be
provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and material
/ thickness of the PCB. Therefore, be sure to check the product performance in the actual set. When using
underfill materials, be sure to check the mechanical characteristics in the actual set.
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully preheat the product ：T less than 130 °C.
If the product is cooled down rapidly like being immersed in liquid, it might be damaged by a rapid temperature
change. Excessive thermal shock should be avoided.
Soldering should be carried out in the conditions shown below to prevent damaging the product. Contact a
Murata representative in case there is concerning about soldering conditions.
Reflow soldering standard conditions (example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
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6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it may
damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment. - Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before actual
use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time
of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures
must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range.
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
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! Note:
Please make sure that your product has been evaluated and confirmed against your specifications when our
product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance notice.
This catalog is for reference only and not an official product specification document, therefore, please review and
approve our official product specification before ordering this product.
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Oct. 2014
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