NFA18SD207X1A45B [MURATA]
This reference specification applies to Chip EMIFIL® LC Combined Array Type NFA18S Series;
| 型号： | NFA18SD207X1A45B |
| 厂家： | 
muRata |
| 描述： | This reference specification applies to Chip EMIFIL® LC Combined Array Type NFA18S Series |
| 文件： | 总11页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec. No. JENF243D-0007L-01
P 1/ 11
Chip EMIFIL® LC Combined Array Type
NFA18S□□□□□1A45□ Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL® LC Combined Array Type NFA18S Series.
2. Part Numbering
NF
A
18
SL
307
V
1A
4
5
L
Product ID Structure Dimension Features Cut-off Frequency Characteristics Rated Voltage Electrode Dimension Packaging Code
(LW)
(T) (L: Taping / B: Bulk)
3. Rating
Insertion Loss (I.L.)(dB )
400 480 800
MHz MHz MHz MHz MHz
Insulation
Resistance
[M min.]
Cut-off
Frequency
[MHz]
Rated
Voltage Current
[V(DC)] [mA(DC)]
Rated
Withstanding
Voltage
[V(DC)]
Customer
Part Number
MURATA
Part Number
300
900
NFA18SL307V1A45L
NFA18SL307V1A45B
NFA18SL407V1A45L
NFA18SL407V1A45B
NFA18SL487V1A45L
NFA18SL487V1A45B
6
max.
20
min. min.
18 18
min. min.
15 15
max. min. min.
20
300
400
480
-
-
1000
1000
1000
10
10
10
100
100
100
30
30
30
6
max.
-
-
-
6
-
<Capacitance> NFA18SL307V1A45□ : 22pF (typ.)
NFA18SL407V1A45□ : 15pF (typ.)
<Inductance> NFA18SL307V1A45□ : 23 nH (typ.)
NFA18SL407V1A45□ : 23 nH (typ.)
NFA18SL487V1A45□ : 8pF (typ.)
NFA18SL487V1A45□ : 23 nH (typ.)
Operating Temperature : -55°C to +125°C (Includes self-heating.)
Storage Temperature: -55°C to +125°C
Insertion Loss (I.L.)(dB)
Insulation
Resistance
[MΩmin.]
Cut-off
Rated
Voltage Current
[V(DC) [mA(DC)]
Rated Withstanding
Customer
Part Number
MURATA
Part Number
2
GHz
Frequency 130 180 200 350 470 900
Voltage
[V(DC)]
[MHz]
MHz MHz MHz MHz MHz MHz
NFA18SL137V1A45L
NFA18SL137V1A45B
NFA18SL187V1A45L
NFA18SL187V1A45B
NFA18SL207V1A45L
NFA18SL207V1A45B
NFA18SL357V1A45L
NFA18SL357V1A45B
6
max
25
25
130
－
－
－
－
－
－
－
－
1000
1000
1000
1000
10
10
10
10
50
50
50
35
30
30
30
30
min min
6
max
20 20
min min
15 15
180
200
350
－
－
－
6
max
－
－
－
min min
6
max
15
min min
13
－
－
<Capacitance> NFA18SL137V1A45□: 40pF(typ.)
NFA18SL187V1A45□: 22pF(typ.)
<Inductance> NFA18SL137V1A45□: 60nH(typ.)
NFA18SL187V1A45□: 60nH(typ.)
NFA18SL207V1A45□: 15pF(typ.)
NFA18SL207V1A45□: 60nH(typ.)
NFA18SL357V1A45□: 4pF(typ.)
NFA18SL357V1A45□: 50nH(typ.)
Operating Temperature : -40°C to +85°C (Includes self-heating.)
Storage Temperature: -40°C to +85°C
Insertion Loss (I.L.)(dB )
500
Insulation
Resistance
[M min.]
Cut-off
Frequency
[MHz]
Rated
Voltage Current
[V(DC)] [mA(DC)]
Rated
Withstanding
Voltage
[V(DC)]
Customer
Part Number
MURATA
Part Number
50
1
MHz
MHz
GHz
NFA18SL506X1A45L
NFA18SL506X1A45B
50
6 max.
30 min.
25 min.
1000
10
25
30
<Capacitance> NFA18SL506X1A45□：73pF(typ.)
<Inductance> NFA18SL506X1A45□：110nH(typ.)
Operating Temperature : -40°C to +85°C (Includes self-heating.)
Storage Temperature: -40°C to +85°C
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
P 2/ 11
Insertion Loss (I.L.)(dB )
Insulation
Resistance
[M min.]
Cut-off
Frequency
[MHz]
Rated
Voltage Current
[V(DC)] [mA(DC)]
Rated
Withstanding
Voltage
[V(DC)]
Customer
Part Number
MURATA
Part Number
220
900
2
MHz
MHz
GHz
NFA18SL227V1A45L
NFA18SL227V1A45B
220
6 max.
30 min.
30 min.
1000
10
25
30
<Capacitance>
NFA18SL227V1A45□：27pF(typ.)
<Inductance>
NFA18SL227V1A45□：65nH(typ.)
Operating Temperature : -40°C to +85°C (Includes self-heating.)
Storage Temperature: -40°C to +85°C
Insertion Loss (I.L.)(dB )
Cut-off
Insulation
Resistance
[M min.]
Rated
Voltage Current
[V(DC)] [mA(DC)]
Rated
Withstanding
Voltage
[V(DC)]
Customer
Part Number
MURATA
Part Number
Frequency
[MHz]
180 200 500 900 1.5
MHz MHz MHz MHz GHz GHz
2
NFA18SD187X1A45L
6
max.
15
max. min. min. min.
13 20 20 20
20 20 20
180
200
－
1000
1000
10V
10V
25
25
30
30
NFA18SD187X1A45B
NFA18SD207X1A45L
6
－
NFA18SD207X1A45B
max. min. min. min. min.
<Capacitance> NFA18SD187X1A45□：22pF(typ.)
NFA18SD207X1A45□：15pF(typ.)
<Inductance> NFA18SD187X1A45□：90nH(typ.)
NFA18SD207X1A45□：90nH(typ.)
Operating Temperature : -40°C to +85°C (Includes self-heating.)
Storage Temperature: -40°C to +85°C
4. Standard Testing Condition
< Unless otherwise specified >
< In case of doubt >
Temperature : Ordinary Temp. / 15 °C to 35 °C
Humidity: Ordinary Humidity / 25 %( RH) to 85 %( RH)
Temperature: 20 °C ± 2 °C
Humidity: 60 %( RH) to 70 %( RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Style and Dimensions
NFA18SL307/407/487
（Top View）
NFA18SL137/187/207/227/357/506,NFA18SD
1.6±0.1
1.6
④
±0.1
⑤
③
④
⑤
⑥
③
⑥
①GND
GND② 0.8±0.1
①GND
GND②
0.8±0.1
⑧
⑩
⑦
⑨
⑦
⑧
⑨
⑩
Polarity Marking
Polarity Marking
③④⑤⑥:IN (OUT)
⑦⑧⑨⑩：OUT (IN)
（Side View）
T(mm)
T
NFA18SL307/357/407/487
NFA18SL137/187/207/227506, NFA18SD
0.5±0.1
0.05
0.6±
0.1
0.2±0.1 0.4±0.05
0.25±0.1
（Bottom View）
Electrode
0.15±0.1
(in mm)
0.20±0.1
MURATA MFG.CO., LTD.
Reference Only
③
Spec. No. JENF243D-0007L-01
Equivalent Circuits
P 3/ 11
■
④
⑤
⑥
③
④
⑤
⑥
NFA18SL307/407/487
NFA18SL137/187/207/357/506
GND
GND
①
②
GND①
②GND
⑦
⑧
⑨
⑩
⑦
⑧
⑨
⑩
③
④
⑧
⑤
⑨
⑥
⑩
③
④
⑤
⑥
NFA18SL227
NFA18SD
GND①
②GND
②GND
GND①
⑦
⑧
⑨
⑩
⑦
■ Unit Mass (Typ.)
0.004g
■
Insertion Loss Characteristics (I.L.) (Typ.)
(50Ωsystem)
NFA18SL307V1A45
0
NFA18SL407V1A45
0
10
20
30
40
50
10
20
30
40
50
10
100
Frequency(MHz)
1000
10000
10
100
1000
10000
Frequency(MHz)
NFA18SL487V1A45
NFA18SL137V1A45
0
10
20
30
40
50
0
10
20
30
40
50
60
10
100
1000
10000
10
100
1000
Frequency(MHz)
10000
Frequency(MHz)
NFA18SL187V1A45
NFA18SL207V1A45
0
0
10
20
30
40
50
60
10
20
30
40
50
60
10
100
1000
Frequency(MHz)
10000
10
100
1000
Frequency(MHz)
10000
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
P 4/ 11
NFA18SL506X1A45
0
10
20
30
40
50
60
10
100
1000
Frequency(MHz)
10000
NFA18SD187X1A45
NFA18SL227V1A45
0
0
10
20
30
40
50
60
10
20
30
40
50
10
0
100
1000
10000
10
100
1000
10000
Frequency (MHz)
Frequency [ MHz ]
NFA18SD207X1A45
10
20
30
40
50
10
100
1000
10000
Frequency [ MHz ]
6. Marking
In case of polarity marking on the left side as shown the equivalent circuits(item 5), coil are upside.
Only NFA18SL227/NFA18SD is a double L-type structure, so it is located from the upper side in order of
coil→capacitor→coil→capacitor.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
P 5/ 11
7. Electrical Performance
No.
Item
Specification
Test Method
7.1 Insertion Loss
(I.L.)
Meet item 3.
50
10dB
Attenuator
50
10dB
Attenuator
Specimen
E
50
50
～
SG
Method of measurement based on MIL-STD-220
Insertion Loss = 20 log (E0 / E1)
E0 : Level without FILTER (short)
E1 : Level with FILTER
· Voltage : Rated Voltage
· Time : 1 minutes
· Test Voltage : 30V(DC)
· Time : 1 to 5 s
7.2 Insulation
Resistance(I.R.)
7.3 Withstanding
Voltage
Products shall not be damaged.
· Charge Current : 50 mA max.
8. Mechanical Performance
No. Item
Specification
Test Method
8.1 Appearance and Meet item 5.
Dimensions
Visual Inspection and measured with Micrometer
caliper and Microscope.
8.2 Solderability
Electrodes shall be at least 90%
covered with new solder coating.
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150°C, 60 s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 245 ± 3°C
· Immersion Time :3±1 s
· Immersion and emersion rates : 25mm / s
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150°C, 60 s
8.3 Resistance to
soldering heat
Meet Table 1.
Table 1
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 270 ± 5°C
· Immersion Time : 10 ± 1 s
Appearance
Insertion Loss
Insulation Resistance
No damaged
meet item 3
· Immersion and emersion rates : 25mm / s
· Pre-heat : 150~180°C, 90±30 s
· Heating: 230 °C min., 60 s max.
· Peak Temperature: 260 °C, 10 s max.
· Solder : Sn-3.0Ag-0.5Cu
8.4 Resistance to
soldering heat
(Reflow)
· The number of Times : 2 times
It shall be dropped on concrete or steel board.
· Method: Free fall
8.5 Drop
Products shall be no failure after
tested.
· Height: 1m
· Attitude from which the product is dropped
: 3 directions
· The Number of Time: 3 times for each direction
(Total 9 times)
8.6 Bonding
Strength
The electrodes shall be no failure after It shall be soldered on the glass-epoxy substrate.
tested.
· Applying Force (F): 9.8 N
· Applying Time : 30 s
0.2
0.175
0.175
(in mm)
1.6
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
P 6/ 11
No.
Item
Specification
Meet Table 1.
Test Method
8.7 Vibration
It shall be soldered on the glass-epoxy substrate.
· Oscillation Frequency: 10 to 2000 to 10Hz for
20 minutes.
· Total amplitude 1.5 mm or Acceleration amplitude
196m/s2 whichever is smaller.
· Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
It shall be soldered on the glass-epoxy substrate
(t = 1.0mm).
8.8 Bending
Strength
Products shall be no failure after
tested.
· Deflection: 2.0 mm
· Keeping Time: 30 s
Pressure jig
R230
F
Deflection
Product
45
45
(in mm)
9. Environment Performance
It shall be soldered on the glass-epoxy substrate.
No.
Item
Specification
Meet Table 1.
Test Method
9.1 Temperature
Cycling
【NFA18SL307/407/487】
· 1 Cycle
1 step: -55 ± 03 °C / 30 ± 30 minutes
2 step: Room Temperature / within 3 minutes
3 step: +125 ± 30 °C / 30 ± 30 minutes
4 step: Room Temperature / within 3 minutes
· Total of 100 cycles
【NFA18SL137/187/207/227/357/506,NFA18SD】
· 1 Cycle
1 step: -40 ± 03 °C / 30 ± 30 minutes
2 step: Room Temperature / within 3 minutes
3 step: +85 ± 30 °C / 30 ± 30 minutes
4 step: Room Temperature / within 3 minutes
· Total of 100 cycles
9.2 Humidity
9.3 Heat Life
· Temperature : 40 ± 2 °C
· Humidity : 90 to 95%(RH)
· Time : 1000± 480 hours
【NFA18SL307/407/487】
· Temperature: 125 ± 2 °C
· Test Voltage: Rated Voltage 200%
· Charge Current: 50 mA max.
· Time: 1000 ± 480 hours
【NFA18SL137/187/207/227/357/506,NFA18SD】
· Temperature: 85 ± 2 °C
· Test Voltage: Rated Voltage 200%
· Charge Current: 50 mA max.
· Time: 1000 ± 480 hours
9.4 Cold Resistance
【NFA18SL307/407/487】
· Temperature: -55 ± 2 °C
· Time: 1000± 480 hours
【NFA18SL137/187/207/227/357/506,NFA18SD】
· Temperature: -40 ± 2 °C
· Time: 1000± 480 hours
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
P 7/ 11
10. Tape Packaging
10.1. Appearance and Dimensions (8mm-wide plastic tape)
Sprocket Hole
φ1.55±0.05
0.25±0.05
Embossed Cavity
φ0.80±0.10
1.00±0.05
4.00±0.10
2.00±0.05
4.00±0.10
0.70±0.05
（in：mm）
Direction of feed
Dimension of the Cavity is
measured at the bottom side.
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
10N min.
Cover tape
10.4. Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Top tape
13.0±0.2
60± 10
9± 10
13±1.4
21.0±0.8
Direction of feed
180±03
(in mm)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
10.6. Marking for reel
P 8/ 11
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
10.8. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(mm)
(Reel)
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
Side on which chips are mounted
1.375
0.175
0.4 0.225
0.05
0.5
0.5
1.3
Resist
Filled viaφ0.1
2.0
Copper foil pattern
2.35
(in mm)
12.
!
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment
(5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
P 9/ 11
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Mounting direction of a product
In the case of mounting, Polarity Marking should surely serve as the upper surface.
When mounted upside down, since the Polarity Marking is formed with the conductor, it has a possibility that the
short-circuit between terminals may occur.
13.2. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.3. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
13.4. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
Products shall be located in the sideways
b
direction (Length:ab) to the mechanical
stress.
Poor example
Good example
〉
〈
〉
〈
(2) Products location on P.C.B. near seam for separation.
C
Seam
Products (A,B,C,D) shall be located carefully so that
products are not subject to the mechanical stress due
to warping the board.
Because they may be subjected the mechanical stress
in order of A C B D.
B
D
A
a
b
Slit
Length:a b
13.5. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
13.6. Reflow Soldering
1) Soldering paste printing for reflow
· Standard thickness of solder paste: 100µm to 150µm.
· Use the solder paste printing pattern of the below pattern.
· For the resist and copper foil pattern, use standard land dimensions.
Standard printing pattern of solder paste.
1.375
0.175
0.4 0.225
0.175
1.2
0.5
0.05
0.35
1.3
2.0
(in mm)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
2) Soldering Conditions
P 10/ 11
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
Heating
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
13.7. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min
Tip temperature : 350°C max.
Soldering time : 3(+1,-0) s
Soldering iron output : 30W max.
Tip diameter : φ3mm max.
Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
13.8. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T t T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
13.9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max. Frequency: 28 kHz to 40 kHz
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
Time: 5 minutes max.
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0007L-01
13.10. Operating Environment
P 11/ 11
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
13.11. Resin coating
The capacitance and inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select
resin. In prior to use, please make the reliability evaluation with the product mounted in your application set.
13.12. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C
Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14. ！ Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
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