NFE61HT681D2A9L [MURATA]
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE61H Series for Automotive Electronics based on AEC-Q200;
| 型号： | NFE61HT681D2A9L |
| 厂家： | 
muRata |
| 描述： | This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE61H Series for Automotive Electronics based on AEC-Q200 LTE |
| 文件： | 总9页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Chip EMIFIL ® LC Combined Type for Large Current
Reference Spec. No. JENF243E-9101A-01
P 1 / 9
NFE61HT□□□□2A9□ Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE61H Series for
Automotive Electronics based on AEC-Q200.
2. Part Numbering
NF
E
61
HT
101
Z
2A
9
L
Product ID Structure Dimension Features Capacitance
Characteristics Rated Electrode Packaging
(LW)
Voltage
Code
(L: Taping / B: Bulk)
3. Rating
ESD Rank
2:2kV
Customer
Part Number
Rated
Voltage
Withstanding
Voltage
Rated
Current
Insulation
Resistance
Murata
Part Number
Capacitance
33pF ± 30%
NFE61HT330U2A9L
NFE61HT330U2A9B
NFE61HT680R2A9L
NFE61HT680R2A9B
NFE61HT101Z2A9L
NFE61HT101Z2A9B
NFE61HT181C2A9L
NFE61HT181C2A9B
NFE61HT361C2A9L
NFE61HT361C2A9B
NFE61HT681D2A9L
NFE61HT681D2A9B
NFE61HT102F2A9L
NFE61HT102F2A9B
NFE61HT332Z2A9L
NFE61HT332Z2A9B
68pF ± 30%
100pF ± 30%
180pF ± 30%
360pF ± 20%
100 V
(DC)
1000 M
min.
250 V(DC)
2 A(DC)
2
680pF ± 30%
８０
1000pF ±
3300pF ±
%
２０
８０
２０
%
Operating Temperature: - 55 °C to + 125 °C
Storage Temperature: - 55 °C to + 125 °C
4. Standard Testing Condition
<Unless otherwise specified>
<In case of doubt>
Temperature : Ordinary Temp. 15°C to 35°C
Temperature: 20°C ± 2°C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH)
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86kPa to 106kPa
5. Style and Dimensions
■ Equivalent Circuit
0.7±0.2
(1)
0.7±0.2
(3)
2.6±0.3
(2)
Output
(3)
Input
(1)
GND
(2)
0.3
6.8±
0.5
1.6±0.3
(1),(3):No Polarity
■ Unit Mass(Typical value)
0.062g
Note : Gap and bend between ceramic capacitor() and ferrite bead(1) may come out as illustrated below, however,
these are not affect the performance, mounting and reliability of the products.
0.5 max.
1
1
0.1 max.
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
P 2 / 9
■
Insertion Loss Characteristics (I.L.) (Typ.) (50Ωsystem)
6. Marking
No marking.
7. Electrical Performance
No. Item
Specification
Test Method
Table 1
7.1 Capacitance
Meet item 3.
Capacitance
Voltage
Frequency
33,68,100 (pF)
180,360,680
1 to 5 V(rms)
1MHz±10%
1±0.2 V(rms)
1kHz±10%
1000,3300 (pF)
7.2 Insulation
Resistance(I.R.)
7.3 Withstanding
Voltage
Voltage : 100 V(DC)
Time : 60 ± 5 seconds
Test Voltage : 250 V(DC)
Testing Time : 1 to 5 seconds
Meet item 3.
Products shall not be damaged.
Limit the charging current: 10mA max.
Attenuating transient voltage of exponential
function shall be applied to products on the
condition.
7.4 Resistance to
Surge Voltage
Meet Table 2.
Table 2
Relay
10
Appearance
No damaged
33,68,100
180,360
680 (pF)
1000
1
100
within
±15%
Product
2 3
EB
Cap.
Change
0.47µF
within
±30%
3300 (pF)
EB
400V
I.R.
Withstanding
Voltage
1000 M min.
Peak Voltage : 400 V
Force Period : 1 s
No damaged
The number of Surges : 105
8. Q200 Requirement
8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
Meet TABLE A after testing.
No.
Stress
Test Method
3
High Temperature 1000hours at 125C
Exposure
(Storage)
Set for 24hours
at room temperature,
then measured.
Table A
Appearance
No damage
Capacitance Change
(33pF-100pF:
1MHz+/-10%)
(180pF-3300pF:
1kHz+/-10%)
I.R.
33pF to 680pF
Within +/-15% at 20C
1000pF to 3300pF
Within +/-30% at 20C
1000M ohm min.
No damage
Withstanding Voltage
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
AEC-Q200
P 3 / 9
Murata Specification / Deviation
Meet Table B after testing.
No.
Stress
Test Method
4
Temperature
Cycling
1000cycles(-55C to 125C)
Measurement at 24±2 hours after Table B
test conclusion.
Appearance
No damage
Capacitance Change
(33pF-100pF:
1MHz+/-10%)
(180pF-3300pF:
1kHz+/-10%)
I.R.
33pF to 680pF
Within +/-15% at 20C
1000pF to 3300pF
Within +/-30% at 20C
100M ohm min
No damage
Withstanding Voltage
5
7
Per EIA469
No defects
Destructive
No electrical tests
Physical Analysis
Biased
1000hours 85C/85%RH.
Apply Maximum rated Voltage and
current.
Meet Table B after testing.
Humidity
Measurement at 24+/-2 hours after
test conclusion.
8
9
Operational Life
1000hours at 125C
Apply Maximum rated Current.
Meet Table B after testing.
Measurement at 24+/-2 hours after
test conclusion.
Visual inspection
External Visual
No abnormalities
No defects
10
Physical
Meet ITEM 4
Dimension
(Style and Dimensions)
12
Resistance
to Solvents
Per MIL-STD-202 Method 215
Not Applicable
13
14
Mechanical Shock Per MIL-STD-202 Method 213
Figure 1 of Method 213.
Meet Table A after testing.
Condition F(1500g's/0.5ms/Half
sine)
Three times each 6 direction.
Vibration
5g's for 20 minutes, 12cycles each Meet Table A after testing.
of 3 oritentations
Osscillation Frequency :
10-2000Hz.
15
17
Resistance
to Soldering Heat 260C +/- degree C
Immersion time 10s
No heating.
Pre-heating: 150C+/-5C, 60s+/-5s
Meet Table A after testing.
ESD
Per AEC-Q200-002
Meet Table C after testing.
ESD Rank: Refer to Item 3. Rating.
Table C
Appearance
No damage
I.R.
1000M ohm min
No damage
Withstanding Voltage
18
19
Solderbility
Per J-STD-002
Method b : Not Applicable
75% of the terminations is to be soldered.
No defects
Electrical
Measured :Capacitance
Characterization
MURATA MFG. CO., LTD.
Reference Only
Murata Specification / Deviation
Reference Spec. No. JENF243E-9101A-01
AEC-Q200
P 4 / 9
No.
20
21
Stress
Flammability
Board Flex
Test Method
Per UL-94
Not Applicable
Meet Table D after testing.
Table D
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Capacitance Change
33pF to 680pF
Within +/-15% at 20C
Within +/-30% at 20C
(33pF-100pF:
1MHz+/-10%)
(180pF-3300pF:
1kHz+/-10%)
17.7N for 60sec
No defects
1000pF to 3300pF
22
30
Terminal Strength Per AEC-Q200-006
A force of 17.7N
for 60sec
Electrical
Transient
Conduction
Per ISO-7637-2
Not Applicable
10. Specification of Packaging
10.1. Appearance and Dimensions (12mm-wide plastic tape)
+0.1
-0
Embossed Cavity
0.3±0.1
1.5
Sprocket Hole
Dimension of the Cavity is
measured at the bottom side.
4.0±0.1
4.0±0.1
2.0±0.05
1.9±0.1
1.75±0.1
(in mm)
Direction of feed
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
2500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
10N min.
Cover tape
10.4. Peeling off force of cover tape
165° ~ 180°
Cover Tape
Plastic Tape
F
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
P 5 / 9
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
Empty tape
210 min.
Cover tape
Label
13.0±0.2
60±1
0
21.0±0.8
Direction of feed
13± 10
17±1.4
180±0
(in: mm)
3
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
10.8. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(mm)
(Reel)
H
W
D
H
186
186
93
4
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
P 6 / 9
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
(a) Standard land dimensions for reflow
(b) Standard land dimensions for flow
(But, NFE61HT332Z2A9 is not applicable.)
･Side on which chips are mounted
Small diameter thru hole
□
･Side on which chips are mounted
0.4
Small diameter thru hole 0.4
1.5
3.8
4.8
9.0
2.0
4.8
8.8
Resist
Copper foil pattern
No pattern
Resist
Copper foil pattern
No pattern
(in mm)
12.
!
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13.Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is
limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
<Consideration for mounting of 2.5mm pitch>
The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume.
< Exclusive Use of Reflow Soldering >
NFE61HT332Z2A9□ can only be soldered with reflow.
If it were soldered with flow, cracks might be caused in the ceramic body.
So, reflow soldering shall be applied for products.
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
13.3. Attention Regarding P.C.B. Bending
P 7 / 9
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔Products direction〕
a
Products shall be located in the sideways direction
b
(Length:ab) to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. near seam for separation.
C
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
Seam
B
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
D
A
a
b
Slit
Lengh:a<b
13.4. Standard Soldering Conditions
On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder
temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the
electrode.
On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat
and so on because de-wetting may be caused.
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
< Flow Soldering Profile >
Temp.
°C
(
)
265°C±3°C
250°C
Limit Profile
150
Heating Time
Standard Profile
Time.(s)
60s min.
Standard Profile
150°C , 60s min.
250°C , 4s ~ 6s
2 times
Limit Profile
Pre-heating
Heating
Cycle of flow
265°C ± 3°C , 5s max.
2 times
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
< Reflow Soldering Profile >
P 8 / 9
Temp.
(°C)
260°C
245°C±3°C
220°C
230°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
above 230°C , 60s max.
260°C , 10s
2 times
2 times
13.5. Printing of Adhesive (Flow Soldering)
Adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength.
The adhesive position is as follows.
1.5
4.8
9.0
Adhesive
Position of adhesive
(in mm)
13.6. Solder paste printing for reflow
· Standard thickness of the solder paste should be
150m to 200µm.
Standard printing pattern of solder paste.
· Use the solder paste printing pattern of the right
pattern.
· For the resist and copper foil pattern, use standard
land dimensions.
1.5
4.8
8.8
(in mm)
13.7. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min
Tip temperature : 350°C max.
Soldering time : 3(+1,-0) s
Soldering iron output : 30W max.
Tip diameter : φ3mm max.
Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243E-9101A-01
13.8. Cleaning Conditions
P 9 / 9
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.10. Resin coating
It may affect on the product's performance when using resin for coating / molding products. So please pay your
careful attention when you select resin. In prior to use, please make the reliability evaluation with the product
mounted in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature
Humidity
:
:
- 10 °C to + 40 °C
15 % to 85% relative humidity No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
! Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG. CO., LTD.
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