NFL18ZT207H1A3D [MURATA]
Data Line Filter,;
| 型号： | NFL18ZT207H1A3D |
| 厂家： | 
muRata |
| 描述： | Data Line Filter, LTE |
| 文件： | 总10页 (文件大小：313K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Reference Spec. No. JENF243D-9101A-01
P 1 / 10
Chip EMIFIL® LC Combined Monolithic
NFL18ZT□□□H1A3□
Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFL18ZT_H Series
for Automotive Electronics based on AEC-Q200 except for Power train and Safety.
2. Part Numbering
NF
L
18
ZT
506
H
1A
3
D
Product ID Structure Dimension Features
Cut-off Frequency
Characteristics Rated
Voltage
Electrode Packaging
Code
(L× W)
(D: Taping / B: Bulk)
3. Rating
Cut-off
Frequency
[MHz]
Insertion Loss
(I.L.)(dB)
Rated
Voltage
[V(DC)]
Withstanding
Voltage
[V(DC)]
Rated
Current
[mA(DC)]
Insulation
Resistance
[MΩmin.]
ESD
Rank
1C:1kV
Customer
Part Number
Murata
Part Number
NFL18ZT506H1A3D
NFL18ZT506H1A3B
NFL18ZT706H1A3D
NFL18ZT706H1A3B
NFL18ZT107H1A3D
NFL18ZT107H1A3B
NFL18ZT207H1A3D
NFL18ZT207H1A3B
NFL18ZT307H1A3D
NFL18ZT307H1A3B
NFL18ZT507H1A3D
NFL18ZT507H1A3B
6 max
(0-50MHz)
30min
(200-1000MHz)
50
6 max
(0-70MHz)
30min
(300-1000MHz)
70
75
6 max
(0-100MHz)
30min
(400-1000MHz)
100
200
300
500
10
30
1000
1C
6 max
(0-200MHz)
30min
(800-1000MHz)
6 max
30min
100
(0-300MHz) (1200-1000MHz)
6 max
30min
(0-500MHz) (1700-1000MHz)
<Capacitance> NFL18ZT506H1A3□: 110pF (typ.)
NFL18ZT706H1A3□: 70pF (typ.)
<Inductance> NFL18ZT506H1A3□: 350nH (typ.)
NFL18ZT706H1A3□: 230nH (typ.)
NFL18ZT107H1A3□: 50pF (typ.)
NFL18ZT107H1A3□: 150nH (typ.)
NFL18ZT207H1A3□: 22pF (typ.)
NFL18ZT207H1A3□: 110nH (typ.)
NFL18ZT307H1A3□: 16pF (typ.)
NFL18ZT507H1A3□: 10pF (typ.)
NFL18ZT307H1A3□: 74nH (typ.)
NFL18ZT507H1A3□: 42nH (typ.)
• Operating Temperature: - 55 °C to + 125 °C (Includes self-heating.)
• Storage Temperature: - 55 °C to + 125 °C
4. Standard Testing Condition
<Unless otherwise specified>
Temperature : Ordinary Temp. 15°C to 35°C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH)
<In case of doubt>
Temperature: 20°C ± 2°C
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
P 2 / 10
5. Style and Dimensions
1.6±0.1
(Top View)
■ Equivalent Circuits
Input
(1)
Out put
(3)
②
①
GND
(2)
③
No Polarity
※
r
②
*Directional Marking
0.3±0.1 0.2±0.1
0.2±0.1
(Side View)
■ Unit Mass(Typical value)
0.004g
0.2以上
:Electrode
（in mm）
*Directional Marking
There are no electrical polarity.
(Bottom View)
0.15±0.1
But there is a directional marking on the top of
product to identify inner physical direction.
■
Insertion Loss Characteristics (I.L.) (Typ.) (50Ωsystem)
6. Marking
In case of polarity marking on the top, coils are placed in upper layer, and capacitor is placed in lower layer.
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
P 3 / 10
7. Electrical Performance
No.
Item
Specification
Test Method
7.1 Insertion Loss
(I.L.)
Meet item 3.
50
10dB
Attenuator
Ω
50
Ω
10dB
Attenuator
Specimen
E
50
Ω
50
Ω
～
SG
∗
Method of measurement based on MIL-STD-220
Insertion Loss = 20 log (E0 / E1)
E0 : Level without FILTER (short)
E1 : Level with FILTER
7.2 Insulation
Resistance(I.R.)
7.3 Withstanding
Voltage
· Voltage : Rated Voltage
· Time : 1 minutes max.
· Test Voltage : 30V(DC)
· Time : 1 to 5s
Products shall not be damaged.
· Charge Current : 50 mA max.
8. Q200 Requirement
8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
Meet TABLE A after testing.
No.
Stress
Test Method
3
High Temperature 1000hours at 125C
Exposure
(Storage)
Set for 24hours
at room temperature,
then measured.
Table A
Appearance
Cap. Change
No damaged
Within ± 5%
(%△C)
Inductance
Change
(%△L)
Within ± 10%
Meet item 3
I.R.
4
Temperature
Cycling
1000cycles(-40C to 125C)
Measurement at 24±2 hours after
test conclusion.
Meet TABLE A after testing.
5
7
Per EIA469
No defects
Destructive
No electrical tests
Physical Analysis
Biased
1000hours 85C/85%RH.
Meet Table A after testing.
Apply Maximum rated Voltage.
Humidity
Measurement at 24+/-2 hours after
test conclusion.
8
Operational Life
1000hours at 125C
Meet Table A after testing.
Apply Maximum rated Current.
Measurement at 24+/-2 hours after
test conclusion.
9
External Visual
Visual inspection
No abnormalities
No defects
10
Physical
Meet ITEM 4
Dimension
(Style and Dimensions)
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
AEC-Q200
P 4 / 10
Murata Specification / Deviation
Not Applicable
No.
12
Stress
Resistance
to Solvents
Test Method
Per MIL-STD-202 Method 215
13
14
Mechanical Shock Per MIL-STD-202 Method 213
Figure 1 of Method 213.
Meet Table A after testing.
Condition F(100g's/6msec/Half
sine)
Three times each 6 direction.
Vibration
5g's for 20 minutes, 12cycles each Meet Table A after testing.
of 3 oritentations
Osscillation Frequency :
10-2000Hz.
15
17
Resistance
No Pre-heating.
Meet Table A after testing.
to Soldering Heat 260C +/- 5degree C
Immersion time 10 +/-1sec
Per AEC-Q200-002
ESD
Meet Table B after testing.
ESD Rank: Refer to Item 3. Rating.
Table B
Appearance
I.R.
Withstanding Voltage
No damage
1000M ohm min
No damage
18
19
Solderability
Per J-STD-002
95% of the terminations is to be soldered.
Electrical
No defects
Characterization
Flammability
Board Flex
20
21
Per UL-94
Not Applicable
Meet Table A after testing.
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
22
30
Terminal Strength Per AEC-Q200-006
A force of 17.7N
10N for 60sec
Not Applicable
for 60sec
Electrical
Transient
Conduction
Per ISO-7637-2
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide paper tape)
φ
1.5± 00.1
4.0±0.1
Sporocket Hole
4.0±0.1
2.0±0.05
1.05±0.1
0
.9max.
Direction of feed
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
P 5 / 10
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Top tape
The base tape and top tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous.
The specified quantity per reel is kept.
10.3. Pull Strength of Top Tape and Bottom Tape
Top tape
5N min.
Bottom tape
10.4. Peeling off force of top tape
Top tape
165 to 180 degree
F
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
Bottom tape
Base tape
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Top tape
13.0±0.2
φ
60±1
φ
0
21.0±0.8
φ
Direction of feed
9± 10
13±1.4
180±0
φ
3
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
10.6. Marking for reel
P 6 / 10
Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (∗2) , Quantity , etc
10.8. Specification of Outer Case
Label
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
D
186
H
(Reel)
W
186
H
93
D
5
W
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
･Side on which chips are mounted
Small diameter thru hole 0.2 0.3
φ
～
0.4
0.6
1.0
2.2
Resist
Copper foil pattern
No pattern
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
12. Caution
P 7 / 10
!
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment
(5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
b
Products shall be located in the sideways
Poor example
Good example
〉
〈
〉
〈
direction (Length:a< b) to the mechanical stress.
(2) Products location on P.C.B. near seam for separation.
C
B
Seam
Products (A,B,C,D) shall be located carefully so that
products are not subject to the mechanical stress due
to warping the board.
D
A
a
b
Slit
<
Length:a b
Because they may be subjected the mechanical stress
in order of A > C > B ≅ D.
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
13.4. Pre-heating Temperature
P 8 / 10
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
13.5. Reflow Soldering
1) Soldering paste printing for reflow
•
Standard printing pattern of solder paste.
·
·
·
Standard thickness of solder paste: 100µm to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land
dimensions.
0.4
1.0
2.2
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(°C)
260°C
245°C±3°C
230°C
220°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
Heating
above 230°C , 60s max.
260°C , 10s
Peak temperature
Cycle of reflow
2 times
2 times
13.6. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min
Tip temperature : 350°C max.
Soldering time : 3(+1,-0) s
Soldering iron output : 30W max.
Tip diameter : 3mm max.
Times : 2times max.
φ
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
13.7. Solder Volume
P 9 / 10
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
≤ ≤
1/3T t T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
13.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
·
Isopropyl alcohol (IPA)
2. Aqueous agent
·
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the
cleaner.
(5) Other cleaning
Please contact us.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
13.10. Resin coating
The capacitance and inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select
resin. In prior to use, please make the reliability evaluation with the product mounted in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG. CO., LTD.
Reference Only
Reference Spec. No. JENF243D-9101A-01
P 10 / 10
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature
Humidity
:
:
-10 to +40°C
15 to 85% relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG. CO., LTD.
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