NFM21H [MURATA]
On-Board Type EMI Suppression Filters (EMIFILr) for Automotive;
| 型号： | NFM21H |
| 厂家： | 
muRata |
| 描述： | On-Board Type EMI Suppression Filters (EMIFILr) for Automotive |
| 文件： | 总93页 (文件大小：6701K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
C50E.pdf
Aug.28,2008
On-Board Type (DC)
EMI Suppression Filters
(EMIFILr) for Automotive
Cat.No.C50E-7
C50E.pdf
Aug.28,2008
C50E.pdf
Aug.28,2008
1
2
3
4
CONTENTS
EMIFILr and "EMIFIL" in this catalog are
the trademarks of Murata Manufacturing Co., Ltd.
Product Guide/Effective Frequency Range
2
3
1
Chip Ferrite Beads Part Numbering
BLM15A/18A/21A/31A
4
BLM18P/21P/31P/41P
25
33
BLM15B/18B/21B
12
For GHz Range Noise Suppression BLM18H/18E
Specifications and Test Methods
Chip EMIFILr
38
2
Part Numbering
42
43
44
47
48
Chip EMIFILr Capacitor Type NFM21H Series
Specifications and Test Methods
Chip EMIFILr LC Combined Type for Large Current NFE61H Series
Specifications and Test Methods
3
4
Chip Common Mode Choke Coils
Part Numbering
50
51
54
Chip Common Mode Choke Coil DLW31S/ 43S Series
Specifications and Test Methods
Block Type EMIFILr
Block Type EMIFILr SMD Type BNX024H/ 025H Series
Block Type EMIFILr Lead Type BNX012H Series
Specifications and Test Methods
57
58
60
64
67
76
78
82
87
!Caution/Notice
Soldering and Mounting
Package
Design Kits
Outlines of Major Noise Regulation Standards
Principles of Noise Suppression by DC EMIFILr
C50E.pdf
Aug.28,2008
Product Guide/Effective Frequency Range
Product Guide
Dimensions
Effective Frequency Range
Type
Series
(mm)
EIA Code
10kHz 100kHz 1MHz 10MHz100MHz 1GHz 10GHz
Inductor
Type
Standard
1.0
BLM15A
BLM18A
BLM21A
BLM31A
BLM15B
BLM18B
BLM21B
BLM18P
BLM21P
BLM31P
BLM41P
BLM18HG
BLM18HD
BLM18EG
NFM21H
NFE61H
DLW31S
DLW43S
0402
0.5
1.6
2.0
3.2
1.0
1.6
2.0
1.6
2.0
3.2
4.5
0603
0805
1206
0402
0603
0805
0603
0805
1206
1806
0603
0603
0603
0805
2706
1206
1812
0.8
1.25
1.6
0.5
0.8
For High
Speed Signals
1.25
0.8
For High
Current
1.25
1.6
1.6
0.8
0.8
0.8
For GHz
Range
1.6
1.6
1.6
2.0
Noise
Suppression
Capacitor
Type
Standard
Type
1.25
1.6
T Filter for
6.8
High Current
Chip Common Mode
Choke Coils
3.2
4.5
1.6
3.2
BNX024H/025H
BNX012H
Block Type EMIFILr
2
C50E.pdf
Aug.28,2008
1
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Ferrite Beads Part Numbering
Chip Ferrite Beads for Automotive
(Part Number)
H
1 D
BL
M
18 AG 102
S
q
w
e
r
t
y
u
i o
qProduct ID
tImpedance
Expressed by three figures. The unit is in ohm (Ω). The first and
second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
Product ID
BL
Chip Ferrite Beads
wType
yElectrode
Code
Type
Expressed by a letter.
M
Monolithic Type
Ex.)
Code
S/T
W
Electrode
Sn Plating
Ag/Pd
eDimensions (LgW)
Code
15
Dimensions (LgW)
1.0g0.5mm
EIA
0402
0603
0805
1206
1806
uCategory
18
1.6g0.8mm
21
2.0g1.25mm
3.2g1.6mm
Code
Category
31
H
for Automotive
41
4.5g1.6mm
iNumber of Circuits
rCharacteristics/Applications
Code
Number of Circuits
*1
Code
AG
AJ
Characteristics/Applications
Series
1
1 Circuit
for General Use
BLM15/18/21/31
BLM18
BA
BB
BD
PG
HG
for High-speed Signal Lines
BLM15/18/21
BLM18/21/31/41
for Power Supplies
for GHz Band General Use
for GHz Band General Use
(Low DC Resistance Type)
EG
HD
BLM18
for GHz Band High-speed Signal Lines
*1 Frequency characteristics vary with each code.
oPackaging
Code
Packaging
Series
K
L
B
J
Embossed Taping (ø330mm Reel)
Embossed Taping (ø180mm Reel)
Bulk
*1
BLM21 /31/41
All Series
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
*2
BLM15/18/21
D
*1 BLM21BD222SH1/BLM21BD272SH1 only.
*2 Except BLM21BD222SH1/BLM21BD272SH1
3
C50E.pdf
Aug.28,2008
1
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Ferrite Beads BLM15/18/21/31/41 Series
BLM15A Series
0.25±0.1
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
1.0±0.05
0.5±0.05
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
(in mm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(ohm)
(°C)
BLM15AG100SH1
BLM15AG700SH1
BLM15AG121SH1
BLM15AG221SH1
BLM15AG601SH1
BLM15AG102SH1
10 (Typ.)
70 (Typ.)
1000
500
500
300
300
200
0.05
0.15
0.25
0.35
0.6
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
120 ±25%
220 ±25%
600 ±25%
1000 ±25%
1.0
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
1200
1000
BLM15AG102SH1
BLM15AG601SH1
BLM15AG221SH1
800
BLM15AG121SH1
600
BLM15AG700SH1
400
200
0
BLM15AG100SH1
(Resistance element becomes dominant
at high frequencies.)
1
10
100
Frequency (MHz)
1000 2000
Continued on the following page.
4
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM15AG100SH1
BLM15AG700SH1
20
120
100
80
60
40
20
0
Z
15
Z
R
R
10
X
5
X
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM15AG121SH1
BLM15AG221SH1
200
150
100
50
400
300
200
100
0
Z
Z
R
R
X
X
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM15AG601SH1
BLM15AG102SH1
1200
800
600
400
200
0
Z
Z
900
600
R
R
X
300
0
X
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
5
C50E.pdf
Aug.28,2008
1
BLM18A Series
0.4±0.2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
1.6±0.15
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
0.8±0.15
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
(in mm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(ohm)
(°C)
BLM18AG121SH1
BLM18AG151SH1
BLM18AG221SH1
BLM18AG331SH1
BLM18AG471SH1
BLM18AG601SH1
BLM18AG102SH1
120 ±25%
150 ±25%
220 ±25%
330 ±25%
470 ±25%
600 ±25%
1000 ±25%
500
500
500
500
500
500
400
0.18
0.25
0.25
0.30
0.35
0.38
0.50
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM18A Series
1200
BLM18AG102SH1
BLM18AG601SH1
900
BLM18AG471SH1
BLM18AG331SH1
BLM18AG221SH1
600
BLM18AG151SH1
BLM18AG121SH1
300
(Resistance element becomes dominant
at high frequencies.)
0
1
10
100
Frequency (MHz)
1000
■ Impedance - Frequency Characteristics
BLM18AG121SH1
BLM18AG151SH1
200
400
150
300
200
Z
R
100
Z
R
X
50
100
0
X
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
Continued on the following page.
6
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM18AG221SH1
BLM18AG331SH1
600
400
450
300
300
Z
Z
R
R
200
X
150
0
100
X
0
1
10
100
1000
1
10
100
Frequency (MHz)
1000
Frequency (MHz)
BLM18AG471SH1
BLM18AG601SH1
800
800
Z
600
400
600
400
R
Z
R
X
200
0
200
0
X
1
10
100
1000
1
10
100
Frequency (MHz)
1000
Frequency (MHz)
BLM18AG102SH1
1200
Z
900
600
R
300
0
X
1
10
100
Frequency (MHz)
1000
7
C50E.pdf
Aug.28,2008
1
BLM18A Series Conductive Glue Applicable Type
0.4±0.2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
1.6±0.15
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
0.8±0.15
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
BLM18A_WH series is designed for conductive glue
mounting method, not for normal soldering method.
Please contact us for applicable mounting method
for BLM18A_WH series.
(in mm)
Impedance
Operating
Rated Current
DC Resistance (max.)
Part Number
(at 100MHz/20°C)
Temperature Range
(mA)
(ohm)
(ohm)
(°C)
BLM18AG471WH1
BLM18AG102WH1
470 ±25%
200
200
0.20
0.70
-55 to +150
-55 to +150
1000 ±25%
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM18A Series
1500
1200
BLM18AG102WH1
900
BLM18AG471WH1
600
(Resistance element becomes dominant
at high frequencies.)
300
0
1
10
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM18AG471WH1
BLM18AG102WH1
1500
1200
900
600
300
0
600
R
400
Z
Z
200
R
X
X
0
1
10
100
1
10
100
1000
1000
Frequency (MHz)
Frequency (MHz)
8
C50E.pdf
Aug.28,2008
1
BLM21A Series
0.5±0.2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
2.0±0.2
1.25±0.2
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
EIA CODE : 0805
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
(in mm)
Impedance
Operating
Temperature Range
(°C)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
(ohm)
BLM21AG121SH1
BLM21AG151SH1
BLM21AG221SH1
BLM21AG331SH1
BLM21AG471SH1
BLM21AG601SH1
BLM21AG102SH1
120 ±25%
150 ±25%
220 ±25%
330 ±25%
470 ±25%
600 ±25%
1000 ±25%
200
200
200
200
200
200
200
0.15
0.15
0.20
0.25
0.25
0.30
0.45
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM21A Series
1200
BLM21AG102SH1
BLM21AG601SH1
900
600
BLM21AG471SH1
BLM21AG331SH1
BLM21AG221SH1
BLM21AG151SH1
BLM21AG121SH1
(Resistance element becomes dominant
at high frequencies.)
300
0
1
10
100
Frequency (MHz)
1000
■ Impedance - Frequency Characteristics
BLM21AG121SH1
BLM21AG151SH1
200
200
Z
150
100
150
R
Z
R
100
X
X
50
0
50
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
Continued on the following page.
9
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM21AG221SH1
BLM21AG331SH1
400
400
Z
300
300
200
R
Z
200
R
X
100
100
0
X
0
1
10
100
Frequency (MHz)
1000
1000
1000
1
10
100
Frequency (MHz)
1000
BLM21AG471SH1
BLM21AG601SH1
800
800
600
400
600
400
Z
Z
R
R
X
200
0
200
0
X
1
10
100
Frequency (MHz)
1
10
100
Frequency (MHz)
1000
BLM21AG102SH1
1200
900
600
Z
R
X
300
0
1
10
100
Frequency (MHz)
10
C50E.pdf
Aug.28,2008
1
BLM31A Series
0.7±0.3
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
3.2±0.2
1.6±0.2
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
in mm
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(°C)
BLM31AJ601SH1
600 ±25%
200
0.90
-55 to +125
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
800
600
Z
R
400
(Resistance element becomes dominant
at high frequencies.)
X
200
0
1
10
100
Frequency (MHz)
1000
11
C50E.pdf
Aug.28,2008
1
BLM15B Series
0.25±0.1
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
1.0±0.05
0.5±0.05
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_B series can minimize attenuation of the signal
waveform due to its sharp impedance characteristics.
Various impedances are available to match signal
frequency.
(in mm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(°C)
BLM15BB050SH1
BLM15BB100SH1
BLM15BB220SH1
BLM15BB470SH1
BLM15BB750SH1
BLM15BB121SH1
BLM15BB221SH1
BLM15BD471SH1
BLM15BD601SH1
BLM15BD102SH1
BLM15BD182SH1
5 ±25%
10 ±25%
500
300
300
300
300
300
200
200
200
200
200
0.08
0.10
0.20
0.35
0.40
0.55
0.80
0.60
0.65
0.90
1.40
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
22 ±25%
47 ±25%
75 ±25%
120 ±25%
220 ±25%
470 ±25%
600 ±25%
1000 ±25%
1800 ±25%
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
12
C50E.pdf
Aug.28,2008
■ Impedance - Frequency (Typical)
1
BLM15BB Series
BLM15BD Series
2500
800
700
BLM15BB221SH1
2000
1500
1000
500
0
600
BLM15BD182SH1
BLM15BD102SH1
500
400
300
200
100
0
BLM15BB121SH1
BLM15BB750SH1
BLM15BB470SH1
BLM15BB220SH1
BLM15BB100SH1
BLM15BB050SH1
BLM15BD601SH1
BLM15BD471SH1
1
10
100
1000 2000
1
10
100
Frequency (MHz)
1000 2000
1000 2000
1000 2000
1000 2000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM15BB050SH1
BLM15BB100SH1
30
60
50
40
30
20
10
25
20
15
Z
Z
X
10
X
5
R
R
0
0
1
1
1
1
10
100
10
100
Frequency (MHz)
1000 2000
1000 2000
1000 2000
Frequency (MHz)
BLM15BB220SH1
BLM15BB470SH1
300
120
100
80
60
40
20
0
250
200
150
100
50
Z
Z
X
R
X
R
0
10
100
Frequency (MHz)
1
10
100
Frequency (MHz)
BLM15BB750SH1
BLM15BB121SH1
400
300
200
100
0
600
450
300
150
0
Z
Z
X
X
R
R
10
100
1
10
100
Frequency (MHz)
Frequency (MHz)
Continued on the following page.
13
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM15BB221SH1
BLM15BD471SH1
1000
800
Z
750
500
600
Z
R
400
X
X
200
250
0
R
0
1
10
100
1000 2000
1000 2000
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM15BD601SH1
BLM15BD102SH1
1200
1600
Z
Z
900
600
1200
800
R
R
X
X
300
0
400
0
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM15BD182SH1
2500
Z
2000
1500
1000
500
0
R
X
1
10
100
Frequency (MHz)
14
C50E.pdf
Aug.28,2008
1
BLM18B Series
0.4±0.2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
1.6±0.15
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
0.8±0.15
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_B series can minimize attenuation of the signal
waveform due to its sharp impedance characteristics.
Various impedances are available to match signal
frequency.
(in mm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(ohm)
(°C)
BLM18BA050SH1
BLM18BB050SH1
BLM18BA100SH1
BLM18BB100SH1
BLM18BA220SH1
BLM18BB220SH1
BLM18BA470SH1
BLM18BB470SH1
BLM18BD470SH1
BLM18BB600SH1
BLM18BA750SH1
BLM18BB750SH1
BLM18BA121SH1
BLM18BB121SH1
BLM18BD121SH1
BLM18BB141SH1
BLM18BB151SH1
BLM18BD151SH1
BLM18BB221SH1
BLM18BD221SH1
BLM18BB331SH1
BLM18BD331SH1
BLM18BD421SH1
BLM18BB471SH1
BLM18BD471SH1
BLM18BD601SH1
BLM18BD102SH1
BLM18BD152SH1
BLM18BD182SH1
BLM18BD222SH1
BLM18BD252SH1
5 ±25%
5 ±25%
500
700
500
700
500
600
300
550
500
550
300
500
200
500
200
450
450
200
450
200
400
200
200
300
200
200
100
50
0.20
0.05
0.25
0.10
0.35
0.20
0.55
0.25
0.30
0.25
0.70
0.30
0.90
0.30
0.40
0.35
0.37
0.40
0.45
0.45
0.58
0.50
0.55
0.85
0.55
0.65
0.85
1.20
1.50
1.50
1.50
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
10 ±25%
10 ±25%
22 ±25%
22 ±25%
47 ±25%
47 ±25%
47 ±25%
60 ±25%
75 ±25%
75 ±25%
120 ±25%
120 ±25%
120 ±25%
140 ±25%
150 ±25%
150 ±25%
220 ±25%
220 ±25%
330 ±25%
330 ±25%
420 ±25%
470 ±25%
470 ±25%
600 ±25%
1000 ±25%
1500 ±25%
1800 ±25%
2200 ±25%
2500 ±25%
50
50
50
15
C50E.pdf
Aug.28,2008
■ Equivalent Circuit
1
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
BLM18BA Series
BLM18BA Series
600
10000
450
7500
5000
300
BLM18BA220SH1
BLM18BA121SH1
BLM18BA100SH1
BLM18BA750SH1
BLM18BA470SH1
150
2500
0
BLM18BA050SH1
0
1000 2000
1
10
100
1000 2000
1
10
100
Frequency (MHz)
Frequency (MHz)
BLM18BB Series
BLM18BB Series
2000
250
200
BLM18BB471SH1
1500
1000
BLM18BB331SH1
BLM18BB221SH1
BLM18BB151SH1
150
100
50
BLM18BB470SH1
BLM18BB141SH1
BLM18BB121SH1
BLM18BB750SH1
BLM18BB220SH1
BLM18BB100SH1
BLM18BB050SH1
500
0
BLM18BB600SH1
0
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BD Series
2800
BLM18BD252SH1
BLM18BD222SH1
BLM18BD182SH1
2100
1400
BLM18BD152SH1
BLM18BD102SH1
BLM18BD601SH1
BLM18BD221SH1
BLM18BD151SH1
BLM18BD121SH1
BLM18BD471SH1
BLM18BD421SH1
BLM18BD331SH1
700
0
BLM18BD470SH1
1
10
100
1000 2000
Frequency (MHz)
16
C50E.pdf
Aug.28,2008
■ Impedance - Frequency Characteristics
1
BLM18BA050SH1
BLM18BB050SH1
30
20
100
Z
75
50
R
Z
X
R
10
25
0
X
0
1000 2000
1
10
100
1000 2000
1
10
100
Frequency (MHz)
Frequency (MHz)
BLM18BA100SH1
BLM18BB100SH1
50
200
Z
40
30
20
10
150
100
R
Z
R
X
X
50
0
0
1000 2000
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BA220SH1
BLM18BB220SH1
100
600
75
50
450
300
Z
Z
R
X
R
25
0
150
0
X
1000 2000
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BA470SH1
BLM18BB470SH1
1600
250
200
1200
800
Z
150
100
50
R
X
Z
400
0
R
X
0
1000 2000
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
Continued on the following page.
17
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM18BD470SH1
BLM18BB600SH1
300
240
180
120
60
200
150
Z
Z
R
100
R
50
0
X
X
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
1000 2000
Frequency (MHz)
BLM18BA750SH1
BLM18BB750SH1
400
6000
300
200
4500
3000
Z
R
X
100
0
1500
0
Z
R
X
1
10
100
1000 2000
1000 2000
1
10
100
Frequency (MHz)
Frequency (MHz)
BLM18BA121SH1
BLM18BB121SH1
10000
500
400
300
200
100
0
7500
5000
Z
X
2500
0
R
Z
R
X
1000 2000
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BD121SH1
BLM18BB141SH1
400
600
Z
300
200
450
300
R
X
Z
R
100
0
150
0
X
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
Continued on the following page.
18
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM18BB151SH1
BLM18BD151SH1
400
300
200
600
Z
Z
450
R
R
X
300
X
150
0
100
0
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BB221SH1
BLM18BD221SH1
1000
800
500
400
300
200
100
0
Z
Z
R
X
R
600
400
200
X
0
1
10
100
1000 2000
1
10
100
1000 2000
1000 2000
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BB331SH1
BLM18BD331SH1
1500
1200
900
600
300
0
900
600
300
0
Z
R
Z
R
X
X
1
10
100
1000 2000
1
10
100
Frequency (MHz)
Frequency (MHz)
BLM18BD421SH1
BLM18BB471SH1
2000
1600
1200
800
400
0
1000
Z
750
500
Z
R
R
X
X
250
0
1
10
100
1
10
100
Frequency (MHz)
1000 2000
Frequency (MHz)
Continued on the following page.
19
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM18BD471SH1
BLM18BD601SH1
1200
1200
Z
900
600
900
Z
R
X
R
600
X
300
0
300
0
1
10
100
1000 2000
1000 2000
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18BD102SH1
BLM18BD152SH1
2500
2000
1600
1200
800
400
0
2000
1500
1000
500
Z
Z
R
R
X
X
0
1
10
100
Frequency (MHz)
1
10
100
1000 2000
Frequency (MHz)
BLM18BD182SH1
BLM18BD222SH1
2500
2500
2000
1500
1000
500
0
Z
2000
1500
1000
500
0
R
Z
R
X
X
1
10
100
Frequency (MHz)
1
10
100
Frequency (MHz)
1000 2000
BLM18BD252SH1
3000
2500
2000
1500
1000
500
Z
R
X
0
1
10
100
1000 2000
Frequency (MHz)
20
C50E.pdf
Aug.28,2008
1
BLM21B Series
0.5±0.2 *2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
2.0±0.2
1.25±0.2
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
*1 BLM21BD222SH1 / 21BD272SH1
:1.25±0.2
*2 BLM21BD272SH1: 0.3±0.2
EIA CODE : 0805
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_B series can minimize attenuation of the signal
waveform due to its sharp impedance characteristics.
Various impedances are available to match signal
frequency.
(in mm)
Impedance
Operating
Temperature Range
(°C)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
(ohm)
BLM21BB050SH1
BLM21BB600SH1
BLM21BB750SH1
BLM21BB121SH1
BLM21BD121SH1
BLM21BB151SH1
BLM21BD151SH1
BLM21BB201SH1
BLM21BB221SH1
BLM21BD221SH1
BLM21BB331SH1
BLM21BD331SH1
BLM21BD421SH1
BLM21BB471SH1
BLM21BD471SH1
BLM21BD601SH1
BLM21BD751SH1
BLM21BD102SH1
BLM21BD152SH1
BLM21BD182SH1
BLM21BD222TH1
BLM21BD222SH1
BLM21BD272SH1
5 ±25%
60 ±25%
500
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.07
0.20
0.25
0.25
0.25
0.25
0.25
0.35
0.35
0.25
0.40
0.30
0.30
0.45
0.35
0.35
0.40
0.40
0.45
0.50
0.60
0.60
0.80
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
75 ±25%
120 ±25%
120 ±25%
150 ±25%
150 ±25%
200 ±25%
220 ±25%
220 ±25%
330 ±25%
330 ±25%
420 ±25%
470 ±25%
470 ±25%
600 ±25%
750 ±25%
1000 ±25%
1500 ±25%
1800 ±25%
2200 ±25%
2250 (Typ.)
2700 ±25%
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
21
C50E.pdf
Aug.28,2008
■ Impedance - Frequency (Typical)
1
BLM21BB Series
BLM21BD Series
2000
3200
BLM21BD272SH1
BLM21BD222SH1
BLM21BD222TH1
1600
2400
1600
BLM21BD182SH1
BLM21BD152SH1
BLM21BD102SH1
BLM21BD751SH1
BLM21BD601SH1
BLM21BB471SH1
BLM21BB331SH1
1200
BLM21BB201SH1
BLM21BB750SH1
BLM21BB221SH1
BLM21BD471SH1
BLM21BB151SH1
800
BLM21BD421SH1
BLM21BD331SH1
BLM21BD221SH1
BLM21BB121SH1
BLM21BB600SH1
800
0
BLM21BD151SH1
BLM21BD121SH1
BLM21BB050SH1
400
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
1000 2000
■ Impedance - Frequency Characteristics
BLM21BB050SH1
BLM21BB600SH1
400
30
Z
300
200
Z
20
10
0
R
X
X
R
100
0
1
10
100
1000 2000
1000 2000
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BB750SH1
BLM21BB121SH1
500
500
400
300
200
100
0
400
300
200
100
Z
Z
R
R
X
X
0
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BD121SH1
BLM21BB151SH1
300
240
180
120
60
800
600
400
Z
Z
R
R
X
X
200
0
0
1
10
100
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
Continued on the following page.
22
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM21BD151SH1
BLM21BB201SH1
300
800
600
400
200
0
Z
Z
240
180
120
60
R
R
X
X
0
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BB221SH1
BLM21BD221SH1
500
1000
800
600
400
200
0
400
300
200
100
0
Z
Z
R
X
R
X
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BB331SH1
BLM21BD331SH1
800
1200
Z
600
400
900
600
Z
R
R
X
X
200
0
300
0
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BD421SH1
BLM21BB471SH1
2000
1000
800
600
400
200
0
Z
1500
1000
Z
R
X
R
X
500
0
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
Continued on the following page.
23
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM21BD471SH1
BLM21BD601SH1
1200
1200
Z
900
900
600
Z
R
R
X
600
X
300
300
0
0
1
10
100
1000 2000
1
10
100
Frequency (MHz)
1000 2000
Frequency (MHz)
BLM21BD751SH1
BLM21BD102SH1
1500
1200
900
600
300
0
1800
1500
1200
900
600
300
0
Z
Z
R
X
R
X
1
10
100
Frequency (MHz)
1000 2000
1
10
100
1000 2000
Frequency (MHz)
BLM21BD152SH1
BLM21BD182SH1
2500
2000
1500
1000
500
2500
2000
1500
1000
500
Z
Z
R
R
X
X
0
0
1
10
100
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BD222TH1
BLM21BD222SH1
3000
2400
1800
1200
600
2400
Z
1800
1200
Z
R
R
X
X
600
0
0
1
10
100
1000 2000
1
10
100
Frequency (MHz)
1000 2000
Frequency (MHz)
Continued on the following page.
24
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM21BD272SH1
3500
3000
2500
Z
2000
R
1500
X
1000
500
0
1
10
100
1000 2000
Frequency (MHz)
BLM18P Series
0.4±0.2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
1.6±0.15
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
0.8±0.15
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
(in mm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(ohm)
(°C)
BLM18PG300SH1
BLM18PG330SH1
BLM18PG600SH1
BLM18PG121SH1
BLM18PG181SH1
BLM18PG221SH1
BLM18PG331SH1
BLM18PG471SH1
30 (Typ.)
33 ±25%
1000
3000
500
0.05
0.025
0.10
0.05
0.09
0.10
0.15
0.20
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
60 (Typ.)
120 ±25%
180 ±25%
220 ±25%
330 ±25%
470 ±25%
2000
1500
1400
1200
1000
For the items of rated current higher than 1200mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM18P Series
600
BLM18PG471SH1
BLM18PG331SH1
BLM18PG221SH1
450
BLM18PG181SH1
BLM18PG121SH1
BLM18PG600SH1
300
BLM18PG330SH1
BLM18PG300SH1
150
(Resistance element becomes dominant
at high frequencies.)
0
1
10
100
1000
Frequency (MHz)
25
C50E.pdf
Aug.28,2008
■ Impedance - Frequency Characteristics
1
BLM18PG300SH1
BLM18PG330SH1
50
60
45
30
15
0
40
Z
Z
30
R
R
20
X
X
10
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM18PG600SH1
BLM18PG121SH1
100
80
60
40
20
0
200
150
100
50
Z
Z
R
R
X
X
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM18PG181SH1
BLM18PG221SH1
280
210
140
70
400
300
200
100
0
Z
Z
R
R
X
X
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM18PG331SH1
BLM18PG471SH1
600
450
300
150
0
800
600
400
200
0
Z
Z
R
R
X
X
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
26
C50E.pdf
Aug.28,2008
1
BLM21P Series
0.5±0.2
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
2.0±0.2
1.25±0.2
EIA CODE : 0805
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
(in mm)
Impedance
Operating
Temperature Range
(°C)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
(ohm)
BLM21PG220SH1
BLM21PG300SH1
BLM21PG600SH1
BLM21PG221SH1
BLM21PG331SH1
22 ±25%
30 (Typ.)
60 ±25%
220 ±25%
330 ±25%
6000
3000
3000
2000
1500
0.01
0.015
0.025
0.050
0.09
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
For the items of rated current higher than 1500mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
600
450
300
BLM21PG331SH1
BLM21PG221SH1
BLM21PG600SH1
BLM21PG300SH1
BLM21PG220SH1
(Resistance element becomes dominant
at high frequencies.)
150
0
1
10
100
Frequency (MHz)
1000
■ Impedance - Frequency Characteristics
BLM21PG220SH1
BLM21PG300SH1
40
60
30
45
30
Z
Z
R
20
R
X
10
X
15
0
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
Continued on the following page.
27
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM21PG600SH1
BLM21PG221SH1
400
120
300
200
90
Z
Z
60
R
R
100
0
30
X
X
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
BLM21PG331SH1
600
450
300
Z
R
X
150
0
1
10
100
Frequency (MHz)
1000
28
C50E.pdf
Aug.28,2008
1
BLM31P Series
0.7±0.3
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
3.2±0.2
1.6±0.2
in mm
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(°C)
BLM31PG330SH1
BLM31PG500SH1
BLM31PG121SH1
BLM31PG391SH1
BLM31PG601SH1
33 ±25%
50 (Typ.)
120 ±25%
390 ±25%
600 ±25%
6000
3000
3000
2000
1500
0.01
0.025
0.025
0.05
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
0.09
For the items of rated current higher than 1500mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
700
600
BLM31PG601SH1
500
BLM31PG391SH1
400
BLM31PG121SH1
300
BLM31PG500SH1
(Resistance element becomes dominant
at high frequencies.)
200
BLM31PG330SH1
100
0
1
10
100
Frequency (MHz)
1000
■ Impedance - Frequency Characteristics
BLM31PG330SH1
BLM31PG500SH1
80
60
Z
60
40
45
Z
R
X
R
30
X
20
0
15
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
Continued on the following page.
29
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM31PG121SH1
BLM31PG391SH1
200
600
150
450
300
Z
Z
R
R
100
50
150
0
X
X
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
BLM31PG601SH1
800
600
400
Z
R
X
200
0
1
10
100
Frequency (MHz)
1000
BLM41P Series
0.7±0.3
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
4.5±0.2
1.6±0.2
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
(in mm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 100MHz/20°C)
Temperature Range
(ohm)
(°C)
BLM41PG600SH1
BLM41PG750SH1
BLM41PG181SH1
BLM41PG471SH1
BLM41PG102SH1
60 (Typ.)
75 (Typ.)
6000
3000
3000
2000
1500
0.01
0.025
0.025
0.05
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
180 ±25%
470 ±25%
1000 ±25%
0.09
For the items of rated current higher than 1500mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
30
C50E.pdf
Aug.28,2008
■ Equivalent Circuit
1
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
1200
250
BLM41PG181SH1
200
900
600
BLM41PG102SH1
150
BLM41PG471SH1
100
BLM41PG750SH1
300
0
50
BLM41PG600SH1
0
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
■ Impedance - Frequency Characteristics
BLM41PG600SH1
BLM41PG750SH1
100
100
Z
75
50
75
Z
R
X
R
50
X
25
0
25
0
1
10
100
1000
1
10
100
Frequency (MHz)
1000
Frequency (MHz)
BLM41PG181SH1
BLM41PG471SH1
400
600
300
200
450
300
Z
R
Z
R
X
100
0
150
0
X
1
10
100
Frequency (MHz)
1000
1
10
100
Frequency (MHz)
1000
Continued on the following page.
31
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM41PG102SH1
1200
900
Z
R
600
X
300
0
1
10
100
Frequency (MHz)
1000
■ Notice (Rating)
In operating temperatures exceeding +85D, derating of
current is necessary for chip Ferrite Beads for which rated
current is 1200mA or over. Please apply the derating curve
shown in chart according to the operating temperature.
Derating
6A
6
5
4A
4
3A
3
2.5A
2A
2
1.5A
1.4A
1.2A
1
0
1A
85
125
Operating Temperature [D]
32
C50E.pdf
Aug.28,2008
1
BLM18H Series
0.4±0.2
BLM18H series has a modified internal electrode
structure, that minimizes stray capacitance and
increases the effective frequency range.
■ Features
1.6±0.15
1. BLM18H series realizes high impedance at 1GHz and
is suitable for noise suppression from 500MHz to
GHz range. The impedance value of HG/HD-type is
about three times as large as that of A/B-type at
1GHz though the impedance characteristic of
HG/HD-type is similar to A/B-type at 100MHz or less.
2. HG-type is effective in noise suppression in wide
frequency range (several MHz to several GHz).
HD-type for high-speed signal line provides a
sharper roll-off after the cut off frequency.
0.8±0.15
(in mm)
3. The magnetic shielded structure minimizes cross talk.
Impedance
(at 100MHz/20°C)
(ohm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 1GHz/20°C)
Temperature Range
(ohm)
(°C)
BLM18HG471SH1
BLM18HG601SH1
BLM18HG102SH1
BLM18HD471SH1
BLM18HD601SH1
BLM18HD102SH1
470 ±25%
600 ±25%
1000 ±25%
470 ±25%
600 ±25%
1000 ±25%
600 (Typ.)
700 (Typ.)
1000 (Typ.)
1000 (Typ.)
1200 (Typ.)
1700 (Typ.)
200
200
100
100
100
50
0.85
1.00
1.60
1.20
1.50
1.80
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
2000
4000
1500
3000
2000
BLM18HG102SH1
BLM18HG601SH1
BLM18HD102SH1
1000
BLM18HG471SH1
BLM18HD601SH1
BLM18HD471SH1
500
0
1000
0
1
1000 2000
10
100
Frequency (MHz)
1
10
100
1000
2000
Frequency (MHz)
33
C50E.pdf
Aug.28,2008
■ Impedance - Frequency Characteristics
1
BLM18HG471SH1
BLM18HG601SH1
1000
800
750
500
600
Z
Z
R
X
R
400
X
250
0
200
0
1000 2000
1
10
100
1000 2000
1
10
100
Frequency (MHz)
Frequency (MHz)
BLM18HG102SH1
BLM18HD471SH1
2000
2000
1500
1000
1500
1000
Z
Z
R
R
500
0
500
0
X
X
1000 2000
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
BLM18HD601SH1
BLM18HD102SH1
4000
2000
3000
2000
1500
1000
Z
Z
X
1000
0
500
0
X
R
R
1000 2000
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
34
C50E.pdf
Aug.28,2008
1
BLM18E Series
1.6±0.15
0.8±0.15
BLM18E series has a modified internal electrode
structure, that minimizes stray capacitance and
increases the effective frequency range.
0.4±0.2
■ Features
1. Low DC Resistance and a large Rated Current are
suitable for noise suppression of the driver
circuit.
T
BLM18EGpppTH1
BLM18EGpppSH1
0.5±0.15
0.8±0.15
(in mm)
2. Excellent direct current characteristics.
3. Thin type (t=0.5mm) is suitable for small and
low profile equipment such as ETC, RKE.
Impedance
(at 100MHz/20°C)
(ohm)
Impedance
Operating
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Part Number
(at 1GHz/20°C)
Temperature Range
(ohm)
(°C)
BLM18EG101TH1
BLM18EG121SH1
BLM18EG181SH1
BLM18EG221TH1
BLM18EG331TH1
BLM18EG391TH1
BLM18EG471SH1
BLM18EG601SH1
100 ±25%
120 ±25%
180 ±25%
220 ±25%
330 ±25%
390 ±25%
470 ±25%
600 ±25%
140 (Typ.)
145 (Typ.)
260 (Typ.)
300 (Typ.)
450 (Typ.)
520 (Typ.)
550 (Typ.)
700 (Typ.)
2000
2000
2000
1000
500
0.045
0.04
0.05
0.15
0.21
0.30
0.21
0.35
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
500
500
500
For the items of rated current higher than 2000mA, derating is required.
Please refer to p.37, "Derating of Rated Current".
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
1000
1000
800
600
400
200
BLM18EG601SH1
BLM18EG471SH1
800
BLM18EG391TH1
BLM18EG331TH1
600
BLM18EG221TH1
BLM18EG181SH1
BLM18EG121SH1
400
BLM18EG101TH1
200
0
0
1
1
10
100
1000 2000
10
100
Frequency (MHz)
1000 2000
Frequency (MHz)
Continued on the following page.
35
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM18EG101TH1
1
BLM18EG121SH1
160
200
160
120
80
Z
120
Z
R
80
R
40
X
X
40
0
1
10
100
1000 2000
0
1
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM18EG181SH1
BLM18EG221TH1
400
300
200
100
0
400
300
200
100
0
Z
Z
R
R
X
X
1
10
100
1000 2000
1
10
100
Frequency (MHz)
1000 2000
Frequency (MHz)
BLM18EG331TH1
BLM18EG391TH1
600
700
560
420
280
140
0
450
300
150
0
Z
Z
R
R
X
X
1
10
100
1000 2000
1
10
100
Frequency (MHz)
1000
2000
Frequency (MHz)
BLM18EG471SH1
BLM18EG601SH1
800
600
400
200
0
1000
750
500
250
0
Z
Z
R
R
X
X
1
10
100
1000 2000
1
10
100
Frequency (MHz)
1000 2000
Frequency (MHz)
Continued on the following page.
36
C50E.pdf
Aug.28,2008
Continued from the preceding page.
■ Notice (Rating)
1
In operating temperatures exceeding +85D, derating of
current is necessary for chip Ferrite Beads for which rated
current is 1200mA or over. Please apply the derating curve
shown in chart according to the operating temperature.
Derating
6A
6
5
4A
4
3A
3
2.5A
2A
2
1.5A
1.4A
1.2A
1
0
1A
85
125
Operating Temperature [D]
37
C50E.pdf
Aug.28,2008
Specifications and Test Methods
1
c Test and Measurement Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
c Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Measuring Frequency
BLM15/18/21/31/41 series
BLM18HG/HD type
100±1MHz
100±1MHz, 1GHz±1MHz
Within the specified tolerance.
1
2
Impedance
Impedance Frequency Characteristics (Typical):
See the appendix.
Measuring Equipment: Agilent 4291A or the equivalent
Test Fixture
BLM15/18/21/31/41 series Agilent 16192A or the equivalent
DC Resistance
Meet specifications.
Measuring Equipment: Digital multi-meter
2. Mechanical Performance
No.
Item
Specifications
Test Methods
Appearance and
Dimensions
1
Meet dimensions.
Visual Inspection and measured with micrometer.
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: qSn/Pb=60/40
wSn-3.0Ag-0.5Cu solder
The electrodes should be at least 95% covered with
new solder coating.
Solder Temperature: q230±5°C
w240±5°C
1
2
Solderability
Immersion Time: q4±1s
w3±1s (BLM15/18 series)
w4±1s (BLM21/31/41 series)
Immersion and emersion rates: 25mm/s
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder
Solder Temperature: 270±5°C
Immersion Time: 10±0.5s
Resistance to Soldering
Heat
3
1
Immersion and emersion rates: 25mm/s
Then measured after exposure to room conditions for 48±4 hrs.
It should be soldered on the substrate.
Applying Force (F): 4.9N (BLM15 series)
6.8N (BLM18 series)
9.8N (BLM21/31/41 series)
(Side view)
Applying Time: 5±1s
F
1
4
Bonding Strength!
F
R0.5
Meet Table 1, two pages ahead.
Substrate
It should be mounting with conductive glue on the substrate.
Applying Force (F): 8N
Applying Time: 5±1s
Applying Direction as shown below.
2
5
Bonding Strength@
1 Except BLM18AGpppWH1
2 BLM18AGpppWH1 only.
Continued on the following page.
38
C50E.pdf
Aug.28,2008
Specifications and Test Methods
1
Continued from the preceding page.
No.
Item
Specifications
Test Methods
It should be soldered on the glass-epoxy substrate.
Substrate: 100 Z 40 Z 1.6mm
(BLM15 series: 100 Z 40 Z 0.8mm)
(BLM18H series: 100 Z 40 Z 1.0mm)
Deflection (n): 1.0mm
1
6
Bending Strength
(BLM15 series: 2.0mm)
Pressure jig
(BLM18H series: 2.0mm)
Speed of Applying Force: 0.5mm/s
Keeping Time: 30s
R340
F
Deflection
45
45
Product
(in mm)
Meet Table 1, next page.
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude: 1.5mm or Acceleration amplitude 49m/s2
whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hrs.)
1
7
8
Vibration!
It should be mounted with conductive glue on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude: 1.5mm or Acceleration amplitude 49m/s2
whichever is smaller.
2
Vibration@
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hrs.)
1 Except BLM18AGpppWH1
2 BLM18AGpppWH1 only.
3. Environmental Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Test Methods
Temperature: 70±2°C
Humidity: 90 to 95% (RH)
1
Humidity
Heat Life
Time: 1000 hrs. (±480hrs.)
Then measured after exposure to room conditions for
48±4 hrs.
Temperature: 150±3°C (BLM18AGpppWH1 only)
1
125±3°C (BLM15/18/21/31 series)
85±3°C (BLM18PG330/121/181/221/331 type
BLM21PG/31PG/41PG series)
2
3
4
Applying Current: Rated Current
Time: 1000 hrs. (±480hrs.)
Then measured after exposure to room conditions for
48±4 hrs.
Meet Table 1, next page.
Temperature: -55±2°C
Time: 1000 hrs. (±480hrs.)
Then measured after exposure to room conditions for
48±4 hrs.
Cold Resistance
1 Cycle
1 step: -55±03°C/30±3 min.
2 step: Room Temperature/within 5 min.
3 step: +125±30°C/30±3 min.
4 step: Room Temperature/within 5 min.
Total of 1000 cycles
Temperature Cycle
Then measured after exposure to room conditions for
48±4 hrs.
1 Except BLM18AGpppWH1
Continued on the following page.
39
C50E.pdf
Aug.28,2008
Specifications and Test Methods
1
Continued from the preceding page.
4. Other Performance
No.
Item
Specifications
Test Methods
The products are adhered on the substrate with the conductive
glue and tested under the condition in Table, and then
measured after exposure in room condition for 1 or 2 hours.
Please refer to the figure about the equivalent circuit.
Capacitance for Charging and
150pF
Discharging
330Ω
Resistance for Discharging R1
1
Resistance for
Charge R2
1
ESD Test!
50 to 100MΩ
+20 times/-20 times
Applying Method
R2
R1
Discharge Chip
Product
SW1
SW2
C
Discharge Return
Circuit Connection
Meet Table 1, below.
The products are adhered on the substrate with the conductive
glue and tested under the condition of Table, and then
measured after exposure in room condition for 1 or 2 hours.
Machine
Model
(MM)
Human
Body Model
(HBM)
Capacitance for Charging
and Discharging
1
200pF
0Ω
100pF
1500Ω
1MΩ
2
ESD Test@
Resistance for
Discharging R1
Resistance for
Charge R2
1MΩ
Applying Method
Applying Voltage
±10 times
300V
±5 times
2kV
1 BLM18AGpppWH1 only.
Table 1.
Appearance
Impedance Change (at 100MHz)
DC Resistance
No damage
within ±30%
Meet Table 2, next page.
Continued on the following page.
40
C50E.pdf
Aug.28,2008
Specifications and Test Methods
1
Continued from the preceding page.
Table 2.
DC Resistance
(ohm max.)
Values After Testing
DC Resistance
(ohm max.)
Values After Testing
DC Resistance
(ohm max.)
Values After Testing
DC Resistance
(ohm max.)
Values After Testing
Part Number
Part Number
Part Number
Part Number
BLM18HG601SH1
BLM18HG102SH1
BLM18HD471SH1
BLM18HD601SH1
BLM18HD102SH1
BLM18EG101TH1
BLM18EG121SH1
BLM18EG181SH1
BLM18EG221TH1
BLM18EG331TH1
BLM18EG391TH1
BLM18EG471SH1
BLM18EG601SH1
1.10
1.70
1.30
1.60
1.90
0.07
0.06
0.08
0.21
0.30
0.40
0.30
0.45
BLM21BD421SH1
BLM21BB471SH1
BLM21BD471SH1
BLM21BD601SH1
BLM21BD751SH1
BLM21BD102SH1
BLM21BD152SH1
BLM21BD182SH1
BLM21BD222SH1
BLM21BD222TH1
BLM21BD272SH1
BLM21PG220SH1
BLM21PG300SH1
BLM21PG600SH1
BLM21PG221SH1
BLM21PG331SH1
0.40
0.55
0.45
0.45
0.50
0.50
0.55
0.60
0.70
0.70
0.90
0.02
0.03
0.05
0.10
0.18
BLM15AG100SH1
BLM15AG700SH1
BLM15AG121SH1
BLM15AG221SH1
BLM15AG601SH1
BLM15AG102SH1
BLM15BB050SH1
BLM15BB100SH1
BLM15BB220SH1
BLM15BB470SH1
BLM15BB750SH1
BLM15BB121SH1
BLM15BB221SH1
BLM15BD471SH1
BLM15BD601SH1
BLM15BD102SH1
BLM15BD182SH1
0.10
0.20
0.35
0.45
0.70
1.10
0.15
0.15
0.30
0.45
0.50
0.65
0.90
0.70
0.75
1.00
1.50
BLM18BA470SH1
BLM18BB470SH1
BLM18BD470SH1
BLM18BB600SH1
BLM18BA750SH1
BLM18BB750SH1
BLM18BA121SH1
BLM18BB121SH1
BLM18BD121SH1
BLM18BB141SH1
BLM18BB151SH1
BLM18BD151SH1
BLM18BB221SH1
BLM18BD221SH1
BLM18BB331SH1
BLM18BD331SH1
BLM18BD421SH1
BLM18BB471SH1
BLM18BD471SH1
BLM18BD601SH1
BLM18BD102SH1
BLM18BD152SH1
BLM18BD182SH1
BLM18BD222SH1
BLM18BD252SH1
BLM18PG300SH1
BLM18PG330SH1
BLM18PG600SH1
BLM18PG121SH1
BLM18PG181SH1
BLM18PG221SH1
BLM18PG331SH1
BLM18PG471SH1
BLM18HG471SH1
0.65
0.35
0.40
0.35
0.80
0.40
1.00
0.40
0.50
0.45
0.47
0.50
0.55
0.55
0.68
0.60
0.65
0.95
0.65
0.75
0.95
1.30
1.60
1.60
1.60
0.10
0.05
0.20
0.10
0.18
0.14
0.195
0.26
0.95
BLM21AG121SH1
BLM21AG151SH1
BLM21AG221SH1
BLM21AG331SH1
BLM21AG471SH1
BLM21AG601SH1
BLM21AG102SH1
BLM21BB050SH1
BLM21BB600SH1
BLM21BB750SH1
BLM21BB121SH1
BLM21BD121SH1
BLM21BB151SH1
BLM21BD151SH1
BLM21BB201SH1
BLM21BB221SH1
BLM21BD221SH1
BLM21BB331SH1
BLM21BD331SH1
0.25
0.25
0.30
0.35
0.35
0.40
0.55
0.14
0.25
0.35
0.35
0.35
0.35
0.35
0.45
0.45
0.35
0.50
0.40
BLM31AJ601SH1
BLM31PG330SH1
BLM31PG500SH1
BLM31PG121SH1
BLM31PG391SH1
BLM31PG601SH1
0.10
0.02
0.05
0.05
0.10
0.18
BLM18AG121SH1
BLM18AG151SH1
BLM18AG221SH1
BLM18AG331SH1
BLM18AG471SH1
BLM18AG601SH1
BLM18AG102SH1
BLM18AG471WH1
BLM18AG102WH1
BLM18BA050SH1
BLM18BB050SH1
BLM18BA100SH1
BLM18BB100SH1
BLM18BA220SH1
BLM18BB220SH1
0.28
0.35
0.35
0.40
0.45
0.48
0.60
0.26
0.80
0.30
0.10
0.35
0.15
0.45
0.30
BLM41PG600SH1
BLM41PG750SH1
BLM41PG181SH1
BLM41PG471SH1
BLM41PG102SH1
0.02
0.05
0.05
0.10
0.18
41
C50E.pdf
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip EMIFILr Part Numbering
2
Chip EMIFILr Capacitor Type for Automotive
(Part Number)
1H
3 D
NF
M
21 HC 102
R
q
w
e
r
t
y
u i o
qProduct ID
yCharacteristics
Product ID
Code
C
Capacitance Change (Temperature Characteristics)
NF
Chip EMI Filters Capacitor Type
±20% , ±22%
+20/-30% , +22/-33%
+30/-80% , +22/-82%
±15%
D
wStructure
F
Code
M
Structure
R
Capacitor Type
U
-750 ±120ppm/°C
Other
E
Block, LC Combined Type
Z
eDimensions (LgW)
uRated Voltage
Code
21
Dimensions (LgW)
2.0g1.25mm
EIA
0805
2606
Code
1A
Rated Voltage
10V
61
6.8g1.6mm
1H
50V
2A
100V
rFeatures
iElectrode/Others
Code
HC
Features
For Automotive
Code
Electrode
Sn Plating
Others
HT
T Circuit for Heavy-duty
3
9
tCapacitance
Expressed by three figures. The unit is in pico-farad (pF). The first
and second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
oPackaging
Code
Packaging
Series
NFE
L
K
B
D
Embossed Taping (ø180mm Reel)
Embossed Taping (ø330mm Reel)
Bulk
All series
Paper Taping (ø180mm Reel)
NFM
42
C50E.pdf
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip EMIFILr Capacitor Type NFM21H Series
0.3±0.2
The chip "EMIFIL" NFM21H series is a chip type three
terminal EMI suppression filter. It can reduce
residual inductance to an extremely low level making
it excellent for noise suppression at high
frequencies.
2
0.6±0.2
2.0±0.2
1.25±0.1
(2)
■ Features
(1)
(3)
1. Wide operating temperature range (-55 to +125
degrees C)
(2)
2. Three terminal structure enables high performance
in high frequency range.
(in mm)
3. Uses original electrode structure which realizes
excellent solderability.
4. An electrostatic capacitance range of 22 to
470,000pF enables suppression of noise at specific
frequencies.
■ Applications
Severe EMI suppression and high impedance circuits
such as digital circuits.
Insulation Resistance
(min.)
Capacitance
(pF)
Rated Voltage
Rated Current
(mA)
Operating Temperature Range
Part Number
(Vdc)
(°C)
(M ohm)
NFM21HC220U1H3
NFM21HC470U1H3
NFM21HC101U1H3
NFM21HC221R1H3
NFM21HC471R1H3
NFM21HC102R1H3
NFM21HC222R1H3
NFM21HC223R1H3
NFM21HC104R1A3
NFM21HC224R1A3
NFM21HC474R1A3
22 +20% ,-20%
47 +20% ,-20%
50
50
50
50
50
50
50
50
10
10
10
700
700
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
100 +20% ,-20%
220 +20% ,-20%
470 +20% ,-20%
1000 +20% ,-20%
2200 +20% ,-20%
22000 +20% ,-20%
100000 +20% ,-20%
220000 +20% ,-20%
470000 +20% ,-20%
700
700
1000
1000
1000
2000
2000
2000
2000
■ Equivalent Circuit
■ Insertion Loss Characteristics
(50Ω - 50Ω)
0
10
20
30
40
(1) Input
Output (3)
50
NFM21HC220U1H3
NFM21HC470U1H3
60
No polarity.
NFM21HC101U1H3
NFM21HC221R1H3
70
GND
(2)
NFM21HC471R1H3
NFM21HC102R1H3
NFM21HC222R1H3
NFM21HC223R1H3
80
90
NFM21HC104R1A3
NFM21HC224R1A3
NFM21HC474R1A3
100
1
10
100
1000
2000
Frequency (MHz)
43
C50E.pdf
Aug.28,2008
Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
2
c Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Frequency
22 to 100pF
1.0±0.1MHz
1.0±0.1kHz
1
Capacitance (Cap.)
Within the specified tolerance.
220 to 470000pF
Voltage: 1±0.2Vrms
Insulation Resistance
(I.R.)
Voltage: Rated Voltage
Charging Time: 2 minutes max.
2
3
1000MΩ min.
Test Voltage
22 to 22000pF
150Vdc
30Vdc
100000 to 470000pF
Withstanding Voltage
Products should not be damaged.
Testing Time: 1 to 5s
Charge/Discharge Current: 50mA max.
Measured with 100mA max.
Rdc1: between signal terminals
Rdc2: between ground terminals
Rdc2
22 to 2200pF: 0.3Ω max.
22000 to 470000pF: 0.03Ω max.
4
DC Resistance (Rdc1, 2)
Rdc1
Rdc1
Rdc2
2. Mechanical Performance
No.
Item
Specifications
Test Methods
Appearance and
Dimensions
1
Meet dimensions.
Visual Inspection and measured with micrometer.
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: qSn/Pb=60/40
wSn-3.0Ag-0.5Cu solder
2
Solderability
Electrodes should be at least 90% covered with new solder coating. Solder Temperature: q230± 5°C
w240± 3°C
Immersion Time: q2±0.5s
w3±1s
Immersion and emersion rates: 25mm/s
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: Sn/Pb = 60/40 or Sn-30Ag-0.5Cu solder
Meet Table 1.
Solder Temperature: 270 ± 5°C
Immersion Time: 10±1s
Table 1
Appearance
Cap. Change
(% ∆C)
No damage
Immersion and emersion rates: 25mm/s
Initial values: About 220 to 470000pF, measured after heat
treatment (150±010°C, 1 hour) and exposure in the room
condition for 48±4 hrs.
Then measured after exposure in room conditions for the
following hours.
Resistance to
Soldering Heat
3
Within ± 7.5%
I.R.
1000MΩ min.
22 to 2200pF
0.5Ω max.
Rdc 1, 2
22000 to 470000pF
0.05Ω max.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
It should be soldered on the glass-epoxy substrate.
Applying Force: 17.6N
Applying Time: 60s
1.0
4
Bonding Strength
The electrodes should show no failure after testing.
0.8
(in mm)
0.6
0.6
Continued on the following page.
44
C50E.pdf
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Methods
It should be soldered on the glass-epoxy substrate (t=1mm).
Deflection: 2.0mm
Keeping Time: 30s
Meet Table 2.
Table 2
Appearance
Cap. Change
(% ∆C)
No damage
Within ± 12.5%
Pressure jig
5
Bending Strength
2
R230
F
Deflection
22 to 2200pF
22000 to 470000pF
0.5Ω max.
0.05Ω max.
Rdc1, 2
45
45
Product (in mm)
Meet Table 3.
Table 3
It should be soldered on the glass-epoxy substrate.
Oscillation Frequency: 10 to 55 to 10Hz for 1 min.
Total Amplitude: 1.5mm
Testing Time: A period of 2 hrs. in each of 3 mutually
perpendicular directions. (Total 6 hrs.)
About 220 to 470000pF: heat treatment (150±010°C, 1 hr.)
Appearance
Capacitance
No damage
Within the specified tolerance.
6
Vibration
22 to 2200pF
0.5Ω max.
Rdc1, 2
22000 to 470000pF
0.05Ω max.
3. Environment Performance (It should be soldered on the glass-epoxy substrate.)
No.
Item
Specifications
Test Methods
Temperature: 70±2°C
Humidity: 90 to 95% (RH)
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
1
Humidity
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Temperature: 85±2°C
Humidity: 80 to 85% (RH)
Test Voltage: Rated Voltage
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
2
3
Biased Humidity
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Temperature: 150±2°C
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
Meet Table 4.
Table 4
High Temperature
Exposure
Appearance
Cap. Change
(% ∆C)
No damage
Within ± 12.5%
220 to 470000pF: 48±4 hrs.
I.R.
1000MΩ min.
22 to 2200pF
22000 to 470000pF
0.5Ω max.
0.05Ω max.
Temperature: 125±2°C
Rdc1, 2
Test Voltage: Rated voltageA200%
Charge/Discharge Current: 50mA max.
Time: 1000hrs. (±480 hrs.)
Initial values: About 220 to 470000pF, measured after voltage
treatment (Maximum Operating Temperature ±2°C, Rated
VoltageA200%, 1 hour) and exposure in room condition
for 48±4 hrs.
4
Heat Life
Then measured after exposure to room conditions for the
following hours.
22 to100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Temperature: -55 ± 2°C
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
5
Cold Resistance
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Continued on the following page.
45
C50E.pdf
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Methods
1 Cycle
1 step: -55±03 °C/30±3 minutes
2 step: Room Temperature/within 5 minutes
3 step: +125±30 °C/30 ±3 minutes
4 step: Room Temperature/within 5 minutes
Total of 1000 cycles
Initial values: About 220 to 470000pF, measured after heat
treatment (150±010°C, 1 hr.) and exposure in room condition
for 48±4 hrs.
Then measured after exposure to room conditions for the
following hours.
Meet Table 5.
Table 5
2
Appearance
Cap. Change
(% ∆C)
No damage
6
Temperature Cycle
Within ± 7.5%
I.R.
1000MΩ min.
22 to 2200pF
22000 to 470000pF
0.5Ω max.
0.05Ω max.
Rdc1, 2
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
46
C50E.pdf
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip EMIFILr LC Combined Type for Large Current NFE61H Series
The T-type chip EMI Filter NFE61H series consists of
2
a feedthrough capacitor and ferrite beads.
0.7±0.2
2.6±0.3
0.7±0.2
(1)
(2)
(3)
■ Features
1. Its large rated current of 2A and low voltage drop
due to small DC resistance are suitable for DC
power line use.
+0.3
6.8
1.6±0.3
-0.5
2. The feedthrough capacitor realizes excellent high
frequency characteristics.
3. The structure incorporates built-in ferrite beads
which minimize resonance with surrounding circuits.
4. 33 to 3,300pF lineups can be used in signal lines.
(in mm)
Insulation Resistance
(min.)
Capacitance
(pF)
Rated Voltage
Rated Current
(A)
Operating Temperature Range
Part Number
(Vdc)
(°C)
(M ohm)
NFE61HT330U2A9
NFE61HT680R2A9
NFE61HT101Z2A9
NFE61HT181C2A9
NFE61HT361C2A9
NFE61HT681D2A9
NFE61HT102F2A9
NFE61HT332Z2A9
33 +30% ,-30%
68 +30% ,-30%
100 +30% ,-30%
180 +30% ,-30%
360 +20% ,-20%
680 +30% ,-30%
1000 +80% ,-20%
3300 +80% ,-20%
100
100
100
100
100
100
100
100
2
2
2
2
2
2
2
2
1000
1000
1000
1000
1000
1000
1000
1000
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
■ Equivalent Circuit
■ Insertion Loss Characteristics
(50Ω - 50Ω)
NFE61HT330U2A9
0
NFE61HT680R2A9
NFE61HT101Z2A9
10
20
NFE61HT181C2A9
Input
(1)
Output
(3)
NFE61HT361C2A9
30
NFE61HT681D2A9
NFE61HT102F2A9
40
NFE61HT332Z2A9
GND
(2)
50
60
No polarity.
0.1
1
10
100
1000
Frequency (MHz)
47
C50E.pdf
Aug.28,2008
Specifications and Test Methods
■ Test and Measurement Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
2
■ Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Table 1
Capacitance
33, 68, 100 (pF)
180, 360, 680, 1000, 3300 (pF) 1±0.2Vrms
Voltage
1 to 5Vrms
Frequency
1MHz±10%
1kHz±10%
1
Capacitance (Cap.)
Within the specified tolerance.
Insulation Resistance
(I.R. )
Voltage: 100Vdc
Charging Time: 60±5s
2
3
1000MΩ min.
Test Voltage: 250Vdc
Testing Time: 1 to 5s
Withstanding Voltage
Products should not be damaged.
Charge/Discharge Current: 10mA max.
Attenuating transient voltage of exponential function should be
applied to products in the following conditions.
Meet Table 2.
Table 2
Relay
10Ω
Appearance
No damage
1
Filter
2 3
100Ω
33, 68, 100, 180,
360, 680 (pF)
E
B
Resistance to
Surge Voltage
0.47µF
within ±15%
4
Cap. Change
1000, 3300 (pF)
within ±30%
E
B
400V
I.R.
Withstanding
Voltage
1000MΩ min.
Peak Voltage: 400V
Force Period: 1s
No damage
The number of Surges: 105
2. Mechanical Performance
No.
Item
Specifications
Test Methods
Appearance and
Dimensions
1
Meet dimensions.
Visual Inspection and measured with micrometer.
Flux: Ethanol solution of rosin, 25wt%
Pre-heat: 150±10°C, 60 to 90s
Solder: qSn/Pb = 60/40
wSn-3.0Ag-0.5Cu solder
Solder Temperature: q230±5°C
w240±3°C
The electrodes should be at least 75% covered with
new solder coating.
2
Solderability
Immersion Time: q4±1s
w3±1s
Immersion and emersion rates: 25mm/s
Flux: Ethanol solution of rosin, 25wt%
Pre-heat: 150±10°C, 60 to 90s
Solder: Sn/Pb = 60/40 or Sn-3.0Ag-0.5Cu solder
Solder Temperature: 270±5°C
(for NFE61HT332Z2A9p: 250±5°C)
Immersion Time: 10±1s
Resistance to
Soldering Heat
3
Meet Table 2, above.
Immersion and emersion rates: 25mm/s
Then measured after exposure in room condition for 4 to
48 hrs.
It should be soldered on the Paper-phenol substrate. (t=1.6mm)
Meet Table 3.
Table 3
Pressure jig
R340
F
Appearance
No damage
33, 68, 100, 180,
360, 680 (pF)
Deflection
4
Bending Strength
45
45
Product (in mm)
within ±15%
within ±30%
Cap. Change
Deflection: 3.0mm
Keeping Time: 30s
1000, 3300 (pF)
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude: 1.5mm or Acceleration amplitude 49m/s2
whichever is smaller.
5
Vibration
Meet Table 2, above.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hrs.)
48
C50E.pdf
Aug.28,2008
Specifications and Test Methods
3. Environment Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Test Methods
Temperature: 85±2°C
Humidity: 85% (RH)
1
Humidity
Heat Life
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
2
Meet Table 4.
Table 4
Temperature: 125±2°C
Test Voltage:
Appearance
No damage
33, 68, 100, 180,
360, 680 (pF)
33 to 680 (pF): Rated VoltageA200%
1000 to 3300 (pF): Rated VoltageA150%
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
within ±15%
Cap. Change
2
3
1000, 3300 (pF)
within ±30%
I.R.
Withstanding
Voltage
100MΩ min.
No damage
Temperature: -55±2°C
Time: 500hrs. (±240 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
Cold Resistance
1 Cycle
1 step: -55±03°C/30±3 minutes
2 step: Room Temperature/within 5 minutes
3 step: +125±30°C/30±3 minutes
4 step: Room Temperature/within 5 minutes
Total of 500 cycles
4
Temperature Cycle
Meet Table 2, previous page.
Then measured after exposure in room condition for 4 to
48 hrs.
49
C50E.pdf
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Common Mode Choke Coils Part Numbering
Chip Common Mode Choke Coils for Automotive
(Part Number)
Q
2
L
DL
W
31
S
H
222
S
q
w
e
r
t
y
u
i o !
qProduct ID
uCircuit
Code
Product ID
Circuit
3
DL
Chip Common Mode Choke Coils
S
X
Expressed by a letter.
wStructure
iFeatures
Code
Structure
W
Winding Type
Code
Q
Features
eDimensions (LgW)
K
Expressed by a letter.
Code
31
Dimensions (LgW)
3.2g1.6mm
EIA
P
1206
1812
oNumber of Signal Lines
43
4.5g3.2mm
Code
Number of Signal Lines
rType
2
Two Lines
Code
Type
!Packaging
S
Magnetically Shielded One Circuit Type
Code
Packaging
Series
tCategory
K
L
Embossed Taping (ø330mm Reel)
Embossed Taping (ø180mm Reel)
Bulk
DLW43S
Code
Category
All Series
H
For Automotive
B
yImpedance (DLW31S)
Typical impedance at 100MHz is expressed by three figures. The
unit is in ohm (Ω). The first and second figures are significant
digits, and the third figure expresses the number of zeros which
follow the two figures.
yInductance (DLW43S)
Expressed by three-figures. The unit is micro-henry (µH). The first
and second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
50
C50E.pdf
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Common Mode Choke Coil DLW31S/43S Series
DLW31S Series
DLW31S series is a high performance wound type
chip common mode choke coil.
1.6±0.2
■ Features
3.2±0.2
1. DLW31S is the small size (3.2x1.6x1.9mm).
3
(1)
(2)
2. Suitable for noise suppression at car area networks
like CAN (Controller Area Network) bus.
3. DLW31S has high common mode impedance so it is
suitable for noise suppression through wide
(4)
(3)
frequency range.
(in mm)
(0.6)
(0.6)
4. Wide operating temperature range (-40 to +125
degrees C)
■ Applications
Noise suppression at car area networks like CAN bus or
car navigation system.
Common Mode Impedance
(at 100MHz/20 degree C)
(ohm)
Insulation Resistance
(min.)
Rated Current Rated Voltage
Withstand Voltage DC Resistance
Part Number
(mA)
(Vdc)
(Vdc)
(ohm)
(M ohm)
DLW31SH222SQ2
2200 ±25%
80
32
10
80
1.6 ±20%
Operating Temperature Range: -40°C to 125°C
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
10000
Common mode
DLW31SH222SQ2
1000
100
(1)
(2)
10
DLW31SH222SQ2
1
(3)
(4)
Differential mode
No polarity.
0.1
1
10
100
Frequency (MHz)
1000
51
C50E.pdf
Aug.28,2008
DLW43S_XK Series
■ Features
1. Small size: L4.5xW3.2xT2.6mm (EIA code: 1812)
Tolerance: +/-0.2mm
(0.8)
4.5±0.2
2. It realized common mode inductance of 100microH
(at 1MHz) though it is small size.
3. Common mode inductance items of 100microH and
51microH, and they can be used for each
applications.
3.2±0.2
(1)
(4)
(2)
(3)
(0.6): 100µH
(0.7): 51µH
■ Applications
(in mm)
For Automotive.
3
Common mode noise suppression of automotive LAN for
Flex Ray, CANBUS.
Insulation Resistance
(min.)
Common Mode Inductance Rated Current Rated Voltage
Withstand Voltage DC Resistance
Part Number
(µH)
(mA)
(Vdc)
(Vdc)
(ohm)
(M ohm)
DLW43SH510XK2
DLW43SH101XK2
51 -30% /+50% (at 1MHz)
100 -30% /+50% (at 1MHz)
230
200
50
50
10
10
125
125
1.0 max.
2.0 max.
Operating Temperature Range: -40°C to 125°C
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
100000
DLW43SH101XK2
10000
(1)
(2)
Common mode
DLW43SH510XK2
1000
100
DLW43SH101XK2
Differential mode
(3)
(4)
10
1
DLW43SH510XK2
No polarity.
1
10
100
Frequency (MHz)
DLW43S_XP Series
■ Features
1. Small size: L4.5xW3.2xT2.7mm (EIA code: 1812)
Tolerance: +/-0.2mm
(0.8)
4.5±0.2
2. It realized common mode inductance of 100microH
(at 0.1MHz) though it is small size.
3.2±0.2
(1)
(4)
(2)
3. Suitable for noise suppression from low
frequency range (0.1MHz).
(3)
■ Applications
For Automotive.
(0.6)
(in mm)
Common mode noise suppression of automotive LAN for
Flex Ray etc.
Insulation Resistance
(min.)
Common Mode Inductance Rated Current Rated Voltage
Withstand Voltage DC Resistance
Part Number
(µH)
(mA)
(Vdc)
(Vdc)
(ohm)
(M ohm)
DLW43SH101XP2
100 -30% /+80% (at 0.1MHz)
170
50
10
125
2.0 max.
Operating Temperature Range: -40°C to 125°C
52
C50E.pdf
Aug.28,2008
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
10000
Common mode
DLW43SH101XP2
1000
100
10
(1)
(2)
DLW43SH101XP2
Differential mode
(3)
(4)
1
No polarity.
0.1
0.1
1
10
100
Frequency (MHz)
3
53
C50E.pdf
Aug.28,2008
Specifications and Test Methods
■ Test and Measurement Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
■ Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Common Mode
Impedance (Zc) *1
Measuring Equipment: Agilent 4291A or the equivalent
Measuring Frequency: 100±1MHz
1
3
Within the specified tolerance.
Common Mode
Inductance (Lc) *2
Measuring Equipment: Agilent 4294A or the equivalent
Measuring Frequency: 1MHz or 0.1MHz (DLW43SH101XP2)
2
3
Insulation
Resistance (I.R.)
Measuring Voltage: Rated Voltage
Charging Time: 1 minute max.
10MΩ min.
Test Voltage: 2.5 times for Rated Voltage
Tsting Time: 1 to 5 s
Charge/Discharge Current: 1mA max.
Products should not be damaged.
4
5
Withstanding Voltage
DC Resistance
Measuring Current: 10mA max.
(In case of doubt in the above mentioned standard conditions,
measure by 4 terminal methods.)
Meet the initial value specification.
*1 DLW31S only.
*2 DLW43S only.
2. Mechanical Performance
No.
Item
Specifications
Test Methods
Appearance
and Dimensions
1
Meet dimensions.
Visual Inspection and measured with micrometer.
Flux: Ethanol solution of rosin, 25wt% includes activator
equivalent to 0.06 to 0.10wt% chlorine
Pre-heating: 150±5°C, 60±5s
Solder: qSn/Pb=60/40
wSn-3.0Ag-0.5Cu solder
Solder Temperature: q230±5°C
w245±3°C
Immersion Time: q3±0.5s
w4±1s
The electrodes should be at least 90% covered with
new solder coating.
2
Solderability
Immersion and emersion rates: 25mm/s
Stainless tweezers
Please hold product as shown.
Flux: Ethanol solution of rosin, 25wt% includes activator
equipment to 0.06 to 0.10wt% chlorine
Pre-heating: 150±5°C, 60±5s
Solder: Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder
Solder Temperature: 260±5°C
Immersion Time: 10±0.5s
Resistance to
Soldering Heat
3
Meet Table 1, next page.
Immersion and emersion rates: 25mm/s
Then measured after exposure in room condition for 4 to
48 hrs.
It should be soldered on the substrate.
Applying Force (F): 10N (DLW31S Series)
17.7N (DLW43S Series)
Applying Time: 5±1s (DLW31S Series)
60s (DLW43S Series)
No evidence of coming off substrate.
Products should not be mechanically damaged.
4
Bonding Strength
Pressure
Product
Substrate
Test board fixture
Continued on the following page.
54
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Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Methods
It should be soldered on the Glass-epoxy substrate.
(t=1.0mm DLW31S Series)
(t=1.6mm DLW43S Series)
Deflection (n): 2.0mm
Keeping time: 5s (DLW31S Series)
60s (DLW43S Series)
5
Bending Strength
Speed of Applying Force: 0.5mm/s
Pressure jig
R230
F
Deflection
Meet Table 1, below.
45
45
Product (in mm)
It should be soldered on the substrate.
3
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude 1.5mm or acceleration amplitude 49m/s2
whichever is smaller. (DLW31S Series)
6
Vibration
Total Amplitude 3.0mm or acceleration amplitude 245m/s2
whichever is smaller. (DLW43S Series)
Testing Time: A period of 4 hrs. in each of 3 mutually
perpendicular directions. (Total 12 hrs.)
3. Environmental Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Test Methods
Temperature: 85±2°C
Humidity: 85% (RH)
1
Time: 1000hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
Humidity
Heat Life
Temperature: 125±2°C
Applying Current: Rated Current
Time: 1000hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
2
3
Temperature: -40± 2°C
Time: 1000hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
Cold Resistance
Meet Table 1, below.
1 Cycle
Step 1: -40±03°C/30±3 minutes
Step 2: Room Temperature/within 5 minutes (DLW31S Series)
Room Temperature/within 10 to 15 minutes (DLW43S Series)
Step 3: +125±30°C/30±3 minutes
4
Temperature Cycle
Step 4: Room Temperature/within 5 minutes (DLW31S Series)
Room Temperature/within 10 to 15 minutes (DLW43S Series)
Total of 1000 cycles (DLW31S Series)
Total of 300 cycles (DLW43S Series)
Then measured after exposure in room condition for 4 to
48 hrs.
Table 1
Appearance
No damage
Common Mode
Impedance Change
within ±20% (DLW31S Series)
Common Mode
Inductance
Meet the initial value specification.
(DLW43S Series)
Insulation Resistance
10MΩ min.
Meet the initial value specification.
(DLW43S Series)
DC Resistance
Withstanding Voltage
No damage
Continued on the following page.
55
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Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
4. Test Terminal (When measuring and supplying the voltage, the following terminal is applied.)
No.
Item
Terminal to be Tested
Common Mode Impedance (Measurement Terminal)
Common Mode Inductance (Measurement Terminal)
Terminal
1
Terminal
Terminal
Terminal
2
3
Withstanding Voltage (Measurement Terminal)
Terminal
Terminal
3
DC Resistance (Measurement Terminal)
Terminal
Terminal
Terminal
Terminal
4
5
Insulation Resistance (Measurement Terminal)
Heat Life (Supply Terminal)
Terminal
Terminal
■ Measuring Method for Common Mode Impedance
Measured common mode impedance may include
measurement error due to stray capacitance, residual
inductance of test fixture.
To correct this error, the common mode impedance should
be calculated as follows;
(1) Measure admittance of the fixture (opened), Go Bo.
(2) Measure impedance of the fixture (shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance |Z| using the formula
below.
|Z| = (Rx2+Xx2)1/2
Where
Gm - Go
Rx =
Xx =
- Rs
- Xs
(Gm-Go)2 + (Bm-Bo)2
-(Bm - Bo)
(Gm-Go)2 + (Bm-Bo)2
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On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Block Type EMIFILr BNX024H/025H/012H Series
Block Type EMIFILr SMD Type
12.1±0.2
(1)
(3)
(2)
(4)
BNX024H/025H (Block Type EMIFIL for automotive) is
EMI suppression filter suppporting large cuurent,
wide frequency.
*
Part Number Appearance
BNX024H01 BNX024
BNX025H01 BNX025
BNX02p*
And it also support SMD mounting.
(1)
(3)
(4)
(2)
This product is effective for noise suppression
(4)
7.0±0.2 1.55±0.2
for DC switching line of automotive device and
FA/OA device, because it covers wide temperature
(3)
(4)
(2)
range from -55C degrees to 125 C degrees.
(1)
: Electrode
(in mm)
2.5±0.2 1.55±0.2
1.0±0.3
■ Features
(4)
1. Supporting large current (15A)
2. Supporting wide frequency range
From 50kHz to 1GHz:35dB min.(BNX025)
3. Suitable for miniaturization with SMD shape.
4
■ Applications
Automotive devices/Displays (PDP/LCD-TV)/
Digital AV equipments/Amusement equipments/
PC peripheral equipments/Industry equipments/
Measurement equipments/Power supplies
Rated
Voltage
(Vdc)
Withstand
Voltage
(Vdc)
Rated
Insulation
Part Number
Current Resistance (min.)
Insertion Loss
(A)
(M ohm)
BNX024H01
BNX025H01
50
25
125
15
100
100kHz to 1GHz:35dB min. (20 to 25 degrees C line impedance=50 ohm)
50kHz to 1GHz:35dB min. (20 to 25 degrees C line impedance=50 ohm)
62.5
15
50
Operating Temperature Range: -55°C to 125°C
■ Equivalent Circuit
■ Insertion Loss Characteristics
BNX024H01
0
10
20
30
40
50
60
70
80
90
100
L1
L2
L3
C2
CB (2)
CG (4)
(1)
B
C1
(3) PSG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
0.01
0.1
1
10
100
1000
Frequency (MHz)
Continued on the following page.
57
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Continued from the preceding page.
■ Insertion Loss Characteristics
BNX025H01
0
10
20
30
40
50
60
70
80
90
100
0.01
0.1
1
10
100
1000
Frequency (MHz)
■ Derating of Rated Current
In operating temperatures exceeding +85°C, derating of
current is necessary for BNX024H/025H series. Please
apply the derating curve shown in chart according to the
operating temperature.
Derating
15
4
1
0
-40
85
125
Operating Temperature (°C)
Block Type EMIFILr Lead Type
(1)
(3)
(4)
BNX012H series is noise suppression filter and ESD
surge protection filter for Automotive.
(2)
Suitable for the power supply circuits which is large
current and wide frequency range.
12.0±0.2
BNX012H
2D
■ Features
1. Large rated current(15A) and Low DC Resistance
0.8
±0.1
ø0.8
ø0.8
(4)
ø0.8
(0.8m ohm-Typ.)
0.6
±0.1
2. High insertion loss characteristic over a wide
frequency range of 1MHz to 1GHz.
3. Low profile (height: 8.0mm except lead terminal)
(4)
7.5±0.2
2.5±0.2
2.5±0.2
(in mm)
■ Applications
Noise suppression and ESD surge protection for power
lines such as ECU, DC-DC Converters , and Inverter
circuits.
Rated
Voltage
(Vdc)
Withstand
Voltage
(Vdc)
Rated
Insulation
Part Number
Current Resistance (min.)
Insertion Loss
1MHz to 1GHz:40dB min. (20 to 25 degrees C line impedance=50 ohm)
(A)
(M ohm)
BNX012H01
50
125
15
500
Operating Temperature Range: -55°C to 125°C
58
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■ Equivalent Circuit
■ Insertion Loss Characteristics
(50Ω - 50Ω)
0
10
20
30
40
50
60
70
80
90
L1
L3
C2
CB (2)
CG (4)
(1)
B
C1
L2
(3) PSG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
0.1
1
10
100
1000
Frequency (MHz)
■ Derating of Rated Current
" Rating
Derating
In operating temperatures exceeding +85°C, derating of
current is necessary for BNX012H series. Please apply the
derating curve shown in chart according to the operating
temperature.
15
4
10
3
0
-55
85
105
125
Operating Temperature (°C)
" Connecting ± Power Line
In case of using ± power line, please connect to each
terminal as shown.
Power Supply
(BNX Input)
BNX
Circuit
(BNX Output)
Power Supply W Bias
Load Circuit W Bias
Load Circuit Ground
CB
CG
B
PSG
Power Supply Ground
Power Supply Y Bias
B
CB
CG
Load Circuit Y Bias
PSG
Power Supply Ground
Load Circuit Ground
59
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BNX024H/025H series Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
Temperature: 20°C±2°C
Humidity: 60 to 70% (RH)
Atmospheric pressure: 86 to 106kPa
c Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Measured at DC rated voltage between terminal (1)(2) and
(3)(4).
Time: 60s max.
Charging Current: 50mA max.
Measuring Equipment: R8340A or the equivalent
BNX024H01: 100MΩ min.
BNX025H01: 50MΩ min.
1
Insulation Resistance
Withstanding voltage shall be applied between terminal (1)(2)
and (3)(4).
Test Voltage: BNX024H01 125V (DC)
BNX025H01 62.5V (DC)
2
Dielectric Strength
Filter should not fail.
Time: 5±1s
Charging current: 50mA max.
4
Measured by the way of 4 terminal method between (1) and (2)
and between (3) and (4).
3
4
DC Resistance
Capacitance
0.43±0.20mΩ
Measured by the follwing condition between Terminal (1)(2)
and (3)(4).
Frequency: 1±0.1kHz
BNX024H01: 4.7µF±15%
BNX025H01: 10µF±15%
Voltage: 1V (rms) max.
Measuring Equipment: HP4278A or the equivalent
50Ω
10dB
50Ω
10dB
Balun
1
2
Attenuator
Attenuator
Specimen
50Ω
3
4
E
BNX024H01: 35dB min. (100kHz to 1GHz)
BNX025H01: 35dB min. (50kHz to 1GHz)
50Ω
5
Insertion Loss
SG
*Method of measurement based on MIL-STD-220
Insertion Loss = -20 log E1/E0 (dB)
E0: Level without FILTER (short)
E1: Level with FILTER
After soldering the part on the test substrate, measure the
voltage with passing the rated current as shown in the
schematic below.
A
(i)
Specimen
V
(ii)
6
Voltage Drop
45mV max.
Where the terminals of the part shall be connected as follows:
Referring to the terminal No. shown in item 5, connect terminal
No. (2) and (4) by soldering copper wire with diameter more
than 1mm / length less than 6mm.
Then connect terminal No. (1) as (i) and terminal No. (3) as (ii)
the measurement circuit as mentioned above.
The probe for measuring the voltage shall be touched on the
solder fillet of (1)(3).
Continued on the following page.
60
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BNX024H/025H series Specifications and Test Methods
Continued from the preceding page.
2. Mechanical Performance
No.
Item
Specifications
Test Methods
Appearance and
Dimensions
Visual Inspection and measured with micrometer caliper and
slid caliper.
1
2
3
Meet dimensions.
Marking
Marking can be read easily.
It is inspected Visually.
Comfirm the solder mounting condition after mounting based
on standard solder mounting method.
Reflow Solderability
Appropriate solder fillet is formed.
Soldering Iron: 100W max.
Tip Temperature: 450±5°C
Soldering Time: 5s, 2 times
Do not touch the products directly with the tip of the soldering
iron.
Resistance to
Soldering Heat
4
Meet Table 1.
Table 1
It shall be soldered on the glass-epoxy substrate.
(100mm x 40mm x 1.6mm)
Pressure jig
Appearance
No damaged
BNX024H01: 100MΩ min.
BNX025H01: 50MΩ min.
No failure
Insulation Resistance
F
R230
Dielectric Strength
Capacitance Change
Deflection
5
Bending Strength
Within ±7.5%
45
45
Product
(in mm)
4
Deflection: 2mm
Keeping Time: 30s
Speed: 0.5mm/s
It shall be dropped on concrete or steel board.
Method: free fall
Height: 1m
6
7
Drop
The Number of Time: 10 times
It shall be soldered on the glass-epoxy substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 minutes
Total amplitude 3.0mm or Acceleration amplitude 196m/s2
whichever is smaller.
Time: A period of 3 hours in each of 3 mutually perpendicular
directions. (Total 9 hours)
Meet Table 2.
Table 2
Vibration
Appearance
No damaged
BNX024H01: 100MΩ min.
BNX025H01: 50MΩ min.
No failure
Insulation Resistance
Dielectric Strength
It shall be soldered on the glass-epoxy substrate.
Acceleration: 14700m/s2
Capacitance Change
Within ±15%
Normal duration: 0.5ms
Waveform: Half-sine wave
8
Shock
Direction: 6 direction
Testing Time: 3 times for each direction
3. Environmental Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Test Methods
Meet Table 3.
Table 3
Temperature: 85±2°C
Humidity: 80 to 85% (RH)
Appearance
No damaged
Voltage: Rated Voltage
1
Biased Humidity
48
BNX024H01: 5MΩ min.
BNX025H01: 2.5MΩ min.
Within ±12.5%
Time: 1000± hrs.
0
Insulation Resistance
Capacitance Change
Then measure values after exposure in room condition for
48±4 hours.
Meet Table 4.
Table 4
Temperature: 125±2°C
Voltage: Rated Voltage x 2
Appearance
No damaged
BNX024H01: 10MΩ min.
BNX025H01: 5MΩ min.
Within ±12.5%
48
2
Heat Life
Time: 1000± hrs.
0
Insulation Resistance
Capacitance Change
Then measure values after exposure in room condition for
48±4 hours.
1 Cycle:
1 step: -55± °C/30± min.
0
3
3
0
2 step: Room Temperature/within 0.5 min.
3
0
3
0
3 step: +125± °C/30± min.
3
Heat Shock
Meet Table 4.
4 step: Room Temperature/within 0.5 min.
Total Cycles: 1000 cycles
Then measure values after exposure in room condition for
48±4 hours.
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BNX012H series Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
<In case of doubt>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
Temperature: 20°C±2°C
Humidity: 60 to 70% (RH)
Atmospheric pressure: 86 to 106kPa
c Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Measured at DC rated voltage between terminal (1)(2) and
(3)(4).
1
Insulation Resistance
500MΩ min.
Voltage: 50Vdc
Charging time: 2 minutes
Suitable resistor: 1MΩ
Test voltage should be applied between terminal (1)(2) and
(3)(4).
2
3
Dielectric Strength
Capacitance
Filter should not fail.
Test Voltage: 125Vdc
Testing Time: 1 to 5s
Charge/Discharge Current: 50mA max.
4
Measured at the following conditions between terminal (1)(2)
and (3)(4).
Frequency: 1.0±0.1kHz
Voltage: 1Vrms max.
1.0µF±15%
Measured by the following circuit.
Measuring Equipment: R3767 C (manufactured by
ADVANTEST) or the equivalent.
Sample: build product into Balun.
NETWORK ANALYZER
Port 1 (50Ω)
Port 2 (50Ω)
4
Insertion Loss
40dB min. (1MHz to 1GHz)
Balun (*) Product
(1) (2)
1 2
3 4
(3)
(3)
(*): It uses the Balun or 1 to 1 transformer.
Rated Current: 15 A
Substrate: 100x100x1.6mm (paper-phenol)
Soldering: Insert the terminals into the holes on P.C. board
completely.
Voltage Drop Value: V1+V2
V1
Product
(4)
(2)
(3)
(1)
(1) to (4): Terminal
A
5
Voltage Drop
35mV max.
Substrate
V2
Probe of each voltmeter should contact the center of soldering
parts as shown in the following figure.
Paper-phenol
Substrate
Probe
Copper foil pattern
Solder
Product’s Terminal
Continued on the following page.
62
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BNX012H series Specifications and Test Methods
Continued from the preceding page.
2. Mechanical Performance
No.
Item
Specifications
Test Methods
Appearance and
Dimensions
1
2
Meet dimensions.
Visual Inspection and measured with micrometer.
It is inspected Visually.
Marking
Marking can be read easily.
Flux: Ethanol solution of rosin, 25(wt)%
Pre-Heating: 150±10°C, 60 to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder Temperature: 235± °C
0
5
Immersion Time: 5±0.5s
The lead is covered with a new solder coating at least
95% of the total surface of the immersed part.
BNX012H
61
3
Solderability
1.6±0.8mm
Molten Solder
Meet Table 1.
Table 1
Flux: Ethanol solution of rosin, 25(wt)%
Pre-Heating: 150±10°C, 60 to 90s
Solder: Sn-3.0Ag-0.5Cu
4
Appearance
No damage
500MΩ min.
No failure
Resistance to
Soldering Heat
4
Solder Temperature: 270±10°C
Insulation Resistance
Dielectric Strength
Capacitance Change
2
0
Immersion Time: 10± s
Then measure values after exposure in room condition for 24
to 48 hrs.
Within ±7.5%
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20min.
Testing Time: A period of 3 hours in each of 3 mutually
perpendicular directions. (Total 9 hrs.)
Total amplitude 1.5mm or Acceleration amplitude 196m/s2
whichever is smaller.
Meet Table 2.
Table 2
Appearance
Insulation Resistance
Dielectric Strength
Capacitance
No damage
500MΩ min.
No failure
5
Vibration
1.0µF±15%
Then measure values after exposure in room condition for 4 to
24 hrs.
3. Environmental Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Test Methods
Temperature: 85±2°C
Humidity: 80 to 85%(RH)
48
1
Humidity
Meet Table 1.
Time: 1000± hrs.
0
Remove the drops and then measure values after exposure in
room condition for 24 to 48 hrs.
Temperature: 85±2°C
Humidity: 80 to 85%(RH)
Test Voltage: 50Vdc
2
Biased Humidity
48
Time: 1000± hrs.
0
Remove the drops and then measure values after exposure in
room condition for 24 to 48 hrs.
Meet Table 3.
Table 3
Temperature: 125±2°C
Appearance
Insulation Resistance
Capacitance Change
No damage
50MΩ min.
Within ±12.5%
Test Voltage: 100Vdc
48
3
4
Heat Life
Time: 1000± hrs.
0
Then measure values after exposure in room condition for 24
to 48 hrs.
Temperature: -55±2°C
48
Time: 1000± hrs.
0
Cold Resistance
Then measure values after exposure in room condition for 24
to 48 hrs.
1 Cycle:
0
1 step: -55± °C/30 minutes
3
2 step: Room Temperature/within 1 minute
3
3 step: +125± °C/30 minutes
4 step: Room Temperature/within 1 minute
Total of 1000 cycles
0
5
Temperature Cycle
Meet Table 1.
Then measure values after exposure in room condition for 24
to 48 hrs.
63
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Chip EMIFILr!Caution/Notice
■ !Caution (Rating)
1. Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
2. Be sure to provide an appropriate fail-safe
function on your product to prevent a second damage
that may be caused by the abnormal function or
the failure our product.
■ !Caution (Soldering and Mounting)
1. Self-heating
Please provide special attention when mounting chip
"EMIFIL" (BLM_P) series in close proximity to other
products that radiate heat.
The heat generated by other products may deteriorate
the insulation resistance and cause excessive heat in this
component.
4
2. Mounting Direction
Mount Chip Common Mode Choke Coils (DLW31S/43S)
in right direction. Wrong direction, which is 90 degrees
rotated from right direction, causes not only open or short
circuit but also flames or other serious trouble.
Z
Z
right direction
wrong direction
■ Notice (Storage and Operating Condition)
< Operating Environment >
2. Storage Conditions
Do not use products in a chemical atmosphere such as
chlorine gas, acid or sulfide gas.
(1) Storage temperature: -10 to 40 degrees C
Relative humidity: 30 to 70%
< Storage and Handling Requirements >
1. Storage Period
Avoid sudden changes in temperature and humidity.
(2) Do not store products in a chemical atmosphere
such as chlorine gas, acid or sulfide gas.
BLM series should be used within 6 months, the
other series should be used within 12 months.
Products to be used after this period should be
checked for solderability or bondability with
glue.
■ Notice (Soldering and Mounting)
1. Washing
4. Other
Failure and degradation of a product are caused
by the washing method. When you wash in conditions
that are not in mounting information, please contact
Murata engineering.
Noise suppression levels resulting from Murata's
EMI suppression filters "EMIFIL" may vary,
depending on the circuits and ICs used, type of
noise, mounting pattern, mounting location, and
other operating conditions. Be sure to check and
confirm in advance the noise suppression effect
of each filter, in actual circuits, etc. before
applying the filter in a commercial-purpose
equipment design.
2. Soldering
Reliability decreases with improper soldering
methods. Please solder by the standard soldering
conditions shown in mounting information.
3. Mounting on-boad with Conductive Glue
BLM18AG_WH is designed for conductive glue
mounting method. Please refer to Mounting
infomation.
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Chip EMIFILr!Caution/Notice
■ Notice (Handling)
1. Resin coating (DLW31S)
So, please pay your careful attention in selecting
Do not make any resin coating DLW31S series.
The impedance value may change due to high
cure-stress of resin to be used for coating/ molding
products.
resin in case of coating/ molding the products with
the resin. Prior to use the coating resin,
please make sure no reliability issue is observed
by evaluating products mounted on your board.
3. Resin coating (Except DLW31S/43S)
It may affect the product's performance when using
resin for coating/ molding products, except
DLW31S/43S.
An open circuit issue may occur by mechanical
stress caused by the resin, amount/ cured shape of
resin, or operating condition etc. Some resin
contains some impurities or chloride possible to
generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil,
leading to open circuit.
So please pay careful attention in selecting resin.
Prior to use, please evaluate reliability with the
product mounted in your application set.
4. Caution for use (DLW31S/43S)
So, please pay your careful attention in selecting
resin in case of coating/ molding the products with
the resin.
Sharp material, such as a pair of tweezers,
should not touch the winding portion to prevent
breaking the wire.
2. Resin coating (DLW43S)
4
The inductance value may change due to high
cure-stress of resin to be used for
Mechanical shock should not be applied to the
products mounted on the board to prevent breaking
the core.
coating/ molding products.
An open circuit issue may occur by mechanical
stress caused by the resin, amount/ cured shape of
resin, or operating condition etc. Some resin
contains some impurities or chloride possible to
generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil,
leading to open circuit.
65
C50E.pdf
Aug.28,2008
Lead Type EMIFILr!Caution/Notice
■ Notice (Rating)
Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
■ Notice (Soldering and Mounting)
Mounting holes should be designed as specified in these
specifications. Other designs than shown in these
specifications may cause cracks in ceramics which may
lead to smoking or firing.
■ Notice (Storage and Operating Condition)
<Operating Environment>
2. Storage Conditions
1. Do not use products in a chemical atmosphere such
as chlorine gas, acid or sulfide gas.
2. Do not use products near water, oil or organic
solvents. Avoid environment where dust or dirt may
adhere to product.
(1) Storage temperature: -10 to 40 degrees C
Relative humidity: 30 to 70%
4
Avoid sudden changes in temperature and
humidity.
(2) Do not store products in a chemical atmosphere
such as chlorine gas, acid or sulfide gas.
<Storage and Handling Requirements>
1. Storage Period
Used the products within 12 months after delivery.
Solderability should be checked if this period is
exceeded.
■ Notice (Soldering and Mounting)
1. Washing
3. Other
Failure and degradation of a product are caused
by the washing method. When you wash in conditions
that are not in mounting information, please
contact Murata engineering.
Noise suppression levels resulting from Murata's
EMI suppression filters "EMIFIL" may vary,
depending on the circuits and ICs used, type of
noise, mounting pattern, mounting location, and
other operating conditions. Be sure to check and
confirm in advance the noise suppression effect
of each filter, in actual circuits, etc. before
applying the filter in a commercial-purpose
equipment design.
2. Soldering
Reliability decreases with improper soldering
methods. Please solder by the standard soldering
conditions shown in mounting information.
66
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Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
1. Standard Land Pattern Dimensions
Land Pattern
+ Solder Resist
Land Pattern
(in mm)
Solder Resist
oReflow and Flow
BLM15
BLM18
BLM21
BLM31
BLM41
BLM Series (Except BLMppP series)
BLMppP
a
b
a
b
Type
Soldering
Reflow
Flow
a
b
c
1
BLM15
0.4
1.2-1.4 0.5
Land pad thickness
Rated
and dimension d
2
Type
Current
(A)
Soldering
a
b
c
2.2-2.6
0.7
BLM18
0.7
1.2
2.0
(Except 18PG)
Reflow
1.8-2.0
18µm 35µm 70µm
0.5-1.5
0.7 0.7 0.7
Flow
BLM21
(Except 21PG)
Flow/
Reflow
3.0-4.0 1.0
4.2-5.2 1.2
2.2-2.6
4
BLM18PG
2
3
0.7
0.7 1.2 0.7 0.7
2.4 1.2 0.7
1.0 1.0 1.0
1.2 1.0 1.0
Reflow
1.8-2.0
BLM31
(Except 31PG)
Flow/
Reflow
1.5
2
1
BLM15 is specially adapted for reflow soldering.
BLM21PG
1.2 3.0-4.0 1.0
3
2.4 1.2 1.0
6.4 3.3 1.65
1.2 1.2 1.2
2.4 1.2 1.2
6.4 3.3 1.65
1.2 1.2 1.2
2.4 1.2 1.2
6.4 3.3 1.65
Flow/
6
Reflow
1.5/2
3
2
BLM31PG
BLM41PG
2.0 4.2-5.2
1.2
BLM18A_WH series
is designed for
conductive glue
mounting method,
not for normal
soldering method.
Please contact us
for applicable
6
1-2
3
3.0 5.5-6.5
6
• Do not apply narrower pattern than listed above to BLMppP.
Narrow pattern can cause excessive heat or open circuit.
mounting method for
BLM18A_WH series.
o Reflow Soldering
NFM21H
Chip mounting side
Small diameter thru hole ø0.4
a
b
c
The chip EMI filter suppresses noise by conducting the high-
frequency noise to ground. Therefore, to get enough noise
reduction, feed through holes which are connected to ground-
plane should be arranged according to the figure to reinforce
the ground pattern.
Size (mm)
Part Number
a
b
c
d
e
f
g
NFM21H
0.6 1.4 2.6 0.6 0.8 1.9 2.3
• NFM21 is specially adapted for reflow soldering.
o Reflow Soldering
o Flow Soldering (Except NFE61HT332)
NFE61H
Chip mounting side
Chip mounting side
Small diameter thru hole ø0.4
Small diameter thru hole ø0.4
1.5
3.8
4.8
9.0
2.0
4.8
8.8
Continued on the following page.
67
C50E.pdf
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
DLW31S
oReflow Soldering
1 : If the pattern is made with wider than 1.6mm (DLW31S) it
may result in components turning around, because
melting speed is different. In the worst case, short circuit
between lines may occur.
2 : If the pattern is made with less than 0.4mm, in the worst
case, short circuit between lines may occur due to spread
of soldering paste or mount placing accuracy.
3 : If the pattern is made with wider than 1.6mm (DLW31S),
the bending strength will be reduced.
3
a
b
Series
a
b
c
d
Do not use gilded pattern; excess soldering heat may dissolve
metal of a copper wire.
DLW31S
1.6
3.7
0.4
1.6
DLW43S
oReflow Soldering
4
1 : If the pattern is made with wider than 3.4mm, it may result
in components turning around, because melting speed is
different. In the worst case, short circuit between lines
may be occur.
2 : If the pattern is made with less than 1.6mm, in the worst
case, short circuit between lines may occur due to the
spread of soldering paste or mount placing accuracy.
3 : If the pattern is made with wider, the strength of bending
will be reduced.
3
a
5.9
Series
a
Do not use gilded pattern; excess soldering heat may dissolve
metal of a copper wire.
DLW43SH510XK2
DLW43SH101XK2
DLW43SH101XP2
3.0
3.2
2. Solder Paste Printing and Adhesive Application
copper foil patterns.
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack. In contrast, if too little solder is applied,
there is the potential that the termination strength will be
insufficient, creating the potential for detachment.
Standard land dimensions should be used for resist and
(in mm)
Series
Solder Paste Printing
Adhesive Application
BLM15
oEnsure that solder is applied smoothly to a
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
Coating amount is illustrated in the
following diagram.
BLM18
BLM21
BLM31
BLM41
a:20−70µm
b:30−35µm
oCoat the solder paste a thickness: 100-200µm
c:50−105µm
Chip Solid Inductor
a
c
b
Bonding agent
Land
PCB
Continued on the following page.
68
C50E.pdf
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
(in mm)
Series
Solder Paste Printing
Adhesive Application
NFM21H
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using
Sn-Zn based solder, please contact Murata in
advance.
oCoat the solder paste a thickness: 100-150µm
0.6
1.4
2.6
Apply 1.0mg of bonding agent at each chip.
NFE61H
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing.
oCoat the solder paste a thickness: 150-200µm
4
1.5
4.8
1.5
4.8
8.8
Bonding agent
9.0
Bonding agent
*Except NFE61HT332
DLW31S
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing.
oCoat the solder paste a thickness: 100-150µm
*Solderability is subject to reflow condition and thermal
conductivity. Please make sure that your product has
been evaluated in view of your specifications with our
product being mounted to your product.
Series
a
b
a
b
c
d
DLW31S
1.6 3.7 0.4 1.6
DLW43S
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing.
oCoat the solder paste a thickness: 150µm
*Solderability is subject to reflow condition and thermal
conductivity. Please make sure that your product has
been evaluated in view of your specifications with our
product being mounted to your product.
Series
a
b
c
d
a
b
3.0 (510)
3.2 (101)
DLW43S
5.9 1.6 3.4
Continued on the following page.
69
C50E.pdf
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Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
3. Standard Soldering Conditions
(1) Soldering Methods
Flux:
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
o Use Rosin-based flux.
In case of DLW31/43 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: H60A H63A solder (JIS Z 3238)
In case of lead-free solder, use Sn-3.0Ag-0.5Cu
solder. Use of Sn-Zn based solder will deteriorate
performance of products. If using NFM series with
Sn-Zn based solder, please contact Murata in
advance.
o Do not use water-soluble flux.
(2) Soldering Profile
4
oFlow Soldering profile
oReflow Soldering profile
(Eutectic solder, Sn-3.0Ag-0.5Cu solder)
qSoldering profile for Lead-free solder (Sn-3.0Ag-0.5Cu)
T4
T2
T3
T1
T3
T2
180
150
t2
Limit Profile
Heating
T1
Limit Profile
t1
Standard Profile
Pre-heating
Standard Profile
t2
90s±30s
time (s)
Pre-heating
t1
time (s)
Standard Profile
Limit Profile
Heating
Standard Profile
Limit Profile
Pre-heating
Peak
temperature
(T4)
Peak
temperature
(T2)
Series
Series
Heating
Heating
Heating
Cycle
Cycle
Cycle
Cycle
of flow
of flow
of reflow
of reflow
Temp. (T1) Time. (t1) Temp. (T2) Time. (t2)
Temp. (T3) Time. (t2)
Temp. (T1) Time. (t1)
Temp. (T3) Time. (t2)
BLM, NFE
NFM,
BLM
(Except BLM15)
230°C 60s 260°C
min. max. /10s
2
2
60s
min.
5s
max.
265
±3°C
150°C
250°C 4 to 6s times
times
max.
DLW31S
220°C 30 to 245 2 times
min. 60s ±3°C max.
2 times
max.
max.
NFE61H*
240°C 30s
260°C
DLW43S
min. max.
*Except NFE61HT332
wSoldering profile for Eutectic solder
(Limit profile: refer to q)
T3
T2
T1
t2
Standard Profile
t1
time (s)
Standard Profile
Pre-heating
Series
Peak
temperature
(T3)
Heating
Cycle
of reflow
Temp. (T1) Time. (t1) Temp. (T2) Time. (t2)
60s
min.
183°C
min.
60s
max.
2 times
max.
BLM, NFE
NFM, DLW
150°C
230°C
Continued on the following page.
70
C50E.pdf
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
(3) Reworking with Soldering Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output: 30W max.
Temperature of soldering iron tip / Soldering time:
BLM/NFM21H/DLW31S/DLW43S
–
Do not allow the tip of the soldering iron to directly
contact the chip.
350°C max./3s max. (2 Times max.)
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
4. Mounting on-board with Conductive Glue of BLM18AG_WH1
Please adhere rigidly to the condition below which shows
the method of mounting with conductive glue.
Please coat print pads with conductive glue using
metal mask and metal squeegee, and then mount our
products on the substrates with a mount machine or
human hand.
Conductive Glue
Print Pads
4
Board
Please put the substrates into a oven (140 to 150°C)
for 30 minutes in order to cure the adhesive.
Please check whether the chips and the substrates are
connected with the conductive glue or not and there is
no electrical short of the conductive glue.
1. Board
Ceramic Board or Alumina Board
2. Thickness of Glue
30 to 50µm
3. Recommended Conductive
Glue
PC3000
(Manufactured by Heraeus)
5. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
Do not clean BLM18AGpppWH1/DLW31S/43S series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
Isopropyl alcohol (IPA)
(2) Ultrasonic
(b) Aqueous cleaning agent
Output: 20W/liter max.
Pine Alpha ST-100S
Duration: 5 minutes max.
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
For additional cleaning methods, please contact Murata
engineering.
Frequency: 28 to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
71
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Block Type EMIFILr SMD Type (Soldering and Mounting)
1. Standard Land Pattern Dimensions
Land Pattern
+ Solder Resist
Land Pattern
Through Hole
(in mm)
BNX024H
BNX025H
(1) A double-sided print board (or multilayer board) as shown in
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(2) Please drop CG on a ground electrode on the back layer
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
12.5
CG
10.2
9.9
9.6
B
CB
CG
7.1
6.2
5.3
PSG
(3) It is recommended to use a double-sided printed circuit
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
2.8
2.3
CG
0
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
(4) The ground pattern should be designed to be as large as
possible to achieve maximum filtering performance.
4
2. Solder Paste Printing and Adhesive Application
(in mm)
Series
Solder Paste Printing
Adhesive Application
oUse Sn-3.0Ag-0.5Cu pattern printing solder.
oCoat with solder paste to the following thickness:
150-200µm
BNX024H
BNX025H
12.5
CG
10.2
9.6
CB
CG
B
7.1
5.3
PSG
2.8
2.3
CG
0
3. Standard Soldering Conditions
(1) Soldering Methods
BNX024H/025H is only for reflow soldering.
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Continued on the following page.
72
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Block Type EMIFILr SMD Type (Soldering and Mounting)
Continued from the preceding page.
(2) Soldering profile
oReflow Soldering profile
qSoldering profile for Lead-free solder (Sn-3.0Ag-0.5Cu)
T4
T3
T2
T1
180
150
Limit Profile
t1
t2
Pre-heating
Standard Profile
90s±30s
time (s)
Standard Profile
Limit Profile
Peak
Peak
temperature
(T2)
Series
Heating
Temp. (T1) Time. (t1)
Heating
Temp. (T3) Time. (t2)
Cycle
of reflow
Cycle
temperature
(T4)
of reflow
2 times
max.
2 times
max.
BNX024H/025H
220°C min. 30 to 60s
250±3°C
230°C min. 60s max. 260°C/10s
4
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Do not allow the tip of the soldering iron to directly
contact the chip.
Pre-heating: 150°C 60s min.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Soldering iron power output: 100W max.
Temperature of soldering iron tip / Soldering time:
BNX024H/025H: 450°C max./5s max.
4. Cleaning
Do not clean BNX024H/025H.
Before cleaning, please contact Murata engineering.
73
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Block Type EMIFILr Lead Type (Soldering and Mounting)
1. Mounting Hole
Mounting holes should be designed as specified below.
Part Number
BNX012H
Bulk Type (in mm)
TERMINAL LAYOUT (Bottom figure)
Component Side
ø1.2
(PSG)
(B)
CB
CG
CG
(CG)
(CG)
(CG)
(CB)
2.5±0.1
5.0±0.1
7.5±0.1
PSG : Power supply ground
CG : Load circuit ground
CB : Load circuit + Bias
PSG
B
2. Using The Block Type EMIFILr Effectively
(1) How to use effectively
P. C. BOARD PATTERNS
4
This product effectively prevents undesired radiation and
external noise from going out / entering the circuit by
grounding the high frequency components which cause
Use a bilateral P.C. board. Insert the BNX into the P.C.board until
the root of the terminal is secured, then solder.
noise problems. Therefore, grounding conditions may affect
the performance of the filter and attention should be paid to
the following for effective use.
(1) COMPONENT SIDE VIEW (2) BOTTOM VIEW
PSG
B
B
PSG
(a) Design maximized grounding area in the P.C. board,
and grounding pattern for all the grounding terminals
of the product to be connected. (Please follow the
specified recommendations.)
Shield plate
PSG
B
B
PSG
CG
CB
CG CG
CB
CG
CG
CG
(b) Minimize the distance between ground of the P.C.
board and the ground plate of the product.
(Recommended to use through-hole connection
between grounding area both of component side and
bottom side.)
Copper foil pattern
(c) Insert the terminals into the holes on P.C. board
completely.
(d) Don't connect PSG terminal with CG terminal directly.
(See the item 1. TERMINAL LAYOUT)
(2) Self-heating
Recommended Land Pattern
Though this product has a large rated current, localized self-
heating may be caused depending on soldering conditions.
To avoid this, attention should be paid to the following:
(a) Use P.C. board with our recommendation on hole
diameter / land pattern dimensions, mentioned in the
right hand drawing, especially for 4 terminals which
pass current.
3.2
3.2
Through holes
ø1.2
B
PSG
CG
CG
(b) Solder the terminals to the P.C. board with solder-
cover area at least 90%. Otherwise, excess self-
heating at connection between terminals and P.C.
board may lead to smoke and / or fire of the product
even when operating at rated current.
CG
CB
3.2
(c) After installing this product in your product, please
make sure of the self-heating with the rated current.
(in mm)
2.5
5.0
Copper foil pattern
7.5
Continued on the following page.
74
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Block Type EMIFILr Lead Type (Soldering and Mounting)
Continued from the preceding page.
3. Soldering
(1) Solder: H60A, H63A solder (JIS Z 3238)
In case of lead-free solder, use Sn-3.0Ag-0.5Cu solder.
(2) Use Rosin-based flux. Do not use strong acidic flux with
halide content exceeding 0.2wt% (chlorine conversion
value).
(3) Products and the leads should not be subjected to any
mechanical stress during the soldering process, or while
subjected to the equivalent high temperatures.
(4) Standard flow soldering profile
Gradual cooling
Soldering
(in air)
Pre-heating
300
250
200
150
100
50
Soldering temperature
150°C
4
60s min.
Soldering time
Solder
Soldering temperature Soldering time
Sn/Pb=60/40, Sn/Pb=63/37
Sn-3.0Ag-0.5Cu solder
240 to 260˚C
250 to 260˚C
5s max.
4 to 6s
4. Cleaning Conditions
Following conditions should be observed when cleaning
BNX012H series.
(b) Aqueous agent
PINE ALPHA ST-100S
(1) Cleaning temperature should be limited to 60°C max.
(40°C max for alcohol type cleaner.)
(2) Ultrasonic cleaning should comply with the following
conditions, avoiding the resonance phenomenon at the
mounted products and P.C.B.
(4) There should be no residual flux or residual cleaner left
after cleaning.
In the case of using aqueous agent, products should be
dried completely after rinsing with de-ionized water in
order to remove the cleaner.
Power: 20 W / l max. Frequency: 28 to 40kHz
Time: 5 min. max.
(5) The surface of products may become dirty after cleaning,
but there is no deterioration on mechanical, electrical
characteristics and reliability.
(3) Cleaner
(a) Alcohol type cleaner
(6) Other cleaning: Please contact us.
Isopropyl alcohol (IPA)
75
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Aug.28,2008
Package
■ Minimum Quantity and Dimensions of 8mm Width Paper / Embossed Tape
<Embossed>
2.0±0.05
4.0±0.1 4.0±0.1 ø1.5+0.1
1
c
<paper>
-
0
d
(in mm)
c
Direction of feed
There are holes in the cavities of the BLM21BD222SH1/
c: Depth of Cavity
(Embossed Tape)
c: Total Thickness of Tape
b
(Paper Tape)
+0.3
BD272SH1 and BLM31 only. ø1.0
-0
1 BLM15: 2.0±0.1
Minimum Qty. (pcs.)
ø330mm reel
Paper Tape Embossed Tape Paper Tape Embossed Tape
Cavity Size (in mm)
Part Number
ø180mm reel
Bulk
a
b
c
d
1.15 0.65
1.85 1.05
2.25 1.45
2.25 1.45
0.8 max.
1.1 max.
1.1 max.
1.3
-
-
10000
-
50000
-
1000
1000
1000
1000
1000
500
BLM15
BLM18
BLM21
4
4000
-
10000
-
-
4000
-
10000
-
0.2
0.2
-
-
3000
3000
-
-
-
-
-
10000
BLM21BD222SH1/272SH1
3.5
2.3 1.55
3.6 2.0
1.9
1.3
-
4000
-
10000
BLM31
NFM21
DLW31S
1.1 max.
2.1
-
-
0.3
2000
500
• Please contact us for BLM15/18 in bulk case.
■ Minimum Quantity and Dimensions of 12mm Width Embossed Tape
c: Depth of Cavity
1
c
2.0±0.05
ø1.5 +0.1
4.0±0.1 4.0±0.1
-
0
Cavity Size
b
Minimum Qty. (pcs.)
0.3
Part Number
a
c
ø180mm reel ø330mm reel
Bulk
1000
500
4.8
7.2
4.9
4.9
1.9 1.75
1.9 1.75
2500
2500
500
8000
8000
2500
2500
BLM41
NFE61
3.6
3.6
2.7
2.9
100
DLW43S_XK
DLW43S_XP
500
100
Direction of feed
1 DLW43S: 8.0±0.1
b
There are holes in the cavities
of the BLM41 only. ø1.5 +0.3
-
0
(in mm)
76
C50E.pdf
Aug.28,2008
Package
Minimum Quantity and Dimensions of 24mm Width Embossed Tape
4.0x10pitch=40.0±0.2
c: 3.6±0.1
+0.1
2.0±0.1
4.0±0.1
ø1.5
-
0
12.0±0.1
+0.5
ø1.5
-
0
0.3±0.1
b: 9.4±0.1
Cavity Size
b
Minimum Qty. (pcs.)
Part Number
BNX024H/025H
4
a
c
ø180mm reel ø330mm reel
Bulk
12.4 9.4
3.6
400
1500
100
(in mm)
77
C50E.pdf
Aug.28,2008
Design Kits
oEKEMAT15B (Chip Ferrite Beads 0402 Size for Automotive)
Quantity
(pcs.)
Impedance typ. (at 100MHz, 20°C)
Rated Current
(mA)
DC Resistance
No.
Part Number
(Ω)
(Ω) max.
BLM15AG100SH1
BLM15AG700SH1
BLM15AG121SH1
BLM15AG221SH1
BLM15AG601SH1
BLM15AG102SH1
BLM15BB050SH1
BLM15BB100SH1
BLM15BB220SH1
BLM15BB470SH1
BLM15BB750SH1
BLM15BB121SH1
BLM15BB221SH1
BLM15BD471SH1
BLM15BD601SH1
BLM15BD102SH1
BLM15BD182SH1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10 (Typ.)
70 (Typ.)
1000
500
500
300
300
200
500
300
300
300
300
300
200
200
200
200
200
0.05
0.15
0.25
0.35
0.6
1
2
3
120 ±25%
220 ±25%
600 ±25%
1000 ±25%
5 ±25%
4
4
5
6
1.0
7
0.08
0.1
8
10 ±25%
9
22 ±25%
0.2
10
11
12
13
14
15
16
17
47 ±25%
0.35
0.4
75 ±25%
120 ±25%
220 ±25%
470 ±25%
600 ±25%
1000 ±25%
1800 ±25%
0.55
0.8
0.6
0.65
0.9
1.4
oEKEMAT18C (Chip Ferrite Beads 0603 Size for Automotive)
Impedance typ.
(at 100MHz, 20°C)
(Ω)
Impedance typ.
(at 1GHz, 20°C)
(Ω)
Quantity
(pcs.)
Rated Current
DC Resistance
No.
Part Number
(mA)
(Ω) max.
BLM18AG121SH1
BLM18AG151SH1
BLM18AG221SH1
BLM18AG331SH1
BLM18AG471SH1
BLM18AG601SH1
BLM18AG102SH1
BLM18BA050SH1
BLM18BA100SH1
BLM18BA220SH1
BLM18BA470SH1
BLM18BA750SH1
BLM18BA121SH1
BLM18BB050SH1
BLM18BB100SH1
BLM18BB220SH1
BLM18BB470SH1
BLM18BB600SH1
BLM18BB750SH1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
120 ±25%
150 ±25%
220 ±25%
330 ±25%
470 ±25%
600 ±25%
1000 ±25%
5 ±25%
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500
500
500
500
500
500
400
500
500
500
300
300
200
700
700
600
550
550
500
0.18
1
2
0.25
0.25
3
0.30
4
0.35
5
0.38
6
0.50
7
0.2
8
10 ±25%
22 ±25%
47 ±25%
75 ±25%
120 ±25%
5 ±25%
0.25
9
0.35
10
11
12
13
14
15
16
17
18
19
0.55
0.7
0.9
0.05
10 ±25%
22 ±25%
47 ±25%
60 ±25%
75 ±25%
0.10
0.20
0.25
0.25
0.30
Continued on the following page.
78
C50E.pdf
Aug.28,2008
Design Kits
Continued from the preceding page.
Impedance typ.
Quantity
(pcs.)
Impedance typ.
(at 1GHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
No.
Part Number
(at 100MHz, 20°C)
(Ω)
(Ω) max.
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
BLM18BB121SH1
BLM18BB141SH1
BLM18BB151SH1
BLM18BB221SH1
BLM18BB331SH1
BLM18BB471SH1
BLM18BD470SH1
BLM18BD121SH1
BLM18BD151SH1
BLM18BD221SH1
BLM18BD331SH1
BLM18BD421SH1
BLM18BD471SH1
BLM18BD601SH1
BLM18BD102SH1
BLM18BD152SH1
BLM18BD182SH1
BLM18BD222SH1
BLM18BD252SH1
BLM18HG471SH1
BLM18HG601SH1
BLM18HG102SH1
BLM18HD471SH1
BLM18HD601SH1
BLM18HD102SH1
BLM18EG101TH1
BLM18EG121SH1
BLM18EG181SH1
BLM18EG221TH1
BLM18EG331TH1
BLM18EG391TH1
BLM18EG471SH1
BLM18EG601SH1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
120 ±25%
140 ±25%
150 ±25%
220 ±25%
330 ±25%
470 ±25%
47 ±25%
-
500
450
450
450
400
300
500
200
200
200
200
200
200
200
100
50
0.30
0.35
0.37
0.45
0.58
0.85
0.30
0.4
-
-
-
-
-
-
120 ±25%
150 ±25%
220 ±25%
330 ±25%
420 ±25%
470 ±25%
600 ±25%
1000 ±25%
1500 ±25%
1800 ±25%
2200 ±25%
2500 ±25%
470 ±25%
600 ±25%
1000 ±25%
470 ±25%
600 ±25%
1000 ±25%
100 ±25%
120 ±25%
180 ±25%
220 ±25%
330 ±25%
390 ±25%
470 ±25%
600 ±25%
-
-
0.4
-
0.45
0.5
-
-
0.55
0.55
0.65
0.85
1.2
-
-
-
4
-
-
50
1.5
-
50
1.5
-
50
1.5
600 (Typ.)
700 (Typ.)
1000 (Typ.)
1000 (Typ.)
1200 (Typ.)
1700 (Typ.)
140 (Typ.)
145 (Typ.)
260 (Typ.)
300 (Typ.)
450 (Typ.)
520 (Typ.)
550 (Typ.)
700 (Typ.)
200
200
100
100
100
50
0.85
1.0
1.6
1.2
1.5
1.8
2000
2000
2000
1000
500
500
500
500
0.04
0.04
0.05
0.15
0.21
0.30
0.21
0.35
oEKEMAT21A (Chip Ferrite Beads 0805 / 1206 Size for Automotive)
Impedance typ. (at 100MHz, 20°C)
(Ω)
Quantity
(pcs.)
Rated Current
DC Resistance
No.
Part Number
(mA)
(Ω) max.
1
2
BLM21AG121SH1
BLM21AG151SH1
BLM21AG221SH1
BLM21AG331SH1
BLM21AG471SH1
BLM21AG601SH1
BLM21AG102SH1
BLM31AJ601SH1
BLM21BB050SH1
BLM21BB600SH1
BLM21BB750SH1
BLM21BB121SH1
BLM21BB151SH1
BLM21BB201SH1
BLM21BB221SH1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
120 ±25%
150 ±25%
220 ±25%
330 ±25%
470 ±25%
600 ±25%
1000 ±25%
600 ±25%
5 ±25%
200
200
200
200
200
200
200
200
500
200
200
200
200
200
200
0.15
0.15
3
0.2
4
0.25
5
0.25
6
0.3
7
0.45
8
0.9
9
0.07
10
11
12
13
14
15
60 ±25%
0.2
75 ±25%
0.25
120 ±25%
150 ±25%
200 ±25%
220 ±25%
0.25
0.25
0.35
0.35
Continued on the following page.
79
C50E.pdf
Aug.28,2008
Design Kits
Continued from the preceding page.
Quantity
(pcs.)
Impedance typ. (at 100MHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
No.
Part Number
(Ω) max.
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
BLM21BB331SH1
BLM21BB471SH1
BLM21BD121SH1
BLM21BD151SH1
BLM21BD221SH1
BLM21BD331SH1
BLM21BD421SH1
BLM21BD471SH1
BLM21BD601SH1
BLM21BD751SH1
BLM21BD102SH1
BLM21BD152SH1
BLM21BD182SH1
BLM21BD222TH1
BLM21BD222SH1
BLM21BD272SH1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
330 ±25%
470 ±25%
120 ±25%
150 ±25%
220 ±25%
330 ±25%
420 ±25%
470 ±25%
600 ±25%
750 ±25%
1000 ±25%
1500 ±25%
1800 ±25%
2200 ±25%
2250 (Typ.)
2700 ±25%
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.4
0.45
0.25
0.25
0.25
0.3
0.3
0.35
0.35
0.4
0.4
0.45
0.5
0.6
0.6
4
0.8
oEKEMATPWA (Chip EMIFILr for Automotive / for Power Supplies)
Quantity
(pcs.)
Impedance typ. (at 100MHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
No.
Part Number
(Ω) max.
BLM18PG300SH1
BLM18PG330SH1
BLM18PG600SH1
BLM18PG121SH1
BLM18PG181SH1
BLM18PG221SH1
BLM18PG331SH1
BLM18PG471SH1
BLM21PG220SH1
BLM21PG300SH1
BLM21PG600SH1
BLM21PG221SH1
BLM21PG331SH1
BLM31PG330SH1
BLM31PG500SH1
BLM31PG121SH1
BLM31PG391SH1
BLM31PG601SH1
BLM41PG600SH1
BLM41PG750SH1
BLM41PG181SH1
BLM41PG471SH1
BLM41PG102SH1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
30 (Typ.)
33 ±25%
60 (Typ.)
120 ±25%
180 ±25%
220 ±25%
330 ±25%
470 ±25%
22 ±25%
30 (Typ.)
60 ±25%
220 ±25%
330 ±25%
33 ±25%
50 (Typ.)
120 ±25%
390 ±25%
600 ±25%
60 (Typ.)
75 (Typ.)
180 ±25%
470 ±25%
1000 ±25%
1000
3000
500
0.05
0.025
0.10
0.05
0.09
0.1
1
2
3
4
2000
1500
1400
1200
1000
6000
3000
3000
2000
1500
6000
3000
3000
2000
1500
6000
3000
3000
2000
1500
5
6
0.15
0.2
7
8
0.01
0.015
0.025
0.050
0.09
0.01
0.025
0.025
0.05
0.09
0.01
0.025
0.025
0.05
0.09
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Quantity
(pcs.)
Capacitance
(pF)
Rated Voltage
Rated Current
Insulation Resistance
No.
Part Number
(Vdc)
(mA)
(MΩ) min.
24
25
26
27
28
29
NFM21HC220U1H3
NFM21HC470U1H3
NFM21HC101U1H3
NFM21HC221R1H3
NFM21HC471R1H3
NFM21HC102R1H3
10
10
10
10
10
10
22 ±20%
47 ±20%
50
50
50
50
50
50
700
700
1000
1000
1000
1000
1000
1000
100 ±20%
220 ±20%
470 ±20%
1000 ±20%
700
700
1000
1000
Continued on the following page.
80
C50E.pdf
Aug.28,2008
Design Kits
Continued from the preceding page.
Quantity
(pcs.)
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(mA)
Insulation Resistance
No.
Part Number
(MΩ) min.
30
31
32
33
34
35
36
37
38
39
40
41
42
NFM21HC222R1H3
NFM21HC223R1H3
NFM21HC104R1A3
NFM21HC224R1A3
NFM21HC474R1A3
NFE61HT330U2A9
NFE61HT680R2A9
NFE61HT101Z2A9
NFE61HT181C2A9
NFE61HT361C2A9
NFE61HT681D2A9
NFE61HT102F2A9
NFE61HT332Z2A9
10
10
10
10
10
10
10
10
10
10
10
10
10
2200 ±20%
22000 ±20%
100000 ±20%
220000 ±20%
470000 ±20%
33 ±30%
50
50
1000
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
10
10
10
100
100
100
100
100
100
100
100
68 ±30%
100 ±30%
180 ±30%
360 ±20%
680 ±30%
1000 +80% , -20%
3300 +80% , -20%
4
81
C50E.pdf
Aug.28,2008
Outlines of Major Noise Regulation Standards
1. EMI Regulations
Countries
Information Regulation
Japan
USA
Europe
Equipment
CISPR61000-6-3
(Residential, Commercial
and Light Industry)
IEC61000-6-4
EN50081-1
(Residential, Commercial
and Light Industry)
EN50081-2
Generic Standard
(Industrial)
(Industrial)
ITE : Information Technology
Equipment
VCCI
1
FCC Part 15
Subpart B
CISPR 22
EN55022
Printer, Personal computer
Word processor, Display
ISM equipment, Microwave
CISPR 11
CISPR 12
1
FCC Part 18
EN55011
Igniter
FCC Part 15
Subpart B
Automotive
Directive
JASO
(Automobile, Motorboat)
FCC Part 15
Subpart B
TV, Radio, Audio, VTR
CISPR 13
1
EN55013
Household electrical
equipment
CISPR 14
CISPR 15
ITU-T
1
1
EN55014
EN55015
Portable tool
FCC Part 18
Fluorescent Lamp, Luminary
Transceiver
Radio Act
ARIB
FCC Part 15
Subpart C
ETS300 Series
(Voluntary Regulation)
FCC Part 22
(Reference) Power Supply
Higher Harmonic
Industrial Voluntary
Regulation
IEC61000-3
EN61000-3
Basic Standard
IEC61000-4
JIS C 61000-4
EN61000-4 Series
IEC61000-6-1
JIS C 61000-6-1
EN50082-1
(Residential, Commercial
and Light Industry)
EN50082-2
(Residential, Commercial (Residential, Commercial
Generic Standard
and Light Industry)
IEC61000-6-2
(Industrial)
and Light Industry)
JIS C 61000-6-2
(Industrial)
(Industrial)
Industrial Process Measurement
and Control Equipment
Industrial Voluntary
Action
Radio, TV
CISPR 20
CISPR 24
EN55020
EN55024
ITE : Information Technology
Equipment
1 Electrical Appliance and Material Safety Law
There are EMI regulations in each country to meet EMI
noise levels emitted from digital equipment.
In the countries which regulate EMI, equipment which does
not satisfy regulations is not allowed to be sold.
Continued on the following page.
82
C50E.pdf
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
2. Measurement Point and Noise Detection
Regulation
Measuring Item
Polarization and Measuring Point
Frequency (Hz)
30M to 1GHz
Detection
Measuring Devices
Radiated Interference
Horizontal Pol. Vertical Pol.
Quasi-Peak Detection
Antenna
CISPR 22/
EN55022
Main Interference Voltage AC Main Ports
150k to 30MHz
30M to 1GHz
Quasi-Peak Detection Mean Detection Artificial Main Network
Quasi-Peak Detection Dipole Antenna
Radiated Interference
Horizontal Pol. Vertical Pol.
VCCI
Main Interference Voltage AC Main Ports
150k to 30MHz
30M to 40GHz
150k to 30MHz
Quasi-Peak Detection Mean Detection Artificial Main Network
Quasi-Peak Detection Mean Detection Antenna
Radiated Interference
Horizontal Pol. Vertical Pol.
FCC Part 15
Main Interference Voltage AC Main Ports
Quasi-Peak Detection
Artificial Main Network
PeakUQuasi-PeakUAverage
(Qp)
V
V
Peak Detection
Quasi-Peak Detection
Peak Detection
Average Detection
Quasi-Peak Detection
Average Detection
t
t
Short Repetition Period
Long Repetition Period
3. Limits of CISPR 22/EN55022
(1) CISPR 22 recommends measurement at 10m distance.
However, other distance is acceptable if the limitation is
converted according to the following calculation.
Limitation shown left is converted to limitation for 3m
distance.
Main Terminal Interference Voltage (Power Supply)
90
79
Class A Quasi-peak value
Class A Mean value
73
70
50
30
66
56
60
50
Conversion
56
46
Class B Quasi-peak value
Class B Mean value
←
Limitation for
10m Distance
R10 (dB µ V/m)
r10 (µ V/m)
Limitation for
3m Distance
R3 (dB µ V/m)
r3 (µ V/m)
10k
100k 150k 500k 1M
5M 10M 30M 100M
R10=20 log r10
R3=20 log r3
Frequency (Hz)
R3=R10+20 (1-log3)
Radiated Interference
10
3
r3 =
r10
90
70
57
47
Class A
Class B
50
40
50
30
10M
30M
100M 230M
Frequency (Hz)
1G
On the border frequency, lower limit should be applied.
Class A Equipment: The equipment which is used in light
industrial commercial areas.
Class B Equipment: The equipment which is used in
residential areas.
Continued on the following page.
83
C50E.pdf
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
(2) Scope of CISPR 22 Regulation
CISPR Regulations
This regulation applies to information technology
equipment (ITE) which are defined as:
(a) Equipment that receives data from external signal
sources;
CISPR 10 Organization, Regulations and Procedures of CISPR
CISPR 11 Industrial, Scientific and Medical (ISM) Radio-Frequency
Equipment
CISPR 12 Vehicles, Motor Boats and Spark-Ignited Engine driven
CISPR 13 Sound and Television Receivers
(b) Equipment that processes received data;
(c) Equipment that outputs data; and
(d) Equipment that has less than 600V rated voltage in
power supply.
CISPR 14 Household Electrical Appliances, Portable Tools and Similar
Electrical Apparatus
CISPR 15 Fluorescent Lamps and Iuminaries
CISPR 16 Radio Interference Measuring Apparatus and Measurement
Methods
CISPR 17 Passive Radio Interference Filters and Suppression
Components
CISPR 18 Power Transmission Cables and High Voltage equipment
CISPR 19 Microwave Ovens for Frequencies above 1GHz
CISPR 20 Immunity of Sound and TV Broadcast Receivers
and Associated Equipment
CISPR 21 Interference to Mobile Radio Communications in the Presence
of Impulsive Noise
CISPR 22 Information Technology Equipment
CISPR 23 Industrial Scientific and Medical (ISM) Equipment
CISPR 24 Immunity Regulation of Information Technology Equipment
CISPR 25 Receiver used onboard vehicles, boats, and on devices
4. Limits of VCCI Voluntary Regulation
(1) VCCI recommends measurement at 10m distance;
3m or 30m distance measurements are also allowed.
Main Terminal Interference Voltage (Power Supply)
90
(2) Scope of VCCI Voluntary Regulation
This regulation applies to information technology
equipment (same as CISPR Pub.22), but the application
is excluded on the following equipment:
· Equipment for which other regulations already exist
(e.g., household electrical appliances, radio and TV
receivers)
79
Class A Quasi-peak value
Class A Mean value
73
70
50
30
66
56
60
50
56
46
Class B Quasi-peak value
Class B Mean value
· In station equipment principal purpose of which is
electrical communication
10k
100k 150k 500k 1M
5M 10M 30M 100M
· Industrial plant control system for which information
processing is a secondary system function
· Industrial, commercial and medical testing and
measuring systems for which data processing is a
secondary system function
Frequency (Hz)
Radiated Interference
90
· Information equipment for which CISPR is conducting
further deliberation
70
VCCI is the acronym of Voluntary Control Council for
Interference by Data Processing Equipment and
Electronic Office Machines.
Class A Quasi-peak value
Class B Quasi-peak value
57
47
50
40
50
30
VCCI is organized by the following organizations:
· Japan Electronics and Information Technology
Industries Association (JEITA)
10M
30M
100M 230M
Frequency (Hz)
1G
· Japan Business Machine and Information System
Industries Association (JBMIA)
· Communication and Information Network Association
of Japan (CIAJ)
On the border frequency, lower limit should be applied.
Class B ITE: Equipment that is designed to be used at home.
Class A ITE: Equipment that does not meet interference
limits of class B equipment, but satisfies
interference limits of class A equipment.
Continued on the following page.
84
C50E.pdf
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
5. Limits of FCC Part 15 Subpart B
(1) Class A recommended to be measured with 10m distance.
Class B recommended to be measured with 3m distance.
(2) The FCC Part 15 regulation controls radiated interference
by establishing quasi-peak and mean value limits for fre-
quencies ranging from 30MHz to 40GHz (or maximum
frequency's fifth harmonic, whichever is lower).
For AC main ports, the FCC Part 15 regulation controls
main terminal interference voltage by establishing quasi-
peak value limits for frequencies ranging from 450kHz to
30MHz.
Main Terminal Interference Voltage (Power Supply)
90
79
Class A Quasi-peak value
Class A Mean value
73
70
50
30
66
56
60
50
56
46
Class B Quasi-peak value
Class B Mean value
Measurement Frequency Range for Radiated Interference
10k
100k 150k 500k 1M
5M 10M 30M 100M
Frequency (Hz)
Maximum Frequency
Upper End of Measurement
the Equipment Internally
Frequency Range
Generates, Uses or Operates
(MHz)
Radiated Interference
or Synchronizes (MHz)
Less than 1.705
1.705 to 108
108 to 500
30
90
Noise level is regulated up to lower
frequency of the 5th harmonics of
maximum signal frequency and 40GHz.
1000
2000
5000
70
50
30
500 to 1000
60
Class A
Maximum Frequency's Fifth
Harmonic or 40GHz,
Whichever is Lower
56.9
54
49.5
40
54
43.5
Over 1000
46
Class B
960M
1G
10M
30M
88M100M 216M
Frequency (Hz)
On the border frequency, lower limit should be applied.
Class A Equipment: The digital equipment that is sold for
commercial, industrial and office use.
Class B Equipment: The digital equipment that is sold to be
used in residential areas.
(3)There is no regulation on power interference.
FCC Regulations
Part 1 Procedures
Part 2 Frequency Division and Radio Wave Treaty Issues and
General Rules
Part 15 Radio Wave Equipment
• Intentionally electromagnetic radiation equipment
• Non-intentionally electromagnetic radiation equipment
• Incidentally electromagnetic radiation equipment
Part 18 Industrial, Scientific and Medical Equipment
Part 22 Public Mobile Wireless Operations
Part 68 Connecting Terminal Equipment to Telephone Circuit Network
Part 76 Cable Television
Continued on the following page.
85
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Outlines of Major Noise Regulation Standards
Continued from the preceding page.
6. Immunity Regulations in the European Union
All electric/electronic equipment cannot be sold in Europe
All products which are sold in EU must satisfy EC directive which
contains immunity regulation.
without CE marking. To use CE marking, they must
satisfy related EC directives such as EMC directives.
For Information Technology Equipment, in EMC directive,
emission regulations are integrated, and immunity
regulations are applied. Although these immunity
regulations are prepared by CENELEC, almost all
contents are same as standards issued by IEC or CISPR.
Principal EC Directive
89/336/EEC
92/31/EEC
EMC Directive
Low-Voltage Electrical
Products Directive
73/23/EEC
Machines Directive
89/392/EEC
7. Immunity Regulations in Japan
Equipment
Association
JEITA (Japan Electronics and Information Technology)
TV, Radio, Audio
ITE
Office Machine
JBMIA (Japan Business Machine and Information System Industries Association)
CIAJ (Communication and Information Network Association of Japan)
ARIB (Association of Radio Industries and Business)
Mi
Machine To Builders
JMTBA (Japan Machine Tool Builders' Association)
JEMIMA (Japan Electric Measuring Instruments Manufacturers' Association)
JARA (Japan Robot Association)
Industrial Measuring Control Equipment
Industrial Robot
Classification
Information Regulation
JIS
The table on the right shows the preparation situation of
JIS for EMC. At this moment, the immunity standards by
JIS do not have a legal force like the Electrical Application
and Material Safety Law/VCCI.
ISO60050-161
(IEV terms 161)
Terms
JIS C 0161
IEC61000-4- 2
IEC61000-4- 3
IEC61000-4- 4
IEC61000-4- 5
IEC61000-4- 6
IEC61000-4- 7
IEC61000-4- 8
IEC61000-4-11
IEC61000-4-14
IEC61000-4-17
JIS C 61000-4-2
JIS C 61000-4-3
JIS C 61000-4-4
JIS C 61000-4-5
JIS C 61000-4-6
JIS C 61000-4-7
JIS C 61000-4-8
JIS C 61000-4-11
JIS C 61000-4-14
JIS C 61000-4-17
Basic Standards
IEC61000-6-1
IEC61000-6-2
JIS C 61000-6-1
JIS C 61000-6-2
Generic Standards
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Principles of Noise Suppression by DC EMIFILr
1. Function of DC EMI Suppression Filters
DC EMI suppression filters absorb and eliminate high
frequency noise which may produce electromagnetic
interference in PC board circuits.
These filters are used in secondary circuits, and are small
in size and light in weight, which further enhances their
excellent noise suppression functions.
Chip and adhesive type filters can be mounted on PC
boards automatically.
These filters are effective in the suppression of radiation
noise in computers, peripheral equipment, and digital
circuit application equipment (including various types of
microcomputer application equipment), and function to
suppress noise in audio/visual equipment, which uses
digital memory chips and DSP.
These filters are also effective for improving the noise
immunity of equipment used in noisy environments (such
as electronic equipment for automobiles).
2. Noise Filter Suppression Principles
Generally, noise problems occur when the noise source
and electronic equipment sensitive to the influence of
noise are located in close proximity to one another.
In such situations, as shown in Figure at right, noise is
conducted through a conductor, which produces an
inductive field around the noise source.
EMI Propagation Mode and Model of Noise Filter Suppression
r
q
Equipment or Device
Affected by EMI
EMI Source
e
To overcome such noise problems, it is preferable to
reduce the amount of noise generated by the noise
source or improve the noise resistance of adjacent
equipment.
w
qConduction mode eConduction mode Radiation mode
wRadiation mode
rRadiation mode
Conduction mode
In order to satisfy equipment performance specifications
and eliminate noise effectively at the same time, however,
it is customary to reduce the amount of noise generated
by the noise source, if it can't be eliminated altogether.
r
EMI Filter
EMI Filter
q
e
Equipment or Device
Affected by EMI
EMI Filter
EMI Filter
EMI Source
Shield
w
Shield
3. Configuration of EMI Suppression Filters (DC)
DC EMI suppression filters are used to suppress noise
produced by conductors. Noise radiation can be
suppressed, if it is eliminated with a filter in advance.
Generally, such noise suppression is achieved with DC
EMI suppression filters, according to the capacitive and
inductive frequency characteristics of the respective
conductors in the circuit.
Filters of this kind can be roughly divided into those:
(1) employing a capacitor,
(2) employing an inductor,
(3) employing a capacitor and inductor combination.
Continued on the following page.
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Principles of Noise Suppression by DC EMIFILr
Continued from the preceding page.
4. Capacitive Noise Suppression
When a capacitor is connected (bypass capacitor) to
Capacitive Noise Suppression
ground from a noisy signal line or power line, the circuit
impedance decreases as the frequency increases. Since
noise is a high frequency phenomenon, it flows to ground
if a capacitor has been connected to ground, thereby
making it possible to eliminate noise. (See Fig.)
1
2πfc
Noise+Signal/DC Power
Noise
Signal/DC Power
=
Z
f
: Frequency
c : Capacitance Value
EMI suppression filters employing a capacitor in this way
are used to eliminate this type of noise.
5. High frequency Capacitor Characteristics Used
for EMI Suppression Filters
Equivalent circuit of general-purpose capacitor and
three terminal capacitor in the high frequency area
and comparison of insertion loss
Even general-purpose capacitors can be used for noise
suppression. However, since noise has an extremely high
frequency range, general-purpose capacitors may not
function as effective bypass capacitors, due to the large
residual inductance built into the capacitor.
(a) Equivalent circuit of capacitors which concerns the ESL effect.
All the capacitors used in Murata's EMI suppression
filters employ a three terminal structure or thru-type
structure, which functions effectively even at high
frequencies, thereby minimizing the influence of residual
inductance. Consequently, an effective filter circuit can be
formed even at frequencies exceeding 1GHz.
(Refer to Fig.)
(b) Improvement of Insertion Loss Characteristics
(50 ohm - 50 ohm)
0
Two terminal capacitor
10
C=22,000pF
20
30
40
50
60
70
80
Three terminal capacitor
C=22,000pF
1
10
100
1000
10000
Frequency (MHz)
6. Inductive Noise Suppression
When an inductor is inserted in series in a noise
producing circuit (See Fig.), its impedance increases with
frequency. In this configuration it is possible to attenuate
and eliminate noise components (high frequency
components). The Murata EMI suppression filter
functions in this way.
Inductive Noise Suppression
Noise
Noise+Signal/DC Power
Signal/DC Power
=
Z
2πfL
f : Frequency
L : Inductance Value
Continued on the following page.
88
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Principles of Noise Suppression by DC EMIFILr
Continued from the preceding page.
7. Characteristics of Inductors Used
in EMI Suppression Filters
Equivalent Circuit
General-purpose inductors also function to suppress
R(f)
noise when configured in series with a noise producing
circuit. However, when general-purpose inductors are
used, resonance may result in peripheral circuits, signal
wave forms may become distorted, and satisfactory
impedance may not be obtained at noise frequencies
(due to insufficient high frequency impedance
characteristics).
(Resistance element becomes dominant at high frequency.)
Example of impedance frequency characteristics of
inductor type EMIFILr
The inductors used for Murata's EMI suppression filters
are designed to function nearly as a resistor at noise
frequencies, which greatly reduces the possibility of
resonance and leaves signal wave forms undistorted.
And since sufficient impedance is obtained for
frequencies ranging to hundreds of MHz, these
specifically designed inductors operate effectively to
suppress high-frequency noise. (See Fig.)
BLM18AG102
1200
Z
900
R
600
300
X
0
1
10
100
Frequency (MHz)
1000
8. Capacitive-Inductive EMI Suppression Filters
If capacitive and inductive suppression characteristics are
combined, it is possible to configure a much higher
performance filter. In signal circuit applications where this
combination is applied, noise suppression effects which
have little influence on the signal wave form become
possible.
This type of filter is also effective in the suppression of
high-speed signal circuit noise. When used in DC power
circuits, capacitive-inductive filters prevent resonance
from occurring in peripheral circuits, thus making it
possible to achieve significant noise suppression under
normal service conditions.
9. Other EMI Suppression Filters
In addition to the capacitive-inductive filter, Murata also
has a common mode choke coil, effective for common
mode noise suppression.
Murata also has a range of built-in filter connectors which
greatly reduce filter mounting space requirements.
Continued on the following page.
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Principles of Noise Suppression by DC EMIFILr
Continued from the preceding page.
10. Expressing EMI Suppression Filter Effects
EMI Suppression Filter effects are expressed in terms of
Measuring Circuit of Insertion Loss
the insertion loss measured in the circuit, normally
specified in MIL-STD 220A. As shown in the 50Ω
impedance circuit in the Figure at right, insertion loss is
represented by the logarithmic ratio of the circuit output
voltage with and without a filter in the circuit, which is
multiplied by 20 and expressed in dB.
Measuring Circuit of Insertion Loss
50Ω
(a)
B(V)
50Ω
50Ω
A(V)
A(V)
Therefore, an insertion loss of 20dB indicates an output
voltage ratio (B/C) of 1/10, and an insertion loss of 40dB
indicates an output voltage ratio (B/C) of 1/100.
50Ω
(b)
EMI
Suppression
Filter
C(V)
B
Insertion Loss = 20 log (dB)
C
90
C50E.pdf
Aug.28,2008
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