NFM31HK103R2A3 [MURATA]
This product specification is applied to Chip EMIFIL;
| 型号： | NFM31HK103R2A3 |
| 厂家： | 
muRata |
| 描述： | This product specification is applied to Chip EMIFIL |
| 文件： | 总11页 (文件大小：542K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip EMIFIL®Chip 3-terminal Capacitor for Very Large Current for Automotive
NFM31HK103R2A3_ (1206, 10000pF, DC100V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor for Very Large Current used for Automotive Electronic equipment.
2.MURATA Part NO. System
(Ex.)
NFM
31
HK
103
R
2A
3
L
(7)Packaging
Code
(3)Nominal
Capacitance
(4)
Characteristics
(5)DC Rated
Voltage
(1)L/W
Dimensions
(6)Electrode
(2)Features
3. Type & Dimensions
a)Equivalent Circuit
g
(1)-1 L
i
(1)-2 W
j
T
e
3.2±0.2
1.2±0.3
1.6±0.2
0.3±0.2
1.3±0.2
0.4±0.3
0.3 min.
4.Rated value
(5)
DC Rated
Voltage
Rated
Current
(mA)
(3) Nominal Capacitance
Capacitance Tolerance
DC
Insulation
Specifications and Test Methods
(Operating /Storage Temp. Range)
Resistance Resistance
10ADCat105℃
/6ADCat125℃
10000 pF
±20 %
DC 100 V
1.5mΩmax. 1000MΩmin.
-55 to 125 °C / -55 to 125 °C
5.Package
mark
(7) Packaging
Packaging Unit
3000 pcs./Reel
f180mm Reel
EMBOSSED W8P4
L
Product specifications in this catalog are as of Feb.9,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
NFM31HK103R2A3-01
1
■AEC-Q200 Murata Standard Specification and Test Methods
Electrical Performance
No
1
Item
Capacitance
(Cap.)
Specification
Shown in Rated value.
Test Method
Frequency: 1±0.1kHz
Voltage : 1±0.2V(rms)
Voltage : Rated Voltage
Time : 2 minutes max.
2
Insulation
Resistance(I.R.)
3
4
DC Resistance
Measured with 100mA max.
Withstanding Voltage
Products shall not be damaged.
Shown in Rated value.
Test Voltage : Rated Voltage x 300%
Time : 1 to 5 s
Charge Current : 50 mA max.
Operating Temperature
Storage Temperature
5
6
Self-temperature rise is not included
Standard Testing Condition
< Unless otherwise specified >
< In case of doubt >
Temperature : Ordinary Temp. / 15 °C to 35 °C
Temperature: 20 °C ± 2 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
JEMCPS-02916
2
■AEC-Q200 Murata Standard Specification and Test Methods
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
4
r
Murata Specification / Deviation
Meet Table D after testing.
No. Stress
Test Method
3
High Temperature
Unpowered
Exposure
1000 hours @ maximum Operating
Temperature(Ceramics)
Measurement at 24+/-2 hours after test
1000cycles (-55C to +125C)
Measurement at 24+/-2 hours after test
1000hours 85C/85%RH.
4
7
Temperature Cycling
Biased Humidity
Meet Table A after testing.
Meet Table D after testing.
Note: Ceramics only Specified conditions:
Rated Voltage and 1.3 to 1.5 volts.
Add 100Kohm resister.
Tantalums-Rated Voltage only.
Measurement at 24+/-2 hours after test
Condition D Steady State TA=125C
Full rated ceramic caps
Measurement at 24+/-2 hours
after test conclusion.
8
9
Operational Life
External Visual
Meet Table D after testing.
Visual inspection
No abnormalities
No defects
Not Applicable
10 Physical Dimension
12 Resistance to Solvents
13 Mechanical Shock
Meet Item 4（Type & Dimensions）
Per MIL-STD-202 Method 215
Figure 1 of Method 213.
Meet Table C after testing.
SMD:Condition F
Leaded:Condition C
14 Vibration
5g's for 20 minutes, 12cycles each of 3
oritentations
Meet Table C after testing.
Use 8"X5" PCB, .031"thick. 7 secure points on
one long side and 2 secure points at corners of
opposite sides.
Parts mounted within 2" from any secure point.
Test from 10-2000Hz.
15 Resistance to
Soldering Heat
No pre-heat of samples. Note: Test condition D Meet Table A after testing.
for
Deviation for AEC-Q200;
SMD. Test condition B for Leaded. Pre-heat
condition of 150ºC, 60-120sec is allowed for
ceramic components.
Testing condition
Flux: Ethanol solution of rosin, 25(wt)%
Pre-heating: 150C+/-10C, 60 to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder Temperature: 270C+/-5C
Immesion Time: 10s+/-1s
Immesion and emersion rates: 25mm/s
Then measured after exposure in the room.
Component Classification:Meet Table E
95% of the terminations is to be soldered.
Method B : Not Applicable
17 ESD
18 Solderability
Per AEC-Q200-002
Per J-STD-002
Summary to show Min, Max, Mean and
Deviation for AEC-Q200;
19 Electrical Characterization Standard deviation at room as well as Min and
Max operating temperatures.
Shown in Rated value.
JEMCPS-02916
3
■AEC-Q200 Murata Standard Specification and Test Methods
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No. Stress
Test Method
21 Board Flex
Required for MLCCs only. 60 sec minimum
holding time.
Meet Table B after testing.
Deviation for AEC-Q200;
It shall be soldered on the Glass-epoxy substrate (100×
40×1.0mm).
• Deflection : 1mm
• Keeping Time : 30s
Pressure jig
R340
F
Deflection
Product
45
45
22 Terminal Strength
Per AEC-Q200-006
A force of 17.7N
for 60 s
The electrode should show no failure after testing.
Deviation for AEC-Q200;
It shall be soldered on the substrate.
• Applying Force : 9.8N
• Applying Time : 30s
23 Beam Load Test
Per AEC-Q200-003
The chip endure 14.7N.
Deviation for AEC-Q200
Place the capacitor in the beam load fixture
as below figure.
Pressure Jig: R0.5
Iron Board
（Speed supplied the Stress Load : 0.5m/s）
JEMCPS-02916
4
■AEC-Q200 Murata Standard Specification and Test Methods
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)
AEC-Q200 Rev.D issued June 1. 2010
Table A
Appearance
Capacitance Change
I.R.
No damage
Within +/-7.5%
Meet initial value Shown in Rated value.)
0.05Ω max.
DC Resistance
Tabe B
Appearance
No damage
Within +/-7.5%
0.05Ω max.
Capacitance Change
DC Resistance
Table C
Appearance
Capacitance
DC Resistance
No damage
Meet initial value Shown in Rated value.)
0.05Ω max.
Table D
Appearance
Capacitance Change
I.R.
No damage
Within +/-12.5%
50M Ω min.
0.05Ω max.
DC Resistance
Table E
Murata PN
DC Resistance
Value After Testing
(Ω) max.
ESD Component
Classification
1C: 1kV(DC) to＜2kV(DC)
NFM31HK series
0.05
1C
JEMCPS-02916
5
P A C K A G I N G
NFM31 Type
1. Appearance and Dimensions (8mm-wide plastic tape)
Dimension of the Cavity is
measured at the bottom
(in mm)
2. Specification of Taping
(1) Packing quantity (standard quantity)
3000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of plastic tape and sealed cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Cover tape
Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous.
The specified quantity per reel is kept.
3. Pull Strength of Plastic Tape and Cover Tape
Plastic Tape
Cover Tape
5N min.
10N min.
4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Top tape
f
13.0±0.2
f
60±10
9±10
13±1.4
f
21.0±0.8
Direction of feed
(in mm)
f
180±03
JEMCPP-02233A
6
Caution
!
1.Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where dust rises.
(4) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew
2. Caution (Rating)
Do not use products beyond the Operating Temperature Range, Rated Voltage and Rated Current.
3. Attention regarding product's lay out
< Attention regarding the heat generated by other products >
Please provide special attention when mounting products in close proximity to other products that radiate heat.
4. Attention regarding chip mounting
An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting,
causing cracked chips.
Please set the suction nozzle's bottom dead point on the upper surface of the board, after the board is adjusted flat.
The chip received force (static loading) from the suction nozzle's should be 1N to 3N.
5. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
6. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
Products shall be located in the sideways
b
direction (Length:a<b) to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. near seam for separation.
C
Products (A,B,C,D) shall be located carefully so that products are
B
Seam
not subject to the mechanical stress due to warping the board.
Because they may be subjected the mechanical stress in order
of A >C >B≒D.
D
A
a
b
Slit
Length:a b
JEMCPC-02252A
7
Caution
!
7. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ• Standard printing pattern of solder paste.
8. Reflow Soldering
1) Soldering paste printing for reflow
• Standard thickness of solder paste: 100µm to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
1.0
2.5
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
4.4
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(°C)
260°C
245°C±3°C
230°C
220°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
Heating
above 230°C , 60s max.
260°C , 10s
Peak temperature
Cycle of reflow
2 times
2 times
9. Flow Soldering
1) Printing of Adhesive
Adhesive amount shall be about 0.06mg per chip to obtain enough adhesive strength.
The adhesive position is as follows
Adhesive
Position of adhesive
2)Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
°C
(
)
265°C±3°C
250°C
Limit Profile
150
Heating Time
Standard Profile
Time.(s)
60s min.
Standard Profile
Limit Profile
Pre-heating
Heating
150°C, 60s min.
250°C, 4s ~ 6s
2 times
265°C ± 3°C, 5s max.
2 times
Cycle of reflow
JEMCPC-02252A
8
Caution
!
10. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
・Pre-heating : 150°C, 1 minute ・Soldering iron output : 30W max.
・Tip temperature : 350°C max. ・Tip diameter : φ3mm max.
・Soldering time : 3(+1,-0) s
・Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
11. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T t T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
12.Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
13. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
ꢀꢀꢀꢀꢀꢀBending ꢀꢀ
ꢀꢀꢀꢀꢀTwisting
Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or partial dispersion
when the product is used.
14.Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
15.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
ꢀ(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
ꢀ (5)Medical equipment (6)Transportation equipment(trains, ships, etc.) (7)Traffic signal equipment
ꢀ (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
ꢀ (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
JEMCPC-02252A
9
Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Other flux (except above) Please contact us for details, then use.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
2. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power
: 20W / l max.
Frequency
Time
: 28kHz to 40kHz
: 5 minutes max.
(3) Cleaner
1. Cleaner
ꢀꢀIsopropyl alcohol (IPA)
2. Aqueous agent
ꢀꢀPINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
3. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to the figure to reinforce the ground-pattern.
For large current design, width of signal land pattern should be wider not less than 1mm per 1A (1mm/A)
For example
In case of 10A, signal land pattern width should be 10mm or more. (1mm/A *10A= 10mm)
< Standard land dimensions for reflow >
•Side on which chips are mounted
small diameter thru hole φ0.4
< Standard land dimensions for flow >
•Side on which chips are mounted
small diameter thru hole φ0.4
10mm or more
(in case of 10A)
10mm or more
(in case of 10A)
1.0
1.4
2.5
4.4
1.0
1.4
2.5
4.4
Resist
Copperfoilpattern
No pattern
(in mm)
4.Storage and Delivery condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
・Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C
Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
・Don’t keep products in salty breeze, corrosive gases such as sulfur, chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
JEMCPC-02252A
10
NOTE
!
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the
product specifications, drawings or other technical documents. Therefore, if your technical documents as above
include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement
liability clause, they will be deemed to be invalid.
JEMCPC-02252A
11
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