NFW31SP407X1E4J [MURATA]

Data Line Filter, 1 Function(s), 25V, 0.2A, EIA STD PACKAGE SIZE 1206, 3 PIN;


型号：	NFW31SP407X1E4J
厂家：	muRata
描述：	Data Line Filter, 1 Function(s), 25V, 0.2A, EIA STD PACKAGE SIZE 1206, 3 PIN LTE
文件：	总7页 (文件大小：170K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

On-Board Type (DC) EMI Suppression Filters(EMIFILr)

Chip EMIFILr LC Combined Winding Type NFW31S Series

The signal line chip EMI filter NFW31S series consist of

0.7±0.2

2.6±0.3

0.7±0.2

high performance EMI suppression filters. They are

designed for noise suppression in high speed signal

digital circuits in which the signal harmonics are prone

to becoming noise sources. These filters achieve a

100dB/dec. (typ.) damping characteristic with Murata's

innovative circuit design. This makes these chips

effective in applications where the signal and noise

frequencies are close to each other.

6.8±0.5

1.6±0.3

in mm

■ Features

1. The filters suppress signal noise with little or no

attenuation of the signal itself.

2. Murata's original internal structure design enables

excellent noise suppression up to high frequencies

(40dB at 1GHz typ.).

3. The NFW31 series is available in six different values

of cutoff frequency ranging from 10MHz up to 500MHz.

Nominal Cutoff Attenuation Attenuation Attenuation Attenuation Attenuation Attenuation Attenuation Attenuation Attenuation Attenuation

Part Number

Freq.

at 10MHz

(dB)

at 20MHz

(dB)

at 50MHz

(dB)

at 100MHz

(dB)

at 150MHz

(dB)

at 200MHz

(dB)

at 300MHz

(dB)

at 400MHz

(dB)

at 500MHz at 1000MHz

(MHz)

(dB)

NFW31SP106X1E4

NFW31SP206X1E4

NFW31SP506X1E4

NFW31SP107X1E4

NFW31SP157X1E4

NFW31SP207X1E4

NFW31SP307X1E4

NFW31SP407X1E4

NFW31SP507X1E4

6 max.

5 min.

25 min.

30 min.

6 max.

5 min.

25 min.

30 min.

20 min.

30 min.

10 min.

5 min.

30 min.

15 min.

10 min.

6 max.

10 min.

30 min.

100

150

200

300

400

500

6 max.

5 min.

6 max.

10 min.

20 min

6 max.

Rated Current : 200mA

Rated Voltage : 25Vdc

Operating Temperature Range : -40°C to 85°C

■ Insertion Loss Characteristics (Typical)

NFW31SP157X1E4

NFW31SP207X1E4

NFW31SP307X1E4

NFW31SP407X1E4

NFW31SP507X1E4

NFW31SP106X1E4

NFW31SP206X1E4

NFW31SP506X1E4

NFW31SP107X1E4

100

500 1000 2000

Frequency (MHz)

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

EMI Suppression Effect

Noise Suppression Effect of NFW31S Series

!Example of EMI Suppression

in an Actual Circuit

[Measuring Circuit]

EMI

74ALS04

10MHz

74ALS00

Suppression Filter

Measuring

Point

20ns/div

1v/div

Type of Filter

Signal Wave Form

EMI Suppression Effect

Description

(

)

100

Signal Waveform

and Noise Spectrum

before Filter Mounting

100

200

300

400

500

[

]

Frequency MHz

Signal Waveform 20ns/div

Noise Spectrum

(10:1 Active Probe)

(

)

1V/div

The NFW31S's steep attenuation

characteristic means excellent EMI

suppression without waveform

cornering.

100

Level before

filter mounting

NFW31S Series

(Cut-off frequency 50MHz)

100

200

300

400

500

Frequency [MHz]

3-terminal capacitors suppress

signal frequencies as EMI

frequencies so the signal waveform

is distorted.

100

Level before

filter mounting

Conventional Chip

Solid type EMI Filter

(NFM41CC 470pF)

100

200

300

Frequency [MHz]

Combinations of inductors and

capacitors can yield a steep

attenuation characteristic, but they

require a great deal more mounting

space.

Moreover, at high frequencies the

EMI suppression is less than that

obtained by the NFW31S.

Filter Combined

with Conventional LCs

100

Level before

filter mounting

L : Chip Inductor

C : Chip Capacitor

(270pF)

100

200

300

Frequency [MHz]

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

NFW/NFE31 Series Notice (Soldering and Mounting)

1. Standard Land Pattern Dimensions

The capacitor type chip EMI suppression filters (NFp

For Reflow and Flow Soldering NFW31S

series) suppress noise by conducting the high-frequency

noise element to ground. Therefore, to obtain maximum

performance from these filters, the ground pattern should

be made as large as possible during the PCB design

stage. As shown bellow, one side of the PCB is used for

chip mounting, and the other is used for grounding. Small

diameter feedthrough holes are then used to connect the

grounds on each side of the PCB. This reduces the high-

frequency impedance of the grounding and maximizes

the filter's performance.

For Reflow Soldering

NFE31P

Land

Solder Resist

Chip mounting side

Back side

Small diameter thru hole

φ0.4-φ0.6

Connect to ground pattern

of mounting side

Ground pattern

0.6

1.2

2.2

4.2

(in mm)

2. Solder Paste Printing and Adhesive Application

When reflow soldering the chip EMI suppression filter, the

printing must be conducted in accordance with the

following cream solder printing conditions. If too much

solder is applied, the chip will prone to be damaged by

mechanical and thermal stress from the PCB and may

crack. In contrast, if too little solder is applied, there is the

potential that the termination strength will be insufficient,

creating the potential for detachment. Standard land

dimensions should be used for resist and copper foil

patterns.

When flow soldering the EMI suppression filter, apply the

adhesive in accordance with the following conditions. If

too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering process.

(1) Solder Paste Printing

NFW31S/NFE31P Series

o Coat the solder paste a thickness of 150µm to 200µm.

o Use H60A solder for pattern printing.

0.6

2.2

(in mm)

4.2

(2) Adhesive Application

NFW31S/NFE31P Series

o Apply 0.2mg of bonding agent at each chip, and

ensure not to cover electrodes.

Bonding agent

Coating positon of bonding agent

Bonding agent

(in mm)

Continued on the following page.

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

NFW/NFE31 Series Notice (Soldering and Mounting)

Continued from the preceding page.

3. Standard Soldering Conditions

(1) SOLDERING METHODS

Allowable Flow Soldering Temperature and Time

Use flow and reflow soldering methods only.

280

Use standard soldering conditions when soldering chip

EMI suppression filters.

270

260

250

240

230

In cases where several different parts are soldered, each

having different soldering conditions, use those

conditions requiring the least heat and minimum time.

NFW31S

(2) SOLDERING TEMPERATURE AND TIME

To prevent external electrode solder leaching and

performance deterioration, solder within the temperature

and time combinations illustrated by the slanted lines in

the following graphs. If soldering is repeated, please note

that the allowed time is the accumulated time.

Time [s]

Allowable Reflow Soldering Temperature and Time

Solder : H60A H63A solder(JIS Z 3238)

Flux :

280

o Use Rosin-based fulx(when using RA type solder, clean

products sufficiently to avoid residual fulx.

o Do not use strong acidic fulx(with chlorine content

exceeding 0.20wt%)

270

260

NFE31P

250

o Do not use water-soluble fulx.

240

NFW31S

230

Time [s]

(3) SOLDERING CONDITIONS

Flow Solder

Gradual cooling

Soldering

(in air)

Pre-heating

300

250

200

150

100

Max. Temp. 250°C

60s Min.

5s Max.

Reflow Solder

Gradual cooling

Pre-heating

Soldering

(in air)

300

250

Max. Temp. 230°C

230°C

183°C

200

150

100

10s Max.

60s Max.

60s Min.

NFE31P : 20s Max. Temp. 250˚C

Continued on the following page.

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

NFW/NFE31 Series Notice (Soldering and Mounting)

Continued from the preceding page.

(4) REWORKING WITH SOLDER IRON

The following conditions must be strictly followed when

using a soldering iron.

Pre-heating

: 150°C 60 second Min.

Soldering iron power output

: 30W Max.

Temperature of soldering iron tip : 280°C Max.

Soldering time : 10 second Max.

Do not allow the tip of the soldering iron directly to

contact the chip.

For additional methods of reworking with soldering iron,

please contact Murata engineering.

4. Cleaning

Following conditions should be observed when cleaning

chip EMI filter.

b) Aqueous cleaning agent

Surface active agent (Clean Thru 750H)

Hydrocarbon (Techno Cleaner 335)

(1) Cleaning Temperature : 60degree C max. (40degree C

max. for CFC alternatives and alcohol cleaning agents)

(2) Ultrasonic

High grade alcohol (Pine Alpha ST-100S)

Alkaline saponifier ( Aqua Cleaner 240 -cleaner should

be diluted within 20% using deionized water.)

(4) Ensure that flux residue is completely removed.

Component should be thoroughly dried after aqueous

agent has been removed with deionized water.

(5) Some products may become slightly whitened.

However, product performance or usage is not affected.

For additional cleaning methods, please contact Murata

engineering.

Output

: 20W/liter max.

Duration : 5 minutes max.

Frequency : 28kHz to 40kHz

(3) Cleaning agent

The following list of cleaning agents have been tested on

the individual components. Evaluation of final assembly

should be completed prior to production.

a) CFC alternatives and alcohol cleaning agents

Isopropyl alcohol (IPA)

HCFC-225

100

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

Outlines of EMI Suppression Filter (EMIFILr) for DC Line

oChip EMIFILr for Signal Line

oChip EMIFILr with Waveform Distortion Suppressing Function

Chip EMIFILr for Signal Line ........P.31–48

Chip EMIFILr with Waveform

Distortion Suppressing Function ......P.75–80

P.81–82

NFW31S

NFL21S

BLM18B/18HD

BLM21B

NFR21G

NFA31G

"ꢀHigh-speed signal application EMIFILr are high perfor-

mance EMI suppression filters which increase the slope

of insertion loss frequency characteristic curves (shape

factor), thereby improving noise and signal separation.

These are used for high speed signal applications in

which noise and signal frequency approach the same

value.

[Comparison of Insertion Loss Characteristics]

NFW31S

Conventional Type

To avoid the elimination of both the noise and specific

signal components, 3-terminal capacitors and other

components are applied.

An NFW31S with a built-in capacitor and an inductor type

BLM--B are available.

50 100

500 10002000

Frequency [MHz]

BLM18HD has additional performance for suppressing

GHz range noise after cut off frequency.

"ꢀThe EMIFILr with waveform distortion suppressing func-

tion suppresses waveform distortion caused by the reso-

nance of digital ICs and surrounding circuits.

[Waveform change when filter is inserted]

Conventional Type

(Chip 3-terminal Capacitor)

EMIFILr for Signal Line

NFW31S series

This is the PDF file of catalog No.C31E-6

C31E6.pdf 01.5.29

Chip EMIFILr LC Combined Type

(Global Part Number)

31 SP 206

u i o

qProduct ID

yCharacteristics (NFL/NFW Series)

Product ID

Code

Characteristics

Cut off Frequency

Chip EMI Filters LC Combined Type

wStructure

yCapacitance Change (NFE Series)

Code

Structure

Code

Capacitance Change

Monolithic, LC Combined Type

Winding, LC Combined Type

Block, LC Combined Type

±10%

±20% , ±22%

+20/-30% , +22/-33%

+20/-55% , +22/-56%

+30/-80% , +22/-82%

±15%

eDimension (LgW)

Code

Dimension (LgW)

2.0g1.25mm

EIA

0805

1206

2606

-750 ±120ppm/ ˚C

Other

3.20g1.60mm

6.80g1.60mm

uRated Voltage

rFeatures

Code

Rated Voltage

16V

Code

Features

π Circuit for Signal Lines

25V

T Circuit for Large Current

50V

π Circuit for Automotive Electronics

100V

T Circuit for Automotive Electronics

iElectrode

Expressed by a figure.

tCut-off Frequency (NFL/NFW Series)

Ex.)

Code

Electrode

Expressed by three figures. The unit is in hertz (Hz). The first and

second figures are significant digits, and the third figure

expresses the number of zeros which follow the two figures.

Ag / Pd Outer Electrode

Sn Plating

Solder Coating

Others

tCapacitance (NFE Series)

Expressed by three figures. The unit is in pico-farad (pF). The first

and second figures are significant digits, and the third figure

expresses the number of zero which follow the two figures.

oPackaging

Code

Packaging

Plastic Taping (ø330mm Reel)

Plastic Taping (ø180mm Reel)

Bulk

Paper Taping (ø330mm Reel)

Paper Taping (ø180mm Reel)

NFW31SP407X1E4J [MURATA]

相关型号：

NFW31SP407X1E4K

NFW31SP407X1E4L

NFW31SP506X1E4

NFW31SP506X1E4B

NFW31SP506X1E4D

NFW31SP506X1E4J

NFW31SP506X1E4K

NFW31SP506X1E4L

NFW31SP507X1E4

NFW31SP507X1E4B

NFW31SP507X1E4D

NFW31SP507X1E4J