PRG18BB221MS1RB [MURATA]
PTC Thermistor;
| 型号： | PRG18BB221MS1RB |
| 厂家： | 
muRata |
| 描述： | PTC Thermistor 电阻器 |
| 文件： | 总7页 (文件大小：417K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Posistor® for over current protection PRG SERIES
BC-E0206C
PRG18BB***MS1RB SERIES For Automotive
1.Part Numbering
ex) PR
G
18
BB
330
Resistance
M
S1
RB
Packang
Product ID Series Dimensions Temperature
Characteristics
Resistance Individual
Tolerance Specifications
2. Ratings
Part Number
Max.
*2
Hd
*3
Trip
Charac.
Resistance
Max.
(at 25°C)
Voltage
Current
Current
Current
18mA
95mA
at +75°C) (at -20°C)
PRG18BB330MS1RB
PRG18BB470MS1RB
PRG18BB101MS1RB
PRG18BB221MS1RB
PRG18BB471MS1RB
33 ohm ±20%
600
420mA
200mA
90mA
36mA 91mA
(at +25°C) (at +25°C)
14mA 78mA
(at +75°C) (at -20°C)
47 ohm ±2%
100 hm ±20%
220 ohm ±20%
470 ohm ±20%
29mA 61mA
(at +25°C) (at +25°C)
12mA 56mA
BB
C.P.100°C
approx
(at +75°C) (at -20°C)
DC 16 V
21mA 45mA
(at +25°C) (at +25°C)
8mA 36mA
(at +75°C) (at -20°C)
14mA 29mA
(at +25°C) (at +25°C)
5mA 26mA
(at +75°C) (at -20°C)
40mA
10mA 21mA
(at +25°C) (at +25°C)
Packaging Tape : Taping (Standard quantity is 4000pcs. Per reel)
*1 Shows the Maximum Current value which Shall be passed repeatedly when the circuit runs abnormally.
*Shows the Maximum Current value which Shall be passed continuously without tripping at +25,+75°C.
*3 Shows the Tripping Current value when Posistor® shall protects circuit flow over load at -20,+25°C.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
3. Dimensions (mm)
L1
(1) Electrode ( Sn Plating)
(2) BaTiO3 Semiconductive Ceramic
W
L2
(1)
L3
W
(2)
H
H
L1
W
H
L2 ad L3
1.60±0.15
0.80±0.15
0.80±0.15
0.1～6
4. Quantity (Standard Quantity)
Products quantity in a reel
4,000 pcs. /reel
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
Resistance-Temperature Characteristics
Typical Curve
1000
100
10
1
0.1
-40
-20
0
20
40
60
80
100
120
140
160
Temperature (℃)
BB-040'
This information may be changed without a previous notice.
Notice for use
CAUTION
1. This product is designed for application, which is used under ordinary environment. (room temperature,
normal humidity, normal pressure) Do not expose this to the following environments, because all these
factors can deteriorate the characteristic of this and can cause failure or burn out.
(1) Corrosive gas or deoxidizing gases (Cl2, H2S, NH3, SOx, NOx etc.)
(2) Volatile, flammable gas
(3) Dusty place
(4) Place in a vacuum, reducing or putting pressure
(5) Place in splashed water, or high humidity and dewing place
(6) Salt water, oil, chemical liquid and solvent
(7) Vibratile place
(8) Other place equivalent to the above
2. Limitation of Applications
Please contact us before using our products for the under-mentioned applitos requiring especially high
reliability in order to prevent defects which might directly cause damage to other party’s life body or property
(listed below).
(1) Aircraft equipment (2) Aerospace equipment (3) Undrsea equipment
(4) Power plant control equipment (5) Medical equipmen
(6) Transportation equipment (automobiles, trainships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / Crime prevention equipmnt (9Data-processing equipment
(10) Applications of similar complexity or ith rliabiliy reuirements comparable to
the applications listed in the above
3. Be sure to provide an appropriate fail-se funtion on your product to prevent a second damage that
may be caused by the abnormal uncton othe failure of our product.
Notice
1. Do not apply abnoravoltag/current exceeding the specified maximum value.
Because they may detriorae or destroy PTC element.
2. Use thprodct within the specified temperature. A higher temperature may deteriorate
he chaceristior material.
3. Te body of this product is not insulated. Please keep an adequate distance to surrounding
components and wiring.
4. orage conditions
To keep solderability from declining, following storage condition is recommended.
(1) Condition Temperature : -10 to +40°C
Humidity
: Less than 75%RH (not dewing condition)
(2) Term: Please use this POSISTOR within 6 months after shipment by first-in and first-out stocking
system.
(3) Handling after seal open: After unpacking of the minimum package, reseal it promptly or store it
inside a sealed container with a drying agent.
(4) Place: Do not store this product in corrosive gas (SOx, Cl etc) or under sunlight.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-017O
5. Solder and Flux
(1) Solder Paste
Use Sn:Pb=60:40wt% ,Sn:Pb=63:37wt%, Sn:Ag:Cu=96.5:3.0:0.5wt% or equivalent type of solder paste.
Do not use strong acidic flux (with halide content exceeding 0.2wt%).
Use of the solder containing Zn may reduce adhesive strength.
When you use the solder containing Zn, please contact us in advance.
For your reference, we are using
‘63Sn/37Pb RMA9086 90-3-M18’, manufactured by Alpha Metals Japan Ltd.,
’96.5Sn/3.0Ag/0.5Cu M705-GRN360-K2-V’, manufactured by Senju Metal Industry Co.,LTD.
for any Internal tests of this product.
(2) Flux
Use rosin type flux in soldering process.
If below flux is used, some problems might be caused in the product charactersticand rliability.
Please do not use below flux.
• Strong acidic flux (with halide content exceeding 0.2wt%).
• Water-soluble flux(*Water-soluble flux can be defined as non rsin type flx inclding wash-type flux
and non-wash-type flux.)
6. For removing the flux after soldering, observe the following points in der to avoid deterioration of
the characteristics or any change of the external electrodes quality.
(1) Cleaning Conditions
Solvent
Dipping Cleaning
Ultrasonic Clanig
Less than 5 min.
at room temp.
or
Less than 2 min.
at 40°C max.
A sufficient cleaning shall
be applied to remove flux
completely.
Less than mi.
20W/L m
Frequeny of several 10 kHz
to sveral 100 kHz.
2-propanol
(2) Drying : After cleaning, dry promptly ths prouct.
7. In your mounting process, observe the following points in order to avoid deterioration of the
characteristics or destruction of ths prouct. he mounting quality of this product may also be affected by
the mounting conditions, shown he ponts below.
This product is for only reflosoleng. Flw soldering shall not be allowed.
Please mount this product solderg. When mounted by other methods, such as conductive adhesives,
please contact us in advance
(1) Standard Land Sze
Too bland sze gies too much solder paste on the land. It may cause destruction of this product,
becausothe mchanal stress especially in the case of board bending.
b
a
b
c
a
c
0.6~0.8
0.6~0.7
0.6~0.8
(mm)
(Printig Coditions of Solder Paste
. Standard thickness of solder paste printing shall be from 0.15 to 0.20 mm.
ii.Afteoldering, the solder fillet shall be a height from 0.2 mm to the thickness of this product.
(See the figures below.)
iii.Too much solder gives too strong mechanical stress to this product, such stress may cause cracking
or any mechanical damage. And also, it can destroy the electrical performance of this product.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-017O
(3) Allowable Soldering Temperature and Time
i. Solder within the temperature and time combinations, indicated by the slanted lines in the following
graphs.
ii.The excessive soldering conditions may cause dissolution of metallization or deterioration of
solder-wetting on the external electrode.
iii. In case of repeated soldering, the total accumulated soldering time should be within the range shown
below figure.(For example, Reflow peak temperature : 250°C,twice → The total accumulated
soldering time at 250°C is within 20sec.)
<Allowable Reflow Soldering Temp. and Time>
270
260
250
240
230
220
210
200
0
10 20 30 40 50 60
Time (sec.)
(4) Standard Temperature Profile for Soldering
i. Insufficient preheating may cause a crack on ceramic ody.
Difference between preheating temperature nd maximum temperature in the profile shall be 100°C.
ii.Rapid cooling by dipping in solvent or by othr means s not recommended.
<Reflow Soldering Condition>
Graduaooling
Preheating: 150 +/- 10 °C
1min. to 2 min.
Soldering: 240 °C
Solderin
240°
Preheating (in air)
(in a
200
100
20sec.
# : In case of repeated soldering, the total
accumulated soldering time should be
within the range shown above figure (3).
0
#
1~min.
20sec.
(5) There is a feaof unexpected failures (tombstone, insufficient solder-wetting, etc.) in your mounting
proess, auseby the mounting conditions. Please evaluate if this product is
corectlmounted under your mounting conditions.
) Coions wh Soldering Iron
When and soldering by iron is applied, be sure to keep following conditions.
Item
Preheating
Temperature of Iron-tip
Soldering Iron Wattage
Diameter of Iron-tip
Soldering Time
Conditions
at 150°C for 1 to 2 minute
350°C max.
30W max.
3mm dia. max.
5sec. max.
Solder
H60A (Sn:Pb=60:40wt%) type ,
H63A (Sn:Pb=63:37wt%) type,
Sn:Ag:Cu=96.5:3.0:0.5wt% or equivalent type.
Flux
Do not use strong acidic flux
(with halide content exceeding 0.2wt%).
Caution
・Do not allow the iron-tip to directly touch the ceramic body.
・Preheat the ceramic body and mounting board.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-017O
8. Do not give this product a strong press-force nor a mechanical shock.
Because such mechanical forces may cause cracking or chipping of this ceramic product.
9. Rapid cooling or heating during soldering is not recommended.
Such treatment may destroy the element.
10. When this product is operated, temperature of some area may be over 100 to 150°C. Be sure that
surrounding parts and inserting material can withstand the temperature. If the surrounding part and
material is kept under such condition, they may be deteriorated or may produce harmfl gases (Cl2, H2S,
NH3, SOX, NOX etc.). And, such harmful gas may deteriorate the element.
11. Do not assemble this product with air-sealing or resin casting. Such sealing may dterrate te
characteristic or destroy PTC element.
12. Location on Printed Circuit Board(PC Board)
<Mounting Close to oard Separaon Line>
Put this product on the PC Board nar the Slit,
not near the Perforation Hles.
<Component Direction>
Locate this product horizontal to
the direction in which stress acts.
Keep this product on the PC Board away from
the Separatin Lne.
Wor””-“C-“B”-“D”
Better
(Worse)
(Better)
oratiHoles
C
B
A
D
Slit
Separation Line
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-017O
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