MX29LV160ABXEC-70G [Macronix]
16M-BIT [2Mx8/1Mx16] CMOS SINGLE VOLTAGE 3V ONLY FLASH MEMORY; 16M - BIT [ 2Mx8 / 1Mx16 ] CMOS单电压3V仅限于Flash存储器型号: | MX29LV160ABXEC-70G |
厂家: | MACRONIX INTERNATIONAL |
描述: | 16M-BIT [2Mx8/1Mx16] CMOS SINGLE VOLTAGE 3V ONLY FLASH MEMORY |
文件: | 总66页 (文件大小:1357K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MX29LV160T/B & MX29LV160AT/AB
16M-BIT[2Mx8/1Mx16]CMOSSINGLEVOLTAGE
3VONLYFLASHMEMORY
FEATURES
• Ready/Busy pin (RY/BY)
• Extended single - supply voltage range 2.7V to 3.6V
• 2,097,152 x 8/1,048,576 x 16 switchable
• Singlepowersupplyoperation
- 3.0V only operation for read, erase and program
operation
• Fast access time: 70/90ns
-Providesahardwaremethodofdetectingprogramor
eraseoperationcompletion.
• Sectorprotection
- Hardware method to disable any combination of
sectors from program or erase operations
-Temporarysectorunprotectallowscodechangesin
previously locked sectors.
• Lowpowerconsumption
- 30mA maximum active current
• CFI (Common Flash Interface) compliant (for
MX29LV160AT/AB)
- 0.2uA typical standby current
• Commandregisterarchitecture
- Flash device parameters stored on the device and
provide the host system to access
• 100,000minimumerase/programcycles
• Latch-up protected to 100mA from -1V to VCC+1V
• Boot Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Low VCC write inhibit is equal to or less than 1.4V
• Package type:
- Byte/word Programming (9us/11us typical)
- Sector Erase (Sector structure 16K-Bytex1,
8K-Bytex2, 32K-Bytex1, and 64K-Byte x31)
• Auto Erase (chip & sector) and Auto Program
-Automaticallyeraseanycombinationofsectorswith
Erase Suspend capability.
- Automatically program and verify data at specified
address
• EraseSuspend/EraseResume
- Suspends sector erase operation to read data from,
orprogramdatato,any sectorthatisnotbeingerased,
then resumes the erase.
- 44-pin SOP
- 48-pin TSOP
-48-ballCSP(8x13mm:forMX29LV160T/B;6x8mm:
forMX29LV160AT/AB)
• Status Reply
• Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
-Datapolling&Togglebitfordetectionofprogramand
eraseoperationcompletion.
power supply levels during erase and programming, while
maintaining maximum EPROM compatibility.
GENERAL DESCRIPTION
The MX29LV160T/B & MX29LV160AT/AB is a 16-mega
bit Flash memory organized as 2M bytes of 8 bits or 1M
words of 16 bits. MXIC's Flash memories offer the most
cost-effective and reliable read/write non-volatile random
access memory. The MX29LV160T/B & MX29LV160AT/
AB is packaged in 44-pin SOP, 48-pinTSOP and 48-ball
CSP. It is designed to be reprogrammed and erased in
system or in standard EPROM programmers.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The MX29LV160T/B & MX29LV160AT/AB uses a
2.7V~3.6V VCC supply to perform the High Reliability
Erase and auto Program/Erase algorithms.
The standard MX29LV160T/B & MX29LV160AT/AB of-
fers access time as fast as 70ns, allowing operation of
high-speed microprocessors without wait states. To elimi-
nate bus contention, the MX29LV160T/B &
MX29LV160AT/AB has separate chip enable (CE) and
output enable (OE) controls.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
Part Name
MX29LV160T/B
Difference
1) Without CFI compliant
2)CSP dimension:8x13mm
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29LV160T/B & MX29LV160AT/AB uses a command
register to manage this functionality. The command reg-
ister allows for 100% TTL level control inputs and fixed
MX29LV160AT/AB 1) With CFI compliant
2)CSP dimension:6x8mm
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REV. 3.7, APR. 23, 2003
1
MX29LV160T/B & MX29LV160AT/AB
PIN CONFIGURATIONS
44 SOP(500 mil)
PIN DESCRIPTION
SYMBOL PIN NAME
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
WE
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
RESET
A18
A17
A7
A0~A19 Address Input
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Q0~Q14 Data Input/Output
A6
A5
A4
A3
A2
A1
A0
CE
GND
OE
Q0
Q8
Q1
Q9
Q2
Q10
Q3
Q11
Q15/A-1 Q15(Word mode)/LSB addr(Byte mode)
CE
Chip Enable Input
WE
Write Enable Input
BYTE
RESET
OE
Word/Byte Selection input
Hardware Reset Pin/Sector Protect Unlock
Output Enable Input
RY/BY
VCC
GND
Ready/Busy Output
Power Supply Pin (2.7V~3.6V)
Ground Pin
Q12
Q4
VCC
48 TSOP (Standard Type) (12mm x 20mm)
A15
A14
A13
A12
A11
A10
A9
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE
GND
Q15/A-1
Q7
2
3
4
5
6
Q14
Q6
7
A8
8
Q13
Q5
A19
NC
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Q12
Q4
WE
RESET
NC
MX29LV160T/B, MX29LV160AT/AB
VCC
Q11
Q3
NC
RY/BY
A18
A17
A7
Q10
Q2
Q9
Q1
A6
Q8
A5
Q0
A4
OE
A3
GND
CE
A2
A1
A0
48-Ball CSP (Ball Pitch=0.8mm) Top View, Balls Facing Down (8x13mm for MX29LV160T/B; 6x8mm for
MX29LV160AT/AB)
A
B
C
D
E
F
G
H
6
5
4
3
2
1
A13
A9
WE
A12
A8
A14
A10
A15
A11
A19
NC
A5
A16
Q7
Q5
Q2
Q0
A0
BYTE
Q14
Q12
Q10
Q8
Q15/A-1 GND
Q13
VCC
Q11
Q9
Q6
RESET NC
Q4
RY/BY NC
A18
A6
Q3
A7
A3
A17
A4
Q1
A2
A1
CE
OE
GND
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2
MX29LV160T/B & MX29LV160AT/AB
BLOCK STRUCTURE
Table 1: MX29LV160T & MX29LV160AT SECTOR ARCHITECTURE
Sector
Sector Size
Address range
Sector Address
Byte Mode Word Mode Byte Mode(x8) Word Mode(x16) A19 A18 A17 A16 A15 A14 A13 A12
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
64Kbytes 32Kwords 000000-00FFFF 00000-07FFF
64Kbytes 32Kwords 010000-01FFFF 08000-0FFFF
64Kbytes 32Kwords 020000-02FFFF 10000-17FFF
64Kbytes 32Kwords 030000-03FFFF 18000-1FFFF
64Kbytes 32Kwords 040000-04FFFF 20000-27FFF
64Kbytes 32Kwords 050000-05FFFF 28000-2FFFF
64Kbytes 32Kwords 060000-06FFFF 30000-37FFF
64Kbytes 32Kwords 070000-07FFFF 38000-3FFFF
64Kbytes 32Kwords 080000-08FFFF 40000-47FFF
64Kbytes 32Kwords 090000-09FFFF 48000-4FFFF
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
SA10 64Kbytes 32Kwords 0A0000-0AFFFF 50000-57FFF
SA11 64Kbytes 32Kwords 0B0000-0BFFFF 58000-5FFFF
SA12 64Kbytes 32Kwords 0C0000-0CFFFF 60000-67FFF
SA13 64Kbytes 32Kwords 0D0000-0DFFFF 68000-6FFFF
SA14 64Kbytes 32Kwords 0E0000-0EFFFF 70000-77FFF
SA15 64Kbytes 32Kwords 0F0000-0FFFFF 78000-7FFFF
SA16 64Kbytes 32Kwords 100000-10FFFF 80000-87FFF
SA17 64Kbytes 32Kwords 110000-11FFFF 88000-8FFFF
SA18 64Kbytes 32Kwords 120000-12FFFF 90000-97FFF
SA19 64Kbytes 32Kwords 130000-13FFFF 98000-9FFFF
SA20 64Kbytes 32Kwords 140000-14FFFF A0000-A7FFF
SA21 64Kbytes 32Kwords 150000-15FFFF A8000-AFFFF
SA22 64Kbytes 32Kwords 160000-16FFFF B0000-B7FFF
SA23 64Kbytes 32Kwords 170000-17FFFF B8000-BFFFF
SA24 64Kbytes 32Kwords 180000-18FFFF C0000-C7FFF
SA25 64Kbytes 32Kwords 190000-19FFFF C8000-CFFFF
SA26 64Kbytes 32Kwords 1A0000-1AFFFF D0000-D7FFF
SA27 64Kbytes 32Kwords 1B0000-1BFFFF D8000-DFFFF
SA28 64Kbytes 32Kwords 1C0000-1CFFFF E0000-E7FFF
SA29 64Kbytes 32Kwords 1D0000-1DFFFF E8000-EFFFF
SA30 64Kbytes 32Kwords 1E0000-1EFFFF F0000-F7FFF
SA31 32Kbytes 16Kwords 1F0000-1F7FFF F8000-FBFFF
SA32
SA33
8Kbytes
8Kbytes
4Kwords 1F8000-1F9FFF FC000-FCFFF
4Kwords 1FA000-1FBFFF FD000-FDFFF
8Kwords 1FC000-1FFFFF FE000-FFFFF
1
1
0
1
SA34 16Kbytes
1
1
X
Note: Byte mode: address range A19:A-1, word mode:address range A19:A0.
P/N:PM0866
REV. 3.7, APR. 23, 2003
3
MX29LV160T/B & MX29LV160AT/AB
Table 2: MX29LV160B & MX29LV160AB SECTOR ARCHITECTURE
Sector
Sector Size
Address range
Sector Address
Byte Mode Word Mode Byte Mode (x8) Word Mode (x16) A19 A18 A17 A16 A15 A14 A13 A12
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
16Kbytes
8Kbytes
8Kbytes
8Kwords 000000-003FFF 00000-01FFF
4Kwords 004000-005FFF 02000-02FFF
4Kwords 006000-007FFF 03000-03FFF
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
1
X
0
0
1
1
32Kbytes 16Kwords 008000-00FFFF 04000-07FFF
64Kbytes 32Kwords 010000-01FFFF 08000-0FFFF
64Kbytes 32Kwords 020000-02FFFF 10000-17FFF
64Kbytes 32Kwords 030000-03FFFF 18000-1FFFF
64Kbytes 32Kwords 040000-04FFFF 20000-27FFF
64Kbytes 32Kwords 050000-05FFFF 28000-2FFFF
64Kbytes 32Kwords 060000-06FFFF 30000-37FFF
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SA10 64Kbytes 32Kwords 070000-07FFFF 38000-3FFFF
SA11 64Kbytes 32Kwords 080000-08FFFF 40000-47FFF
SA12 64Kbytes 32Kwords 090000-09FFFF 48000-4FFFF
SA13 64Kbytes 32Kwords 0A0000-0AFFFF 50000-57FFF
SA14 64Kbytes 32Kwords 0B0000-0BFFFF 58000-5FFFF
SA15 64Kbytes 32Kwords 0C0000-0CFFFF 60000-67FFF
SA16 64Kbytes 32Kwords 0D0000-0DFFFF 68000-6FFFF
SA17 64Kbytes 32Kwords 0E0000-0EFFFF 70000-77FFF
SA18 64Kbytes 32Kwords 0F0000-0FFFFF 78000-7FFFF
SA19 64Kbytes 32Kwords 100000-10FFFF 80000-87FFF
SA20 64Kbytes 32Kwords 110000-11FFFF 88000-8FFFF
SA21 64Kbytes 32Kwords 120000-12FFFF 90000-97FFF
SA22 64Kbytes 32Kwords 130000-13FFFF 98000-9FFFF
SA23 64Kbytes 32Kwords 140000-14FFFF A0000-A7FFF
SA24 64Kbytes 32Kwords 150000-15FFFF A8000-AFFFF
SA25 64Kbytes 32Kwords 160000-16FFFF B0000-B7FFF
SA26 64Kbytes 32Kwords 170000-17FFFF B8000-BFFFF
SA27 64Kbytes 32Kwords 180000-18FFFF C0000-C7FFF
SA28 64Kbytes 32Kwords 190000-19FFFF C8000-CFFFF
SA29 64Kbytes 32Kwords 1A0000-1AFFFF D0000-D7FFF
SA30 64Kbytes 32Kwords 1B0000-1BFFFF D8000-DFFFF
SA31 64Kbytes 32Kwords 1C0000-1CFFFF E0000-E7FFF
SA32 64Kbytes 32Kwords 1D0000-1DFFFF E8000-EFFFF
SA33 64Kbytes 32Kwords 1E0000-1EFFFF F0000-FFFFF
SA34 64Kbytes 32Kwords 1F0000-1FFFFF F8000-FFFFF
Note: Byte mode:address range A19:A-1, word mode:address range A19:A0.
P/N:PM0866
REV. 3.7, APR. 23, 2003
4
MX29LV160T/B & MX29LV160AT/AB
BLOCK DIAGRAM
WRITE
CE
OE
WE
CONTROL
INPUT
PROGRAM/ERASE
HIGH VOLTAGE
STATE
MACHINE
(WSM)
LOGIC
RESET
STATE
REGISTER
ADDRESS
LATCH
FLASH
ARRAY
ARRAY
A0-A19
SOURCE
HV
AND
COMMAND
DATA
BUFFER
Y-PASS GATE
DECODER
PGM
DATA
HV
SENSE
AMPLIFIER
COMMAND
DATA LATCH
PROGRAM
DATA LATCH
I/O BUFFER
Q0-Q15/A-1
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REV. 3.7, APR. 23, 2003
5
MX29LV160T/B & MX29LV160AT/AB
AUTOMATIC ERASE ALGORITHM
AUTOMATIC PROGRAMMING
MXIC's Automatic Erase algorithm requires the user to
write commands to the command register using stan-
dard microprocessor write timings. The device will auto-
matically pre-program and verify the entire array. Then
the device automatically times the erase pulse width,
provides the erase verification, and counts the number
of sequences. A status bit toggling between consecu-
tive read cycles provides feedback to the user as to the
status of the erasing operation.
The MX29LV160T/B & MX29LV160AT/AB is byte/word
programmable using the Automatic Programming algo-
rithm. The Automatic Programming algorithm makes
the external system do not need to have time out se-
quence nor to verify the data programmed. The typical
chip programming time at room temperature of the
MX29LV160T/B & MX29LV160AT/AB is less than 18 sec
(byte)/12 sec (word).
Register contents serve as inputs to an internal state-
machine which controls the erase and programming cir-
cuitry. During write cycles, the command register inter-
nally latches address and data needed for the program-
ming and erase operations. During a system write cycle,
addresses are latched on the falling edge, and data are
latched on the rising edge of WE or CE, whichever hap-
pens first.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm requires the
user to only write program set-up commands (including
2 unlock write cycle and A0H) and a program command
(program data and address). The device automatically
times the programming pulse width, provides the pro-
gram verification, and counts the number of sequences.
A status bit similar to DATA polling and a status bit tog-
gling between consecutive read cycles, provide feed-
back to the user as to the status of the programming
operation. Refer to write operation status, table 7, for
more information on these status bits.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, reli-
ability, and cost effectiveness. The MX29LV160T/B &
MX29LV160AT/AB electrically erases all bits simulta-
neously using Fowler-Nordheim tunneling. The bytes are
programmed by using the EPROM programming mecha-
nism of hot electron injection.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 10 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than 25 second. The Automatic Erase algorithm
automatically programs the entire array prior to electri-
cal erase. The timing and verification of electrical erase
are controlled internally within the device.
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is completed,
the device stays in read mode. After the state machine
has completed its task, it will allow the command regis-
ter to respond to its full command set.
AUTOMATIC SECTOR ERASE
AUTOMATIC SELECT
The MX29LV160T/B & MX29LV160AT/AB is sector(s)
erasable using MXIC's Auto Sector Erase algorithm.The
Automatic Sector Erase algorithm automatically pro-
grams the specified sector(s) prior to electrical erase.
The timing and verification of electrical erase are con-
trolled internally within the device. An erase operation
can erase one sector, multiple sectors, or the entire de-
vice.
The automatic select mode provides manufacturer and
device identification, and sector protection verification,
through identifier codes output on Q7~Q0.This mode is
mainly adapted for programming equipment on the de-
vice to be programmed with its programming algorithm.
When programming by high voltage method, automatic
select mode requires VID (11.5V to 12.5V) on address
pin A9. Other address pin A6, A1 and A0 as referring to
Table 3.In addition, to access the automatic select codes
in-system, the host can issue the automatic select com-
P/N:PM0866
REV. 3.7, APR. 23, 2003
6
MX29LV160T/B & MX29LV160AT/AB
mand through the command register without requiring
VID, as shown in table 5.
To verify whether or not sector being protected, the sec-
tor address must appear on the appropriate highest or-
der address bit (see Table 1 and Table 2). The rest of
address bits, as shown in Table 3, are don't care. Once
all necessary bits have been set as required, the pro-
gramming equipment may read the corresponding iden-
tifier code on Q7~Q0.
TABLE 3. MX29LV160T/B & MX29LV160AT/AB AUTO SELECT MODE BUS OPERATION (A9=VID)
A19 A11
A9 A8
A6 A5 A1
A0
Description
Mode CE
OE
WE RESET
|
|
|
|
Q15~Q0
A12 A10
A7
A2
Read Silicon ID
Manufacture Code
Device ID
L
L
H
H
X
X
VID
X
L
X
L
L
C2H
Word
Byte
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
VID
VID
VID
VID
X
X
X
X
L
L
L
L
X
X
X
X
L
L
L
L
H
H
H
H
22C4H
XXC4H
2249H
(Top Boot Block)
Device ID
Word
(Bottom Boot Block) Byte
XX49H
XX01H
(protected)
Sector Protection
Verification
L
L
H
H
SA
X
VID
X
L
X
H
L
XX00H
(unprotected)
NOTE: SA=Sector Address, X=Don't Care, L=Logic Low, H=Logic High
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REV. 3.7, APR. 23, 2003
7
MX29LV160T/B & MX29LV160AT/AB
described inTable 4.
QUERY COMMAND AND COMMON FLASH
The single cycle Query command is valid only when the
device is in the Read mode, including Erase Suspend,
Standby mode, and Automatic Select mode;however, it
is ignored otherwise.
INTERFACE (CFI) MODE ( for MX29LV160AT/
AB)
MX29LV160AT/AB is capable of operating in the CFI
mode. This mode all the host system to determine the
manufacturer of the device such as operating param-
eters and configuration.Two commands are required in
CFI mode. Query command of CFI mode is placed first,
then the Reset command exits CFI mode. These are
The Reset command exits from the CFI mode to the
Read mode, or Erase Suspend mode, or Automatic Se-
lect mode.The command is valid only when the device
is in the CFI mode.
Table 4-1. CFI mode: Identification Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
Query-unique ASCII string "QRY"
20
22
24
26
28
2A
2C
2E
30
32
34
10
11
12
13
14
15
16
17
18
19
1A
0051
0052
0059
0002
0000
0040
0000
0000
0000
0000
0000
Primary vendor command set and control interface ID code
Address for primary algorithm extended query table
Alternate vendor command set and control interface ID code (none)
Address for secondary algorithm extended query table (none)
Table 4-2. CFI Mode: System Interface Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
VCC supply, minimum (2.7V)
36
38
3A
3C
3E
40
42
44
46
48
4A
4C
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
0027
0036
0000
0000
0004
0000
000A
0000
0005
0000
0004
0000
VCC supply, maximum (3.6V)
VPP supply, minimum (none)
VPP supply, maximum (none)
Typical timeout for single word/byte write (2N us)
Typical timeout for Minimum size buffer write (2N us) (not supported)
Typical timeout for individual sector erase (2N ms)
Typical timeout for full chip erase (2N ms)
Maximum timeout for single word/byte write times (2N X Typ)
Maximum timeout for buffer write times (2N X Typ)
Maximum timeout for individual sector erase times (2N X Typ)
Maximum timeout for full chip erase times (not supported)
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MX29LV160T/B & MX29LV160AT/AB
Table 4-3. CFI Mode: Device Geometry Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
Device size (2N bytes)
4E
50
52
54
56
58
5A
5C
5E
60
62
64
66
68
6A
6C
6E
70
72
74
76
78
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
0015
0002
0000
0000
0000
0004
0000
0000
0040
0000
0001
0000
0020
0000
0000
0000
0080
0000
001E
0000
0000
0001
Flash device interface code (x8/x16 async.)
Maximum number of bytes in multi-byte write (not supported)
Number of erase sector regions
Erase sector region 1 information (refer to the CFI publication 100)
Erase sector region 2 information
Erase sector region 3 information
Erase sector region 4 information
Table 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
Query-unique ASCII string "PRI"
80
82
84
86
88
8A
8C
8E
90
92
94
96
98
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
0050
0052
0049
0031
0030
0000
0002
0001
0001
0004
0000
0000
0000
Major version number, ASCII
Minor version number, ASCII
Address sensitive unlock (0=required, 1= not required)
Erase suspend (2= to read and write)
Sector protect (N= # of sectors/group)
Temporarysectorunprotect(1=supported)
Sector protect/chip unprotect scheme
SimultaneousR/Woperation(0=notsupported)
Burst mode type (0=not supported)
Page mode type (0=not supported)
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MX29LV160T/B & MX29LV160AT/AB
in the improper sequence will reset the device to the
read mode. Table 5 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and
Erase Resume (30H) commands are valid only while the
Sector Erase operation is in progress.
COMMAND DEFINITIONS
Device operations are selected by writing specific ad-
dress and data sequences into the command register.
Writing incorrect address and data values or writing them
TABLE 5. MX29LV160T/B & MX29LV160AT/AB COMMAND DEFINITIONS
First Bus
Bus Cycle
Second Bus Third Bus
Fourth Bus
Cycle
Fifth Bus
Cycle
Sixth Bus
Cycle
Command
Cycle
Cycle
Cycle Addr Data Addr
Data Addr
Data Addr Data Addr
Data Addr Data
Reset
1
1
4
4
4
XXXH F0H
RA RD
Read
Read Silicon ID Word
Byte
555H AAH 2AAH 55H 555H 90H ADI
AAAH AAH 555H 55H AAAH 90H ADI
DDI
DDI
Sector Protect
Verify
Word
555H AAH 2AAH 55H 555H 90H (SA) XX00H
x02H XX01H
Byte
4
AAAH AAH 555H 55H AAAH 90H (SA) 00H
x04H 01H
Program
Word
Byte
Word
Byte
Word
Byte
4
4
6
6
6
6
1
1
1
555H AAH 2AAH 55H 555H A0H PA
AAAH AAH 555H 55H AAAH A0H PA
PD
PD
Chip Erase
Sector Erase
555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H
555H 10H
AAAH 10H
AAAH AAH 555H 55H AAAH 80H AAAH AAH 555H 55H
555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H
SA
SA
30H
30H
AAAH AAH 555H 55H AAAH 80H AAAH AAH 555H 55H
Sector Erase Suspend
Sector Erase Resume
XXXH B0H
XXXH 30H
555H 98
AAAH
CFI Query (for
Word
29LV160AT/AB) Byte
Note:
1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacturer code,A1=0, A0 = 1 for device code. A2-A19=do not care.
(Refer to table 3)
DDI = Data of Device identifier : C2H for manufacture code, C4H/49H (x8) and 22C4H/2249H (x16) for device code.
X = X can be VIL or VIH
RA=Address of memory location to be read. RD=Data to be read at location RA.
2.PA = Address of memory location to be programmed. PD = Data to be programmed at location PA.
SA = Address of the sector to be erased.
3.The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 in word mode/AAAH or
555H to Address A10~A-1 in byte mode.
Address bit A11~A19=X=Don't care for all address commands except for Program Address (PA) and Sector
Address (SA). Write Sequence may be initiated with A11~A19 in either state.
4. For Sector Protect Verify operation: If read out data is 01H, it means the sector has been protected. If read out data is 00H,
it means the sector is still not being protected.
5. Any number of CFI data read cycles are permitted.
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MX29LV160T/B & MX29LV160AT/AB
TABLE 6. MX29LV160T/B & MX29LV160AT/AB BUS OPERATION
ADDRESS
OE WE RESET A19 A11 A9 A8 A6 A5 A1 A0
Q8~Q15
DESCRIPTION
CE
Q0~Q7
BYTE
BYTE
=VIL
A12 A10
A7
A2
=VIH
Read
L
L
H
H
AIN
Dout
Dout
=High Z
DQ15=A-1
Write
L
H
X
X
H
X
L
X
X
H
X
H
L
AIN
X
DIN(3)
High Z
DIN
DIN
High Z
DIN
Reset
X
X
High Z
High Z
High Z
High Z
Temporary sector unlock
Output Disable
Standby
VID
H
AIN
X
L
High Z
High Z
High Z
High Z
Vcc±
0.3V
L
Vcc±
0.3V
VID
VID
H
X
Sector Protect
H
H
L
L
L
SA
X
X
X
X
X
X
X
X
X
L
H
L
X
X
X
H
H
H
L
L
L
DIN
DIN
X
X
X
X
X
X
Chip Unprotect
L
Sector Protection Verify
L
H
SA
VID
CODE(5)
NOTES:
1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 4.
2. VID is the high voltage, 11.5V to 12.5V.
3. Refer to Table 5 for valid Data-In during a write operation.
4. X can be VIL or VIH.
5. Code=00H/XX00H means unprotected.
Code=01H/XX01H means protected.
6. A19~A12=Sector address for sector protect.
7.The sector protect and chip unprotect functions may also be implemented via programming equipment.
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MX29LV160T/B & MX29LV160AT/AB
tive current specification for the write mode. The "AC
Characteristics" section contains timing specification
table and timing diagrams for write operations.
REQUIREMENTS FOR READING ARRAY
DATA
To read array data from the outputs, the system must
drive the CE and OE pins toVIL.CE is the power control
and selects the device. OE is the output control and
gates array data to the output pins.WE should remain at
VIH.
STANDBY MODE
When using both pins of CE and RESET, the device
enter CMOS Standby with both pins held at Vcc ±0.3V.
If CE and RESET are held at VIH, but not within the
range ofVCC ±0.3V, the device will still be in the standby
mode, but the standby current will be larger.During Auto
Algorithm operation,Vcc active current (ICC2) is required
even CE = "H" until the operation is completed.The de-
vice can be read with standard access time (tCE) from
either of these standby modes, before it is ready to read
data.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory con-
tent occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard
microprocessor read cycles that assert valid address
on the device address inputs produce valid data on the
device data outputs.The device remains enabled for read
access until the command register contents are altered.
OUTPUT DISABLE
WRITE COMMANDS/COMMAND SEQUENCES
With the OE input at a logic high level (VIH), output from
the devices are disabled.This will cause the output pins
to be in a high impedance state.
To program data to the device or erase sectors of
memory, the system must drive WE and CE to VIL, and
OE to VIH.
RESET OPERATION
An erase operation can erase one sector, multiple sec-
tors, or the entire device.Table 1 andTable 2 indicate the
address space that each sector occupies. A "sector ad-
dress" consists of the address bits required to uniquely
select a sector. The Writing specific address and data
commands or sequences into the command register ini-
tiates device operations.Table 5 defines the valid regis-
ter command sequences.Writing incorrect address and
data values or writing them in the improper sequence
resets the device to reading array data. Section has de-
tails on erasing a sector or the entire chip, or suspend-
ing/resuming the erase operation.
The RESET pin provides a hardware method of reset-
ting the device to reading array data.When the RESET
pin is driven low for at least a period of tRP, the device
immediately terminates any operation in progress,
tristates all output pins, and ignores all read/write com-
mands for the duration of the RESET pulse.The device
also resets the internal state machine to reading array
data. The operation that was interrupted should be re-
initiated once the device is ready to accept another com-
mand sequence, to ensure data integrity.
After the system writes the "read silicon-ID" and "sector
protect verify" command sequence, the device enters
the "read silicon-ID" and "sector protect verify" mode.
The system can then read "read silicon-ID" and "sector
protect verify" codes from the internal register (which is
separate from the memory array) on Q7-Q0. Standard
read cycle timings apply in this mode. Refer to the "read
silicon-ID" and "sector protect verify" Mode and "read
silicon-ID" and "sector protect verify" Command Se-
quence section for more information.
Current is reduced for the duration of the RESET pulse.
When RESET is held at VSS±0.3V, the device draws
CMOS standby current (ICC4). If RESET is held at VIL
but not within VSS±0.3V, the standby current will be
greater.
The RESET pin may be tied to system reset circuitry. A
system reset would that also reset the Flash memory,
enabling the system to read the boot-up firmware from
the Flash memory.
ICC2 in the DC Characteristics table represents the ac-
If RESET is asserted during a program or erase opera-
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MX29LV160T/B & MX29LV160AT/AB
tion, the RY/BY pin remains a "0" (busy) until the inter-
AUTOMATIC CHIP ERASE COMMANDS
nal reset operation is complete, which requires a time of
tREADY (during Embedded Algorithms).The system can
thus monitor RY/BY to determine whether the reset op-
eration is complete. If RESET is asserted when a pro-
gram or erase operation is completed within a time of
tREADY (not during Embedded Algorithms). The sys-
tem can read data tRH after the RESET pin returns to
VIH.
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cy-
cles are then followed by the chip erase command 10H.
The device does not require the system to entirely pre-
program prior to executing the Automatic Chip Erase.
Upon executing the Automatic Chip Erase, the device
will automatically program and verify the entire memory
for an all-zero data pattern. When the device is auto-
matically verified to contain an all-zero pattern, a self-
timed chip erase and verify begin. The erase and verify
operations are completed when the data on Q7 is "1" at
which time the device returns to the Read mode. The
system is not required to provide any control or timing
during these operations.
Refer to the AC Characteristics tables for RESET
parameters and to Figure 22 for the timing diagram.
READ/RESET COMMAND
The read or reset operation is initiated by writing the
read/reset command sequence into the command reg-
ister. Microprocessor read cycles retrieve array data.
The device remains enabled for reads until the command
register contents are altered.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
(no erase verification command is required).
If program-fail or erase-fail happen, the write of F0H will
reset the device to abort the operation. A valid com-
mand must then be written to place the device in the
desired state.
If the Erase operation was unsuccessful, the data on
Q5 is "1" (see Table 8), indicating the erase operation
exceed internal timing limit.
The automatic erase begins on the rising edge of the
last WE or CE pulse, whichever happens first in the
command sequence and terminates when either the data
on Q7 is "1" at which time the device returns to the
Read mode or the data on Q6 stops toggling for two
consecutive read cycles at which time the device re-
turns to the Read mode.
SILICON-ID READ COMMAND
Flash memories are intended for use in applications where
the local CPU alters memory contents. As such, manu-
facturer and device codes must be accessible while the
device resides in the target system. PROM program-
mers typically access signature codes by raising A9 to
a high voltage (VID). However, multiplexing high volt-
age onto address lines is not generally desired system
design practice.
The MX29LV160T/B & MX29LV160AT/AB contains a Sili-
con-ID-Read operation to supple traditional PROM pro-
gramming methodology. The operation is initiated by
writing the read silicon ID command sequence into the
command register. Following the command write, a read
cycle with A1=VIL, A0=VIL retrieves the manufacturer
code of C2H/00C2H. A read cycle with A1=VIL, A0=VIH
returns the device code of C4H/22C4H for MX29LV160T/
AT, 49H/2249H for MX29LV160B/AB.
The system must write the reset command to exit the
"Silicon-ID Read Command" code.
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MX29LV160T/B & MX29LV160AT/AB
TABLE 7. SILICON ID CODE
Pins
A0
Word VIL
Byte VIL
A1
VIL 00H
VIL
Q15~Q8 Q7 Q6 Q5
Q4 Q3 Q2 Q1 Q0 Code(Hex)
Manufacturer code
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
1
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
0
00C2H
X
C2H
Device code
Word VIH VIL 22H
22C4H
for MX29LV160(A)T Byte VIH VIL
Device code Word VIH VIL 22H
for MX29LV160(A)B Byte VIH VIL
X
C4H
2249H
X
X
X
49H
Sector Protection
Verification
Word
Byte
X
X
VIH
VIH
01H (Protected)
00H (Unprotected)
READING ARRAY DATA
RESET COMMAND
Writing the reset command to the device resets the
device to reading array data. Address bits are don't care
for this command.
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data.The device is also ready to read array data
after completing an Automatic Program or Automatic
Erase algorithm.
The reset command may be written between the
sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array
data. Once erasure begins, however, the device ignores
reset commands until the operation is complete.
After the device accepts an Erase Suspend command,
the device enters the Erase Suspend mode. The system
can read array data using the standard read timings,
except that if it reads at an address within erase-
suspended sectors, the device outputs status data. After
completing a programming operation in the Erase
Suspend mode, the system may once again read array
data with the same exception. See erase Suspend/Erase
Resume Commands” for more information on this mode.
The system must issue the reset command to re-en-
able the device for reading array data if Q5 goes high, or
while in the "read silicon-ID" and "sector protect verify"
mode. See the "Reset Command" section, next.
The reset command may be written between the
sequence cycles in a program command sequence before
programming begins. This resets the device to reading
array data (also applies to programming in Erase
Suspend mode). Once programming begins, however,
the device ignores reset commands until the operation
is complete.
The reset command may be written between the
sequence cycles in an Automatic Select command
sequence. Once in the Automatic Select mode, the reset
command must be written to return to reading array data
(also applies to Automatic Select during Erase Suspend).
If Q5 goes high during a program or erase operation,
writing the reset command returns the device to reading
array data (also applies during Erase Suspend).
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MX29LV160T/B & MX29LV160AT/AB
mand is issued during the sector erase operation, the
device requires a maximum 20us to suspend the sector
erase operation.However, when the Erase Suspend com-
mand is written during the sector erase time-out, the
device immediately terminates the time-out period and
suspends the erase operation. After this command has
been executed, the command register will initiate erase
suspend mode. The state machine will return to read
mode automatically after suspend is ready. At this time,
state machine only allows the command register to re-
spond to Erase Resume, program data to , or read data
from any sector not selected for erasure. The system
can use Q7 or Q6 and Q2 together, to determine if a
sector is actively erasing or is erase-suspend.
SECTOR ERASE COMMANDS
The device does not require the system to entirely pre-
program prior to executing the Automatic Sector Erase
Set-up command and Automatic Sector Erase com-
mand. Upon executing the Automatic Sector Erase com-
mand, the device will automatically program and verify
the sector(s) memory for an all-zero data pattern. The
system is not required to provide any control or timing
during these operations.
When the sector(s) is automatically verified to contain
an all-zero pattern, a self-timed sector erase and verify
begin. The erase and verify operations are complete
when either the data on Q7 is "1" at which time the de-
vice returns to the Read mode or the data on Q6 stops
toggling for two consecutive read cycles at which time
the device returns to the Read mode. The system is not
required to provide any control or timing during these
operations.
The system can determine the status of the program
operation using the Q7 or Q6 status bits, just as in the
standard program operation. After an erase-suspend pro-
gram operation is complete, the system can once again
read array data within non-suspended sectors.
When using the Automatic Sector Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
(no erase verification command is required). Sector
erase is a six-bus cycle operation. There are two "un-
lock" write cycles. These are followed by writing the
set-up command 80H. Two more "unlock" write cycles
are then followed by the sector erase command 30H.
The sector address is latched on the falling edge of WE
or CE, whichever happens later, while the command
(data) is latched on the rising edge of WE or CE, which-
ever happens first. Sector addresses selected are
loaded into internal register on the sixth falling edge of
WE or CE, whichever happens later. Each successive
sector load cycle started by the falling edge of WE or
CE, whichever happens later must begin within 50us
from the rising edge of the preceding WE or CE, which-
ever happens first. Otherwise, the loading period ends
and internal auto sector erase cycle starts.(Monitor Q3
to determine if the sector erase timer window is still open,
see section Q3, Sector EraseTimer.) Any command other
than Sector Erase (30H) or Erase Suspend (B0H) during
the time-out period resets the device to read mode.
ERASE RESUME
This command will cause the command register to clear
the suspend state and return back to Sector Erase mode
but only if an Erase Suspend command was previously
issued. Erase Resume will not have any effect in all
other conditions. Another Erase Suspend command can
be written after the chip has resumed erasing.However,
for MX29LV160T/B, a 10ms time delay must be required
after the erase resume command, if the system imple-
ments a endless erase suspend/resume loop, or the
number of erase suspend/resume is exceeded 1024
times. The erase times will be expended if the erase
behavior always be suspended. (Please refer to MXIC
Flash Application Note for details.) Please note that the
above 10ms time delay is not necessary for
MX29LV160AT/AB.
WORD/BYTE PROGRAM COMMAND SEQUENCE
The device programs one byte of data for each program
operation. The command sequence requires four bus
cycles, and is initiated by writing two unlock write cycles,
followed by the program set-up command. The program
address and data are written next, which in turn initiate
the Embedded Program algorithm. The system is not
required to provide further controls or timings.The device
automatically generates the program pulses and verifies
the programmed cell margin. Table 5 shows the address
ERASE SUSPEND
This command only has meaning while the state ma-
chine is executing Automatic Sector Erase operation,
and therefore will only be responded during Automatic
Sector Erase operation. When the Erase Suspend Com-
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MX29LV160T/B & MX29LV160AT/AB
and data requirements for the byte program command
sequence.
address to read valid status information on Q7. If a pro-
gram address falls within a protected sector, Data Poll-
ing on Q7 is active for approximately 1 us, then the de-
vice returns to reading array data.
When the Embedded Program algorithm is complete,
the device then returns to reading array data and
addresses are no longer latched. The system can
determine the status of the program operation by using
Q7, Q6, or RY/BY. See "Write Operation Status" for
information on these status bits.
During the Automatic Erase algorithm, Data Polling pro-
duces a "0" on Q7. When the Automatic Erase algo-
rithm is complete, or if the device enters the Erase Sus-
pend mode, Data Polling produces a "1" on Q7. This is
analogous to the complement/true datum output de-
scribed for the Automatic Program algorithm: the erase
function changes all the bits in a sector to "1" prior to
this, the device outputs the "complement,” or "0".” The
system must provide an address within any of the sec-
tors selected for erasure to read valid status information
on Q7.
Any commands written to the device during the
Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the programming
operation. The Byte/Word Program command sequence
should be reinitiated once the device has reset to reading
array data, to ensure data integrity.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed from a
"0" back to a "1". Attempting to do so may cause the
device to set Q5 to "1", or cause the Data Polling
algorithm to indicate the operation was successful.
However, a succeeding read will show that the data is
still "0". Only erase operations can convert a "0" to a
"1".
After an erase command sequence is written, if all sec-
tors selected for erasing are protected, Data Polling on
Q7 is active for approximately 100 us, then the device
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
When the system detects Q7 has changed from the
complement to true data, it can read valid data at Q7-Q0
on the following read cycles. This is because Q7 may
change asynchronously with Q0-Q6 while Output En-
able (OE) is asserted low.
WRITE OPERATION STATUS
The device provides several bits to determine the sta-
tus of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/
BY. Table 8 and the following subsections describe the
functions of these bits. Q7, RY/BY, and Q6 each offer a
method for determining whether a program or erase op-
eration is complete or in progress.These three bits are
discussed first.
RY/BY : Ready/Busy
The RY/BY is a dedicated, open-drain output pin that
indicates whether an Automatic Erase/Program algorithm
is in progress or complete. The RY/BY status is valid
after the rising edge of the final WE or CE, whichever
happens first, in the command sequence. Since RY/BY
is an open-drain output, several RY/BY pins can be tied
together in parallel with a pull-up resistor to Vcc.
Q7: Data Polling
The Data Polling bit, Q7, indicates to the host system
whether an Automatic Algorithm is in progress or com-
pleted, or whether the device is in Erase Suspend. Data
Polling is valid after the rising edge of the finalWE pulse
in the program or erase command sequence.
If the output is low (Busy), the device is actively erasing
or programming. (This includes programming in the Erase
Suspend mode.) If the output is high (Ready), the de-
vice is ready to read array data (including during the
Erase Suspend mode), or is in the standby mode.
During the Automatic Program algorithm, the device out-
puts on Q7 the complement of the datum programmed
to Q7.This Q7 status also applies to programming dur-
ing Erase Suspend.When the Automatic Program algo-
rithm is complete, the device outputs the datum pro-
grammed to Q7.The system must provide the program
Table 8 shows the outputs for RY/BY during write opera-
tion.
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16
MX29LV160T/B & MX29LV160AT/AB
happens first, in the command sequence.
Q6:Toggle BIT I
Toggle Bit I on Q6 indicates whether an Automatic Pro-
gram or Erase algorithm is in progress or complete, or
whether the device has entered the Erase Suspend mode.
Toggle Bit I may be read at any address, and is valid
after the rising edge of the final WE or CE, whichever
happens first, in the command sequence (prior to the
program or erase operation), and during the sector time-
out.
Q2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. (The
system may use either OE or CE to control the read
cycles.) But Q2 cannot distinguish whether the sector
is actively erasing or is erase-suspended. Q6, by com-
parison, indicates whether the device is actively eras-
ing, or is in Erase Suspend, but cannot distinguish which
sectors are selected for erasure. Thus, both status bits
are required for sectors and mode information. Refer to
Table 7 to compare outputs for Q2 and Q6.
During an Automatic Program or Erase algorithm opera-
tion, successive read cycles to any address cause Q6
to toggle.The system may use either OE or CE to con-
trol the read cycles.When the operation is complete, Q6
stops toggling.
Reading Toggle Bits Q6/ Q2
Whenever the system initially begins reading toggle bit
status, it must read Q7-Q0 at least twice in a row to
determine whether a toggle bit is toggling. Typically, the
system would note and store the value of the toggle bit
after the first read. After the second read, the system
would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has
completed the program or erase operation. The system
can read array data on Q7-Q0 on the following read cycle.
After an erase command sequence is written, if all sec-
tors selected for erasing are protected, Q6 toggles and
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
The system can use Q6 and Q2 together to determine
whether a sector is actively erasing or is erase sus-
pended.When the device is actively erasing (that is, the
Automatic Erase algorithm is in progress), Q6 toggling.
When the device enters the Erase Suspend mode, Q6
stops toggling. However, the system must also use Q2
to determine which sectors are erasing or erase-sus-
pended. Alternatively, the system can use Q7.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the sys-
tem also should note whether the value of Q5 is high
(see the section on Q5). If it is, the system should then
determine again whether the toggle bit is toggling, since
the toggle bit may have stopped toggling just as Q5 went
high. If the toggle bit is no longer toggling, the device
has successfully completed the program or erase op-
eration. If it is still toggling, the device did not complete
the operation successfully, and the system must write
the reset command to return to reading array data.
If a program address falls within a protected sector, Q6
toggles for approximately 2 us after the program com-
mand sequence is written, then returns to reading array
data.
The remaining scenario is that system initially determines
that the toggle bit is toggling and Q5 has not gone high.
The system may continue to monitor the toggle bit and
Q5 through successive read cycles, determining the sta-
tus as described in the previous paragraph. Alterna-
tively, it may choose to perform other system tasks. In
this case, the system must start at the beginning of the
algorithm when it returns to determine the status of the
operation.
Q6 also toggles during the erase-suspend-program mode,
and stops toggling once the Automatic Program algo-
rithm is complete.
Table 8 shows the outputs for Toggle Bit I on Q6.
Q2:Toggle Bit II
The "Toggle Bit II" on Q2, when used with Q6, indicates
whether a particular sector is actively erasing (that is,
the Automatic Erase algorithm is in process), or whether
that sector is erase-suspended. Toggle Bit II is valid
after the rising edge of the final WE or CE, whichever
Q5 : Exceeded Timing Limits
Q5 will indicate if the program or erase time has ex-
REV. 3.7, APR. 23, 2003
P/N:PM0866
17
MX29LV160T/B & MX29LV160AT/AB
If this time-out condition occurs during the chip erase
operation, it specifies that the entire chip is bad or com-
bination of sectors are bad.
ceeded the specified limits (internal pulse count). Under
these conditions Q5 will produce a "1". This time-out
condition indicates that the program or erase cycle was
not successfully completed. Data Polling andToggle Bit
are the only operating functions of the device under this
condition.
If this time-out condition occurs during the byte/word
programming operation, it specifies that the entire sec-
tor containing that byte/word is bad and this sector may
not be reused, (other sectors are still functional and can
be reused).
If this time-out condition occurs during sector erase op-
eration, it specifies that a particular sector is bad and it
may not be reused. However, other sectors are still func-
tional and may be used for the program or erase opera-
tion. The device must be reset to use other sectors.
Write the Reset command sequence to the device, and
then execute program or erase command sequence. This
allows the system to continue to use the other active
sectors in the device.
The time-out condition will not appear if a user tries to
program a non blank location without erasing. Please
note that this is not a device failure condition since the
device was incorrectly used.
Table 8. WRITE OPERATION STATUS
Status
Q7
Q6
Q5
Q3
Q2 RY/BY
(Note1)
(Note2)
Byte/Word Program in Auto Program Algorithm
Auto Erase Algorithm
Q7
Toggle
Toggle
0
N/A
1
No
0
Toggle
0
1
0
0
Toggle
0
1
Erase Suspend Read
(Erase Suspended Sector)
No
Toggle
N/A Toggle
In Progress
Erase Suspended Mode
Erase Suspend Read
Data
Q7
Data Data Data Data
1
0
0
(Non-Erase Suspended Sector)
Erase Suspend Program
Toggle
Toggle
0
1
N/A N/A
Byte/Word Program in Auto Program Algorithm
Q7
N/A
1
No
Toggle
Exceeded
Time Limits Auto Erase Algorithm
0
Toggle
Toggle
1
1
Toggle
0
0
Erase Suspend Program
Q7
N/A N/A
Note:
1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further
details.
2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits.
See "Q5: Exceeded Timing Limits " for more information.
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18
MX29LV160T/B & MX29LV160AT/AB
Q3
POWER SUPPLY DECOUPLING
Sector Erase Timer
In order to reduce power switching effect, each device
should have a 0.1uF ceramic capacitor connected be-
tween itsVCC and GND.
After the completion of the initial sector erase command
sequence, the sector erase time-out will begin. Q3 will
remain low until the time-out is complete. Data Polling
andToggle Bit are valid after the initial sector erase com-
mand sequence.
POWER-UP SEQUENCE
The MX29LV160T/B & MX29LV160AT/AB powers up in
the Read only mode. In addition, the memory contents
may only be altered after successful completion of the
predefined command sequences.
If Data Polling or theToggle Bit indicates the device has
been written with a valid erase command, Q3 may be
used to determine if the sector erase timer window is
still open. If Q3 is high ("1") the internally controlled
erase cycle has begun; attempts to write subsequent
commands to the device will be ignored until the erase
operation is completed as indicated by Data Polling or
Toggle Bit. If Q3 is low ("0"), the device will accept
additional sector erase commands. To insure the com-
mand has been accepted, the system software should
check the status of Q3 prior to and following each sub-
sequent sector erase command. If Q3 were high on the
second status check, the command may not have been
accepted.
TEMPORARY SECTOR UNPROTECT
This feature allows temporary unprotection of previously
protected sector to change data in-system.TheTempo-
rary Sector Unprotect mode is activated by setting the
RESET pin toVID (11.5V-12.5V). During this mode, for-
merly protected sectors can be programmed or erased
as un-protected sector. Once VID is remove from the
RESET pin. All the previously protected sectors are pro-
tected again.
DATA PROTECTION
SECTOR PROTECTION
The MX29LV160T/B & MX29LV160AT/AB is designed
to offer protection against accidental erasure or program-
ming caused by spurious system level signals that may
exist during power transition. During power up the de-
vice automatically resets the state machine in the Read
mode. In addition, with its control register architecture,
alteration of the memory contents only occurs after suc-
cessful completion of specific command sequences. The
device also incorporates several features to prevent in-
advertent write cycles resulting fromVCC power-up and
power-down transition or system noise.
The MX29LV160T/B & MX29LV160AT/AB features hard-
ware sector protection. This feature will disable both
program and erase operations for these sectors pro-
tected. To activate this mode, the programming equip-
ment must force VID on address pin A9 and OE (sug-
gest VID = 12V). Programming of the protection cir-
cuitry begins on the falling edge of the WE pulse and is
terminated on the rising edge. Please refer to sector pro-
tect algorithm and waveform.
To verify programming of the protection circuitry, the pro-
gramming equipment must forceVID on address pin A9
( with CE and OE atVIL andWE atVIH). When A1=VIH,
A0=VIL, A6=VIL, it will produce a logical "1" code at
device output Q0 for a protected sector. Otherwise the
device will produce 00H for the unprotected sector. In
this mode, the addresses, except for A1, are don't care.
Address locations with A1 = VIL are reserved to read
manufacturer and device codes. (Read Silicon ID)
WRITE PULSE "GLITCH" PROTECTION
Noise pulses of less than 5ns (typical) on OE, CE orWE
will not initiate a write cycle.
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE = VIL, CE
= VIH or WE = VIH. To initiate a write cycle CE and WE
must be a logical zero while OE is a logical one.
It is also possible to determine if the sector is protected
in the system by writing a Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
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19
MX29LV160T/B & MX29LV160AT/AB
a logical "1" at Q0 for the protected sector.
The system must write the reset command to exit the
"Silicon-ID Read Command" code.
CHIP UNPROTECT
TheMX29LV160T/B&MX29LV160AT/ABalsofeatures
thechipunprotectmode,sothatallsectorsareunprotected
after chip unprotect is completed to incorporate any
changes in the code. It is recommended to protect all
sectors before activating chip unprotect mode.
Toactivatethismode,theprogrammingequipmentmust
forceVIDoncontrolpinOEandaddresspinA9. TheCE
pins must be set at VIL. Pins A6 must be set to VIH.
Refer to chip unprotect algorithm and waveform for the
chip unprotect algorithm. The unprotection mechanism
begins on the falling edge of the WE pulse and is
terminated on the rising edge.
It is also possible to determine if the chip is unprotected
in the system by writing the Read Silicon ID command.
PerformingareadoperationwithA1=VIH,itwillproduce
00H at data outputs(Q0-Q7) for an unprotected sector.
It is noted that all sectors are unprotected after the chip
unprotect algorithm is completed.
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20
MX29LV160T/B & MX29LV160AT/AB
OPERATING RATINGS
ABSOLUTE MAXIMUM RATINGS
StorageTemperature
Commercial (C) Devices
Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC
Ambient Temperature (TA ). . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
AmbientTemperature
with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC
Voltage with Respect to Ground
Ambient Temperature (TA ). . . . . . . . . . -40°C to +85°C
VCC Supply Voltages
VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V
VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V
A9, OE, and
Operating ranges define those limits between which the
functionality of the device is guaranteed.
RESET (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V
All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5 V.
During voltage transitions, input or I/O pins may over-
shoot VSS to -2.0 V for periods of up to 20 ns. Maxi-
mum DC voltage on input or I/O pins is VCC +0.5 V.
During voltage transitions, input or I/O pins may over-
shoot to VCC +2.0 V for periods up to 20 ns.
2. Minimum DC input voltage on pins A9, OE, and
RESET is -0.5 V. During voltage transitions, A9, OE,
and RESET may overshootVSS to -2.0V for periods
of up to 20 ns. Maximum DC input voltage on pin A9
is +12.5 V which may overshoot to 14.0 V for periods
up to 20 ns.
3.No more than one output may be shorted to ground at
a time. Duration of the short circuit should not be
greater than one second.
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device at these or any other conditions above those in-
dicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maxi-
mum rating conditions for extended periods may affect
device reliability.
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21
MX29LV160T/B & MX29LV160AT/AB
CAPACITANCE TA = 25oC, f = 1.0 MHz
SYMBOL
CIN1
PARAMETER
MIN.
TYP
6
MAX.
7.5
9
UNIT
pF
CONDITIONS
VIN = 0V
Input Capacitance
Control Pin Capacitance
Output Capacitance
CIN2
7.5
8.5
pF
VIN = 0V
COUT
12
pF
VOUT = 0V
Table 9. DC CHARACTERISTICS TA = -40oC TO 85oC, VCC = 2.7V~3.6V
Symbol PARAMETER
MIN.
TYP
MAX.
±1
35
±1
16
4
UNIT
uA
CONDITIONS
ILI
Input Leakage Current
VIN = VSS to VCC, VCC=VCC max
VCC=VCC max; A9=12.5V
VOUT = VSS to VCC, VCC=VCC max
ILIT
ILO
ICC1
A9 Input Leakage Current
Output Leakage Current
VCC Active Read Current
uA
uA
9
2
mA
mA
mA
mA
mA
uA
CE=VIL, OE=VIH
(Byte Mode)
@5MHz
@1MHz
@5MHz
@1MHz
9
16
4
CE=VIL, OE=VIH
(Word Mode)
2
ICC2
ICC3
ICC4
VCC Active write Current
VCC Standby Current
VCC Standby Current
During Reset (See Conditions)
Automatic sleep mode
Input Low Voltage (Note 1)
Input High Voltage
20
0.2
0.2
30
5
CE=VIL, OE=VIH, WE=VIL
CE; RESET=VCC ±0.3V
RESET=VSS ±0.3V
5
uA
ICC5
VIL
0.2
5
uA
V
VIH=VCC ±0.3V;VIL=VSS ±0.3V
-0.5
0.8
VIH
VID
0.7xVCC
VCC+ 0.3
V
Voltage for Automatic
Select and Temporary
Sector Unprotect
11.5
12.5
0.45
V
V
VCC=3.3V
VOL
Output Low Voltage
Output High Voltage (TTL)
Output High Voltage
(CMOS)
IOL = 4.0mA, VCC= VCC min
IOH = -2mA, VCC=VCC min
IOH = -100uA, VCC min
VOH1
VOH2
0.85xVCC
VCC-0.4
VLKO
Low VCC Lock-out
Voltage
1.4
2.1
V
NOTES:
1.VIL min. = -1.0V for pulse width is equal to or less than 50 ns.
VIL min. = -2.0V for pulse width is equal to or less than 20 ns.
2.VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns
If VIH is over the specified maximum value, read operation cannot be guaranteed.
3.Automatic sleep mode enable the low power mode when addresses remain stable for tACC +30ns.
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22
MX29LV160T/B & MX29LV160AT/AB
AC CHARACTERISTICS
TA = -40oC to 85oC, VCC = 2.7V~3.6V
Table 10. READ OPERATIONS
29LV160(A)T/B-70
29LV160(A)T/B-90
Symbol PARAMETER
MIN.
MAX.
MIN.
MAX.
UNIT CONDITIONS
tRC
tACC
tCE
Read Cycle Time (Note 1)
Address to Output Delay
CE to Output Delay
70
90
ns
70
70
30
25
90
90
35
30
ns
ns
ns
ns
ns
ns
ns
CE=OE=VIL
OE=VIL
tOE
OE to Output Delay
CE=VIL
tDF
OE High to Output Float (Note2)
Output Enable Read
0
0
0
CE=VIL
tOEH
0
Hold Time
Toggle and Data Polling 10
10
0
tOH
Address to Output hold
0
CE=OE=VIL
NOTE:
TEST CONDITIONS:
• Input pulse levels: 0V/3.0V.
1. Not 100% tested.
• Input rise and fall times is equal to or less than 5ns.
• Outputload:1TTLgate+100pF(Includingscopeand
jig),for29LV160(A)T/B-90.1TTL gate+30pF(Includ-
ing scope and jig) for 29LV160(A)T/B-70 .
2. tDF is defined as the time at which the output achieves
the open circuit condition and data is no longer driven.
• Reference levels for measuring timing: 1.5V.
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23
MX29LV160T/B & MX29LV160AT/AB
SWITCHING TEST CIRCUITS
DEVICE UNDER
TEST
2.7K ohm
+3.3V
CL
6.2K ohm
DIODES=IN3064
OR EQUIVALENT
CL=100pF Including jig capacitance for MX29LV160(A)T/B-90
CL=30pF Including jig capacitance for MX29LV160(A)T/B-70
SWITCHING TEST WAVEFORMS
3.0V
TEST POINTS
0V
INPUT
OUTPUT
AC TESTING: Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0".
Input pulse rise and fall times are < 5ns.
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24
MX29LV160T/B & MX29LV160AT/AB
Figure 1. READ TIMING WAVEFORMS
tRC
VIH
VIL
ADD Valid
Addresses
tACC
tCE
VIH
VIL
CE
VIH
VIL
WE
tOE
tDF
tOEH
VIH
VIL
OE
tACC
tOH
HIGH Z
HIGH Z
VOH
VOL
Outputs
DATA Valid
VIH
VIL
RESET
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MX29LV160T/B & MX29LV160AT/AB
AC CHARACTERISTICS
TA = -40oC to 85oC, VCC = 2.7V~3.6V
Table 11. Erase/Program Operations
29LV160(A)T/B-70 29LV160(A)T/B-90
SYMBOL
tWC
PARAMETER
MIN.
70
0
MAX.
MIN.
90
0
MAX.
UNIT
ns
Write Cycle Time (Note 1)
Address Setup Time
tAS
ns
tAH
Address Hold Time
45
35
0
45
45
0
ns
tDS
Data Setup Time
ns
tDH
Data Hold Time
ns
tOES
tGHWL
Output Enable Setup Time
Read Recovery Time Before Write
(OE High to WE Low)
0
0
ns
0
0
ns
tCS
CE Setup Time
0
0
ns
ns
ns
ns
us
tCH
CE Hold Time
0
0
tWP
Write Pulse Width
35
35
tWPH
tWHWH1
Write Pulse Width High
ProgrammingOperation(Note2)
(Byte/Wordprogramtime)
Sector Erase Operation (Note 2)
VCC Setup Time (Note 1)
Recovery Time from RY/BY
Sector Erase Valid to RY/BY Delay
Chip Erase Valid to RY/BY Delay
Program Valid to RY/BY Delay
Write pulse width for sector
protect (A9, OE Control)
Write pulse width for sector
unprotect (A9, OE Control)
Voltage transition time
OE setup time to WE active
30
30
9/11(typ.)
9/11(typ.)
tWHWH2
tVCS
0.7(typ.)
0.7(typ.)
sec
us
ns
ns
ns
ns
50
0
50
0
tRB
tBUSY
90
90
90
90
90
90
tWPP1
tWPP2
100ns
100ns
10us(typ.) 100ns
10us(typ.)
12ms(typ.) 100ns
12ms(typ.)
tVLHT
4
4
4
4
us
tOESP
us
NOTES:
1. Not 100% tested.
2.See the "Erase and Programming Performance" section for more information.
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MX29LV160T/B & MX29LV160AT/AB
AC CHARACTERISTICS
TA = -40oC to 85oC, VCC = 2.7V~3.6V
Table 12. Alternate CE Controlled Erase/Program Operations
29LV160(A)T/B-70
29LV160(A)T/B-90
SYMBOL
tWC
PARAMETER
MIN.
MAX.
MIN.
MAX.
UNIT
ns
Write CycleTime (Note 1)
Address SetupTime
Address HoldTime
Data SetupTime
70
90
tAS
0
0
ns
tAH
45
45
ns
tDS
35
45
ns
tDH
Data HoldTime
0
0
ns
tOES
tGHEL
tWS
Output Enable SetupTime
Read RecoveryTime BeforeWrite
WE Setup Time
0
0
ns
0
0
ns
0
0
ns
tWH
WE HoldTime
0
0
ns
tCP
CE Pulse Width
35
35
ns
tCPH
tWHWH1
CE Pulse Width High
30
30
ns
Programming
Byte
9(Typ.)
11(Typ.)
0.7(Typ.)
9(Typ.)
11(Typ.)
0.7(Typ.)
us
Operation(note2)
Word
us
tWHWH2
Sector Erase Operation (note2)
sec
NOTE:
1. Not 100% tested.
2.See the "Erase and Programming Performance" section for more information.
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MX29LV160T/B & MX29LV160AT/AB
Figure 2. COMMAND WRITE TIMING WAVEFORM
VCC
3V
VIH
VIL
Addresses
ADD Valid
tAH
tAS
VIH
VIL
WE
CE
tOES
tWPH
tWP
tCWC
VIH
VIL
tCS
tCH
tDH
VIH
VIL
OE
tDS
VIH
VIL
Data
DIN
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MX29LV160T/B & MX29LV160AT/AB
AUTOMATIC PROGRAMMING TIMING WAVEFORM
ing after automatic programming starts. Device outputs
DATA during programming and DATA after programming
on Q7.(Q6 is for toggle bit; see toggle bit, DATA polling,
timing waveform)
One byte data is programmed. Verify in fast algorithm
and additional verification by external control are not re-
quired because these operations are executed automati-
cally by internal control circuit. Programming comple-
tion can be verified by DATA polling or toggle bit check-
Figure 3. AUTOMATIC PROGRAMMING TIMING WAVEFORM
Program Command Sequence(last two cycle)
Read Status Data (last two cycle)
tWC
tAS
PA
PA
555h
PA
Address
tAH
CE
tCH
tGHWL
OE
tWHWH1
tWP
WE
tCS
tWPH
tDS tDH
Status
A0h
PD
DOUT
Data
tBUSY
tRB
RY/BY
tVCS
VCC
NOTES:
1.PA=Program Address, PD=Program Data, DOUT is the true data the program address
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MX29LV160T/B & MX29LV160AT/AB
Figure 4. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Write Data AAH
Write Data 55H
Write Data A0H
Write Program Data/Address
Data Poll
Increment
Address
from system
No
No
Verify Data Ok ?
YES
Last Address ?
YES
Auto Program Completed
P/N:PM0866
REV. 3.7, APR. 23, 2003
30
MX29LV160T/B & MX29LV160AT/AB
Figure 5. CE CONTROLLED WRITE TIMING WAVEFORM
PA for program
555 for program
2AA for erase
SA for sector erase
555 for chip erase
Data Polling
Address
PA
tWC
tWH
tAS
tAH
WE
OE
tGHEL
tCP
tWHWH1 or 2
CE
tWS
tDS
tCPH
tBUSY
tDH
DOUT
Q7
Data
PD for program
30 for sector erase
10 for chip erase
A0 for program
55 for erase
tRH
RESET
RY/BY
NOTES:
1.PA=Program Address, PD=Program Data, DOUT=Data Out, Q7=complement of data written to device.
2.Figure indicates the last two bus cycles of the command sequence.
P/N:PM0866
REV. 3.7, APR. 23, 2003
31
MX29LV160T/B & MX29LV160AT/AB
AUTOMATIC CHIP ERASE TIMING WAVEFORM
All data in chip are erased. External erase verification is
not required because data is verified automatically by
internal control circuit. Erasure completion can be veri-
fied by DATA polling or toggle bit checking after auto-
matic erase starts. Device outputs 0 during erasure
and 1 after erasure on Q7. (Q6 is for toggle bit; see toggle
bit, DATA polling, timing waveform)
Figure 6. AUTOMATIC CHIP ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
Read Status Data
VA
tWC
tAS
VA
2AAh
555h
Address
tAH
CE
tCH
tGHWL
OE
tWHWH2
tWP
WE
tCS
tWPH
tDS tDH
In
Progress
55h
10h
Complete
Data
tBUSY
tRB
RY/BY
tVCS
VCC
NOTES:
VA=Valid Address for reading status data(see "Write Operation Status").
P/N:PM0866
REV. 3.7, APR. 23, 2003
32
MX29LV160T/B & MX29LV160AT/AB
Figure 7. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 10H Address 555H
Data Poll from System
NO
Data=FFh ?
YES
Auto Chip Erase Completed
P/N:PM0866
REV. 3.7, APR. 23, 2003
33
MX29LV160T/B & MX29LV160AT/AB
AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Sector indicated by A12 to A19 are erased. External
erase verify is not required because data are verified
automatically by internal control circuit. Erasure comple-
tion can be verified by DATA polling or toggle bit check-
ing after automatic erase starts. Device outputs 0 dur-
ing erasure and 1 after erasure on Q7. (Q6 is for toggle
bit; see toggle bit, DATA polling, timing waveform)
Figure 8. AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
Read Status Data
tWC
tAS
VA
VA
2AAh
SA
Address
tAH
CE
tCH
tGHWL
OE
tWHWH2
tWP
WE
tCS
tWPH
tDS tDH
In
Progress
55h
30h
Complete
Data
tBUSY
tRB
RY/BY
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
P/N:PM0866
REV. 3.7, APR. 23, 2003
34
MX29LV160T/B & MX29LV160AT/AB
Figure 9. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 30H Sector Address
NO
Last Sector
to Erase
YES
Data Poll from System
NO
Data=FFh
YES
Auto Sector Erase Completed
P/N:PM0866
REV. 3.7, APR. 23, 2003
35
MX29LV160T/B & MX29LV160AT/AB
Figure 10. ERASE SUSPEND/ERASE RESUME FLOWCHART
START
Write Data B0H
ERASE SUSPEND
NO
Toggle Bit checking Q6
not toggled
YES
Read Array or
Program
Reading or
NO
Programming End
YES
Write Data 30H
Delay 10ms (note)
Continue Erase
ERASE RESUME
Another
NO
Erase Suspend ?
YES
Note:It's only for a certain condition of MX29LV160T/B.If the system implements an endless erase suspend/resume
loop, or the number of erase suspend/resume is exceeded 1024 times, then the 10ms time delay must be put into
consideration. Please note that the 10ms time delay is not necessary for MX29LV160AT/AB.
P/N:PM0866
REV. 3.7, APR. 23, 2003
36
MX29LV160T/B & MX29LV160AT/AB
Figure 11. IN-SYSTEM SECTOR PROTECT/CHIP UNPROTECT TIMING WAVEFORM (RESET Control)
VID
VIH
RESET
SA, A6
A1, A0
Valid*
Valid*
Valid*
Sector Protect or Sector Unprotect
Verify
40h
Status
Data
60h
60h
Sector Protect =150us
chip Unprotect =15ms
1us
CE
WE
OE
Note: When sector protect, A6=0, A1=1, A0=0. When chip unprotect, A6=1, A1=1, A0=0.
P/N:PM0866
REV. 3.7, APR. 23, 2003
37
MX29LV160T/B & MX29LV160AT/AB
Figure 12. SECTOR PROTECT TIMING WAVEFORM (A9, OE Control)
A1
A6
12V
5V
A9
tVLHT
tVLHT
Verify
12V
5V
OE
tVLHT
tWPP 1
WE
CE
tOESP
Data
01H
F0H
tOE
A19-A12
Sector Address
Notes: tVLHT (Voltage transition time)=4us min.
tOESP (OE setup time to WE active)=4us min.
P/N:PM0866
REV. 3.7, APR. 23, 2003
38
MX29LV160T/B & MX29LV160AT/AB
Figure 13. SECTOR PROTECTION ALGORITHM (A9, OE Control)
START
Set Up Sector Addr
PLSCNT=1
OE=VID,A9=VID,CE=VIL
A6=VIL
Activate WE Pulse
Time Out 150us
Set WE=VIH, CE=OE=VIL
A9 should remain VID
.
Read from Sector
No
Addr=SA, A1=1, A6=0, A0=0
No
Data=01H?
PLSCNT=32?
Yes
Device Failed
Yes
Protect Another
Sector?
Remove VID from A9
Write Reset Command
Sector Protection
Complete
P/N:PM0866
REV. 3.7, APR. 23, 2003
39
MX29LV160T/B & MX29LV160AT/AB
Figure 14. IN-SYSTEM SECTOR PROTECTION ALGORITHM WITH RESET=VID
START
PLSCNT=1
RESET=VID
Wait 1us
No
Temporary Sector
Unprotect Mode
First Write
Cycle=60H
Yes
Set up sector address
Write 60H to sector address
with A6=0, A1=1, A0=0
Wait 150us
Verify sector protect :
write 40H with A6=0,
A1=1, A0=0
Increment PLSCNT
Reset PLSCNT=1
Read from sector address
No
No
PLSCNT=25?
Data=01H ?
Yes
Yes
Device failed
Yes
Protect another
sector?
No
Remove VID from RESET
Write reset command
Sector protect complete
P/N:PM0866
REV. 3.7, APR. 23, 2003
40
MX29LV160T/B & MX29LV160AT/AB
Figure 15. IN-SYSTEM CHIP UNPROTECTION ALGORITHM WITH RESET=VID
START
PLSCNT=1
RESET=VID
Wait 1us
No
No
Temporary Sector
Unprotect Mode
First Write
Cycle=60H ?
Yes
All sector
Protect all sectors
protected?
Yes
Set up first sector address
Sector unprotect :
write 60H with
A6=1, A1=1, A0=0
Wait 50ms
Verify sector unprotect
write 40H to sector address
with A6=1, A1=1, A0=0
Increment PLSCNT
Read from sector address
with A6=1, A1=1, A0=0
No
No
Set up next sector address
PLSCNT=1000?
Data=00H ?
Yes
Yes
Device failed
Yes
Last sector
verified?
No
Remove VID from RESET
Write reset command
Sector unprotect complete
P/N:PM0866
REV. 3.7, APR. 23, 2003
41
MX29LV160T/B & MX29LV160AT/AB
Figure 16. TIMING WAVEFORM FOR CHIP UNPROTECTION (A9, OE Control)
A1
12V
Vcc 3V
A9
A6
tVLHT
Verify
12V
Vcc 3V
OE
tVLHT
tVLHT
tWPP 2
WE
CE
tOESP
Data
00H
F0H
tOE
A19-A12
Sector Address
P/N:PM0866
REV. 3.7, APR. 23, 2003
42
MX29LV160T/B & MX29LV160AT/AB
Figure 17. CHIP UNPROTECTION ALGORITHM (A9, OE Control)
START
Protect All Sectors
PLSCNT=1
Set OE=A9=VID
CE=VIL,A6=1
Activate WE Pulse
Time Out 50ms
Increment
PLSCNT
Set OE=CE=VIL
A9=VID, A1=1, A6=0, A0=0
Set Up First Sector Addr
Read Data from Device
No
No
Data=00H?
Yes
PLSCNT=1000?
Increment
Sector Addr
Yes
Device Failed
No
All sectors have
been verified?
Yes
Remove VID from A9
Write Reset Command
Chip Unprotect
Complete
* It is recommended before unprotect whole chip, all sectors should be protected in advance.
P/N:PM0866
REV. 3.7, APR. 23, 2003
43
MX29LV160T/B & MX29LV160AT/AB
WRITE OPERATION STATUS
Figure 18. DATA POLLING ALGORITHM
Start
Read Q7~Q0
Add.=VA(1)
Yes
Q7 = Data ?
No
No
Q5 = 1 ?
Yes
Read Q7~Q0
Add.=VA
Yes
Q7 = Data ?
(2)
No
FAIL
Pass
NOTE : 1.VA=Valid address for programming or erasure.
2.Q7 should be re-checked even Q5="1" because Q7 may change
simultaneously with Q5.
P/N:PM0866
REV. 3.7, APR. 23, 2003
44
MX29LV160T/B & MX29LV160AT/AB
Figure 19. TOGGLE BIT ALGORITHM
Start
Read Q7-Q0
Read Q7-Q0
(Note 1)
NO
Toggle Bit Q6 =
Toggle ?
YES
NO
Q5= 1?
YES
Read Q7~Q0 Twice
(Note 1,2)
NO
Toggle bit Q6=
Toggle?
YES
Program/Erase Operation
Not Complete,Write
Reset Command
Program/Erase
operation Complete
Note:1.Read toggle bit twice to determine whether or not it is toggling.
2. Recheck toggle bit because it may stop toggling as Q5 change to "1".
P/N:PM0866
REV. 3.7, APR. 23, 2003
45
MX29LV160T/B & MX29LV160AT/AB
Figure 20. Data Polling Timings (During Automatic Algorithms)
tRC
VA
VA
VA
Address
CE
tACC
tCE
tCH
tOE
OE
tOEH
tDF
WE
tOH
High Z
High Z
Complement
Status Data
Complement
Status Data
True
True
Valid Data
Valid Data
DQ7
Q0-Q6
tBUSY
RY/BY
NOTES:
VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle.
P/N:PM0866
REV. 3.7, APR. 23, 2003
46
MX29LV160T/B & MX29LV160AT/AB
Figure 21. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)
tRC
VA
VA
tACC
tCE
VA
VA
Address
CE
tCH
tOE
OE
tDF
tOEH
WE
tOH
High Z
Valid Status
(second read)
Valid Status
(first raed)
Valid Data
Valid Data
Q6/Q2
(stops toggling)
tBUSY
RY/BY
NOTES:
VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle, and
array data read cycle.
P/N:PM0866
REV. 3.7, APR. 23, 2003
47
MX29LV160T/B & MX29LV160AT/AB
Table 13. AC CHARACTERISTICS
Parameter Std Description
Test Setup All Speed Options Unit
tREADY1
tREADY2
RESET PIN Low (During Automatic Algorithms)
MAX
20
us
to Read or Write (See Note)
RESET PIN Low (NOT During Automatic
Algorithms) to Read orWrite (See Note)
RESET Pulse Width (During Automatic Algorithms)
RESET HighTime Before Read (See Note)
RY/BY Recovery Time (to CE, OE go low)
MAX
500
ns
tRP
tRH
tRB
MIN
MIN
MIN
500
70
ns
ns
ns
70
Note:Not 100% tested
Figure 22. RESET TIMING WAVEFORM
RY/BY
CE, OE
tRH
RESET
tRP
tReady2
Reset Timing NOT during Automatic Algorithms
tReady1
RY/BY
tRB
CE, OE
RESET
tRP
Reset Timing during Automatic Algorithms
P/N:PM0866
REV. 3.7, APR. 23, 2003
48
MX29LV160T/B & MX29LV160AT/AB
AC CHARACTERISTICS
WORD/BYTE CONFIGURATION (BYTE)
Parameter
Description
Speed Options
Unit
JEDEC Std
-70
-90
tELFL/tELFH CE to BYTE Switching Low or High
Max
Max
Min
5
ns
ns
ns
tFLQZ
tFHQV
BYTE Switching Low to Output HIGH Z
BYTE Switching High to Output Active
25
70
30
90
Figure 23. BYTE TIMING WAVEFORM FOR READ OPERATIONS (BYTE switching from byte
mode to word mode)
CE
OE
tELFH
BYTE
DOUT
(Q0-Q7)
DOUT
(Q0-Q14)
Q0~Q14
Q15/A-1
DOUT
(Q15)
VA
tFHQV
P/N:PM0866
REV. 3.7, APR. 23, 2003
49
MX29LV160T/B & MX29LV160AT/AB
Figure 24. BYTE TIMING WAVEFORM FOR READ OPERATIONS (BYTE switching from word
mode to byte mode)
CE
OE
tELFH
BYTE
DOUT
(Q0-Q14)
DOUT
(Q0-Q7)
Q0~Q14
Q15/A-1
DOUT
(Q15)
VA
tFLQZ
Figure 25. BYTE TIMING WAVEFORM FOR PROGRAM OPERATIONS
CE
The falling edge of the last WE signal
WE
BYTE
tAS
tAH
P/N:PM0866
REV. 3.7, APR. 23, 2003
50
MX29LV160T/B & MX29LV160AT/AB
Table 14. TEMPORARY SECTOR UNPROTECT
Parameter Std. Description
Test Setup All Speed Options Unit
tVIDR
tRSP
VID Rise and Fall Time (See Note)
RESET SetupTime forTemporary Sector Unprotect
Min
Min
500
4
ns
us
Note:
Not 100% tested
Figure 26. TEMPORARY SECTOR UNPROTECT TIMING DIAGRAM
12V
RESET
0 or Vcc
0 or Vcc
Program or Erase Command Sequence
tVIDR
tVIDR
CE
WE
tRSP
RY/BY
Figure 27. Q6 vs Q2 for Erase and Erase Suspend Operations
Enter Embedded
Erasing
Erase
Enter Erase
Erase
Suspend
Suspend Program
Resume
Erase
Erase Suspend
Read
Erase
Erase Suspend
Read
Erase
Erase
Complete
WE
Q6
Suspend
Program
Q2
NOTES:
The system can use OE or CE to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended
P/N:PM0866
REV. 3.7, APR. 23, 2003
51
MX29LV160T/B & MX29LV160AT/AB
Figure 28. TEMPORARY SECTOR UNPROTECT ALGORITHM
Start
RESET = VID (Note 1)
Perform Erase or Program Operation
Operation Completed
RESET = VIH
Temporary Sector Unprotect Completed(Note 2)
Note :
1. All protected sectors are temporary unprotected.
VID=11.5V~12.5V
2. All previously protected sectors are protected again.
P/N:PM0866
REV. 3.7, APR. 23, 2003
52
MX29LV160T/B & MX29LV160AT/AB
Figure 29. ID CODE READ TIMING WAVEFORM
VCC
3V
VID
VIH
VIL
ADD
A9
VIH
VIL
ADD
A0
tACC
tACC
VIH
VIL
A1
ADD
A2-A8
VIH
A10-A19 VIL
CE
VIH
VIL
VIH
VIL
tCE
WE
OE
tOE
VIH
VIL
tDF
tOH
tOH
VIH
VIL
DATA
Q0-Q15
DATA OUT
DATA OUT
C4H/49H (Byte)
C2H/00C2H
22C4H/2249H (Word)
P/N:PM0866
REV. 3.7, APR. 23, 2003
53
MX29LV160T/B & MX29LV160AT/AB
ERASE AND PROGRAMMING PERFORMANCE (1)
LIMITS
TYP.(2)
PARAMETER
MIN.
MAX.(3)
15
UNITS
sec
Sector Erase Time
Chip Erase Time
0.7
15
9
30
sec
Byte Programming Time
Word Programming Time
Chip Programming Time
300
360
54
us
11
18
12
us
Byte Mode
Word Mode
sec
36
sec
Erase/Program Cycles
100,000
Cycles
Note: 1. Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C, 3V.
3. Maximum values measured at 85°C, 2.7V, 100,000 cycles.
LATCHUP CHARACTERISTICS
MIN.
-1.0V
MAX.
Input Voltage with respect to GND on all pins except I/O pins
Input Voltage with respect to GND on all I/O pins
VCC Current
12.5V
Vcc + 1.0V
+100mA
-1.0V
-100mA
Includes all pins except Vcc. Test conditions: Vcc = 3.0V, one pin at a time.
P/N:PM0866
REV. 3.7, APR. 23, 2003
54
MX29LV160T/B & MX29LV160AT/AB
ORDERING INFORMATION
PART NO.
ACCESSTIME
OPERATING CURRENT STANDBY CURRENT PACKAGE
(ns)
70
MAX.(mA)
MAX.(uA)
MX29LV160TMC-70
MX29LV160BMC-70
MX29LV160TMC-90
MX29LV160BMC-90
MX29LV160TTC-70
30
30
30
30
30
5
5
5
5
5
44 Pin SOP
44 Pin SOP
44 Pin SOP
44 Pin SOP
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Ball CSP
48 Ball CSP
48 Ball CSP
48 Ball CSP
48 Ball CSP
48 Ball CSP
48 Ball CSP
48 Ball CSP
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
70
90
90
70
MX29LV160BTC-70
MX29LV160TTC-90
MX29LV160BTC-90
MX29LV160TTI-70
MX29LV160BTI-70
MX29LV160TTI-90
MX29LV160BTI-90
70
90
90
70
70
90
90
30
30
30
30
30
30
30
5
5
5
5
5
5
5
MX29LV160TXBC-70
MX29LV160BXBC-70
MX29LV160TXBC-90
MX29LV160BXBC-90
MX29LV160TXBI-70
MX29LV160BXBI-70
MX29LV160TXBI-90
MX29LV160BXBI-90
MX29LV160ATTC-70
70
70
90
90
70
70
90
90
70
30
30
30
30
30
30
30
30
30
5
5
5
5
5
5
5
5
5
MX29LV160ABTC-70
MX29LV160ATTC-90
MX29LV160ABTC-90
70
90
90
30
30
30
5
5
5
P/N:PM0866
REV. 3.7, APR. 23, 2003
55
MX29LV160T/B & MX29LV160AT/AB
PART NO.
ACCESSTIME
OPERATING CURRENT STANDBY CURRENT PACKAGE
(ns)
MAX.(mA)
MAX.(uA)
MX29LV160ATTI-70
MX29LV160ABTI-70
MX29LV160ATTI-90
MX29LV160ABTI-90
MX29LV160ATXBC-70
MX29LV160ABXBC-70
MX29LV160ATXEC-70
MX29LV160ABXEC-70
MX29LV160ATXBC-90
MX29LV160ABXBC-90
MX29LV160ATXEC-90
MX29LV160ABXEC-90
MX29LV160ATXBI-70
MX29LV160ABXBI-70
MX29LV160ATXEI-70
MX29LV160ABXEI-70
MX29LV160ATXBI-90
MX29LV160ABXBI-90
MX29LV160ATXEI-90
MX29LV160ABXEI-90
70
30
5
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Ball CSP
70
90
90
70
70
70
70
90
90
90
90
70
70
70
70
90
90
90
90
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
P/N:PM0866
REV. 3.7, APR. 23, 2003
56
MX29LV160T/B & MX29LV160AT/AB
PART NO.
AccessTime Operating Current Standby Current
Package
Remark
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
PB free
(ns)
MAX.(mA)
MAX.(uA)
MX29LV160ATTC-70G
MX29LV160ABTC-70G
MX29LV160ATTC-90G
MX29LV160ABTC-90G
MX29LV160ATTI-70G
MX29LV160ABTI-70G
MX29LV160ATTI-90G
MX29LV160ABTI-90G
70
30
5
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Pin TSOP
(NormalType)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
70
90
90
70
70
90
90
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
MX29LV160ATXBC-70G 70
MX29LV160ABXBC-70G 70
MX29LV160ATXEC-70G 70
MX29LV160ABXEC-70G 70
MX29LV160ATXBC-90G 90
MX29LV160ABXBC-90G 90
MX29LV160ATXEC-90G 90
MX29LV160ABXEC-90G 90
MX29LV160ATXBI-70G
MX29LV160ABXBI-70G
MX29LV160ATXEI-70G
MX29LV160ABXEI-70G
MX29LV160ATXBI-90G
MX29LV160ABXBI-90G
MX29LV160ATXEI-90G
MX29LV160ABXEI-90G
70
70
70
70
90
90
90
90
(ball size:0.3mm)
48 Ball CSP
(ball size:0.3mm)
48 Ball CSP
(ball size:0.4mm)
48 Ball CSP
(ball size:0.4mm)
P/N:PM0866
REV. 3.7, APR. 23, 2003
57
MX29LV160T/B & MX29LV160AT/AB
PACKAGE INFORMATION
P/N:PM0866
REV. 3.7, APR. 23, 2003
58
MX29LV160T/B & MX29LV160AT/AB
44-PIN PLASTIC SOP (MX29LV160TMC/BMC)
P/N:PM0866
REV. 3.7, APR. 23, 2003
59
MX29LV160T/B & MX29LV160AT/AB
48-Ball CSP (for MX29LV160ATXBC/ATXBI/ABXBC/ABXBI)
P/N:PM0866
REV. 3.7, APR. 23, 2003
60
MX29LV160T/B & MX29LV160AT/AB
48-Ball CSP (for MX29LV160TXBC/TXBI/BXBC/BXBI)
P/N:PM0866
REV. 3.7, APR. 23, 2003
61
MX29LV160T/B & MX29LV160AT/AB
48-Ball CSP (for MX29LV160ATXEC/ATXEI/ABXEC/ABXEI)
P/N:PM0866
REV. 3.7, APR. 23, 2003
62
MX29LV160T/B & MX29LV160AT/AB
REVISION HISTORY
Revision No. Description
(MX29LV160AT/AB)
Page
Date
0.1
Mis-typing:Table 4-3 Device Gemetry Data Values
P9
NOV/15/2001
1) Device size: Data=0015h
2) Erase block region 1 information:
Data=0000h for byte address=5A, Word address=2D
Data=0040h for byte address=5E, Word address=2F
Data=0000h for byte address=60, Word address=30
Added 48-Ball CSP Package
1.Modify Ordering Information
2.Add 48-ball CSP Package Information for MX29LV160ATXEC/TXEI P60
/BXEC/BXBI)
0.2
0.3
P1,2,56,59 DEC/11/2001
P56
DEC/28/2001
DEC/28/2001
(MX29LV160T/B)
1.1
Changed DQ-->Q
P2,6,7,9,21,22APR/05/2000
Modify Toggle Bit I-->II
Modify Ambient Operating Temperature 0°C to 70°C
Correct Type Error
P13
P15
P8
1.2
APR/17/2000
Modify DC Characteristics VCC=5V±10%-->VCC=3V±10%
Modify Timing Waveform for Chip Unprotection 5V-->3V
1.Add "Table 8" for Read Operation, DC Characteristics
2.Add "Table 9" for Read Operation, AC Characteristics
3.Add & Modify "Table 10" for Erase/Program Operation,
AC Characteristics
P16
P33
P19
P20
P23
1.3
1.4
MAY/08/2000
JUN/05/2000
4.Add "Table 11" for Alternate CE Controlled Erase/Program
Operations
P24
5.Modify Automatic Programming Timing Waveform, Automatic
Programming Algorithm Flowchart
P26,27
6.Add CE Controlled Programming Timing Waveform
8.Add Write Operation Status for DATA polling & Toggle Bit
Algorithm and Timing Waveform
P28
P39,40,41
9.Add Q6 vs Q2 for Erase and Erase Suspend Operation
P44
1.5
Modify Feature--10,000 minimum erase/program cycles-->100,000-- P1
Modify General Description--even after 10,000 --->100,000 erase-- P1
JUN/28/2000
1.6
1.7
Modify Erase/Program Cycles(MIN.) 10,000-->100,000
Correct content error
P47
AUG/25/2000
P13,14,19,30 SEP/14/2000
Add Title Description
Add Sector Protect Timing waveform
Add Sector Protection Algorithm
P34,37
P35
P36
1.8
Add AC Characteristics-- 29LV160T/B-70R
Add Ordering Information
P20
P50
P23,24
P8
P14
P50
P2
NOV/09/2000
1.9
2.0
Add AC Characteristics Table10 & Table11-- 29LV160T/B-70R
Delete Unlock Bypass Command Definitions
Delete Unlock Bypass Command Sequence
Add Ordering Information--48 Ball CSP
To corrected the naming of reset pin from RP to RESET
Modify Timing Waveform
NOV/16/2000
JAN/04/2001
2.1
2.2
2.3
JAN/16/2001
JAN/30/2001
P27,29,30,32 FEB/07/2001
P28
Modify Automatic Programming Algorithm Flowchart
Delete Figure 21. Toggle Bit Timings(During Embedded Algorithms) P45
Add Figure 19. Toggle Bit Algorithm
Modify Absolute Maximum Ratings
P43
P19
P/N:PM0866
REV. 3.7, APR. 23, 2003
63
MX29LV160T/B & MX29LV160AT/AB
Rev. No. Description
Page
P24
P23,2
P40
P52~54
P24
Date
MAR/07/2001
JUL/03/2001
2.4
2.5
Change tBUSY spec. from 90ns to 90us
Correct typing error
tWPP1/tWPP2 was changed to 100ns
To modify Package Information
2.6
Separate the tBUSY spec: tBUSY:90us for sector erase
tBUSY:90ns for chip erase ; tBUSY:90ns for program
Correct typing error
JUL/05/2001
2.7
2.8
P24
All
JUL/10/2001
JUL/24/2001
Add MX29LV161T/B part number
MX29LV160T/B tBUSY=90ns at sector erase mode
MX29LV161T/B tBUSY=90us at sector erase mode
P24
P24
2.9
1.Separate data sheet into two files:MX29LV160T/B & MX29LV161T/B All
SEP/24/2001
2.tBUSY spec was changed from 90ns min. to 90ns max.
3.Add tWPP1/tWPP2 typical spec
P24
P24
4.Add word/byte switching spec and waveform
5.Add 90R speed grade
6.The expression of 48-ball CSP pin configuration was changed from
"Top view, ball facing up" to "Top view, ball facing down"
(The physical pin out is not changed, just a different expression.)
7.Correct mistyping
P47,48
P21,24,51
P2
- byte/word program:7us/12us-->9us/11us
P1,24
- sector size of word mode 16K words/8K words/32K words/64K words P4
--->8K words/4K words/16K words/32K words
- TA of Extended Devices was removed
- ICC4 condition: RESET=VCC±0.3V --> RESET=VSS±0.3V
- TA=0°C to 70°C -->TA=-40°C to 85°C
- Add A19~A12 into figure
P19
P20
P20,21,24
P35,41
3.0
Wording change of sector erase commands
P11,13,27,30 OCT/17/2001
P32
(MX29LV160T/B & MX29LV160AT/AB)
3.1
1. Combinded MX29LV160AT/AB & MX29LV160T/B datasheet to be
All
JAN/11/2001
together
2. The system must write "Reset" command to exit "silicon-ID read
mode" & "sector protection verification" mode
1. Add 10ms time delay for erase suspend/resume
1. Correct typing error
P12-14,19
P15,36
P1,2,7,10,11 MAR/08/2002
13,14,16,17,51
3.2
3.3
MAR/01/2002
3.4
1. Modified content error
All
OCT/01/2002
2. Updated Spec :
P1,21,48
VLKO value : 2.3V/2.5V-->1.4V/2.1V ;
min. of tRH/tRB : 50ns/0ns-->70ns/70ns
3. Removed 44SOP package information of "A" version
4. Removed -R grade information
P2, 55
P21,23,26,27,49,55-56
5. Updated Capacitance
6. Added note at Switching Test Circuit
CL=100pF for MX29LV160(A)T/B-90
P22
P22
CL=30pF for MX29LV160(A)T/B-70
7.To added the tVLHT & tOESP timing in AC Characteristics table
8.Redefined Erase and Programming Performance :maximum values
measued from 25°C, 2.7V to 85°C, 2.7V, 100,000 cycles
1.To modify Package Information
P26
P54
3.5
P57~61
NOV/21/2002
P/N:PM0866
REV. 3.7, APR. 23, 2003
64
MX29LV160T/B & MX29LV160AT/AB
Rev. No. Description
Page
P57
P22
P54
Date
MAR/26/2003
APR/23/2003
3.6
3.7
1. To added pb-free part no. to order information
1. Corrected typing error
2. Improved chip erase time from 25(typ.) to 15(typ.)/30(max.)
P/N:PM0866
REV. 3.7, APR. 23, 2003
65
MX29LV160T/B & MX29LV160AT/AB
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