MX29SL800CBXBC-90G [Macronix]
8M-BIT [1Mx8/512K x16] CMOS SINGLE VOLTAGE 1.8V ONLY FLASH MEMORY; 8M - BIT [ 1Mx8 / 512K X16 ] CMOS单电压仅1.8V闪存型号: | MX29SL800CBXBC-90G |
厂家: | MACRONIX INTERNATIONAL |
描述: | 8M-BIT [1Mx8/512K x16] CMOS SINGLE VOLTAGE 1.8V ONLY FLASH MEMORY |
文件: | 总64页 (文件大小:734K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MX29SL800C T/B
8M-BIT [1Mx8/512K x16] CMOS SINGLE VOLTAGE
1.8V ONLY FLASH MEMORY
FEATURES
• Ready/Busy# pin (RY/BY#)
• Extendedsingle-supplyvoltagerange1.65Vto2.2V
• 1,048,576 x 8/524,288 x 16 switchable
• Singlepowersupplyoperation
- 1.8V only operation for read, erase and program
operation
• Fast access time: 90ns
-Providesahardwaremethodofdetectingprogramor
eraseoperationcompletion
• Hardwareresetpin(RESET#)
-Hardwaremethodtoresetthedevicetoreadingarray
data
• Sectorprotection
• Lowpowerconsumption
- Hardware method to disable any combination of
sectors from program or erase operations
-Temporarysectorunprotectedallowscodechanges
in previously locked sectors
- 12mA maximum active current (10MHz)
- 1uA typical standby current
• Commandregisterarchitecture
- Byte/word Programming (12us/18us typical)
- Sector Erase (Sector structure 16K-Bytex1,
8K-Bytex2, 32K-Bytex1, and 64K-Byte x15)
• Auto Erase (chip & sector) and Auto Program
-Automaticallyeraseanycombinationofsectorswith
Erase Suspend capability.
• CFI (Common Flash Interface) compliant
- Flash device parameters stored on the device and
provide the host system to access
• 100,000minimumerase/programcycles
• Latch-up protected to 100mA from -1V to VCC+1V
• Boot Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Package type:
- Automatically program and verify data at specified
address
• Erasesuspend/EraseResume
- Suspends sector erase operation to read data from,
orprogramdatato,any sectorthatisnotbeingerased,
then resumes the erase
- 48-pin TSOP
- 48-ball CSP
- All Pb-free devices are RoHS Compliant
• Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
• Status Reply
- Data# polling & Toggle bit for detection of program
anderaseoperationcompletion
• 10 years data retention
GENERAL DESCRIPTION
The MX29SL800C T/B is a 8-mega bit Flash memory
organized as 1M bytes of 8 bits or 512K words of 16 bits.
MXIC's Flash memories offer the most cost-effective and
reliable read/write non-volatile random access memory.
The MX29SL800CT/B is packaged in 48-pinTSOP and
48-ball CSP. It is designed to be reprogrammed and
erased in system or in standard EPROM programmers.
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maxi-
mum EPROM compatibility.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The MX29SL800C T/B uses a 1.65V~2.2V VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The standard MX29SL800C T/B offers access time as
fast as 90ns, allowing operation of high-speed micropro-
cessors without wait states. To eliminate bus conten-
tion, the MX29SL800C T/B has separate chip enable
(CE#) and output enable (OE#) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29SL800CT/B uses a command register to manage
this functionality. The command register allows for 100%
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamperes on
address and data pin from -1V to VCC + 1V.
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MX29SL800C T/B
PIN CONFIGURATIONS
PIN DESCRIPTION
SYMBOL PIN NAME
48 TSOP (Standard Type) (12mm x 20mm)
A0~A18
Address Input
A15
A14
A13
A12
A11
A10
A9
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
GND
Q15/A-1
Q7
2
Q0~Q14 Data Input/Output
3
4
Q15/A-1
Q15 (data input/output, word mode)/
5
6
Q14
Q6
A-1(LSB address input, byte mode)
Chip Enable Input
7
A8
8
Q13
Q5
CE#
NC
9
NC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Q12
Q4
WE#
Write Enable Input
WE#
RESET#
NC
VCC
Q11
Q3
MX29SL800C T/B
BYTE#
Word/Byte Selection input
NC
RESET# Hardware Reset Pin
RY/BY#
A18
A17
A7
Q10
Q2
OE#
Output Enable Input
Ready/Busy Output
Power Supply Pin (1.65V~2.2V)
Ground Pin
Q9
Q1
RY/BY#
VCC
A6
Q8
A5
Q0
A4
OE#
GND
CE#
A0
A3
A2
GND
A1
48-Ball CSP( Ball Pitch = 0.5 mm),Top View, Balls Facing Down
6
5
4
3
2
1
A2
A1
A0
A4
A3
A5
A6
A7
A17
NC
NC
NC
WE#
NC
NC
A9
A10
A8
A11
A13
A12
A14
A15
A18
CE#
Q8
OE#
Q0
Q10
Q9
Q4
Q5
Q11
Q6
A16
Q7
GND
NC
Q2
NC
Q1
Q3
VCC
Q12
Q13
Q14
Q15
GND
A
B
C
D
E
F
G
H
J
K
L
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MX29SL800C T/B
48-Ball CSP( Ball Pitch = 0.8 mm),Top View, Balls Facing Down
Q15/
A-1
6
5
4
3
2
1
A13
A9
A12
A8
A14
A10
A15
A11
A16
Q7
BYTE#
Q14
GND
Q6
Q13
RE-
SET#
WE#
NC
NC
Q5
Q12
VCC
Q4
RY/BY#
A7
NC
A17
A4
A18
A6
NC
A5
A1
Q2
Q0
A0
Q10
Q8
Q11
Q9
Q3
Q1
A3
A2
CE#
OE#
GND
A
B
C
D
E
F
G
H
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MX29SL800C T/B
BLOCK STRUCTURE
TABLE 1: MX29SL800CT SECTOR ARCHITECTURE
Sector
Sector Size
Address range
Sector Address
Byte Mode Word Mode Byte Mode (x8)
Word Mode (x16) A18 A17 A16 A15 A14 A13 A12
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
00000h-0FFFFh
10000h-1FFFFh
20000h-2FFFFh
30000h-3FFFFh
40000h-4FFFFh
50000h-5FFFFh
60000h-6FFFFh
70000h-7FFFFh
80000h-8FFFFh
90000h-9FFFFh
A0000h-AFFFFh
B0000h-BFFFFh
C0000h-CFFFFh
D0000h-DFFFFh
E0000h-EFFFFh
F0000h-F7FFFh
F8000h-F9FFFh
FA000h-FBFFFh
FC000h-FFFFFh
00000h-07FFFh
08000h-0FFFFh
10000h-17FFFh
18000h-1FFFFh
20000h-27FFFh
28000h-2FFFFh
30000h-37FFFh
38000h-3FFFFh
40000h-47FFFh
48000h-4FFFFh
50000h-57FFFh
58000h-5FFFFh
60000h-67FFFh
68000h-6FFFFh
70000h-77FFFh
78000h-7BFFFh
7C000h-7CFFFh
7D000h-7DFFFh
7E000h-7FFFFh
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
SA10 64Kbytes 32Kwords
SA11 64Kbytes 32Kwords
SA12 64Kbytes 32Kwords
SA13 64Kbytes 32Kwords
SA14 64Kbytes 32Kwords
SA15 32Kbytes 16Kwords
SA16
SA17
8Kbytes
8Kbytes
4Kwords
4Kwords
8Kwords
1
1
0
1
SA18 16Kbytes
1
1
X
Note: Byte mode:address range A18:A-1, word mode:address range A18:A0.
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MX29SL800C T/B
TABLE 2: MX29SL800CB SECTOR ARCHITECTURE
Sector
Sector Size
Address range
Sector Address
Byte Mode Word Mode Byte Mode (x8)
Word Mode (x16) A18 A17 A16 A15 A14 A13 A12
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
SA8
SA9
16Kbytes
8Kbytes
8Kbytes
8Kwords
4Kwords
4Kwords
00000h-03FFFh
04000h-05FFFh
06000h-07FFFh
08000h-0FFFFh
10000h-1FFFFh
20000h-2FFFFh
30000h-3FFFFh
40000h-4FFFFh
50000h-5FFFFh
60000h-6FFFFh
70000h-7FFFFh
80000h-8FFFFh
90000h-9FFFFh
A0000h-AFFFFh
B0000h-BFFFFh
C0000h-CFFFFh
D0000h-DFFFFh
E0000h-EFFFFh
F0000h-FFFFFh
00000h-01FFFh
02000h-02FFFh
03000h-03FFFh
04000h-07FFFh
08000h-0FFFFh
10000h-17FFFh
18000h-1FFFFh
20000h-27FFFh
28000h-2FFFFh
30000h-37FFFh
38000h-3FFFFh
40000h-47FFFh
48000h-4FFFFh
50000h-57FFFh
58000h-5FFFFh
60000h-67FFFh
68000h-6FFFFh
70000h-77FFFh
78000h-7FFFFh
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
1
X
0
0
1
1
32Kbytes 16Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
64Kbytes 32Kwords
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SA10 64Kbytes 32Kwords
SA11 64Kbytes 32Kwords
SA12 64Kbytes 32Kwords
SA13 64Kbytes 32Kwords
SA14 64Kbytes 32Kwords
SA15 64Kbytes 32Kwords
SA16 64Kbytes 32Kwords
SA17 64Kbytes 32Kwords
SA18 64Kbytes 32Kwords
Note: Byte mode:address range A18:A-1, word mode:address range A18:A0.
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MX29SL800C T/B
BLOCK DIAGRAM
WRITE
CE#
OE#
WE#
CONTROL
INPUT
PROGRAM/ERASE
STATE
MACHINE
(WSM)
HIGH VOLTAGE
LOGIC
RESET#
STATE
REGISTER
FLASH
ARRAY
ADDRESS
LATCH
ARRAY
A0-A18
SOURCE
HV
AND
COMMAND
DATA
BUFFER
Y-PASS GATE
DECODER
PGM
SENSE
DATA
COMMAND
DATA LATCH
AMPLIFIER
HV
PROGRAM
DATA LATCH
I/O BUFFER
Q0-Q15/A-1
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MX29SL800C T/B
write commands to the command register using stan-
dard microprocessor write timings. The device will auto-
matically pre-program and verify the entire array. Then
the device automatically times the erase pulse width,
provides the erase verification, and counts the number
of sequences. A status bit toggling between consecu-
tive read cycles provides feedback to the user as to the
status of the erasing operation.
AUTOMATIC PROGRAMMING
The MX29SL800CT/B is byte programmable using the
Automatic Programming algorithm. The Automatic Pro-
gramming algorithm makes the external system do not
need to have time out sequence nor to verify the data
programmed. The typical chip programming time at room
temperature of the MX29SL800C T/B is less than 9.6
seconds.
Register contents serve as inputs to an internal state-
machine which controls the erase and programming cir-
cuitry. During write cycles, the command register inter-
nally latches address and data needed for the program-
ming and erase operations. During a system write cycle,
addresses are latched on the falling edge of WE# or
CE#, whichever happens last, and data are latched on
the rising edge of WE# or CE#, whichever happens first.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm requires the
user to only write program set-up commands (including
2 unlock write cycle and A0H) and a program command
(program data and address). The device automatically
times the programming pulse width, provides the pro-
gram verification, and counts the number of sequences.
A status bit similar to DATA# polling and a status bit
toggling between consecutive read cycles, provide feed-
back to the user as to the status of the programming
operation.Refer to write operation status, table 8, for more
information on these status bits.
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, reli-
ability, and cost effectiveness. The MX29SL800C T/B
electrically erases all bits simultaneously using Fowler-
Nordheim tunneling. The bytes are programmed by us-
ing the EPROM programming mechanism of hot elec-
tron injection.
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is completed,
the device stays in read mode. After the state machine
has completed its task, it will allow the command regis-
ter to respond to its full command set.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 10 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than 14 second. The Automatic Erase algorithm
automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
controlled internally within the device.
AUTOMATIC SELECT
AUTOMATIC SECTOR ERASE
The auto select mode provides manufacturer and de-
vice identification, and sector protection verification,
through identifier codes output on Q7~Q0.This mode is
mainly adapted for programming equipment on the de-
vice to be programmed with its programming algorithm.
When programming by high voltage method, automatic
select mode requires VID (10V to 11V) on address pin
A9 and other address pin A6, A1 and A0 as referring to
Table 3.In addition, to access the automatic select codes
in-system, the host can issue the automatic select com-
mand through the command register without requiringVID,
as shown in table 5.
The MX29SL800CT/B is sector(s) erasable using MXIC's
Auto Sector Erase algorithm. The Automatic Sector
Erase algorithm automatically programs the specified
sector(s) prior to electrical erase. The timing and verifi-
cation of electrical erase are controlled internally within
the device. An erase operation can erase one sector,
multiple sectors, or the entire device.
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to
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MX29SL800C T/B
To verify whether or not sector being protected, the sec-
tor address must appear on the appropriate highest order
address bit (seeTable 1 andTable 2).The rest of address
bits, as shown in table 3, are don't care. Once all neces-
sary bits have been set as required, the programming
equipment may read the corresponding identifier code on
Q7~Q0.
TABLE 3. MX29SL800C T/B AUTO SELECT MODE OPERATION
A18 A11 A9 A8 A6 A5 A1 A0
Description
Mode CE# OE# WE#
|
|
|
A7
X
|
A2
X
Q15~Q0
A12 A10
Manufacturer Code
L
L
L
L
L
L
L
L
L
L
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
VID
VID
VID
VID
VID
L
L
L
L
L
L
L
L
L
L
L
C2H
22EAH
Read Device ID
Word
Byte
Word
X
X
H
H
H
H
Silicon (Top Boot Block)
X
X
XXEAH
226BH
ID
Device ID
X
X
(Bottom Boot Block) Byte
X
X
XX6BH
XX01H
Sector Protection
Verification
L
L
H
SA
X
VID
X
L
X
H
L
(protected)
XX00H
(unprotected)
NOTE:SA=Sector Address, X=Don't Care, L=Logic Low, H=Logic High
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MX29SL800C T/B
QUERY COMMAND AND COMMON FLASH
INTERFACE (CFI) MODE
The single cycle Query command is valid only when the
device is in the Read mode, including Erase Suspend,
Standby mode, and Read ID mode; however, it is ig-
nored otherwise.
MX29SL800CT/B is capable of operating in the CFI mode.
This mode all the host system to determine the manu-
facturer of the device such as operating parameters and
configuration.Two commands are required in CFI mode.
Query command of CFI mode is placed first, then the
Reset command exits CFI mode.These are described in
Table 6.
The Reset command exits from the CFI mode to the
Read mode, or Erase Suspend mode.The command is
valid only when the device is in the CFI mode.
TABLE 4-1. CFI mode: Identification Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
Query-unique ASCII string "QRY"
20
22
24
26
28
2A
2C
2E
30
32
34
10
11
12
13
14
15
16
17
18
19
1A
0051
0052
0059
0002
0000
0040
0000
0000
0000
0000
0000
Primary vendor command set and control interface ID code
Address for primary algorithm extended query table
Alternate vendor command set and control interface ID code (none)
Address for secondary algorithm extended query table (none)
TABLE 4-2. CFI Mode: System Interface Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
VCC supply, minimum (1.65V)
36
38
3A
3C
3E
40
42
44
46
48
4A
4C
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
0016
0022
0000
0000
0004
0000
000A
0000
0005
0000
0004
0000
VCC supply, maximum (2.2V)
VPP supply, minimum (none)
VPP supply, maximum (none)
Typical timeout for single word/byte write (2N us)
Typical timeout for Minimum size buffer write (2N us)
Typical timeout for individual block erase (2N ms)
Typical timeout for full chip erase (2N ms)
Maximum timeout for single word/byte write times (2N X Typ)
Maximum timeout for buffer write times (2N X Typ)
Maximum timeout for individual block erase times (2N X Typ)
Maximum timeout for full chip erase times (not supported)
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MX29SL800C T/B
TABLE 4-3. CFI Mode: Device Geometry Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
Device size (2N bytes)
4E
50
52
54
56
58
5A
5C
5E
60
62
64
66
68
6A
6C
6E
70
72
74
76
78
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
0014
0002
0000
0000
0000
0004
0000
0000
0040
0000
0001
0000
0020
0000
0000
0000
0080
0000
000E
0000
0000
0001
Flash device interface code (refer to the CFI publication 100)
Maximum number of bytes in multi-byte write (not supported)
Number of erase block regions
Erase block region 1 information (refer to the CFI publication 100)
Erase block region 2 information
Erase block region 3 information
Erase block region 4 information
TABLE 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values
(All values in these tables are in hexadecimal)
Description
Address
Address
Data
(ByteMode)
(WordMode)
Query-unique ASCII string "PRI"
80
82
84
86
88
8A
8C
8E
90
92
94
96
98
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
0050
0052
0049
0031
0030
0000
0002
0001
0001
0004
0000
0000
0000
Major version number, ASCII
Minor version number, ASCII
Address sensitive unlock (0=required, 1= not required)
Erase suspend (2= to read and write)
Sector protect (N= # of sectors/group)
Temporarysectorunprotected(1=supported)
Sectorprotect/unprotectedscheme
SimultaneousR/Woperation(0=notsupported)
Burst mode type (0=not supported)
Page mode type (0=not supported)
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MX29SL800C T/B
TABLE 5. MX29SL800C T/B COMMAND DEFINITIONS
First Bus
Bus Cycle
Second Bus Third Bus
Fourth Bus
Cycle
Fifth Bus
Cycle
Sixth Bus
Cycle
Command
Cycle
Cycle
Cycle Addr Data Addr
Data Addr
Data Addr Data Addr
Data Addr Data
Reset
1
1
4
4
4
XXXH F0H
RA RD
Read
Read Silicon ID Word
Byte
555H AAH 2AAH 55H 555H 90H ADI
AAAH AAH 555H 55H AAAH 90H ADI
DDI
DDI
Sector Protect
Verify
Word
555H AAH 2AAH 55H 555H 90H (SA) XX00H
x02H XX01H
Byte
4
AAAH AAH 555H 55H AAAH 90H (SA) 00H
x04H 01H
Program
Word
Byte
Word
Byte
Word
Byte
4
4
6
6
6
6
1
1
1
1
4
4
555H AAH 2AAH 55H 555H A0H PA
AAAH AAH 555H 55H AAAH A0H PA
PD
PD
Chip Erase
Sector Erase
555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H
555H 10H
AAAH 10H
AAAH AAH 555H 55H AAAH 80H AAAH AAH 555H 55H
555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H
SA
SA
30H
30H
AAAH AAH 555H 55H AAAH 80H AAAH AAH 555H 55H
Sector Erase Suspend
Sector Erase Resume
XXXH B0H
XXXH 30H
55H 98
AAH 98
CFI Query
Word
Byte
Sector Protect
(Note 6,7)
Note:
Word
Byte
XXXH 60H SPA
XXXH 60H SPA
60H SPA
60H SPA
40H SPA SD
40H SPA SD
1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacturer code,A1=0, A0 = 1 for device code. A2-A18=do not care.
(Refer to table 3)
DDI = Data of Device identifier : C2H for manufacture code, 22EAH/EAH(Top), and 226BH/6BH(Bottom) for device code.
X = X can be VIL or VIH
RA=Address of memory location to be read.
RD=Data to be read at location RA.
2. PA = Address of memory location to be programmed.
PD = Data to be programmed at location PA.
SA = Address of the sector.
3. The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 in word mode/AAAH or
555H to Address A10~A-1 in byte mode.
Address bit A11~A18=X=Don't care for all address commands except for Program Address (PA) and Sector Address (SA).
Write Sequence may be initiated with A11~A18 in either state.
4. For Sector Protect Verify operation: If read out data is 01H, it means the sector has been protected. If read out data is 00H,
it means the sector is still not being protected.
5. Any number of CFI data read cycle are permitted.
6. Set sector address (SA) with (A6, A1, A0)=(0,1,0).
7. This command is valid while RESET#=VID.
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MX29SL800C T/B
COMMAND DEFINITIONS
sequences. Note that the Erase Suspend (B0H) and
Erase Resume (30H) commands are valid only while the
Sector Erase operation is in progress.
Device operations are selected by writing specific ad-
dress and data sequences into the command register.
Writing incorrect address and data values or writing them
in the improper sequence will reset the device to the
read mode. Table 5 defines the valid register command
TABLE 6. MX29SL800C T/B BUS OPERATION
ADDRESS
CE# OE# WE#RESET# A18 A10 A9 A8 A6 A5 A1 A0 Q0~Q7 BYTE#
Q8~Q15
BYTE#=VIL
Q8~Q14 Q15/A-1
DESCRIPTION
A12 A11
A7
A2
=VIH
Read
L
L
H
H
AIN
Dout
Dout Q8~Q14
A-1
=High Z
DIN
Write
L
H
X
L
H
L
AIN
X
DIN(3)
Reset
X
X
High Z High Z High Z
DIN DIN High Z
X
X
Temporary sector
Unprotection
X
X
X
VID
AIN
Output Disable
Standby
L
VCC±
0.3V
L
H
X
H
X
H
VCC±
0.3V
VID
VID
H
X
X
High Z High Z High Z
High Z High Z High Z
X
X
Sector Protect
Chip Unprotected
Sector Protection Verify
NOTES:
H
H
L
L
L
SA
X
X
X
X
X
X
X
X
X
L
H
L
X
X
X
H
H
H
L
L
L
DIN
DIN
X
X
X
X
X
X
L
X
L
L
L
H
SA
VID
CODE(5)
1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 5.
2. VID is the Silicon-ID-Read high voltage, 10V to 11V.
3. Refer to Table 5 for valid Data-In during a write operation.
4. X can be VIL or VIH.
5. Code=00H/XX00H means unprotected.
Code=01H/XX01H means protected.
6. A18~A12=Sector address for sector protect.
7. The sector protect and chip unprotected functions may also be implemented via programming equipment.
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MX29SL800C T/B
REQUIREMENTS FOR READING ARRAY
DATA
STANDBY MODE
When using both pins of CE# and RESET#, the device
enter CMOS Standby with both pins held at Vcc ± 0.3V.
If CE# and RESET# are held at VIH, but not within the
range of VCC ± 0.3V, the device will still be in the standby
mode, but the standby current will be larger.During Auto
Algorithm operation,Vcc active current (Icc2) is required
even CE# = "H" until the operation is completed. The
device can be read with standard access time (tCE) from
either of these standby modes, before it is ready to read
data.
To read array data from the outputs, the system must
drive the CE# and OE# pins to VIL. CE# is the power
control and selects the device. OE# is the output control
and gates array data to the output pins. WE# should
remain atVIH.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory
content occurs during the power transition. No command
is necessary in this mode to obtain array data. Standard
microprocessor read cycles that assert valid address
on the device address inputs produce valid data on the
device data outputs.The device remains enabled for read
access until the command register contents are altered.
OUTPUT DISABLE
With the OE# input at a logic high level (VIH), output
from the devices are disabled.This will cause the output
pins to be in a high impedance state.
WRITE COMMANDS/COMMAND SEQUENCES
RESET# OPERATION
To program data to the device or erase sectors of memory
, the system must drive WE# and CE# to VIL, and OE#
to VIH.
The RESET# pin provides a hardware method of resetting
the device to reading array data.When the RESET# pin
is driven low for at least a period of tRP, the device
immediately terminates any operation in progress, tri-
states all output pins, and ignores all read/write
commands for the duration of the RESET# pulse. The
device also resets the internal state machine to reading
array data.The operation that was interrupted should be
reinitiated once the device is ready to accept another
command sequence, to ensure data integrity
An erase operation can erase one sector, multiple sectors
, or the entire device.Table indicates the address space
that each sector occupies. A "sector address" consists
of the address bits required to uniquely select a sector.
The "Writing specific address and data commands or
sequences into the command register initiates device
operations. Table 1 defines the valid register command
sequences.Writing incorrect address and data values or
writing them in the improper sequence resets the device
to reading array data. Section has details on erasing a
sector or the entire chip, or suspending/resuming the
erase operation.
Current is reduced for the duration of the RESET# pulse.
When RESET# is held at VSS±0.3V, the device draws
CMOS standby current (ICC4).If RESET# is held atVIL
but not within VSS±0.3V, the standby current will be
greater.
After the system writes the autoselect command
sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal
register (which is separate from the memory array) on
Q7-Q0. Standard read cycle timings apply in this mode.
Refer to the Autoselect Mode and Autoselect Command
Sequence section for more information.
The RESET# pin may be tied to system reset circuitry.
A system reset would that also reset the Flash memory,
enabling the system to read the boot-up firmware from
the Flash memory.
If RESET# is asserted during a program or erase
operation, the RY/BY# pin remains a "0" (busy) until the
internal reset operation is complete, which requires a
time of tREADY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine whether
the reset operation is complete. If RESET# is asserted
when a program or erase operation is completed within a
ICC2 in the DC Characteristics table represents the
active current specification for the write mode.The "AC
Characteristics" section contains timing specification
table and timing diagrams for write operations.
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MX29SL800C T/B
The Automatic Chip Erase does not require the device to
be entirely pre-programmed prior to executing the Auto-
matic Chip Erase. Upon executing the Automatic Chip
Erase, the device will automatically program and verify
the entire memory for an all-zero data pattern. When the
device is automatically verified to contain an all-zero pat-
tern, a self-timed chip erase and verify begin. The erase
and verify operations are completed when the data on Q7
is "1" at which time the device returns to the Read mode.
The system is not required to provide any control or tim-
ing during these operations.
time of tREADY (not during Embedded Algorithms).The
system can read data tRH after the RESET# pin returns
to VIH.
Refer to the AC Characteristics tables for RESET#
parameters and to Figure 22 for the timing diagram.
READ/RESET COMMAND
The read or reset operation is initiated by writing the read/
reset command sequence into the command register.
Microprocessor read cycles retrieve array data. The de-
vice remains enabled for reads until the command regis-
ter contents are altered.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
(no erase verification command is required).
If program-fail or erase-fail happen, the write of F0H will
reset the device to abort the operation. A valid com-
mand must then be written to place the device in the
desired state.
If the Erase operation was unsuccessful, the data on Q5
is "1" (see Table 8), indicating the erase operation ex-
ceed internal timing limit.
The automatic erase begins on the rising edge of the last
WE# or CE# pulse, whichever happens first in the com-
mand sequence and terminates when the data on Q7 is
"1" at which time the device returns to the Read mode,
or the data on Q6 stops toggling for two consecutive read
cycles at which time the device returns to the Read mode.
SILICON-ID READ COMMAND
Flash memories are intended for use in applications where
the local CPU alters memory contents. As such, manu-
facturer and device codes must be accessible while the
device resides in the target system. PROM program-
mers typically access signature codes by raising A9 to
a high voltage (VID). However, multiplexing high voltage
onto address lines is not generally desired system de-
sign practice.
The MX29SL800C T/B contains a Silicon-ID-Read op-
eration to supple traditional PROM programming meth-
odology. The operation is initiated by writing the read
silicon ID command sequence into the command regis-
ter. Following the command write, a read cycle with
A1=VIL, A0=VIL retrieves the manufacturer code of C2H/
00C2H. A read cycle with A1=VIL, A0=VIH returns the
device code of EAH/22EAH for MX29SL800CT, 6BH/
226BH for MX29SL800CB.
SET-UP AUTOMATIC CHIP/SECTOR ERASE
COMMANDS
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cycles
are then followed by the chip erase command 10H or
sector erase command 30H.
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MX29SL800C T/B
TABLE 7. SILICON ID CODE
Pins
A0
A1 Q15~Q8 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Code (Hex)
Manufacture code Word VIL VIL 00H
Byte VIL VIL
Word VIH VIL 22H
for MX29SL800CT Byte VIH VIL
Device code Word VIH VIL 22H
for MX29SL800CB Byte VIH VIL
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
0
00C2H
X
C2H
Device code
22EAH
X
EAH
226BH
X
6BH
Sector Protection Word X
Verification Byte X
VIH X
VIH X
01H (Protected)
00H (Unprotected)
READING ARRAY DATA
RESET COMMAND
The device is automatically set to reading array data
after device power-up. No commands are required to re-
trieve data.The device is also ready to read array data
after completing an Automatic Program or Automatic
Erase algorithm.
Writing the reset command to the device resets the de-
vice to reading array data. Address bits are don't care
for this command.
The reset command may be written between the se-
quence cycles in an erase command sequence before
erasing begins. This resets the device to reading array
data.Once erasure begins, however, the device ignores
reset commands until the operation is complete.
After the device accepts an Erase Suspend command,
the device enters the Erase Suspend mode. The sys-
tem can read array data using the standard read tim-
ings, except that if it reads at an address within erase-
suspended sectors, the device outputs status data. Af-
ter completing a programming operation in the Erase
Suspend mode, the system may once again read array
data with the same exception. See Erase Suspend/Erase
Resume Commands” for more information on this mode.
The system must issue the reset command to re-en-
able the device for reading array data if Q5 goes high, or
while in the autoselect mode. See the "Reset Command"
section, next.
The reset command may be written between the se-
quence cycles in a program command sequence before
programming begins. This resets the device to reading
array data (also applies to programming in Erase Sus-
pend mode). Once programming begins, however, the
device ignores reset commands until the operation is
complete.
The reset command may be written between the se-
quence cycles in an SILICON ID READ command se-
quence. Once in the SILICON ID READ mode, the reset
command must be written to return to reading array data
(also applies to SILICON ID READ during Erase Sus-
pend).
If Q5 goes high during a program or erase operation,
writing the reset command returns the device to read-
ing array data (also applies during Erase Suspend).
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MX29SL800C T/B
device requires a maximum 20us to suspend the sector
erase operation.However, when the Erase Suspend com-
mand is written during the sector erase time-out, the
device immediately terminates the time-out period and
suspends the erase operation. After this command has
been executed, the command register will initiate erase
suspend mode. The state machine will return to read
mode automatically after suspend is ready. At this time,
state machine only allows the command register to re-
spond to Erase Resume, program data to , or read data
from any sector not selected for erasure.
SECTOR ERASE COMMANDS
The Automatic Sector Erase does not require the de-
vice to be entirely pre-programmed prior to executing
the Automatic Sector Erase Set-up command and Au-
tomatic Sector Erase command. Upon executing the
Automatic Sector Erase command, the device will auto-
matically program and verify the sector(s) memory for
an all-zero data pattern. The system is not required to
provide any control or timing during these operations.
When the sector(s) is automatically verified to contain
an all-zero pattern, a self-timed sector erase and verify
begin. The erase and verify operations are complete
when either the data on Q7 is "1" at which time the de-
vice returns to the Read mode, or the data on Q6 stops
toggling for two consecutive read cycles at which time
the device returns to the Read mode. The system is not
required to provide any control or timing during these
operations.
The system can determine the status of the program
operation using the Q7 or Q6 status bits, just as in the
standard program operation. After an erase-suspend pro-
gram operation is complete, the system can once again
read array data within non-suspended sectors.
ERASE RESUME
When using the Automatic sector Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
(no erase verification command is required). Sector
erase is a six-bus cycle operation. There are two "un-
lock" write cycles. These are followed by writing the
set-up command 80H. Two more "unlock" write cycles
are then followed by the sector erase command 30H.
The sector address is latched on the falling edge of WE#
or CE#, whichever happens later, while the command
(data) is latched on the rising edge of WE# or CE#,
whichever happens first. Sector addresses selected are
loaded into internal register on the sixth falling edge of
WE# or CE#, whichever happens later. Each succes-
sive sector load cycle started by the falling edge of WE#
or CE#, whichever happens later must begin within 50us
from the rising edge of the preceding WE# or CE#, which-
ever happens first. Otherwise, the loading period ends
and internal auto sector erase cycle starts. (Monitor Q3
to determine if the sector erase timer window is still open,
see section Q3, Sector EraseTimer.) Any command other
than Sector Erase (30H) or Erase Suspend (B0H) during
the time-out period resets the device to read mode.
This command will cause the command register to clear
the suspend state and return back to Sector Erase mode
but only if an Erase Suspend command was previously
issued. Erase Resume will not have any effect in all
other conditions. Another Erase Suspend command can
be written after the chip has resumed erasing.However,
a delay time must be required after the erase resume
command (500us for MX29SL800C T/B), if the system
implements an endless erase suspend/resume loop, or
the number of erase suspend/resume is exceeded 1024
times. The erase times will be expended if the erase
behavior always be suspended. (Please refer to MXIC
Flash Application Note for details.)
WORD/BYTE PROGRAM COMMAND SEQUENCE
The device programs one word/byte of data for each
program operation.The command sequence requires four
bus cycles, and is initiated by writing two unlock write
cycles, followed by the program set-up command. The
program address and data are written next, which in turn
initiate the Embedded Program algorithm. The system is
not required to provide further controls or timings. The
device automatically generates the program pulses and
verifies the programmed cell margin. Table 1 shows the
address and data requirements for the byte program
command sequence.
ERASE SUSPEND
This command only has meaning while the state ma-
chine is executing Automatic Sector Erase operation,
and therefore will only be responded during Automatic
Sector Erase operation. When the Erase Suspend Com-
mand is issued during the sector erase operation, the
When the Embedded Program algorithm is complete,
the device then returns to reading array data and
addresses are no longer latched. The system can
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MX29SL800C T/B
determine the status of the program operation by using
Q7, Q6, or RY/BY#. See "Write Operation Status" for
information on these status bits.
rithm is complete, or if the device enters the Erase Sus-
pend mode, DATA# polling produces a "1" on Q7.This is
analogous to the complement/true datum out-put de-
scribed for the Automatic Program algorithm: the erase
function changes all the bits in a sector to "1" prior to
this, the device outputs the "complement," or "0". The
system must provide an address within any of the sec-
tors selected for erasure to read valid status information
on Q7.
Any commands written to the device during the Em-
bedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the programming
operation. The Byte Program command sequence should
be reinitiated once the device has reset to reading array
data, to ensure data integrity.
After an erase command sequence is written, if all sec-
tors selected for erasing are protected, DATA# polling on
Q7 is active for approximately 100 us, then the device
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed from a
"0" back to a "1". Attempting to do so may halt the
operation and set Q5 to "1" , or cause the DATA# polling
algorithm to indicate the operation was successful.
However, a succeeding read will show that the data is
still "0". Only erase operations can convert a "0" to a
"1".
When the system detects Q7 has changed from the
complement to true data, it can read valid data at Q7-Q0
on the following read cycles. This is because Q7 may
change asynchronously with Q0-Q6 while Output En-
able (OE#) is asserted low.
WRITE OPERATION STATUS
The device provides several bits to determine the sta-
tus of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/
BY#. Table 10 and the following subsections describe
the functions of these bits. Q7, RY/BY#, and Q6 each
offer a method for determining whether a program or erase
operation is complete or in progress. These three bits
are discussed first.
RY/BY# : Ready/Busy
The RY/BY# is a dedicated, open-drain output pin that
indicates whether an Automatic Erase/Program algorithm
is in progress or complete. The RY/BY# status is valid
after the rising edge of the final WE# or CE#, whichever
happens first, in the command sequence.Since RY/BY#
is an open-drain output, several RY/BY# pins can be
tied together in parallel with a pull-up resistor to VCC.
Q7: Data# Polling
The DATA# polling bit, Q7, indicates to the host system
whether an Automatic Algorithm is in progress or com-
pleted, or whether the device is in Erase Suspend.DATA#
polling is valid after the rising edge of the finalWE# pulse
in the program or erase command sequence.
If the output is low (Busy), the device is actively erasing
or programming. (This includes programming in the Erase
Suspend mode.) If the output is high (Ready), the de-
vice is ready to read array data (including during the
Erase Suspend mode), or is in the standby mode.
During the Automatic Program algorithm, the device out-
puts on Q7 the complement of the datum programmed
to Q7.This Q7 status also applies to programming dur-
ing Erase Suspend.When the Automatic Program algo-
rithm is complete, the device outputs the datum pro-
grammed to Q7.The system must provide the program
address to read valid status information on Q7. If a pro-
gram address falls within a protected sector, DATA# poll-
ing on Q7 is active for approximately 2 us, then the de-
vice returns to reading array data.
Table 8 shows the outputs for RY/BY# during write op-
eration.
Q6:Toggle BIT I
Toggle Bit I on Q6 indicates whether an Automatic Pro-
gram or Erase algorithm is in progress or complete, or
whether the device has entered the Erase Suspend mode.
Toggle Bit I may be read at any address, and is valid
after the rising edge of the final WE# or CE#, whichever
During the Automatic Erase algorithm, DATA# polling pro-
duces a "0" on Q7. When the Automatic Erase algo-
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MX29SL800C T/B
happens first, in the command sequence (prior to the
program or erase operation), and during the sector time-
out.
parison, indicates whether the device is actively eras-
ing, or is in Erase Suspend, but cannot distinguish which
sectors are selected for erasure. Thus, both status bits
are required for sectors and mode information. Refer to
Table 8 to compare outputs for Q2 and Q6.
During an Automatic Program or Erase algorithm opera-
tion, successive read cycles to any address cause Q6
to toggle. The system may use either OE# or CE# to
control the read cycles.When the operation is complete,
Q6 stops toggling.
Reading Toggle Bits Q6/ Q2
Whenever the system initially begins reading toggle bit
status, it must read Q7-Q0 at least twice in a row to
determine whether a toggle bit is toggling. Typically, the
system would note and store the value of the toggle bit
after the first read. After the second read, the system
would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has
completed the program or erase operation. The system
can read array data on Q7-Q0 on the following read cycle.
After an erase command sequence is written, if all sec-
tors selected for erasing are protected, Q6 toggles and
returns to reading array data. If not all selected sectors
are protected, the Automatic Erase algorithm erases the
unprotected sectors, and ignores the selected sectors
that are protected.
The system can use Q6 and Q2 together to determine
whether a sector is actively erasing or is erase sus-
pended.When the device is actively erasing (that is, the
Automatic Erase algorithm is in progress), Q6 toggling.
When the device enters the Erase Suspend mode, Q6
stops toggling. However, the system must also use Q2
to determine which sectors are erasing or erase-sus-
pended. Alternatively, the system can use Q7.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the sys-
tem also should note whether the value of Q5 is high
(see the section on Q5). If it is, the system should then
determine again whether the toggle bit is toggling, since
the toggle bit may have stopped toggling just as Q5 went
high. If the toggle bit is no longer toggling, the device
has successfully completed the program or erase op-
eration. If it is still toggling, the device did not complete
the operation successfully, and the system must write
the reset command to return to reading array data.
If a program address falls within a protected sector, Q6
toggles for approximately 2 us after the program com-
mand sequence is written, then returns to reading array
data.
Q6 also toggles during the erase-suspend-program mode,
and stops toggling once the Automatic Program algo-
rithm is complete.
The remaining scenario is that system initially determines
that the toggle bit is toggling and Q5 has not gone high.
The system may continue to monitor the toggle bit and
Q5 through successive read cycles, determining the sta-
tus as described in the previous paragraph. Alterna-
tively, it may choose to perform other system tasks. In
this case, the system must start at the beginning of the
algorithm when it returns to determine the status of the
operation.
Table 8 shows the outputs for Toggle Bit I on Q6.
Q2:Toggle Bit II
The "Toggle Bit II" on Q2, when used with Q6, indicates
whether a particular sector is actively erasing (that is,
the Automatic Erase algorithm is in process), or whether
that sector is erase-suspended. Toggle Bit II is valid
after the rising edge of the final WE# or CE#, whichever
happens first, in the command sequence.
Q5
ExceededTiming Limits
Q5 will indicate if the program or erase time has ex-
ceeded the specified limits (internal pulse count). Under
these conditions Q5 will produce a "1". This time-out
condition indicates that the program or erase cycle was
not successfully completed. Data# Polling and Toggle
Bit are the only operating functions of the device under
this condition.
Q2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. (The
system may use either OE# or CE# to control the read
cycles.) But Q2 cannot distinguish whether the sector
is actively erasing or is erase-suspended. Q6, by com-
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MX29SL800C T/B
If this time-out condition occurs during sector erase op-
eration, it specifies that a particular sector is bad and it
may not be reused. However, other sectors are still func-
tional and may be used for the program or erase opera-
tion. The device must be reset to use other sectors.
Write the Reset command sequence to the device, and
then execute program or erase command sequence. This
allows the system to continue to use the other active
sectors in the device.
If this time-out condition occurs during the byte program-
ming operation, it specifies that the entire sector con-
taining that byte is bad and this sector may not be re-
used, (other sectors are still functional and can be re-
used).
The time-out condition will not appear if a user tries to
program a non blank location without erasing. Please
note that this is not a device failure condition since the
device was incorrectly used.
If this time-out condition occurs during the chip erase
operation, it specifies that the entire chip is bad or com-
bination of sectors are bad.
TABLE 8. WRITE OPERATION STATUS
Status
Q7
Q6
Q5
Q3
Q2 RY/BY#
(Note1)
(Note2)
Word/Byte Program in Auto Program Algorithm
Auto Erase Algorithm
Q7# Toggle
0
0
1
0
0
1
Toggle
1
0
0
1
0
Toggle
Toggle
0
1
Erase Suspend Read
(Erase Suspended Sector)
In Progress
Erase Suspended Mode
Erase Suspend Read
Data
Data Data Data Data
1
0
(Non-Erase Suspended Sector)
Erase Suspend Program
(Non-Erase Suspended Sector)
Q7# Toggle
Q7# Toggle
0
1
0
0
1
1
Word/Byte Program in Auto Program Algorithm
0
Exceeded
Time Limits Auto Erase Algorithm
0
Toggle
1
1
1
0
N/A
N/A
0
0
Erase Suspend Program
(Non-Erase Suspended Sector)
Q7# Toggle
Note:
1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits.
See "Q5:Exceeded Timing Limits " for more information.
3. Successive reads from the erasing or erase-suspend sector causes Q2 to toggle.
4. Reading from non-erase suspended sector address will indicate logic "1" at the Q2 bit.
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19
MX29SL800C T/B
Q3
POWER SUPPLY DECOUPLING
Sector Erase Timer
In order to reduce power switching effect, each device
should have a 0.1uF ceramic capacitor connected be-
tween itsVCC and GND.
After the completion of the initial sector erase command
sequence, the sector erase time-out will begin. Q3 will
remain low until the time-out is complete. DATA# polling
andToggle Bit are valid after the initial sector erase com-
mand sequence.
POWER-UP SEQUENCE
The MX29SL800CT/B powers up in the Read only mode.
In addition, the memory contents may only be altered
after successful completion of the predefined command
sequences.
If DATA# polling or the Toggle Bit indicates the device
has been written with a valid erase command, Q3 may
be used to determine if the sector erase timer window is
still open. If Q3 is high ("1") the internally controlled
erase cycle has begun; attempts to write subsequent
commands to the device will be ignored until the erase
operation is completed as indicated by DATA# polling or
Toggle Bit. If Q3 is low ("0"), the device will accept
additional sector erase commands. To insure the com-
mand has been accepted, the system software should
check the status of Q3 prior to and following each sub-
sequent sector erase command. If Q3 were high on the
second status check, the command may not have been
accepted.
TEMPORARY SECTOR UNPROTECTED
This feature allows temporary unprotected of previously
protected sector to change data in-system.TheTempo-
rary Sector Unprotected mode is activated by setting
the RESET# pin to VID (10V-11V). During this mode,
formerly protected sectors can be programmed or erased
as un-protected sector. Once VID is remove from the
RESET# pin, all the previously protected sectors are
protected again.
DATA PROTECTION
SECTOR PROTECTION
The MX29SL800C T/B is designed to offer protection
against accidental erasure or programming caused by
spurious system level signals that may exist during power
transition. During power up the device automatically re-
sets the state machine in the Read mode. In addition,
with its control register architecture, alteration of the
memory contents only occurs after successful comple-
tion of specific command sequences. The device also
incorporates several features to prevent inadvertent write
cycles resulting fromVCC power-up and power-down tran-
sition or system noise.
The MX29SL800CT/B features hardware sector protec-
tion. This feature will disable both program and erase
operations for these sectors protected. To activate this
mode, the programming equipment must force VID on
address pin A9 and OE#. Programming of the protection
circuitry begins on the falling edge of theWE# pulse and
is terminated on the rising edge. Please refer to sector
protect algorithm and waveform.
To verify programming of the protection circuitry, the pro-
gramming equipment must forceVID on address pin A9
( with CE# and OE# at VIL and WE# at VIH). When
A1=VIH, A0=VIL, A6=VIL, it will produce a logical "1"
code at device output Q0 for a protected sector. Other-
wise the device will produce 00H for the unprotected
sector. In this mode, the addresses, except for A1, are
don't care. Address locations with A1 =VIL are reserved
to read manufacturer and device codes. (Read Silicon
ID)
WRITE PULSE "GLITCH" PROTECTION
Noise pulses of less than 5ns(typical) on CE# or WE#
will not initiate a write cycle.
LOGICAL INHIBIT
Writing is inhibited by holding any one of OE# = VIL,
CE# = VIH or WE# = VIH. To initiate a write cycle CE#
and WE# must be a logical zero while OE# is a logical
one.
It is also possible to determine if the sector is protected
in the system by writing a Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
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20
MX29SL800C T/B
a logical "1" at Q0 for the protected sector.
CHIP UNPROTECTED
The MX29SL800CT/B also features the chip unprotected
mode, so that all sectors are unprotected after chip un-
protected is completed to incorporate any changes in the
code. It is recommended to protect all sectors before
activating chip unprotected mode.
To activate this mode, the programming equipment must
force VID on control pin OE# and address pin A9. The
CE# pins must be set at VIL. Pins A6 must be set to
VIH. Refer to chip unprotected algorithm and waveform
for the chip unprotected algorithm. The unprotection
mechanism begins on the falling edge of the WE# pulse
and is terminated on the rising edge.
It is also possible to determine if the chip is unprotected
in the system by writing the Read Silicon ID command.
Performing a read operation with A1=VIH, it will produce
00H at data outputs (Q0-Q7) for an unprotected sector.
It is noted that all sectors are unprotected after the chip
unprotected algorithm is completed.
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MX29SL800C T/B
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
StorageTemperature
Plastic Packages . . . . . . . . . . . . . ..... -55oC to +125oC
Commercial (C) Devices
Ambient Temperature (TA ). . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
AmbientTemperature
with Power Applied. . . . . . . . . . . . . .... -40oC to +85oC
Voltage with Respect to Ground
Ambient Temperature (TA ). . . . . . . . . . -40°C to +85°C
VCC Supply Voltages
VCC for full voltage range. . . . . . . . . . . +1.65 V to 2.2 V
VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +3.0 V
A9, OE#, and
Operating ranges define those limits between which the
functionality of the device is guaranteed.
RESET# (Note 2) . . . . . . . . . . . ....-0.3 V to +11.5 V
All other pins (Note 1) . . . . . . . -0.3 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.3 V.
During voltage transitions, input or I/O pins may over-
shoot VSS to -2.0 V for periods of up to 20 ns. See
Figure 6. Maximum DC voltage on input or I/O pins is
VCC +0.5 V. During voltage transitions, input or I/O
pins may overshoot to VCC +2.0 V for periods up to
20 ns.
2. Minimum DC input voltage on pins A9, OE#, and
RESET# is -0.3V.During voltage transitions, A9, OE#,
and RESET# may overshoot VSS to -2.0 V for peri-
ods of up to 20 ns. See Figure 6. Maximum DC input
voltage on pin A9 is +11.5 V which may overshoot to
12.5 V for periods up to 20 ns.
3.No more than one output may be shorted to ground at
a time. Duration of the short circuit should not be
greater than one second.
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device at these or any other conditions above those in-
dicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maxi-
mum rating conditions for extended periods may affect
device reliability.
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MX29SL800C T/B
TABLE 9. DC CHARACTERISTICS TA = -40oC to 85oC, VCC = 1.65V~2.2V
Symbol PARAMETER
MIN.
TYP
MAX.
± 1
UNIT
uA
CONDITIONS
ILI
Input Leakage Current
VIN = VSS to VCC, VCC=VCC max
VCC=VCC max;
ILIT
A9, OE#, RESET# Input
Leakage Current
35
uA
A9, OE#, RESET#=11V
VOUT = VSS to VCC, VCC=VCC max
CE#=VIL, OE#=VIH @10MHz
ILO
Output Leakage Current
VCC Active Read Current
± 1
12
6
uA
mA
mA
mA
mA
mA
uA
ICC1
(Byte Mode)
@5MHz
12
6
CE#=VIL, OE#=VIH @10MHz
(Word Mode)
@5MHz
ICC2
ICC3
VCC Active write Current
VCC Standby Current
15
1
25
5
CE#=VIL, OE#=VIH
VCC=VCC max;
CE#, RESET#= VCC ± 0.3V
RESET#= VSS ± 0.3V
ICC4
ICC5
VCC Standby Current
During Reset
1
1
5
5
uA
uA
Automatic sleep mode
VCC=VCC max;
CE#=VSS ± 0.3V;
RESET#=VCC ± 0.3V;
VIH=VCC ± 0.3V;
VIL=VSS ± 0.3V
VIL
VIH
VID
Input Low Voltage(Note 1)
Input High Voltage
-0.5
0.2xVCC
VCC+ 0.3
V
V
0.7xVCC
Voltage for Automatic
Select, Sector protection
and Temporary
10
10.5
11
V
Sector Unprotected
Output Low Voltage
VOL
0.25
0.1
V
V
IOL = 2.0mA, VCC= VCC min
IOL = 100uA, VCC= VCC min
IOH = -2mA, VCC=VCC min
IOH = -100uA, VCC=VCC min
VOH1
VOH2
Output High Voltage(TTL)
0.85xVCC
Output High Voltage(CMOS) VCC-0.1
NOTES:
1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns.
VIL min. = -2.0V for pulse width is equal to or less than 20 ns.
2. Automatic sleep mode enable the low power mode when addresses remain stable for tACC +30ns.
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MX29SL800C T/B
AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 1.65V~2.2V
TABLE 10. READ OPERATIONS
29SL800CT/B-90
SYMBOL PARAMETER
MIN.
MAX.
UNIT
ns
CONDITIONS
tRC
tACC
tCE
Read Cycle Time (Note 1)
Address to Output Delay
CE# to Output Delay
90
90
90
35
30
ns
CE#=OE#=VIL
OE#=VIL
ns
tOE
OE# to Output Delay
ns
CE#=VIL
tDF
OE# High to Output Float (Note1)
Output Enable Read
0
ns
CE#=VIL
tOEH
0
ns
Hold Time
Toggle and
10
ns
Data# Polling
tOH
Address to Output hold
0
ns
CE#=OE#=VIL
NOTES:
1. Not 100% tested.
2. tDF is defined as the time at which the output achieves
the open circuit condition and data is no longer driven.
TEST CONDITIONS:
• Input pulse levels: 0V or VCC
• Input rise and fall times is equal to or less than 5ns.
• Output load: 1 TTL gate + 30pF
• Reference levels for measuring timing: VCC/2
CAPACITANCE TA = 25oC, f = 1.0 MHz
SYMBOL
CIN1
PARAMETER
MIN.
TYP
MAX.
8
UNIT
pF
CONDITIONS
VIN = 0V
Input Capacitance
Control Pin Capacitance
Output Capacitance
CIN2
12
pF
VIN = 0V
COUT
12
pF
VOUT = 0V
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MX29SL800C T/B
SWITCHING TEST CIRCUITS
DEVICE UNDER
TEST
2.7K ohm
VCC
CL
6.2K ohm
DIODES=IN3064
OR EQUIVALENT
CL= 30pF Including jig capacitance
SWITCHING TEST WAVEFORMS
VCC
TEST POINTS
0V
INPUT
OUTPUT
AC TESTING: Inputs are driven at VCC for a logic "1" and 0V for a logic "0".
Input pulse rise and fall times are < 5ns.
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MX29SL800C T/B
FIGURE 1. READ TIMING WAVEFORMS
tRC
VIH
ADD Valid
Addresses
VIL
tACC
tCE
VIH
CE#
VIL
VIH
WE#
VIL
tOE
tDF
tOEH
VIH
OE#
VIL
tACC
tOH
HIGH Z
HIGH Z
VOH
VOL
Outputs
DATA Valid
VIH
VIL
RESET#
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MX29SL800C T/B
AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 1.65V~2.2V
TABLE 11. Erase/Program Operations
Parameter
Speed Options
Std.
tWC
tAS
Description
90
Unit
ns
Write Cycle Time (Note 1)
Address Setup Time
Min
Min
Min
Min
Min
Min
Min
90
0
45
45
0
ns
tAH
Address Hold Time
ns
tDS
Data Setup Time
ns
tDH
Data Hold Time
ns
tOES
tGHWL
Output Enable Setup Time
Read Recovery Time Before Write
(OE# High to WE# Low)
CE# Setup Time
0
ns
0
ns
tCS
Min
Min
Min
Min
Typ
Typ
Typ
Min
Min
Max
Min
Typ
Min
Typ
Max
0
0
ns
ns
ns
ns
us
us
sec
us
ns
ns
ns
us
ns
ms
us
tCH
CE# Hold Time
tWP
Write Pulse Width
45
30
12
18
1.3
50
0
tWPH
tWHWH1
Write Pulse Width High
ProgrammingOperation(Note2)
(Byte/Wordprogramtime)
Sector Erase Operation (Note 2)
VCC Setup Time (Note 1)
Recovery Time from RY/BY#
Program/Erase Valid to RY/BY# Delay
Write Pulse Width for Sector Protect
(A9, OE#Control)
Byte
Word
tWHWH2
tVCS
tRB
tBUSY
tWPP1
90
100
10
100
12
50
tWPP2
tBAL
Write Pulse Width for Chip Unprotected
(A9, OE#Control)
Sector Address Load Time
NOTES:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
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MX29SL800C T/B
AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 1.65V~2.2V
TABLE 12. Alternate CE# Controlled Erase/Program Operations
Parameter
Speed Options
Std.
Description
90
90
0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
us
sec
tWC
Write CycleTime (Note 1)
Address SetupTime
Address HoldTime
Data SetupTime
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Typ
Typ
Typ
tAS
tAH
45
45
0
tDS
tDH
Data HoldTime
tOES
tGHEL
tWS
Output Enable SetupTime
Read RecoveryTime BeforeWrite
WE# SetupTime
0
0
0
tWH
WE# HoldTime
0
tCP
CE# PulseWidth
45
30
12
18
1.3
tCPH
tWHWH1
CE# Pulse Width High
Programming
Byte
Word
Operation(note2)
tWHWH2
Sector Erase Operation (note2)
NOTE:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
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MX29SL800C T/B
FIGURE 2. COMMAND WRITE TIMING WAVEFORM
VCC
1.8V
VIH
Addresses
ADD Valid
VIL
tAH
tAS
VIH
VIL
WE#
CE#
tWPH
tCWC
tOES
tWP
VIH
VIL
tCS
tCH
tDH
VIH
VIL
OE#
Data
tDS
VIH
VIL
DIN
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MX29SL800C T/B
AUTOMATIC PROGRAMMING TIMING WAVEFORM
ing after automatic programming starts. Device outputs
DATA# during programming and DATA# after program-
ming on Q7. (Q6 is for toggle bit; see toggle bit, DATA#
polling, timing waveform)
One byte data is programmed. Verify in fast algorithm
and additional verification by external control are not re-
quired because these operations are executed automati-
cally by internal control circuit. Programming comple-
tion can be verified by DATA# polling and toggle bit check-
FIGURE 3. AUTOMATIC PROGRAMMING TIMING WAVEFORM
Program Command Sequence(last two cycle)
Read Status Data (last two cycle)
tWC
tAS
PA
PA
555h
PA
Address
CE#
tAH
tCH
tGHWL
OE#
WE#
tWHWH1
tWP
tCS
tWPH
tDS tDH
Status
A0h
PD
DOUT
Data
tBUSY
tRB
RY/BY#
tVCS
VCC
NOTES:
1.PA=Program Address, PD=Program Data, DOUT is the true data the program address
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MX29SL800C T/B
FIGURE 4. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data A0H Address 555H
Write Program Data/Address
Data Poll
Increment
Address
from system
No
No
Verify Word Ok ?
YES
Last Address ?
YES
Auto Program Completed
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MX29SL800C T/B
FIGURE 5. CE# CONTROLLED PROGRAM TIMING WAVEFORM
PA for program
555 for program
2AA for erase
SA for sector erase
555 for chip erase
Data Polling
Address
PA
tWC
tWH
tAS
tAH
WE#
OE#
tGHEL
tCP
tWHWH1 or 2
CE#
Data
tWS
tDS
tCPH
tBUSY
tDH
DOUT
DQ7
PD for program
30 for sector erase
10 for chip erase
A0 for program
55 for erase
tRH
RESET#
RY/BY#
NOTES:
1.PA=Program Address, PD=Program Data, DOUT=Data Out, DQ7=complement of data written to device.
2.Figure indicates the last two bus cycles of the command sequence.
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MX29SL800C T/B
AUTOMATIC CHIP ERASE TIMING WAVEFORM
All data in chip are erased. External erase verification is
not required because data is verified automatically by
internal control circuit. Erasure completion can be veri-
fied by DATA# polling and toggle bit checking after auto-
matic erase starts. Device outputs 0 during erasure
and 1 after erasure on Q7. (Q6 is for toggle bit; see toggle
bit, DATA# polling, timing waveform)
FIGURE 6. AUTOMATIC CHIP ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
Read Status Data
VA
tWC
tAS
VA
2AAh
555h
Address
CE#
tAH
tCH
tGHWL
OE#
WE#
tWHWH2
tWP
tCS
tWPH
tDS tDH
In
Progress
55h
10h
Complete
Data
tBUSY
tRB
RY/BY#
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
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MX29SL800C T/B
FIGURE 7. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 10H Address 555H
Data Pall from System
NO
Data=FFh ?
YES
Auto Chip Erase Completed
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MX29SL800C T/B
AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Sector indicated by A12 to A18 are erased. External
erase verify is not required because data are verified
automatically by internal control circuit. Erasure comple-
tion can be verified by DATA# polling and toggle bit check-
ing after automatic erase starts. Device outputs 0 dur-
ing erasure and 1 after erasure on Q7. (Q6 is for toggle
bit; see toggle bit, DATA# polling, timing waveform)
FIGURE 8. AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Erase Command Sequence(last two cycle)
Read Status Data
VA
tWC
tAS
Sector
Sector
Sector
VA
2AAh
Address
CE#
Address 0
Address 1
Address n
tAH
tCH
tGHWL
OE#
WE#
tWHWH2
tBAL
tWP
tCS
tWPH
tDS tDH
In
Progress
55h
30h
30h
30h
Complete
Data
tBUSY
tRB
RY/BY#
tVCS
VCC
NOTES:
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").
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MX29SL800C T/B
FIGURE 9. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 30H Sector Address
NO
Last Sector
to Erase
YES
Data Poll from System
NO
Data=FFh
YES
Auto Sector Erase Completed
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MX29SL800C T/B
FIGURE 10. ERASE SUSPEND/ERASE RESUME FLOWCHART
START
Write Data B0H
ERASE SUSPEND
NO
Toggle Bit checking Q6
not toggled
YES
Read Array or
Program
Reading or
NO
Programming End
YES
Write Data 30H
Delay Time (Note 2)
Continue Erase
ERASE RESUME
Another
NO
Erase Suspend ?
YES
Note:
1. If the system implements an endless erase suspend/resume loop, or the number of erase suspend/resume is
exceeded 1024 times, then the delay time must be put into consideration.
2. Delay timing: 1.5ms for MX29SL800C T/B.
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MX29SL800C T/B
FIGURE 11. IN-SYSTEM SECTOR PROTECT/UNPROTECTEDTIMINGWAVEFORM (RESET# Control)
VID
VIH
RESET#
SA, A6
A1, A0
Valid*
Valid*
Valid*
Sector Protect or Chip Unprotect
Verify
40h
Status
Data
60h
60h
Sector Protect =150us
Chip Unprotect =15ms
1us
CE#
WE#
OE#
Note: When sector protect, A6=0, A1=1, A0=0. When chip unprotect, A6=1, A1=1, A0=0.
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MX29SL800C T/B
FIGURE 12. SECTOR PROTECT TIMING WAVEFORM (A9, OE# Control)
A1
A6
10.5V
3V
A9
tVLHT
tVLHT
Verify
10.5V
3V
OE#
tVLHT
tWPP 1
WE#
CE#
tOESP
Data
01H
F0H
tOE
Sector Address
A18-A12
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MX29SL800C T/B
FIGURE 13. SECTOR PROTECTION ALGORITHM (A9, OE# Control)
START
Set Up Sector Addr
PLSCNT=1
OE#=VID, A9=VID, CE#=VIL
A6=VIL
Activate WE# Pulse
Time Out 150us
Set WE#=VIH, CE#=OE#=VIL
A9 should remain VID
.
Read from Sector
Addr=SA, A1=1
No
No
Data=01H?
PLSCNT=32?
Yes
Device Failed
Yes
Protect Another
Sector?
Remove VID from A9
Write Reset Command
Sector Protection
Complete
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MX29SL800C T/B
FIGURE 14. IN-SYSTEM SECTOR PROTECTION ALGORITHM WITH RESET#=VID
START
PLSCNT=1
RESET#=VID
Wait 1us
No
Temporary Sector
Unprotect Mode
First Write
Cycle=60H
Yes
Set up sector address
Write 60H to sector address
with A6=0, A1=1, A0=0
Wait 150us
Verify sector protect :
write 40H with A6=0,
A1=1, A0=0
Increment PLSCNT
Reset PLSCNT=1
Read from sector address
No
No
PLSCNT=25?
Data=01H ?
Yes
Yes
Device failed
Yes
Protect another
sector?
No
Remove VID from RESET#
Write reset command
Sector protect complete
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MX29SL800C T/B
FIGURE 15. IN-SYSTEM CHIP UNPROTECTION ALGORITHM WITH RESET#=VID
START
PLSCNT=1
RESET#=VID
Wait 1us
No
No
Temporary Sector
Unprotect Mode
First Write
Cycle=60H ?
Yes
All sector
Protect all sectors
protected?
Yes
Set up first sector address
Chip unprotect :
write 60H with
A6=1, A1=1, A0=0
Wait 50ms
Verify chip unprotect
write 40H to sector address
with A6=1, A1=1, A0=0
Increment PLSCNT
Read from sector address
with A6=1, A1=1, A0=0
No
No
Set up next sector address
PLSCNT=1000?
Data=00H ?
Yes
Yes
Device failed
Yes
Last sector
verified?
No
Remove VID from RESET#
Write reset command
Chip unprotect complete
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MX29SL800C T/B
FIGURE 16. TIMING WAVEFORM FOR CHIP UNPROTECTION (A9, OE# Control)
A1
10.5V
VCC
A9
A6
tVLHT
Verify
10.5V
VCC
OE#
tVLHT
tVLHT
tWPP 2
WE#
CE#
tOESP
Data
00H
F0H
tOE
A18-A12
Sector Address
Notes: tVLHT (Voltage transition time)=4us min.
tWPP1 (Write pulse width for sector protect)=100ns min, 10us(Typ.)
tWPP2 (Write pulse width for chip unprotected)=100ns min, 12ms(Typ.)
tOESP (OE# setup time to WE# active)=4us min.
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MX29SL800C T/B
FIGURE 17. CHIP UNPROTECTION ALGORITHM (A9, OE# Control)
START
Protect All Sectors
PLSCNT=1
Set OE#=A9=VID
CE#=VIL,A6=1
Activate WE# Pulse
Time Out 50ms
Increment
PLSCNT
Set OE#=CE#=VIL
A9=VID,A1=1
Set Up First Sector Addr
Read Data from Device
No
No
Data=00H?
Yes
PLSCNT=1000?
Increment
Sector Addr
Yes
Device Failed
No
All sectors have
been verified?
Yes
Remove VID from A9
Write Reset Command
Chip Unprotect
Complete
* It is recommended before unprotect whole chip, all sectors should be protected in advance.
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MX29SL800C T/B
WRITE OPERATION STATUS
FIGURE 18. DATA# POLLING ALGORITHM
Start
Read Q7~Q0
Add.=VA(1)
Yes
Q7 = Data ?
No
No
Q5 = 1 ?
Yes
Read Q7~Q0
Add.=VA
Yes
(2)
Q7 = Data ?
No
FAIL
Pass
NOTE : 1.VA=Valid address for programming
2.Q7 should be re-checked even Q5="1" because Q7 may change
simultaneously with Q5.
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MX29SL800C T/B
FIGURE 19. TOGGLE BIT ALGORITHM
Start
Read Q7-Q0
Read Q7-Q0
(Note 1)
NO
Toggle Bit Q6 =
Toggle ?
YES
NO
Q5= 1?
YES
Read Q7~Q0 Twice
(Note 1,2)
NO
Toggle bit Q6=
Toggle?
YES
Program/Erase Operation
Not Complete,Write
Reset Command
Program/Erase
operation Complete
Note:1.Read toggle bit twice to determine whether or not it is toggling.
2. Recheck toggle bit because it may stop toggling as Q5 change to "1".
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MX29SL800C T/B
FIGURE 20. DATA# Polling Timings (During Automatic Algorithms)
tRC
VA
VA
VA
Address
CE#
tACC
tCE
tCH
tOE
OE#
WE#
tOEH
tDF
tOH
High Z
High Z
Complement
Status Data
Complement
Status Data
True
True
Valid Data
Valid Data
DQ7
Q0-Q6
tBUSY
RY/BY#
NOTES:
1. VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle.
2. CE# must be toggled when DATA# polling.
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FIGURE 21. Toggle Bit Timings (During Automatic Algorithms)
tRC
VA
VA
VA
VA
Address
CE#
tACC
tCE
tCH
tOE
OE#
tDF
tOEH
WE#
tOH
High Z
Valid Status
(second read)
Valid Status
(first read)
Valid Data
Valid Data
Q6/Q2
(stops toggling)
tBUSY
RY/BY#
NOTES:
1. VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle,
and array data read cycle.
2. CE# must be toggled when toggle bit toggling.
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MX29SL800C T/B
TABLE 13. AC CHARACTERISTICS
Parameter Std Description
Test Setup All Speed Options Unit
tREADY1
RESET# PIN Low (During Automatic Algorithms)
MAX
20
us
to Read or Write (See Note)
tREADY2
RESET# PIN Low (NOT During Automatic
Algorithms) to Read or Write (See Note)
RESET# Pulse Width (During Automatic Algorithms)
RESET# HighTime Before Read (See Note)
RY/BY# Recovery Time (to CE#, OE# go low)
MAX
500
ns
tRP
tRH
tRB
MIN
MIN
MIN
500
200
0
ns
ns
ns
Note: Not 100% tested
FIGURE 22. RESET# TIMING WAVEFORM
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tReady2
Reset Timing NOT during Automatic Algorithms
tReady1
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Reset Timing during Automatic Algorithms
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MX29SL800C T/B
AC CHARACTERISTICS
TABLE 14. WORD/BYTE CONFIGURATION (BYTE#)
Parameter
Std
Description
Speed OptionsUnit JEDEC
-90
tELFL/tELFH CE# to BYTE# Switching Low or High
Max
Max
Min
5
30
90
ns
ns
ns
tFLQZ
tFHQV
BYTE# Switching Low to Output HIGH Z
BYTE# Switching High to Output Active
FIGURE 23. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte
mode to word mode)
CE#
OE#
tELFH
BYTE#
DOUT
(Q0-Q7)
DOUT
(Q0-Q14)
Q0~Q14
Q15/A-1
DOUT
(Q15)
VA
tFHQV
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FIGURE 24. BYTE# TIMINGWAVEFORM FOR READ OPERATIONS (BYTE# switching from word
mode to byte mode)
CE#
OE#
tELFH
BYTE#
DOUT
(Q0-Q14)
DOUT
(Q0-Q7)
Q0~Q14
Q15/A-1
DOUT
(Q15)
VA
tFLQZ
FIGURE 25. BYTE# TIMING WAVEFORM FOR PROGRAM OPERATIONS
CE#
The falling edge of the last WE# signal
WE#
BYTE#
tAS
tAH
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TABLE 15. TEMPORARY SECTOR UNPROTECTED
Parameter Std. Description
Test Setup All Speed Options Unit
tVIDR
tRSP
VID Rise and Fall Time (See Note)
Min
Min
500
4
ns
us
RESET# Setup Time for Temporary Sector Unprotected
Note:
Not 100% tested
FIGURE 26. TEMPORARY SECTOR UNPROTECTED TIMING DIAGRAM
10.5V
RESET#
0 or VCC
0 or VCC
Program or Erase Command Sequence
tVIDR
tVIDR
CE#
WE#
tRSP
RY/BY#
FIGURE 27. Q6 vs Q2 for Erase and Erase Suspend Operations
Enter Embedded
Erasing
Erase
Enter Erase
Erase
Suspend
Suspend Program
Resume
Erase
Erase
Erase Suspend
Read
Erase
Erase
WE#
Q6
Suspend
Program
Complete
Q2
NOTES:
The system can use OE or CE to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended
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FIGURE 28. TEMPORARY SECTOR UNPROTECTED ALGORITHM
Start
RESET# = VID (Note 1)
Perform Erase or Program Operation
Operation Completed
RESET# = VIH
Temporary Sector Unprotect Completed(Note 2)
Note :
1. All protected sectors are temporary unprotected.
VID=10V~11V
2. All previously protected sectors are protected again.
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MX29SL800C T/B
FIGURE 29. ID CODE READ TIMING WAVEFORM
VCC
1.8V
VID
ADD
A9
VIH
VIL
VIH
VIL
ADD
A0
tACC
tACC
VIH
VIL
A1
ADD
A2-A8
VIH
A10-A18 VIL
CE#
VIH
VIL
VIH
VIL
tCE
WE#
OE#
tOE
VIH
VIL
tDF
tOH
tOH
VIH
VIL
DATA
Q0-Q15
DATA OUT
DATA OUT
EAH/6BH (Byte)
C2H/00C2H
22EAH/226BH (Word)
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MX29SL800C T/B
RECOMMENDED OPERATING CONDITIONS
At Device Power-Up
AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up.
If the timing in the figure is ignored, the device may not operate correctly.
VCC(min)
VCC
GND
tVR
tACC
tR or tF
tR or tF
VIH
VIL
Valid
ADDRESS
CE#
Address
tF
tCE
tR
VIH
VIL
VIH
VIL
WE#
tF
tOE
tR
VIH
VIL
OE#
VIH
VIL
WP#/ACC
DATA
VOH
VOL
High Z
Valid
Ouput
Figure A. ACTiming at Device Power-Up
Notes
Symbol
Parameter
Min.
Max.
Unit
us/V
us/V
us/V
tVR
tR
VCC RiseTime
1
20
500000
20
Input Signal RiseTime
Input Signal Fall Time
1,2
1,2
tF
20
Notes :
1. Sampled, not 100% tested.
2. This specification is applied for not only the device power-up but also the normal operations.
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MX29SL800C T/B
TABLE 16. ERASE AND PROGRAMMING PERFORMANCE (1)
LIMITS
TYP.(2)
1.3
PARAMETER
MIN.
MAX.(3)
UNITS
sec
Sector Erase Time
Chip Erase Time
15
18
sec
Byte Programming Time
Word Programming Time
Chip Programming Time
12
72
us
18
108
us
Byte Mode
Word Mode
12.6
9.6
sec
sec
Erase/Program Cycles
100,000
Cycles
Note: 1. Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C, 1.8V.
3. Maximum values measured at 90°C, 1.65V, 100K cycles.
TABLE 17. LATCH-UP CHARACTERISTICS
MIN.
-1.0V
MAX.
Input Voltage with respect to GND on OE#, RESET#, A9
Input Voltage with respect to GND on all power pins, Address pins, CE# and WE#
Input Voltage with respect to GND on all I/O pins
11V
-1.0V
2xVCC
-1.0V
VCC + 1.0V
+100mA
Current
-100mA
Includes all pins except VCC. Test conditions: VCC = 1.8V, one pin at a time.
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MX29SL800C T/B
ORDERING INFORMATION
PART NO.
ACCESS
OPERATING
STANDBY
PACKAGE
Remark
TIME (ns) Current MAX. (mA) Current MAX. (uA)
MX29SL800CTTC-90
MX29SL800CBTC-90
MX29SL800CTXBC-90
MX29SL800CBXBC-90
MX29SL800CTXEC-90
MX29SL800CBXEC-90
MX29SL800CTXHC-90
90
90
90
90
90
90
90
12
12
12
12
12
12
12
5
5
5
5
5
5
5
48-PinTSOP
(NormalType)
48-PinTSOP
(NormalType)
48-ball CSP
(Ball Size:0.3mm)
48-ball CSP
(Ball Size:0.3mm)
48-ball CSP
(Ball Size:0.4mm)
48-ball CSP
(Ball Size:0.4mm)
48-ball CSP
(Ball Pitch:0.5mm,
Ball Size:0.3mm)
48-ball CSP
MX29SL800CBXHC-90
90
12
5
(Ball Pitch:0.5mm,
Ball Size:0.3mm)
48-PinTSOP
MX29SL800CTTI-90
MX29SL800CBTI-90
MX29SL800CTXBI-90
MX29SL800CBXBI-90
MX29SL800CTXEI-90
MX29SL800CBXEI-90
MX29SL800CTXHI-90
90
90
90
90
90
90
90
12
12
12
12
12
12
12
5
5
5
5
5
5
5
(NormalType)
48-PinTSOP
(NormalType)
48-ball CSP
(Ball Size:0.3mm)
48-ball CSP
(Ball Size:0.3mm)
48-ball CSP
(Ball Size:0.4mm)
48-ball CSP
(Ball Size:0.4mm)
48-ball CSP
(Ball Pitch:0.5mm,
Ball Size:0.3mm)
48-ball CSP
MX29SL800CBXHI-90
90
12
5
(Ball Pitch:0.5mm,
Ball Size:0.3mm)
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MX29SL800C T/B
PART NAME DESCRIPTION
MX 29 SL 800 C T T C 90 G
OPTION:
G: Lead-free package
blank: normal
SPEED:
90: 90ns
TEMPERATURE RANGE:
C: Commercial (0˚C to 70˚C)
I: Industrial (-40˚C to 85˚C)
PACKAGE:
T: TSOP
XB: CSP (0.8mm ball pitch, 0.3mm ball size)
XE: CSP (0.8mm ball pitch, 0.4mm ball size)
XH: CSP (0.5mm ball pitch, 0.3mm ball size)
BOOT BLOCK TYPE:
T: Top Boot
B: Bottom Boot
REVISION:
C
DENSITY & MODE:
800: 8M, x8/x16 Boot Block
TYPE:
SL: 1.8V
DEVICE:
29: Flash
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PACKAGE INFORMATION
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REVISION HISTORY
Revision No. Description
Page
Date
1.0
1. Removed "Preliminary" title
P1
APR/20/2006
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MX29SL800C T/B
MACRONIX INTERNATIONALCO., LTD.
Headquarters:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
Europe Office :
TEL:+32-2-456-8020
FAX:+32-2-456-8021
Hong Kong Office :
TEL:+86-755-834-335-79
FAX:+86-755-834-380-78
Japan Office :
Kawasaki Office :
TEL:+81-44-246-9100
FAX:+81-44-246-9105
Osaka Office :
TEL:+81-6-4807-5460
FAX:+81-6-4807-5461
Singapore Office :
TEL:+65-6346-5505
FAX:+65-6348-8096
Taipei Office :
TEL:+886-2-2509-3300
FAX:+886-2-2509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-262-8887
FAX:+1-408-262-8810
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
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