PC29M33AT-E1 [NEC]
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR; 三端低压差稳压器
| 型号： | PC29M33AT-E1 |
| 厂家： | 
NEC |
| 描述： | THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR |
| 文件： | 总16页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC29M33A,µPC29M05A
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
DESCRIPTION
The µPC29M33A, µPC29M05A of low dropout voltage three terminal positive regulators is constructed with PNP output
transistor. The µPC29M33A, µPC29M05A feature the ability to source 0.5 A of output current with a low dropout voltage
of typically 0.5 V.
The power dissipation of the µPC29M33A, µPC29M05A can be drastically reduced compared with the conventional
three terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to
the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators ( µPC24M00A series).
FEATURES
• Output current in excess of 0.5 A
• Low dropout voltage VDIF = 0.5 V TYP. (at IO = 0.5 A)
• On-chip overcurrent and thermal protection circuit
• On-chip output transistor safe area protection circuit
PIN CONFIGURATION (Marking Side)
µPC29M33AHF,
µPC29M05AHF: MP-45G
µPC29M33AHB, PC29M05AHB: MP-3
µ
µ
PC29M33A, PC29M05AT: MP-3Z
µ
4
1
2
3
1
2
3
1: INPUT
1: INPUT
2: GND
3: OUTPUT
2: GND
3: OUTPUT
4: GND (Fin)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G15368EJ1V0DS00 (1st edition)
Date Published May 2001 NS CP(K)
Printed in Japan
2001
©
µPC29M33A,µPC29M05A
BLOCK DIAGRAM
INPUT
Safe operating
area protection
Start-up
circuit
Reference
voltage
Saturation
protection
Error
amp.
Drive
circuit
OUTPUT
Thermal
shut down
Over current
protection
GND
2
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
ORDERING INFORMATION
Part Number
Package
Output Voltage
3.3 V
Marking
29M33A
Package Type
µPC29M33AHF
MP-45G
• Packed in envelope
(Isolated TO-220)
MP-3 (SC-64)
MP-3Z (SC-63)
MP-3Z (SC-63)
µPC29M33AHB
µPC29M33AT
3.3 V
3.3 V
3.3 V
29M33A
29M33A
29M33A
• Packed in envelope
• Packed in envelope
• 16 mm wide embossed taping
• Pin 1 on drawout side
• 2000 pcs/reel
µPC29M33AT-E1
µPC29M33AT -E2
µPC29M33AT -T1
µPC29M33AT -T2
µPC29M05AHF
MP-3Z (SC-63)
MP-3Z (SC-63)
MP-3Z (SC-63)
3.3 V
3.3 V
3.3 V
5.0 V
29M33A
29M33A
29M33A
29M05A
• 16 mm width embossed taping
• Pin 1 at takeup side
• 2000 pcs/reel
• 32 mm wide adhesive taping
• Pin 1 at drawout side
• 1500 pcs/reel
• 32 mm wide adhesive taping
• Pin 1 at takeup side
• 1500 pcs/reel
MP-45G
• Packed in envelope
(Isolated TO-220)
MP-3 (SC-64)
MP-3Z (SC-63)
MP-3Z (SC-63)
µPC29M05AHB
µPC29M05AT
µPC2905AT-E1
5.0 V
5.0 V
5.0 V
29M05A
29M05A
29M05A
• Packed in envelope
• Packed in envelope
• 16 mm wide embossed taping
• Pin 1 at drawout side
• 2000 pcs/reel
µPC2905AT-E2
µPC2905AT-T1
µPC2905AT-T2
MP-3Z (SC-63)
MP-3Z (SC-63)
MP-3Z (SC-63)
5.0 V
5.0 V
5.0 V
29M05A
29M05A
29M05A
• 16 mm wide embossed taping
• Pin 1 at takeup side
• 2000 pcs/reel
• 32 mm wide adhesive taping
• Pin 1 at drawout side
• 1500 pcs/reel
• 32 mm wide adhesive taping
• Pin 1 at takeup side
• 1500 pcs/reel
3
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Rating
Parameter
Symbol
Unit
µPC29M33AHF,
µPC29M05AHF
µPC29M33AHB, µPC29M05AHB
µPC29M33AT, µPC29M05AT
Input Voltage
Internal Power Dissipation
VIN
20
V
W
Note
(TC = 25°C)
PT
15
10
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
TA
–30 to +85
–30 to +150
–55 to +150
°C
TJ
°C
Tstg
°C
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Rth(J-C)
Rth(J-A)
7
12.5
125
°C/W
°C/W
65
Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the
output voltage.
Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the
quality of the product may be degraded. In other words, absolute maximum ratings specify the
values exceeding which the product may be physically damaged. Be sure to use the product with
these ratings never exceeded.
STANDARD CONNECTION
D1
PC29M33A, PC29M05A
INPUT
OUTPUT
+
D2
CIN
COUT
CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure
to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and
temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure
that CIN is 0.1 µF or higher for the voltage and temperature range to be used.
COUT: 47 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place
CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
4
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
RECOMMENDED OPERATING CONDITIONS
Parameter
Input Voltage
Symbol
VIN
Type Number
MIN.
4.3
6
TYP.
MAX.
16
Unit
V
µPC29M33A
µPC29M05A
16
Output Current
IO
All
All
0
0.5
A
TA
–30
+85
°C
Operating Ambient Temperature
Operating Junction Temperature
TJ
All
–30
+125
°C
ELECTRICAL CHARACTERISTICS
µPC29M33A (TJ = 25°C, VIN = 5 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
VO
Conditions
MIN.
3.18
TYP.
3.3
MAX.
3.42
Unit
V
0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 350 mA
3.14
3.46
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A
4.3 V ≤ VIN ≤ 16 V
Line Regulation
Load Regulation
Quiescent Current
REGIN
REGL
IBIAS
8
10
1.8
15
9
33
33
3.0
20
20
50
15
mV
mA
mA
0 A ≤ IO ≤ 0.5 A
IO = 0 A
IO = 0.5 A
Startup Quiescent Current
IBIAS (s)
VIN = 3.1 V, IO = 0 A
VIN = 3.1 V, IO = 0.5 A
0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V
10 Hz ≤ f ≤ 100 kHz
4.3 V ≤ VIN ≤ 16 V, f = 120 Hz
0°C ≤ TJ ≤ 125°C, IO = 0.5 A
VIN = 4.5 V
Quiescent Current Change
Output Noise Voltage
Ripple Rejection
∆IBIAS
Vn
2.9
56
mA
µVr.m.s.
dB
R•R
VDIF
IOpeak
48
64
Dropout Voltage
0.5
1.1
0.6
1.2
1.0
1.0
1.5
V
Short Circuit Current
0.7
A
VIN = 16 V
Peak Output Current
IOpeak
VIN = 4.5 V
0.7
0.6
1.5
1.5
A
VIN = 16 V
Temperature Coefficient of
Output Voltage
∆VO /∆T
0°C ≤ TJ ≤ 125°C, IO = 5 mA
–0.4
mV/°C
5
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
µPC29M05A (TJ = 25°C, VIN = 8 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
VO
Conditions
MIN.
4.83
TYP.
5.0
MAX.
5.18
Unit
V
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 350 mA
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A
6 V ≤ VIN ≤ 16 V
4.75
5.25
Line Regulation
Load Regulation
Quiescent Current
REGIN
REGL
IBIAS
26
17
1.9
15
10
50
50
4.0
20
20
50
15
mV
mV
mA
0 A ≤ IO ≤ 0.5 A
IO = 0 A
IO = 0.5 A
Startup Quiescent Current
IBIAS (s)
VIN = 4.5 V, IO = 0 A
VIN = 4.5 V, IO = 0.5 A
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V
10 Hz ≤ f ≤ 100 kHz
6 V ≤ VIN ≤ 16 V, f = 120 Hz
0°C ≤ TJ ≤ 125°C, IO = 0.5 A
VIN = 6.5 V
mA
Quiescent Current Change
Output Noise Voltage
Ripple Rejection
∆IBIAS
Vn
2.4
87
mA
µVr.m.s.
dB
R•R
VDIF
IOpeak
46
60
Dropout Voltage
0.5
1.1
0.6
1.2
1.1
1.0
1.5
V
Short Circuit Current
0.65
A
VIN = 16 V
Peak Output Current
IOpeak
VIN = 6.5 V
0.7
0.6
1.5
1.5
A
VIN = 16 V
Temperature Coefficient of
Output Voltage
∆VO /∆T
0°C ≤ TJ ≤ 125°C, IO = 5 mA
0.7
mV/°C
6
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
TYPICAL CHARACTERISTICS (Reference Values)
∆V
O
vs T
J
150
100
50
20
15
10
Solid line:
µ
PC29M33AHF, µPC29M05AHF
Broken line:
PC29M33AHB , PC29M05AHB
PC29M33AT , PC29M05AT
µ
µ
µ
µ
With infinite heatsink
µ
PC29M05A
0
µ
PC29M33A
–50
–100
5
0
–150
–200
I
O
= 5 mA
0
25
50
75
100
125
150
0
50
100 150
–50
T
A
- Operating Ambient Temperature - ˚C
T
J
- Operating Junction Temperature - ˚C
µ
VO vs. VIN ( PC29M05A)
µ
VO vs. VIN ( PC29M33A)
8
7
6
5
4
3
2
4.0
3.5
3.0
2.5
2.0
1.5
1.0
TJ = 25˚C
TJ = 25˚C
I
O
= 5 mA
I = 0.5 A
O
I
O
= 0.35 A
I
O
= 0.35 A
= 5 mA
IO = 0.5 A
I
O
1
0
0.5
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
V
IN - Input Voltage - V
V
IN - Input Voltage - V
I
BIAS (IBIAS(s)) vs. VIN
(
µ
PC29M33A)
I
BIAS (IBIAS(s)) vs. VIN
µ
( PC29M05A)
50
40
30
20
50
40
30
20
T
J
= 25˚C
T
= 25˚C
I
O
= 0.5 A
IO
= 0.5 A
I
O
= 0.35 A
10
0
10
0
IO = 0.35 A
IO = 0 A
O
= 0 A
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
V
IN - Input Voltage - V
V
IN - Input Voltage - V
7
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
V
DIF vs. T
J
I
Opeak vs. VDIF ( PC29M33A)
µ
1.0
0.8
0.6
0.4
0.2
0
1.5
1.0
TJ = 0˚C
PC29M05A
µ
T = 25˚C
J
PC29M33A
µ
TJ = 125˚C
0.5
0.0
I
O
= 0.5 A
125
-25
0
25
50
75
100
150
0
5
10
15
20
V
DIF - Dropout Voltage - V
TJ - Operating Junction Temperature - ˚C
R·R vs f
I
Opeak vs. VDIF
µ
( PC2905A)
80
70
60
50
40
30
1.5
1.0
T = 0˚C
J
µ
PC29M33A
PC29M05A
µ
T = 25˚C
J
0.5
0.0
T
J
= 125˚C
T
J
= 25˚C, I
O = 0.5 A
4.3 V ≤ VIN ≤ 16 V PC29M33A
6 V≤ VIN ≤ 16 V PC29M05A
µ
20
0
µ
10
100
1 k
10 k
100 k
0
5
10
15
20
f - Frequency - Hz
V
DIF - Dropout Voltage - V
.
VDIF vs. I
O
R
R vs. I
O
80
70
60
50
1.0
TJ = 25˚C
0.8
0.6
0.4
µ
PC29M33A
µ
PC29M05A
µ
PC29M33A
T
J
= 25˚C, f = 120 Hz
PC29M05A
µ
4.3 V ≤ VIN ≤ 16 V PC29M33A
µ
40
30
0.2
0
6 V≤ VIN ≤ 16 V PC29M05A
µ
0
0.1
0.2
0.3
0.4
0.5
0
0.1
0.2
0.3
0.4
0.5
IO - Output Current - A
IO - Output Current - A
8
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
V
O
vs. IO ( PC29M05A)
µ
VO
vs. I ( PC29M33A)
O
µ
6
5
4
3
2
1
6
5
4
3
2
1
T = 25˚C
J
T = 25˚C
J
VIN =
8 V
V
= 5 V
V
IN = 16 V
V
IN = 16 V
V
IN = 6 V
VIN
= 4.3 V
0
0.2
0.4
0.6
0.8
1.0
1.2
0
0.2
0.4
0.6
0.8
1.0
1.2
I
O
- Output Current - A
I
O
- Output Current - A
9
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
PACKAGE DRAWINGS
µPC29M33AHF, µPC29M05AHF
3PIN PLASTIC SIP (MP-45G)
A
B
N
P
E
I
L
M
D
1
2
3
K
Y
V
U
J
H
Z
C
M
F
G
NOTE
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
ITEM MILLIMETERS
A
B
C
D
E
F
G
H
I
10.0±0.2
7.0±0.2
1.50±0.2
17.0±0.3
φ
3.3±0.2
0.75±0.10
0.25
2.54 (T.P.)
5.0±0.3
J
2.46±0.2
5.0±0.2
K
L
8.5±0.2
M
N
P
U
V
Y
Z
8.5±0.2
4.5±0.2
2.8±0.2
2.4±0.5
0.65±0.10
8.9±0.7
1.30±0.2
P3HF-254B-4
10
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
µPC29M33AHB, µPC29M05AHB
MP-3(SC-64) (Unit: mm)
2.3±0.2
±
6.5 0.2
5.0 0.2
±
0.5±0.1
4
1
2
3
1.1±0.1
0.2
0.5+–
0.1
0.2
0.5+–
0.1
2.3 2.3
µPC29M33AT, µPC29M05AT
MP-3Z (SC-63) (Unit: mm )
2.3±0.2
6.5
±
±
0.2
0.2
1
0.5±0.
5.0
4
1
2
3
1.1±0.2
0.9 MAX.
0.8 MAX.
2.3
2.3
0.8
11
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface Mount Device
µPC29M33AT, µPC29M05AT: MP-3Z (SC-63)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 2 times or less.
IR35-00-2
Vapor Phase Soldering
Wave Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 2 times or less.
VP15-00-2
WS60-00-1
–
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Through-hole devices
µPC29M33AHF, µPC29M05AHF: MP-45G
µPC29M33AHB, µPC29M05AHB: MP-3
Process
Wave soldering
Conditions
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
(only to leads)
Partial heating method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
12
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
NOTES ON USE
When the µPC29M33A, µPC29M05A are used with an input voltage that is lower than the value indicated in the
recommended operating conditions, a large quiescent current flows through the device due to saturation of the transistor
of the output stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS).
These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the
power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts
up.
REFERENCE DOCUMENTS
Document Name
Document No.
C11531E
QUALITY GRADE ON NEC SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
VOLTAGE REGULATOR OF SMD
C10535E
G11872E
X13769E
SEMICONDUCTOR SELECTION GUIDE – PRODUCTS AND PACKAGES
13
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
[MEMO]
14
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
[MEMO]
15
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
•
The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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