PS2561AL-1-A [NEC]

Transistor Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, PLASTIC, SURFACE MOUNT, DIP-4;
PS2561AL-1-A
型号: PS2561AL-1-A
厂家: NEC    NEC
描述:

Transistor Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, PLASTIC, SURFACE MOUNT, DIP-4

输出元件 光电
文件: 总16页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
PHOTOCOUPLER  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
HIGH ISOLATION VOLTAGE  
SINGLE TRANSISTOR TYPE  
MULTI PHOTOCOUPLER SERIES  
NEPOC Series−  
DESCRIPTION  
The PS2561A-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon  
phototransistor to realize an excellent cost performance.  
The PS2561A-1 is in a plastic DIP (Dual In-line Package) and the PS2561AL-1 is lead bending type (Gull-wing) for  
surface mount.  
The PS2561AL1-1 is lead bending L1 type and the PS2561AL2-1 is lead bending L2 type (Gull-wing).  
FEATURES  
PIN CONNECTION  
Lead-free product : Solder plating specification Sn-Bi  
High isolation voltage (BV = 5 000 Vr.m.s.)  
Ordering number of taping product: PS2561AL-1-E3, E4, F3, F4  
: PS2561AL2-1-E3, E4  
(Top View)  
4
3
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2
Safety standards  
1
UL, BSI, CSA, NEMKO, DEMKO, SEMKO, FIMKO, approved  
DIN EN60747-5-2 (VDE0884 Part2) approved (option)  
APPLICATIONS  
Power supply  
Telephone/FAX.  
FA/OA equipment  
Programmable logic controller  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10222EJ02V0DS (2nd edition)  
Date Published May 2004 CP(K)  
Printed in Japan  
The mark  shows major revised points.  
NEC Compound Semiconductor Devices 2003, 2004  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
PACKAGE DIMENSIONS (UNIT : mm)  
DIP Type  
Long Creepage Distance  
PS2561AL1-1  
PS2561A-1  
4.6±0.35  
4.6±0.35  
4
3
4
3
7.62  
1
2
1
2
10.16  
0 to 15˚ +0.1  
0.25–0.05  
0.50±0.1  
0.25 M  
1.25±0.15  
0.50±0.10  
0.25  
+0.1  
1.25±0.15  
M
0.25  
–0.05  
0 to 15˚  
2.54  
2.54  
Lead Bending Type  
PS2561AL-1  
Long Creepage Distance (Gull-Wing)  
PS2561AL2-1  
4.6±0.35  
4.6±0.35  
4
3
4
3
1
2
1
2
0.9±0.25  
0.25  
1.25±0.15  
0.25 M  
10.16  
1.25±0.15  
0.25  
0.9±0.25  
9.60±0.4  
+0.2  
–0.5  
11.8  
2.54  
M
0.15  
2.54  
2
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
MARKING EXAMPLE  
No. 1 pin  
Mark  
2561A  
N 301  
Assembly Lot  
N
3
01  
Week Assembled  
Year Assembled  
(Last 1 Digit)  
In-house Code  
CTR Rank Code  
Solder plating  
specification  
Made in Japan Made in Taiwan  
Package  
H
K
New PKG  
E
J
Sn-Pb  
Sn-Bi  
3
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
ORDERING INFORMATION (1/2)  
Part Number  
Package  
Packing Style  
Safety Standard  
Approval  
Solder plating Application Part  
Specification  
Number*1  
PS2561A-1  
4-pin DIP Magazine case 100 pcs  
Standard products  
(UL, CSA, BSI,  
Sn-Pb  
PS2561A-1  
PS2561AL-1  
PS2561AL1-1  
NEMKO, DEMKO,  
SEMKO, FIMKO  
PS2561AL2-1  
PS2561AL-1-E3  
PS2561AL-1-E4  
PS2561AL2-1-E3  
PS2561AL2-1-E4  
PS2561AL-1-F3  
PS2561AL-1-F4  
PS2561A-1-V  
Embossed Tape 1 000 pcs/reel approved)  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 2 000 pcs/reel  
Magazine case 100 pcs  
DIN EN60747-5-2  
(VDE0884 Part2)  
Approved products  
(option)  
PS2561AL-1-V  
PS2561AL1-1-V  
PS2561AL2-1-V  
PS2561AL-1-V-E3  
PS2561AL-1-V-E4  
PS2561AL2-1-V-E3  
PS2561AL2-1-V-E4  
PS2561AL-1-V-F3  
PS2561AL-1-V-F4  
PS2561A-1-A  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 2 000 pcs/reel  
Magazine case 100 pcs  
Standard products  
(UL, CSA, BSI,  
Sn-Bi  
PS2561AL-1-A  
PS2561AL1-1-A  
PS2561AL2-1-A  
PS2561AL-1-E3-A  
PS2561AL-1-E4-A  
PS2561AL2-1-E3-A  
PS2561AL2-1-E4-A  
PS2561AL-1-F3-A  
PS2561AL-1-F4-A  
NEMKO, DEMKO,  
SEMKO, FIMKO  
Embossed Tape 1 000 pcs/reel approved)  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 2 000 pcs/reel  
*1 For the application of the Safety Standard, following part number should be used.  
4
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
ORDERING INFORMATION (2/2)  
Part Number  
Package  
Packing Style  
Safety Standard  
Approval  
Solder plating Application Part  
Specification  
Number*1  
PS2561A-1-V-A  
4-pin DIP Magazine case 100 pcs  
DIN EN60747-5-2  
(VDE0884 Part2)  
Approved products  
(option)  
Sn-Bi  
PS2561A-1  
PS2561AL-1-V-A  
PS2561AL1-1-V-A  
PS2561AL2-1-V-A  
PS2561AL-1-V-E3-A  
PS2561AL-1-V-E4-A  
PS2561AL2-1-V-E3-A  
PS2561AL2-1-V-E4-A  
PS2561AL-1-V-F3-A  
PS2561AL-1-V-F4-A  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 1 000 pcs/reel  
Embossed Tape 2 000 pcs/reel  
*1 For the application of the Safety Standard, following part number should be used.  
5
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)  
Parameter  
Symbol  
VR  
Ratings  
Unit  
V
Diode  
Reverse Voltage  
6
Forward Current (DC)  
Power Dissipation Derating  
Power Dissipation  
IF  
30  
mA  
PD/°C  
PD  
1.5  
mW/°C  
mW  
A
150  
Peak Forward Current*1  
IFP  
0.5  
Transistor Collector to Emitter Voltage  
Emitter to Collector Voltage  
Collector Current  
VCEO  
VECO  
IC  
70  
V
5
30  
V
mA  
Power Dissipation Delay  
Power Dissipation  
PC/°C  
PC  
1.5  
mW/°C  
mW  
Vr.m.s.  
°C  
150  
Isolation Voltage*2  
BV  
5 000  
Operating Ambient Temperature  
Storage Temperature  
TA  
55 to +100  
55 to +150  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1%  
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output  
6
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.2  
MAX.  
1.4  
5
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
Terminal Capacitance  
IF = 10 mA  
VR = 5 V  
IR  
µA  
pF  
nA  
Ct  
V = 0 V, f = 1.0 MHz  
VCE = 70 V, IF = 0 mA  
10  
Transistor Collector to Emitter Dark  
Current  
ICEO  
100  
300  
0.3  
Coupled  
Current Transfer Ratio  
(IC/IF)*1  
CTR  
IF = 5 mA, VCE = 5 V  
IF = 10 mA, IC = 2 mA  
50  
%
V
Collector Saturation  
Voltage  
VCE (sat)  
0.13  
Isolation Resistance  
Isolation Capacitance  
Rise Time*2  
RI-O  
CI-O  
tr  
VI-O = 1.0 kVDC  
1011  
V = 0 V, f = 1.0 MHz  
0.4  
5
pF  
µs  
VCC = 10 V, IC = 2 mA, RL = 100 Ω  
Fall Time*2  
tf  
7
*1 CTR rank  
N :  
H :  
50 to 300 (%)  
80 to 160 (%)  
Q : 100 to 200 (%)  
W : 130 to 260 (%)  
*2 Test circuit for switching time  
Pulse Input  
V
CC  
PW = 100  
µ
s
Duty Cycle = 1/10  
I
F
V
OUT  
50  
RL  
= 100 Ω  
7
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)  
TRANSISTOR POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
DIODE POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
200  
150  
100  
50  
200  
150  
100  
50  
1.5 mW/˚C  
1.5 mW/˚C  
0
25  
50  
75  
100  
(˚C)  
125  
0
25  
50  
75  
100  
(˚C)  
125  
Ambient Temperature T  
A
Ambient Temperature T  
A
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
100  
50  
25  
20  
15  
10  
5
T
A
= +100˚C  
+60˚C  
I = 10 mA  
F
+25˚C  
10  
5
0˚C  
–25˚C  
–55˚C  
I
I
F
F
= 5 mA  
1
0.5  
= 2 mA  
= 1 mA  
0.1  
I
F
0.05  
0
2
4
6
8
10  
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5  
Forward Voltage V  
F
(V)  
Collector to Emitter Voltage VCE (V)  
COLLECTOR TO EMITTER DARK  
CURRENT vs. AMBIENT TEMPERATURE  
COLLECTOR CURRENT vs.  
COLLECTOR SATURATION VOLTAGE  
10 000  
10  
IF = 10mA  
I
F
= 5mA  
= 2mA  
1 000  
100  
10  
I
F
V
CE = 70 V  
1
V
CE = 24 V  
I
F
= 1mA  
1
0.1  
0
0.2  
0.4  
0.6  
0.8  
1.0  
0
25  
50  
75  
100  
Ambient Temperature T  
A
(˚C)  
Collector Saturation Voltage VCE(sat) (V)  
Remark  
The graphs indicate nominal characteristics.  
8
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
NORMALIZED CURRENT TRANSFER  
RATIO vs. AMBIENT TEMPERATURE  
CURRENT TRANSFER RATIO vs.  
FORWARD CURRENT  
300  
250  
200  
150  
100  
50  
1.4  
V
n = 2  
CE = 5 V,  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
Sample A  
B
Normalized to 1.0  
at T = 25˚C,  
A
I
F
= 5 mA, VCE = 5 V  
CTR:130%  
CTR:270%  
0
0
50  
25  
0
25  
50  
75  
100  
0.01  
0.1  
1
10  
100  
Ambient Temperature T  
A
(˚C)  
Forward Current I  
F
(mA)  
SWITCHING TIME vs.  
LOAD RESISTANCE  
SWITCHING TIME vs.  
LOAD RESISTANCE  
1 000  
100  
10  
100  
10  
I
C
= 2 mA, VCC = 10 V,  
I
F
= 5 mA, VCC = 5 V,  
CTR = 216%  
CTR = 216%  
t
t
f
t
t
f
r
µ
µ
s
t
d
t
s
1
t
r
t
d
0.1  
10  
1
1
10  
Load Resistance R  
100  
100  
1 000  
()  
10 000  
Load Resistance R  
L
L
(k)  
FREQUENCY RESPONSE  
LONG TERM CTR DEGRADATION  
5
0
5
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I = 5 mA (TYP.)  
F
T
A
= 25˚C  
= 60˚C  
100 Ω  
10  
15  
20  
25  
300 Ω  
T
A
R = 1 kΩ  
L
I
V
F
= 5 mA,  
CE = 5 V  
0
0.1  
1
10  
Frequency f (kHz)  
100  
1 000  
10  
102  
103  
Time (Hr)  
104  
105  
Remark The graphs indicate nominal characteristics.  
9
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
TAPING SPECIFICATIONS (UNIT : mm)  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
+0.1  
4.5 MAX.  
φ
1.5–0  
1.55±0.1  
4.0±0.1  
5.3±0.1  
8.0±0.1  
0.4  
Tape Direction  
PS2561AL-1-E3  
PS2561AL-1-E4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
φ13.0±0.2  
R 1.0  
φ
φ
φ21.0±0.8  
17.5±1.0  
21.5±1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 1 000 pcs/reel  
10  
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
+0.1  
4.5 MAX.  
φ
1.5–0  
1.55±0.1  
4.0±0.1  
5.3±0.1  
8.0±0.1  
0.4  
Tape Direction  
PS2561AL-1-F3  
PS2561AL-1-F4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
φ
R 1.0  
φ
φ
φ
21.0±0.8  
17.5±1.0  
21.5±1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 2 000 pcs/reel  
11  
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
4.4±0.2  
1.55±0.1  
0.38  
2.05±0.1  
6.6±0.2  
12.0±0.1  
Tape Direction  
PS2561AL2-1-E3  
PS2561AL2-1-E4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
φ
φ
R 1.0  
φ
φ
21.0±0.8  
25.5±1.0  
29.5±1.0  
23.9 to 27.4  
Outer edge of  
flange  
Packing: 1 000 pcs/reel  
12  
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
NOTES ON HANDLING  
1. Recommended soldering conditions  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
10 seconds or less  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120±30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120±30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One (Allowed to be dipped in solder including plastic mold portion.)  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Soldering by soldering iron  
• Peak temperature (lead part temperature)  
• Time (each pins)  
350°C or below  
3 seconds or less  
• Flux  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.  
(b) Please be sure that the temperature of the package would not be heated over 100°C.  
13  
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
(4) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
2. Cautions regarding noise  
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between  
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute  
maximum ratings.  
USAGE CAUTIONS  
1. Protect against static electricity when handling.  
2. Avoid storage at a high temperature and high humidity.  
14  
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
The information in this document is current as of May, 2004. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
15  
Data Sheet PN10222EJ02V0DS  
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1  
This product uses gallium arsenide (GaAs).  
Caution GaAs Products  
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe  
the following points.  
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws  
and/or ordinances, dispose of the product as recommended below.  
1. Commission a disposal company able to (with a license to) collect, transport and dispose of  
materials that contain arsenic and other such industrial waste materials.  
2. Exclude the product from general industrial waste and household garbage, and ensure that the  
product is controlled (as industrial waste subject to special control) up until final disposal.  
• Do not burn, destroy, cut, crush, or chemically dissolve the product.  
• Do not lick the product or in any way allow it to enter the mouth.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
http://www.ncsd.necel.com/  
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