PS2581AL1-H [NEC]
Transistor Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, DIP-4;
| 型号： | PS2581AL1-H |
| 厂家： | 
NEC |
| 描述： | Transistor Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, DIP-4 输出元件 光电 |
| 文件： | 总12页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLER
PS2581AL1,PS2581AL2
LONG CREEPAGE HIGH ISOLATION VOLTAGE
−NEPOC Series−
4-PIN PHOTOCOUPLER
DESCRIPTION
The PS2581AL1, PS2581AL2 are optically coupled isolators containing a GaAs light emitting diode and an NPN
silicon phototransistor in a plastic DIP (Dual In-line Package) to realize an excellent cost performance.
Creepage distance and clearance of leads are over 8 millimeters.
The PS2581AL2 is lead bending type (Gull-wing) for surface mounting.
FEATURES
PIN CONNECTION
•
•
•
•
•
•
Long creepage and clearance distance (8 mm)
High isolation voltage (BV = 5 000 Vr.m.s.)
High-speed switching (tr = 5 µs TYP., tf = 7 µs TYP.)
Ordering number of tape product: PS2581AL2-E3, E4: 1 000 pcs/reel
Pb-Free product
(Top View)
3
4
1. Anode
2. Cathode
3. Emitter
Safety standards
4. Collector
•
•
UL, BSI, CSA, NEMKO, DEMKO, SEMKO, FIMKO approved
DIN EN60747-5-2 (VDE0884 Part2) approved
1
2
APPLICATIONS
•
•
•
•
Power supply
Telephone/FAX.
FA/OA equipment
Programmable logic controller
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10223EJ03V0DS (3rd edition)
Date Published November 2004 CP(K)
Printed in Japan
The mark shows major revised points.
NEC Compound Semiconductor Devices, Ltd. 2003 , 2004
PS2581AL1,PS2581AL2
PACKAGE DIMENSIONS (UNIT : mm)
PS2581AL1
4.6 0.35
1.0 0.2
4
3
10.16
7.62
1
2
0.50 0.1
0.25 M
2.54
1.25 0.15
0 to 15˚
PS2581AL2
4.6 0.35
3
1.0 0.2
4
10.16
7.62
1
2
1.25 0.15
0.25 M
0.9 0.25
12.0 MAX.
2.54
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance
Unit (MIN.)
8 mm
Outer Creepage Distance
Inner Creepage Distance
Isolation Thickness
8 mm
4 mm
0.4 mm
2
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
MARKING EXAMPLE
No. 1 pin
Mark
2581A
N 301
Assembly Lot
VDE Mark
N
3
01
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Solder Plating
Made in Japan Made in Taiwan
Package
Specification
Solder contains lead
Pb-Free
H
K
New PKG
E
J
3
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS2581AL1
PS2581AL2
PS2581AL1
PS2581AL2
Solder
Magazine case 100 pcs
Standard products
PS2581AL1
contains lead
(UL, CSA,BSI, NEMKO, PS2581AL2
PS2581AL2-E3 PS2581AL2-E3
PS2581AL2-E4 PS2581AL2-E4
Embossed Tape 1 000 pcs/reel SEMKO,DEMKO,FIMKO,
DIN EN60747-5-2
PS2581AL1
PS2581AL2
PS2581AL1-A
PS2581AL2-A
Pb-Free
Magazine case 100 pcs
(VDE0884 Part2)
PS2581AL1
PS2581AL2
Approved products)
PS2581AL2-E3 PS2581AL2-E3-A
PS2581AL2-E4 PS2581AL2-E4-A
Embossed Tape 1 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
VR
Ratings
Unit
V
Diode
Reverse Voltage
6
Forward Current (DC)
Power Dissipation Derating
Power Dissipation
IF
30
mA
∆PD/°C
PD
1.5
mW/°C
mW
A
150
Peak Forward Current*1
IFP
0.5
Transistor Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
VCEO
VECO
IC
70
V
5
30
V
mA
Power Dissipation Delay
Power Dissipation
∆PC/°C
PC
1.5
mW/°C
mW
Vr.m.s.
°C
150
Isolation Voltage*2
BV
5 000
Operating Ambient Temperature
Storage Temperature
TA
−55 to +100
−55 to +150
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
4
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.2
MAX.
1.4
5
Unit
V
Diode
Forward Voltage
Reverse Current
Terminal Capacitance
IF = 10 mA
VR = 5 V
IR
µA
pF
nA
Ct
V = 0 V, f = 1.0 MHz
VCE = 70 V, IF = 0 mA
10
Transistor Collector to Emitter Dark
Current
ICEO
100
300
0.3
Coupled
Current Transfer Ratio
(IC/IF)*1
CTR
IF = 5 mA, VCE = 5 V
IF = 10 mA, IC = 2 mA
50
%
V
Collector Saturation
Voltage
VCE (sat)
0.13
Isolation Resistance
Isolation Capacitance
Rise Time*2
RI-O
CI-O
tr
VI-O = 1.0 kVDC
1011
Ω
V = 0 V, f = 1.0 MHz
0.4
5
pF
µs
VCC = 10 V, IC = 2 mA, RL = 100 Ω
Fall Time*2
tf
7
*1 CTR rank
N :
H :
50 to 300 (%)
80 to 160 (%)
Q : 100 to 200 (%)
W : 130 to 260 (%)
*2 Test circuit for switching time
Pulse Input
V
CC
PW = 100
Duty Cycle = 1/10
µ
s
I
F
V
OUT
50 Ω
R
L
= 100 Ω
5
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
200
150
100
50
200
150
100
50
1.5 mW/˚C
1.5 mW/˚C
0
25
50
75
100
(˚C)
125
0
25
50
75
100
(˚C)
125
Ambient Temperature T
A
Ambient Temperature T
A
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
50
25
20
15
10
5
T
A
= +100˚C
+60˚C
I = 10 mA
F
+25˚C
10
5
0˚C
–25˚C
–55˚C
I
I
F
F
= 5 mA
1
0.5
= 2 mA
= 1 mA
0.1
I
F
0.05
0
2
4
6
8
10
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Collector to Emitter Voltage VCE (V)
Forward Voltage V (V)
F
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
10 000
10
IF = 10 mA
I
F
= 5 mA
= 2 mA
1 000
100
10
I
F
V
CE = 70 V
1
V
CE = 24 V
I
F
= 1 mA
1
0.1
0
0.2
0.4
0.6
0.8
1.0
0
25
50
75
100
Ambient Temperature T
A
(˚C)
Collector Saturation Voltage VCE(sat) (V)
Remark
The graphs indicate nominal characteristics.
6
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
250
200
150
100
50
1.4
V
n = 2
CE = 5 V,
1.2
1.0
0.8
0.6
0.4
0.2
Sample A
B
Normalized to 1.0
at T = 25˚C,
A
I
F
= 5 mA, VCE = 5 V
CTR:130%
CTR:270%
0
0
–
50
–
25
0
25
50
75
100
0.01
0.1
1
10
100
Ambient Temperature T
A
(˚C)
Forward Current I
F
(mA)
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
1 000
100
10
100
10
I
C
= 2 mA, VCC = 10 V,
I
F
= 5 mA, VCC = 5 V,
CTR = 216%
CTR = 216%
t
f
t
f
t
r
µ
µ
t
s
td
t
s
1
t
t
r
d
0.1
1
1
10
100
10
100
1 000
(Ω)
10 000
Load Resistance R
L
Load Resistance R (kΩ)
L
FREQUENCY RESPONSE
LONG TERM CTR DEGRADATION
5
0
5
1.2
1.0
0.8
0.6
0.4
0.2
I = 5 mA (TYP.)
F
–
T
A
= 25˚C
= 60˚C
100 Ω
–
–
–
–
10
15
20
25
300 Ω
T
A
R = 1 kΩ
L
IF = 5 mA,
VCE = 5 V
0
0.1
1
10
Frequency f (kHz)
100
1 000
10
102
103
Time (Hr)
104
105
Remark The graphs indicate nominal characteristics.
7
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
TAPING SPECIFICATIONS (UNIT : mm)
Outline and Dimensions (Tape)
2.0 0.1
4.0 0.1
4.4 0.2
1.55 0.1
0.38
2.05 0.1
6.6 0.2
12.0 0.1
Tape Direction
PS2581AL2-E3
PS2581AL2-E4
Outline and Dimension (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
φ
φ
R 1.0
φ
φ
21.0 0.8
25.5 1.0
29.5 1.0
23.9 to 27.4
Outer edge of
flange
Packing: 1 000 pcs/reel
8
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
• Time of temperature higher than 220°C
10 seconds or less
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
• Time (each pins)
350°C or below
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
9
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
10
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
•
The information in this document is current as of November, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
11
Data Sheet PN10223EJ03V0DS
PS2581AL1,PS2581AL2
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Caution GaAs Products
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0406
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