PS2581L1-A-D [NEC]

Transistor Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, PLASTIC, DIP-4;
PS2581L1-A-D
型号: PS2581L1-A-D
厂家: NEC    NEC
描述:

Transistor Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, PLASTIC, DIP-4

光电 输出元件 分离技术 隔离技术
文件: 总12页 (文件大小:108K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
PHOTOCOUPLER  
PS2581L1,PS2581L2  
LONG CREEPAGE TYPE HIGH ISOLATION VOLTAGE  
4-PIN PHOTOCOUPLER  
NEPOCTM Series−  
DESCRIPTION  
The PS2581L1, PS2581L2 are optically coupled isolators containing a GaAs light emitting diode and an NPN  
silicon phototransistor in a plastic DIP (Dual In-line Package).  
Creepage distance and clearance of leads are over 8 millimeters.  
The PS2581L2 is lead bending type (Gull-wing) for surface mounting.  
FEATURES  
Long creepage and clearance distance (8 mm)  
High isolation voltage (BV = 5 000 Vr.m.s.)  
High collector to emitter voltage (VCEO = 80 V)  
High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.)  
High current transfer ratio (CTR = 200 % TYP.)  
UL approved: File No. E72422 (S)  
CSA approved: No. 101391  
BSI approved: No. 8243/8244  
NEMKO approved: No. P97103006  
DEMKO approved: No. 307269  
SEMKO approved: No. 9741154/01  
FIMKO approved: No. 018277  
VDE0884 approved  
ORDERING INFORMATION  
Part Number  
Package  
Safety Standard Approval  
UL, CSA, BSI, NEMKO, DEMKO,  
SEMKO, FIMKO, VDE approved  
Application Part Number*1  
PS2581L1  
PS2581L1  
PS2581L2  
4-pin DIP  
4-pin DIP  
PS2581L2  
(lead bending surface mount)  
PS2581L2-E3, E4  
4-pin DIP taping  
*1 As applying to Safety Standard, following part number should be used.  
The information in this document is subject to change without notice.  
Document No. P12809EJ2V0DS00 (2nd edition)  
Date Published June 1998 NS CP(K)  
Printed in Japan  
The mark shows major revised points.  
1997  
©
PS2581L1,PS2581L2  
PACKAGE DIMENSIONS (in millimeters)  
PS2581L1  
4.6±0.35  
1.0±0.2  
TOP VIEW  
3
4
1
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2
10.16  
7.62  
0.50±0.1  
0.25 M  
2.54  
1.25±0.15  
0 to 15˚  
PS2581L2  
4.6±0.35  
1.0±0.2  
TOP VIEW  
3
4
1
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2
10.16  
7.62  
1.25±0.15  
0.9±0.25  
0.25 M  
2.54  
12.0 MAX.  
PHOTOCOUPLER CONSTRUCTION  
Parameter  
Air Distance  
Unit (MIN.)  
8 mm  
Outer Creepage Distance  
Inner Creepage Distance  
Isolation Thickness  
8 mm  
4 mm  
0.4 mm  
2
PS2581L1,PS2581L2  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)  
Parameter  
Symbol  
IF  
Ratings  
Unit  
Diode  
Forward Current (DC)  
Reverse Voltage  
80  
mA  
V
VR  
6
Power Dissipation Derating  
Power Dissipation  
PD/°C  
PD  
1.5  
mW/°C  
mW  
A
150  
Peak Forward Current*1  
IFP  
1
Transistor Collector to Emitter Voltage  
Emitter to Collector Voltage  
Collector Current  
VCEO  
VECO  
IC  
80  
V
7
50  
V
mA  
Power Dissipation Derating  
Power Dissipation  
PC/°C  
PC  
1.5  
mW/°C  
mW  
Vr.m.s.  
°C  
150  
Isolation Voltage*2  
BV  
5 000  
Operating Ambient Temperature  
Storage Temperature  
TA  
55 to +100  
55 to +150  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1 %  
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output  
3
PS2581L1,PS2581L2  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.17  
MAX.  
1.4  
5
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
Terminal Capacitance  
IF = 10 mA  
VR = 5 V  
IR  
µA  
pF  
nA  
Ct  
V = 0 V, f = 1.0 MHz  
VCE = 80 V, IF = 0 mA  
50  
Collector to Emitter Dark  
Current  
Transistor  
Coupled  
ICEO  
100  
Current Transfer Ratio (I  
C/IF)*1  
CTR  
VCE(sat)  
RI-O  
CI-O  
tr  
I = 5 mA, V = 5 V  
IF = 10 mA, IC = 2 mA  
VI-O = 1.0 kVDC  
F
CE  
80  
200  
400  
0.3  
%
V
Collector Saturation Voltage  
Isolation Resistance  
Isolation Capacitance  
Rise Time*2  
1011  
V = 0 V, f = 1.0 MHz  
VCC = 10 V, IC = 2 mA,  
RL = 100 Ω  
0.5  
3
pF  
µs  
Fall Time*2  
tf  
5
*1 CTR rank  
L : 200 to 400 (%)  
M : 80 to 240 (%)  
D : 100 to 300 (%)  
H : 80 to 160 (%)  
W : 130 to 260 (%)  
N : 80 to 400 (%)  
*2 Test circuit for switching time  
Pulse Input  
V
CC  
µ
PW = 100  
s
Duty Cycle = 1/10  
I
F
V
OUT  
50  
RL = 100 Ω  
4
PS2581L1,PS2581L2  
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)  
DIODE POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
TRANSISTOR POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
150  
100  
150  
100  
50  
50  
0
100  
Ambient Temperature T  
25  
50  
75  
125  
(˚C)  
150  
0
25  
50  
75  
100  
125  
(˚C)  
150  
A
Ambient Temperature T  
A
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
100  
50  
70  
T
A
= +100 ˚C  
+60 ˚C  
60  
50  
40  
30  
20  
10  
+25 ˚C  
10  
5
0 ˚C  
–25 ˚C  
–55 ˚C  
1
0.5  
IF = 5 mA  
0.1  
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5  
Forward Voltage V (V)  
0
4
8
10  
2
6
Collector to Emitter Voltage VCE (V)  
F
COLLECTOR TO EMITTER DARK  
CURRENT vs. AMBIENT TEMPERATURE  
COLLECTOR CURRENT vs.  
COLLECTOR SATURATION VOLTAGE  
40  
10 000  
1 000  
100  
10  
V
CE = 80 V  
40 V  
10  
5
24 V  
10 V  
5 V  
IF  
= 1 mA  
1
0.5  
1
0.1  
50  
–25  
0
25  
50  
75  
100  
1.0  
0
0.2  
0.4  
0.6  
0.8  
Ambient Temperature T (˚C)  
A
Collector Saturation Voltage VCE(sat) (V)  
5
PS2581L1,PS2581L2  
NORMALIZED CURRENT TRANSFER  
RATIO vs. AMBIENT TEMPERATURE  
CURRENT TRANSFER RATIO vs.  
FORWARD CURRENT  
450  
1.2  
400  
350  
300  
250  
200  
150  
100  
50  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Normalized to 1.0  
at T  
A
= 25 ˚C,  
I
F
= 5 mA, VCE = 5 V  
0
–50  
0.05 0.1  
0.5  
Forward Current I  
–25  
0
25  
50  
75  
100  
1
5
10  
50  
Ambient Temperature T  
A
(˚C)  
F
(mA)  
SWITCHING TIME vs.  
LOAD RESISTANCE  
SWITCHING TIME vs.  
LOAD RESISTANCE  
50  
10  
1 000  
100  
10  
t
f
I
V
C
= 2 mA,  
I
V
F
= 5 mA,  
CC = 5 V,  
CTR = 290 %  
t
f
CC = 10 V,  
tr  
CTR = 290 %  
µ
µ
ts  
td  
ts  
1
tr  
t
d
0.1  
10  
1
100  
10 k  
5 k  
50 100  
500  
1 k  
()  
500 1 k  
5 k 10 k  
()  
50 k 100 k  
Load Resistance R  
L
Load Resistance R  
L
FREQUENCY RESPONSE  
LONG TERM CTR DEGRADATION  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I
V
F
= 5 mA,  
CE = 5 V  
TYP.  
0
–5  
I = 5 mA  
F
TA  
= 25 ˚C  
–10  
–15  
–20  
100 Ω  
I
F
= 5 mA  
A
T = 60 ˚C  
RL = 1 kΩ  
300 Ω  
10 20 50 100200 500  
Frequency f (kHz)  
0
103  
Time (Hr)  
0.5  
1
2
5
102  
104  
105  
Remark The graphs indicate nominal characteristics.  
6
PS2581L1,PS2581L2  
TAPING SPECIFICATIONS (in millimeters)  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
4.3±0.2  
1.55±0.1  
0.38  
2.05±0.1  
6.45±0.1  
12.0±0.1  
Tape Direction  
PS2581L2-E3  
PS2581L2-E4  
Outline and Dimensions (Reel)  
2.0±0.5  
φ13.0±1.0  
φ
R 1.0  
φ
φ21.0±1.6  
+2.0  
–0.0  
24.4  
Packing: 1 000 pcs/reel  
7
PS2581L1,PS2581L2  
RECOMMENDED SOLDERING CONDITIONS  
(1) Infrared reflow soldering  
• Peak reflow temperature  
• Time of temperature higher than 210 °C  
• Number of reflows  
235 °C (package surface temperature)  
30 seconds or less  
Three  
• Flux  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt % is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
235 ˚C (peak temperature)  
210 ˚C  
to 30 s  
120 to 160 ˚C  
60 to 90 s  
(preheating)  
Time (s)  
Caution Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.  
Peak temperature 235 ˚C or below  
(2) Dip soldering  
• Temperature  
260 °C or below (molten solder temperature)  
• Time  
10 seconds or less  
• Number of times  
• Flux  
One  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of  
0.2 Wt % is recommended.)  
8
PS2581L1,PS2581L2  
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)  
Parameter  
Application classification (DIN VDE 0109)  
Symbol  
Speck  
Unit  
for rated line voltages 300 Vr.m.s.  
for rated line voltages 600 Vr.m.s.  
IV  
III  
Climatic test class (DIN IEC 68 Teil 1/09.80)  
55/100/21  
Dielectric strength maximum operating isolation voltage.  
Test voltage (partial discharge test procedure a for type test and random test)  
Upr = 1.2 × UIORM, Pd < 5 pC  
UIORM  
Upr  
890  
Vpeak  
Vpeak  
1 068  
Test voltage (partial discharge test procedure b for random test)  
Upr  
1 424  
Vpeak  
Upr = 1.6 × UIORM, Pd < 5 pC  
Highest permissible overvoltage  
Degree of pollution (DIN VDE 0109)  
Clearance distance  
UTR  
8 000  
2
Vpeak  
> 8.0  
mm  
mm  
Creepage distance  
> 8.0  
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)  
Material group (DIN VDE 0109)  
Storage temperature range  
CTI  
175  
III a  
Tstg  
TA  
55 to +150  
55 to +100  
°C  
°C  
Operating temperature range  
Isolation resistance, minimum value  
VIO = 500 V dc at TA = 25 °C  
Ris MIN.  
Ris MIN.  
1012  
1011  
VIO = 500 V dc at TA MAX. at least 100 °C  
Safety maximum ratings (maximum permissible in case of fault, see thermal  
derating curve)  
Package temperature  
Tsi  
Isi  
175  
400  
700  
°C  
mA  
mW  
Current (input current IF, Psi = 0)  
Power (output or total power dissipation)  
Isolation resistance  
Psi  
VIO = 500 V dc at TA = 175 °C (Tsi)  
Ris MIN.  
109  
9
PS2581L1,PS2581L2  
[MEMO]  
10  
PS2581L1,PS2581L2  
[MEMO]  
11  
PS2581L1,PS2581L2  
CAUTION  
Within this device there exists GaAs (Gallium Arsenide) material which is a  
harmful substance if ingested. Please do not under any circumstances break the  
hermetic seal.  
NEPOC is a trademark of NEC Corporation.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this  
document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from use of a device described herein or any other liability arising  
from use of such device. No license, either express, implied or otherwise, is granted under any patents,  
copyrights or other intellectual property rights of NEC Corporation or others.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on  
a customer designated "quality assurance program" for a specific application. The recommended applications  
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each  
device before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
Anti-radioactive design is not implemented in this product.  
M4 96. 5  

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