PS2581L1-V [NEC]

Transistor Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, DIP-4;
PS2581L1-V
型号: PS2581L1-V
厂家: NEC    NEC
描述:

Transistor Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, DIP-4

输出元件 光电
文件: 总12页 (文件大小:85K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
PHOTOCOUPLER  
PS2581L1,PS2581L2  
LONG CREEPAGE TYPE HIGH ISOLATION VOLTAGE  
4-PIN PHOTOCOUPLER  
NEPOC Series−  
DESCRIPTION  
The PS2581L1, PS2581L2 are optically coupled isolators containing a GaAs light emitting diode and an NPN  
silicon phototransistor in a plastic DIP (Dual In-line Package).  
Creepage distance and clearance of leads are over 8 millimeters.  
The PS2581L2 is lead bending type (Gull-wing) for surface mounting.  
FEATURES  
Long creepage and clearance distance (8 mm)  
High isolation voltage (BV = 5 000 Vr.m.s.)  
High collector to emitter voltage (VCEO = 80 V)  
High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.)  
High current transfer ratio (CTR = 200 % TYP.)  
UL approved: File No. E72422 (S)  
CSA approved: No. CA101391  
BSI approved: No. 8243/8244  
NEMKO approved: No. P97103006  
DEMKO approved: No. 307269  
SEMKO approved: No. 9741154/01  
FIMKO approved: No. 018277  
VDE0884 approved  
ORDERING INFORMATION  
Part Number  
Package  
Safety Standard Approval  
UL, CSA, BSI, NEMKO, DEMKO,  
SEMKO, FIMKO, VDE approved  
Application Part Number*1  
PS2581L1  
PS2581L1  
PS2581L2  
4-pin DIP  
4-pin DIP  
PS2581L2  
(lead bending surface mount)  
PS2581L2-E3, E4  
4-pin DIP taping  
*1 As applying to Safety Standard, following part number should be used.  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10239EJ01V0DS (1st edition)  
The mark shows major revised points.  
(Previous No. P12809EJ2V0DS00)  
Date Published February 2003 CP(K)  
Printed in Japan  
NEC Compound Semiconductor Devices 1997, 2003  
PS2581L1,PS2581L2  
PACKAGE DIMENSIONS (in millimeters)  
PS2581L1  
4.6±0.35  
1.0±0.2  
TOP VIEW  
3
4
1
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2
10.16  
7.62  
0.50±0.1  
0.25 M  
2.54  
1.25±0.15  
0 to 15˚  
PS2581L2  
4.6±0.35  
1.0±0.2  
TOP VIEW  
3
4
1
1. Anode  
2. Cathode  
3. Emitter  
4. Collector  
2
10.16  
7.62  
1.25±0.15  
0.9±0.25  
0.25 M  
2.54  
12.0 MAX.  
PHOTOCOUPLER CONSTRUCTION  
Parameter  
Air Distance  
Unit (MIN.)  
8 mm  
Outer Creepage Distance  
Inner Creepage Distance  
Isolation Distance  
8 mm  
4 mm  
0.4 mm  
2
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)  
Parameter  
Symbol  
IF  
Ratings  
Unit  
Diode  
Forward Current (DC)  
Reverse Voltage  
80  
mA  
V
VR  
6
Power Dissipation Derating  
Power Dissipation  
PD/°C  
PD  
1.5  
mW/°C  
mW  
A
150  
Peak Forward Current*1  
IFP  
1
Transistor Collector to Emitter Voltage  
Emitter to Collector Voltage  
Collector Current  
VCEO  
VECO  
IC  
80  
V
7
50  
V
mA  
Power Dissipation Derating  
Power Dissipation  
PC/°C  
PC  
1.5  
mW/°C  
mW  
Vr.m.s.  
°C  
150  
Isolation Voltage*2  
BV  
5 000  
Operating Ambient Temperature  
Storage Temperature  
TA  
55 to +100  
55 to +150  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1 %  
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output  
3
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.17  
MAX.  
1.4  
5
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
Terminal Capacitance  
IF = 10 mA  
VR = 5 V  
IR  
µA  
pF  
nA  
Ct  
V = 0 V, f = 1.0 MHz  
VCE = 80 V, IF = 0 mA  
50  
Collector to Emitter Dark  
Current  
Transistor  
Coupled  
ICEO  
100  
Current Transfer Ratio (I  
C/IF)*1  
CTR  
VCE(sat)  
RI-O  
CI-O  
tr  
I = 5 mA, V = 5 V  
IF = 10 mA, IC = 2 mA  
VI-O = 1.0 kVDC  
F
CE  
80  
200  
400  
0.3  
%
V
Collector Saturation Voltage  
Isolation Resistance  
Isolation Capacitance  
Rise Time*2  
1011  
V = 0 V, f = 1.0 MHz  
VCC = 10 V, IC = 2 mA,  
RL = 100 Ω  
0.5  
3
pF  
µs  
Fall Time*2  
tf  
5
*1 CTR rank  
L : 200 to 400 (%)  
M : 80 to 240 (%)  
D : 100 to 300 (%)  
H : 80 to 160 (%)  
W : 130 to 260 (%)  
N : 80 to 400 (%)  
*2 Test circuit for switching time  
Pulse Input  
V
CC  
µ
PW = 100  
s
Duty Cycle = 1/10  
I
F
V
OUT  
50  
RL = 100 Ω  
4
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)  
DIODE POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
TRANSISTOR POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
150  
100  
150  
100  
50  
50  
0
100  
Ambient Temperature T  
25  
50  
75  
125  
(˚C)  
150  
0
25  
50  
75  
100  
125  
(˚C)  
150  
A
Ambient Temperature T  
A
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
100  
50  
70  
T
A
= +100 ˚C  
+60 ˚C  
60  
50  
40  
30  
20  
10  
+25 ˚C  
10  
5
0 ˚C  
–25 ˚C  
–55 ˚C  
1
0.5  
IF = 5 mA  
0.1  
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5  
Forward Voltage V (V)  
0
4
8
10  
2
6
Collector to Emitter Voltage VCE (V)  
F
COLLECTOR TO EMITTER DARK  
CURRENT vs. AMBIENT TEMPERATURE  
COLLECTOR CURRENT vs.  
COLLECTOR SATURATION VOLTAGE  
40  
10 000  
1 000  
100  
10  
V
CE = 80 V  
40 V  
10  
5
24 V  
10 V  
5 V  
IF  
= 1 mA  
1
0.5  
1
0.1  
50  
–25  
0
25  
50  
75  
100  
1.0  
0
0.2  
0.4  
0.6  
0.8  
Ambient Temperature T (˚C)  
A
Collector Saturation Voltage VCE(sat) (V)  
5
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
NORMALIZED CURRENT TRANSFER  
RATIO vs. AMBIENT TEMPERATURE  
CURRENT TRANSFER RATIO vs.  
FORWARD CURRENT  
450  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
400  
350  
300  
250  
200  
150  
100  
50  
Normalized to 1.0  
at T  
A
= 25 ˚C,  
I
F
= 5 mA, VCE = 5 V  
0
–50  
0.05 0.1  
0.5  
Forward Current I  
–25  
0
25  
50  
75  
100  
1
5
10  
50  
Ambient Temperature T  
A
(˚C)  
F
(mA)  
SWITCHING TIME vs.  
LOAD RESISTANCE  
SWITCHING TIME vs.  
LOAD RESISTANCE  
50  
10  
1 000  
100  
10  
t
f
I
V
C
= 2 mA,  
I
V
F
= 5 mA,  
CC = 5 V,  
CTR = 290 %  
t
f
CC = 10 V,  
tr  
CTR = 290 %  
µ
µ
ts  
td  
ts  
1
tr  
t
d
0.1  
10  
1
100  
10 k  
5 k  
50 100  
500  
1 k  
()  
500 1 k  
5 k 10 k  
()  
50 k 100 k  
Load Resistance R  
L
Load Resistance R  
L
FREQUENCY RESPONSE  
LONG TERM CTR DEGRADATION  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I
V
F
= 5 mA,  
CE = 5 V  
TYP.  
0
–5  
I = 5 mA  
F
TA  
= 25 ˚C  
–10  
–15  
–20  
100 Ω  
I
F
= 5 mA  
A
T = 60 ˚C  
RL = 1 kΩ  
300 Ω  
10 20 50 100200 500  
Frequency f (kHz)  
0
103  
Time (Hr)  
0.5  
1
2
5
102  
104  
105  
Remark The graphs indicate nominal characteristics.  
6
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
TAPING SPECIFICATIONS (in millimeters)  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
4.4±0.2  
1.55±0.1  
0.38  
2.05±0.1  
6.6±0.2  
12.0±0.1  
Tape Direction  
PS2581L2-E3  
PS2581L2-E4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
R 1.0  
21.0±0.8  
25.5±1.0  
29.5±1.0  
23.9 to 27.4  
Outer edge of  
flange  
Packing: 1 000 pcs/reel  
7
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
NOTES ON HANDLING  
1. Recommended soldering conditions  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
10 seconds or less  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120±30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120±30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One (Allowed to be dipped in solder including plastic mold portion.)  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
2. Cautions regarding noise  
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between  
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute  
maximum ratings.  
8
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
USAGE CAUTIONS  
1. Protect against static electricity when handling.  
2. Avoid storage at a high temperature and high humidity.  
9
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)  
Parameter  
Application classification (DIN VDE 0109)  
Symbol  
Speck  
Unit  
for rated line voltages 300 Vr.m.s.  
for rated line voltages 600 Vr.m.s.  
IV  
III  
Climatic test class (DIN IEC 68 Teil 1/09.80)  
55/100/21  
Dielectric strength maximum operating isolation voltage.  
Test voltage (partial discharge test procedure a for type test and random test)  
Upr = 1.2 × UIORM, Pd < 5 pC  
UIORM  
Upr  
890  
Vpeak  
Vpeak  
1 068  
Test voltage (partial discharge test procedure b for all devices test)  
Upr  
1 424  
Vpeak  
Upr = 1.6 × UIORM, Pd < 5 pC  
Highest permissible overvoltage  
Degree of pollution (DIN VDE 0109)  
Clearance distance  
UTR  
8 000  
2
Vpeak  
> 8.0  
mm  
mm  
Creepage distance  
> 8.0  
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)  
Material group (DIN VDE 0109)  
Storage temperature range  
CTI  
175  
III a  
Tstg  
TA  
55 to +150  
55 to +100  
°C  
°C  
Operating temperature range  
Isolation resistance, minimum value  
VIO = 500 V dc at TA = 25 °C  
Ris MIN.  
Ris MIN.  
1012  
1011  
VIO = 500 V dc at TA MAX. at least 100 °C  
Safety maximum ratings (maximum permissible in case of fault, see thermal  
derating curve)  
Package temperature  
Tsi  
Isi  
175  
400  
700  
°C  
mA  
mW  
Current (input current IF, Psi = 0)  
Power (output or total power dissipation)  
Isolation resistance  
Psi  
VIO = 500 V dc at TA = 175 °C (Tsi)  
Ris MIN.  
109  
10  
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
The information in this document is current as of February, 2003. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
11  
Data Sheet PN10239EJ01V0DS  
PS2581L1,PS2581L2  
SAFETY INFORMATION ON THIS PRODUCT  
The product contains gallium arsenide, GaAs.  
Caution GaAs Products  
GaAs vapor and powder are hazardous to human health if inhaled or ingested.  
• Do not destroy or burn the product.  
• Do not cut or cleave off any part of the product.  
• Do not crush or chemically dissolve the product.  
• Do not put the product in the mouth.  
Follow related laws and ordinances for disposal. The product should be excluded from general  
industrial waste or household garbage.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 E-mail: salesinfo@csd-nec.com  
NEC Compound Semiconductor Devices Hong Kong Limited  
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TEL: +852-3107-7303  
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FAX: +82-2-558-5209  
http://www.ee.nec.de/  
TEL: +49-211-6503-01 FAX: +49-211-6503-487  
FAX: +852-3107-7309  
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California Eastern Laboratories, Inc.  
http://www.cel.com/  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
0302  

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