PS2913-1-A-L [NEC]
Transistor Output Optocoupler, 1-Element, 2500V Isolation, 4.60 X 2.50 MM, 2.10 MM HEIGHT, LEAD FREE, ULTRA SMALL, PLASTIC PACKAGE-4;
| 型号： | PS2913-1-A-L |
| 厂家： | 
NEC |
| 描述： | Transistor Output Optocoupler, 1-Element, 2500V Isolation, 4.60 X 2.50 MM, 2.10 MM HEIGHT, LEAD FREE, ULTRA SMALL, PLASTIC PACKAGE-4 |
| 文件： | 总12页 (文件大小：111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLER
PS2913-1
SINGLE Tr. OUTPUT, HIGH COLLECTOR TO EMITTER VOLTAGE
4-PIN ULTRA SMALL FLAT-LEAD
−NEPOC Series−
PHOTOCOUPLER
DESCRIPTION
The PS2913-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor in one package for high density mounting applications.
An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 30%
compared with the PS28xx series.
FEATURES
•
•
•
•
•
•
Ultra small flat-lead package (4.6 (L) × 2.5 (W) × 2.1 (H) mm)
Isolation distance (0.4 mm MIN.)
High collector to emitter voltage (VCEO = 120 V)
High isolation voltage (BV = 2 500 Vr.m.s.)
Ordering number of taping product: PS2913-1-F3, F4: 3 500 pcs/reel
Safety standards
<R>
•
•
•
UL approved: File No. E72422
BSI approved: No. 8657, 8658
DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
•
•
Hybrid IC
Power supply
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10043EJ03V0DS (3rd edition)
Date Published May 2006 NS CP(K)
Printed in Japan
2000, 2006
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
PS2913-1
PACKAGE DIMENSIONS (UNIT: mm)
TOP VIEW
2.5 0.3
4
3
4
3
1. Anode
2. Cathode
3. Emitter
4. Collector
N
1
2
1
2
5.0 0.2
0.4 0.1
0.2 0.1
1.27
<R>
MARKING EXAMPLE
Last number of
type No. : 13
13
*1
An initial of "NEC"
N
Assembly lot
601
No. 1 pin
mark
(Nicked
corner)
01
6
Week assembled
Year assembled
*1 Bar : Pb-Free
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance
Unit (MIN.)
4 mm
Creepage Distance
Isolation Distance
4 mm
0.4 mm
2
Data Sheet PN10043EJ03V0DS
PS2913-1
<R>
ORDERING INFORMATION
Solder Plating
Specification
Safety Standard
Approval
Application
Part Number
Order Number
Packing Style
Part Number*1
PS2913-1
PS2913-1-A
Pb-Free
50 pcs (Tape 50 pcs cut)
Standard products PS2913-1
PS2913-1-F3
PS2913-1-F4
PS2913-1-V
PS2913-1-V-F3
PS2913-1-V-F4
PS2913-1-F3-A
PS2913-1-F4-A
PS2913-1-V-A
PS2913-1-V-F3-A
PS2913-1-V-F4-A
Embossed Tape 3 500 pcs/reel (UL, BSI approved)
50 pcs (Tape 50 pcs cut)
DIN EN60747-5-2
Embossed Tape 3 500 pcs/reel (VDE0884 Part2)
Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
Unit
mA
Diode
Forward Current
50
Forward Current Derating
Peak Forward Current*1
Power Dissipation
Reverse Voltage
∆IF/°C
IFP
0.5
mA/°C
A
0.5
PD
60
mW
V
VR
6
Transistor Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
VCEO
VECO
IC
120
V
6
30
V
mA
Power Dissipation Derating
Power Dissipation
∆PC/°C
PC
1.2
mW/°C
mW
Vr.m.s.
mW
°C
120
Isolation Voltage*2
BV
2 500
160
Total Power Dissipation
Operating Ambient Temperature
Storage Temperature
PT
TA
−55 to +100
−55 to +150
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
3
Data Sheet PN10043EJ03V0DS
PS2913-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
0.9
TYP.
1.1
MAX.
1.3
5
Unit
V
Diode
Forward Voltage
Reverse Current
Terminal Capacitance
IF = 1 mA
VR = 5 V
IR
µA
pF
nA
Ct
V = 0 V, f = 1 MHz
15
Transistor Collector to Emitter Dark
Current
ICEO
IF = 0 mA, VCE = 120 V
100
*1
Coupled
Current Transfer Ratio (I
C/IF)
CTR
VCE (sat)
RI-O
CI-O
tr
IF = 1 mA, VCE = 5 V
IF = 1 mA, IC = 0.2 mA
VI-O = 1 kVDC
50
100
200
0.3
%
V
Collector Saturation Voltage
Isolation Resistance
Isolation Capacitance
Rise Time*2
0.13
1011
Ω
V = 0 V, f = 1 MHz
0.4
10
10
80
5
pF
µs
VCC = 5 V, IC = 2 mA, RL = 100 Ω
Fall Time*2
tf
On Time*2
ton
VCC = 5 V, IF = 1 mA, RL = 5 kΩ
µs
µs
µs
Storage Time*2
Off Time*2
ts
toff
50
*1 CTR rank
N : 50 to 200 (%)
K : 100 to 200 (%)
75 to 150 (%)
L
:
M : 50 to 100 (%)
*2 Test circuit for switching time
Pulse Input
V
V
CC
PW = 100 s
µ
Duty cycle = 1/10
I
C
IF
In monitor
OUT
50 Ω
R
L
= 100 Ω/5 kΩ
4
Data Sheet PN10043EJ03V0DS
PS2913-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
80
60
40
20
140
120
100
80
60
0.5 mA/˚C
40
20
50
75
100
(˚C)
125
0
25
50
Ambient Temperature T
75
100
25
0
A
(˚C)
Ambient Temperature T
A
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
10
1
12
10
8
IF = 5 mA
CTR = 100%
TA
= +100˚C
+60˚C
+25˚C
6
0˚C
–25˚C
–50˚C
4
2 mA
0.1
2
1 mA
0.5 mA
0.01
0.0
0.5
1.0
1.5
(V)
2.0
0
2
4
6
8
10
Forward Voltage V
F
Collector to Emitter Voltage VCE (V)
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
50 000
10
CTR = 100%
5 mA
2 mA
10 000
5 000
1 000
500
V
CE = 40 V
24 V
1 mA
100
50
10 V
1
10
5
I
F
= 0.5 mA
1
0.5
0.1
0.0
0.1
–60 –40 –20
0
20
40
60 80 100
(˚C)
0.2
0.4
0.6
0.8
1.0
Ambient Temperature T
A
Collector Saturation Voltage VCE(sat) (V)
Remark The graphs indicate nominal characteristics.
5
Data Sheet PN10043EJ03V0DS
PS2913-1
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
300
250
200
150
100
V
CE = 5 V,
n = 3
Sample A
B
C
Normalized to 1.0
50
0
at T
A
= 25˚C,
I
F
= 1 mA, VCE = 5 V
–50
–25
0
25
50
75
(˚C)
100
0.1
1
10
(mA)
100
Ambient Temperature T
A
Forward Current I
F
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
10 000
1.2
1.0
I
V
F
= 1 mA,
CC = 5 V,
CTR = 120%
toff
1 000
µ
R
L
= 1 kΩ
510 Ω
300 Ω
100 Ω
0.8
0.6
0.4
0.2
0.0
100
ts
t
on
10
1
1k
10k
100 k
(Ω)
1 000 k
0.5
1
5
10
50 100
500
Load Resistance R
L
Frequency f (kHz)
LONG TERM CTR DEGRADATION
1.2
1.0
0.8
0.6
I
I
I
I
F
F
F
F
= 1 mA,
= 5 mA,
= 20 mA, T
= 20 mA, T
T
T
A
A
A
A
= 25˚C
= 25˚C
= 25˚C
= 60˚C
0.4
0.2
0.0
1
102
103
104
105
106
Time (Hr)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10043EJ03V0DS
PS2913-1
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0 0.05
+0.1
–0
4.0 0.1
1.5
2.9 MAX.
0.3
2.4 0.1
1.55 0.05
2.9 0.1
4.0 0.1
Tape Direction
PS2913-1-F4
PS2913-1-F3
N
N
N
N
N
N
N
N
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
13.5 1.0
11.9 to 15.4
Outer edge of
flange
Packing: 3 500 pcs/reel
7
Data Sheet PN10043EJ03V0DS
PS2913-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.27
0.8
0.6
(
) : Reference value
24-R0.1
Remark This drawing is considered to meet air and outer creepage distance 4.0 mm minimum. All dimensions in
this figure must be evaluated before use.
8
Data Sheet PN10043EJ03V0DS
PS2913-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of peak reflow temperature
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
<R>
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
• Time (each pins)
350°C or below
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
9
Data Sheet PN10043EJ03V0DS
PS2913-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
<R>
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
10
Data Sheet PN10043EJ03V0DS
PS2913-1
•
The information in this document is current as of May, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
•
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2)
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
11
Data Sheet PN10043EJ03V0DS
PS2913-1
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Caution GaAs Products
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: contact@ncsd-hk.necel.com
Hong Kong Head Office TEL: +852-3107-7303
FAX: +852-3107-7309
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120 FAX: +82-2-558-5209
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.eu.necel.com/
TEL: +49-211-6503-0
FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500
FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
0604
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