PS710B-1A [NEC]
6-PIN DIP, 0.05 Ω LOW ON-STATE RESISTANCE 2.5 A CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET; 6引脚DIP ， 0.05 Ω低导通电阻2.5 A连续负载电流1路光耦合MOS场效应管
| 型号： | PS710B-1A |
| 厂家： | 
NEC |
| 描述： | 6-PIN DIP, 0.05 Ω LOW ON-STATE RESISTANCE 2.5 A CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET |
| 文件： | 总14页 (文件大小：99K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
Solid State Relay
OCMOS FET
PS710B-1A,PS710BL-1A
6-PIN DIP, 0.05 Ω LOW ON-STATE RESISTANCE
2.5 A CONTINUOUS LOAD CURRENT
−NEPOC Series−
1-ch Optical Coupled MOS FET
DESCRIPTION
The PS710B-1A and PS710BL-1A are solid state relays containing a GaAs LED input side and MOS FETs on the
output side.
It is suitable for PLC, etc. because of its large continuous load current and low on-state resistance.
The PS710BL-1A has a surface mount type lead.
FEATURES
•
•
•
•
•
•
•
•
•
•
Low on-state resistance (Ron = 0.05 Ω TYP.)
Large continuous load current (IL = 2.5 A)
1 channel type (1 a output)
Low LED operating current (IF = 2 mA)
Designed for AC/DC switching line changer
Small package (6-pin DIP)
Low offset voltage
Ordering number of taping product: PS710BL-1A-E3, E4: 1 000 pcs/reel
Pb-Free product
<R>
<R>
Safety standards
• UL approved: File No. E72422
APPLICATIONS
•
•
Measurement equipment
FA equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10064EJ03V0DS (3rd edition)
Date Published July 2006 NS CP(K)
Printed in Japan
2002, 2006
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
PS710B-1A,PS710BL-1A
PACKAGE DIMENSIONS (UNIT: mm)
PS710B-1A
9.25 0.5
TOP VIEW
6
1
5
2
4
3
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
7.62
6.5 0.5
0 to 15˚
0.5 0.1
1.34 0.1
2.54
0.25 M
PS710BL-1A
9.25 0.5
TOP VIEW
6
1
5
2
4
3
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
6.5 0.5
0.9 0.25
9.60 0.4
2.54
1.34 0.1
0.25 M
2
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
<R>
MARKING EXAMPLE
No. 1 pin
Mark
Country Assembled
Type Number
Assembly Lot
PS710B-1A
NL601
N L 6 01
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
(L: Pb-Free)
Rank Code
3
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard Application Part
Approval
Number*1
PS710B-1A
PS710B-1A-A
Pb-Free
Magazine case 50 pcs
Standard products PS710B-1A
(UL approved)
PS710BL-1A
PS710BL-1A-A
PS710BL-1A-E3-A
PS710BL-1A-E4-A
PS710BL-1A-E3
PS710BL-1A-E4
Embossed Tape 1 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
4
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
50
Unit
mA
V
Diode
Forward Current (DC)
Reverse Voltage
IF
VR
PD
IFP
VL
IL
5.0
50
Power Dissipation
mW
A
Peak Forward Current*1
1
MOS FET Load Voltage
Continuous
60
V
Connection A
Connection B
Connection C
2.5
3.5
5.0
5.0
A
Load Current*2
Pulse Load Current*3
ILP
A
(AC/DC Connection)
Power Dissipation
PD
BV
PT
625
1 500
mW
Vr.m.s.
mW
°C
Isolation Voltage*4
Total Power Dissipation
Operating Ambient Temperature
Storage Temperature
675
TA
−40 to +85
−40 to +100
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1%
*2 Conditions: IF ≥ 2 mA. The following types of load connections are available.
6
1
Connection A
Connection B
Connection C
2
3
5
V
V
L
L
(AC/DC)
(DC)
I
I
L
L
L
L
4
6
5
+
–
1
2
3
4
6
1
2
3
–
+
5
4
V
V
L
L
(DC)
(DC)
I
I
L
L
L
6
5
+
–
L
1
2
3
I
L
+ I
L
I
L
4
*3 PW = 100 ms, 1 shot
*4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-3 shorted together, 4-6 shorted together.
5
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
LED Operating Current
LED Off Voltage
Symbol
MIN.
TYP.
10
MAX.
20
Unit
mA
V
IF
2
0
VF
0.5
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.2
MAX.
1.4
Unit
V
Diode
Forward Voltage
Reverse Current
IF = 10 mA
VR = 5 V
IR
5.0
µA
nA
MOS FET Off-state Leakage
Current
ILoff
VD = 60 V
50
Output Capacitance
Cout
IFon
Ron
ton
VD = 0 V, f = 1 MHz
IL = 2.5 A
500
pF
mA
Ω
Coupled
LED On-state Current
On-state Resistance
Turn-on Time*1, 2
2.0
0.1
5.0
0.2
IF = 10 mA, IL = 2.5 A, t ≤ 10 ms
0.05
2.5
IF = 10 mA, VO = 5 V, RL = 500 Ω,
PW ≥ 10 ms
ms
Turn-off Time*1, 2
toff
0.05
Isolation Resistance
Isolation Capacitance
RI-O
CI-O
VI-O = 1.0 kVDC
109
Ω
V = 0 V, f = 1 MHz
0.5
pF
*1 Test Circuit for Switching Time
IF
50%
Input
Pulse Input
VL
0
V
O
= 5 V
90%
10%
Input monitor
VO monitor
Output
Rin
RL
t
on
t
off
*2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms.
Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off
time will increase.
6
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
100
80
60
40
20
0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
85
85
–25
0
25
50
75
(˚C)
100
–25
0
25
50
75
(˚C)
100
Ambient Temperature T
A
Ambient Temperature T
A
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
1.6
1.4
1.2
1.0
0.8
600
500
400
300
200
100
f = 1 MHz
I = 50 mA
F
30 mA
20 mA
10 mA
5 mA
1 mA
–25
0
25
50
75
(˚C)
100
0
10
20
30
(V)
40
Ambient Temperature T
A
Applied Voltage V
D
OFF-STATE LEAKAGE CURRENT vs.
AMBIENT TEMPERATURE
LOAD CURRENT vs. LOAD VOLTAGE
10–6
10–7
10–8
10–9
10–10
10–11
3.0
IF = 10 mA
VD = 60 V
2.0
1.0
–0.15
–0.10
–0.05
0
0.05
0.10
0.15
–1.0
–2.0
–3.0
0
20
40
60
80
(˚C)
100
Ambient Temperature T
A
Load Voltage V (V)
L
Remark The graphs indicate nominal characteristics.
7
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
ON-STATE RESISTANCE DISTRIBUTION
3.0
60
n = 50 pcs,
Normalized to 1.0
I
I
t
F
= 10 mA,
= 2.5 A,
10 ms
at T = 25˚C,
A
2.5
2.0
1.5
1.0
0.5
0.0
50
40
30
20
10
0
L
I
I
F
= 10 mA,
= 2.5 A
L
50
52
54
56
58
–25
0
25
50
75
100
On-state Resistance Ron (mΩ)
Ambient Temperature T (˚C)
A
TURN-ON TIME vs. FORWARD CURRENT
TURN-OFF TIME vs. FORWARD CURRENT
0.14
30
V
R
O
= 5 V,
= 500 Ω
V
R
O
= 5 V,
= 500 Ω
L
L
0.12
0.10
0.08
0.06
0.04
0.02
20
10
0
10
20
30
(mA)
40
0
10
20
30
(mA)
40
Forward Current I
F
Forward Current I
F
TURN-ON TIME DISTRIBUTION
TURN-OFF TIME DISTRIBUTION
30
25
20
15
10
5
30
25
20
15
10
5
n = 50 pcs,
= 10 mA,
n = 50 pcs,
= 10 mA,
IF
I
F
V
O
= 5 V,
V
O
= 5 V,
R
L
= 500 Ω
R
L
= 500 Ω
0
0
2.3
2.4
2.5
2.6
2.7
0.03
0.04
0.05
0.06
0.08
Turn-on Time ton (ms)
Turn-off Time toff (ms)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
3.0
3.0
Normalized to 1.0
Normalized to 1.0
at T
A
= 25˚C,
at T
A
= 25˚C,
2.5
2.0
1.5
1.0
0.5
0.0
I
V
F
= 10 mA,
2.5
2.0
1.5
1.0
0.5
0.0
I
V
F
= 10 mA,
O
= 5 V,
O
= 5 V,
R
L
= 500 Ω
R
L
= 500 Ω
–25
0
25
50
75
100
–25
0
25
50
75
100
Ambient Temperature T
A
(˚C)
Ambient Temperature T (˚C)
A
Remark The graphs indicate nominal characteristics.
9
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0 0.1
4.0 0.1
+0.1
1.5
–0
4.5 MAX.
10.4 0.1
4.0 0.1
0.3
1.55 0.1
12.0 0.1
Tape Direction
PS710BL-1A-E3
PS710BL-1A-E4
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
φ13.0 0.2
φ
R 1.0
φ
φ21.0 0.8
17.5 1.0
21.5 1.0
15.9 to 19.4
Outer edge of
flange
Packing: 1 000 pcs/reel
10
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
• Time of temperature higher than 220°C
10 seconds or less
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
<R>
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
• Time (each pins)
350°C or below
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
11
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
<R>
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
•
The information in this document is current as of July, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
•
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2)
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
13
Data Sheet PN10064EJ03V0DS
PS710B-1A,PS710BL-1A
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Caution GaAs Products
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: contact@ncsd-hk.necel.com
Hong Kong Head Office TEL: +852-3107-7303
FAX: +852-3107-7309
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120 FAX: +82-2-558-5209
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.eu.necel.com/
TEL: +49-211-6503-0
FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500
FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
0604
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