PS8103-F3-A-L [NEC]
Linear IC Output Optocoupler, 1-Element, 2500V Isolation, 0.2MBps, LEAD FREE, PLASTIC, SOP-5;
| 型号： | PS8103-F3-A-L |
| 厂家： | 
NEC |
| 描述： | Linear IC Output Optocoupler, 1-Element, 2500V Isolation, 0.2MBps, LEAD FREE, PLASTIC, SOP-5 光电 输出元件 |
| 文件： | 总10页 (文件大小：308K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PHOTOCOUPLER
PS8103
HIGH-SPEED (200 kbps) ANALOG OUTPUT TYPE
5-PIN SOP PHOTOCOUPLER
−NEPOC Series−
DESCRIPTION
The PS8103 is an optically coupled isolator containing a GaAs LED on the light emitting diode (input side) and a
PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
This is a plastic SOP (Small Out-line Package) type for high density applications.
FEATURES
•
•
•
•
•
•
•
Wide operating VCC range (VCC = −0.5 to +15 V)
Small package (5-pin SOP)
PIN CONNECTION
(Top View)
High isolation voltage (BV = 2 500 Vr.m.s.)
High-speed response (tPHL, tPLH = 5 µs MAX. (@RL = 4.1 kΩ))
Ordering number of taping product: PS8103-F3, F4: 2 500 pcs/reel
Pb-Free product
5
4
3
1. Anode
2. Cathode
3. GND
Safety standards
4. VO
5. VCC
•
UL approved: File No. E72422
1
2
APPLICATIONS
•
•
•
•
Computer and peripheral manufactures
General purpose inverter
Substitutions for relays and pulse transformers
Power supply
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10261EJ02V0DS (2nd edition)
Date Published February 2005 CP(K)
Printed in Japan
The mark shows major revised points.
©
NEC Compound Semiconductor Devices, Ltd. 2003, 2005
PS8103
PACKAGE DIMENSIONS (UNIT: mm)
+0.3
3.4
–0.1
7.0±0.3
4.4
0.5±0.3
1.27
+0.10
0.25 M
0.4
–0.05
MARKING
8103
N234
Assembly Lot
*1
No. 1 pin Mark
Initial of NEC
N
(Engraved mark)
N
2
34
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
*1 Bar : Pb-Free
2
Data Sheet PN10261EJ02V0DS
PS8103
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS8103
PS8103-A
Pb-Free*2
Magazine case 100 pcs
Standard products
PS8103
PS8103-F3
PS8103-F4
PS8103-F3-A
PS8103-F4-A
Embossed Tape 2 500 pcs/reel (UL approved)
*1 For the application of the Safety Standard, following part number should be used.
*2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your
nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
Unit
mA
V
Diode
Forward Current
Reverse Voltage
Power Dissipation *1
Supply Voltage
Output Voltage
Output Current
50
VR
5
50
PD
mW
V
VCC
VO
−0.5 to +15
−0.5 to +15
8
Detector
V
IO
mA
mW
Vr.m.s.
°C
Power Dissipation *2
PC
80
Isolation Voltage *3
BV
TA
2 500
Operating Ambient Temperature
Storage Temperature
−40 to +100
−55 to +125
Tstg
°C
*1 Reduced to 0.5 mW/°C at TA = 25°C or more.
*2 Applies to output pin VO. Reduced to 0.8 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
3
Data Sheet PN10261EJ02V0DS
PS8103
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.2
MAX.
1.5
Unit
V
Diode
Forward Voltage
Reverse Current
Terminal Capacitance
IF = 16 mA
VR = 3 V
IR
10
µA
pF
nA
µA
V
Ct
V = 0 V, f = 1 MHz
30
7
Detector High Level Output Current
High Level Output Current
Low Level Output Voltage
IOH (1)
IOH (2)
VOL
IF = 0 mA, VCC = VO = 5.5 V
500
100
0.4
1
IF = 0 mA, VCC = VO = 15 V
IF = 16 mA, VCC = 4.5 V, IOL = 1.1 mA
IF = 0 mA, VO = open, VCC = 15 V
IF = 16 mA, VO = open, VCC = 15 V
IF = 16 mA, VCC = 4.5 V, VO = 0.4 V
0.1
0.01
150
23
High Level Supply Current
Low Level Supply Current
ICCH
µA
ICCL
800
30
Coupled Current Transfer Ratio (IC/IF)
CTR
10
%
*1
Isolation Resistance
Isolation Capacitance
RI-O
CI-O
tPHL
VI-O = 1 kVDC, RH = 40 to 60%
V = 0 V, f = 1 MHz
1011
Ω
0.4
1
pF
µs
Propagation Delay Time
(H → L) *2
IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
5
5
CL = 15 pF
Propagation Delay Time
(L → H) *2
tPLH
tPHL
tPLH
2
1
7
Propagation Delay Time
(H → L) *2
IF = 16 mA, VCC = 5 V, RL = 20 kΩ,
15
15
CL = 15 pF
Propagation Delay Time
(L → H) *2
*1 CTR rank
L : 15 to 30 (%)
N : 10 to 30 (%)
*2 Test circuit for propagation delay time
Input
V
CC = 5 V
50%
Pulse input (I
F
)
0.1 µF
R
L
= 4.1/20 kΩ
(Monitor)
(Pulse width = 100
Duty cycle = 1/10)
µs,
V
O
5 V
CL = 15 pF
Output
Input
(Monitor)
1.5 V
47 Ω
V
OL
t
PHL
t
PLH
CL includes probe and stray wiring capacitance.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1 µF is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
4
Data Sheet PN10261EJ02V0DS
PS8103
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
60
50
40
30
20
10
120
100
80
60
40
20
0
25
50
75
100
1.6
50
0
25
50
75
100
Ambient Temperature T
A
(˚C)
Ambient Temperature T
A
(˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
100
10
1 000
100
10
I = 0 mA
F
T
A
= +100˚C
+50˚C
V
CC = V
O
= 15 V
5.5 V
+25˚C
1
0˚C
–25˚C
0.1
0.01
1
0.1
–25
0.2
0.4
0.6
0.8
1.0
1.2
(V)
1.4
0
25
50
75
(˚C)
100
Forward Voltage V
F
Ambient Temperature T
A
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
40
35
30
25
20
15
10
5
1.6
1.4
1.2
1.0
0.8
0.6
0.4
V
V
CC = 4.5 V,
= 0.4 V
Normalized to 1.0
at T
V
O
A
= 25˚C, I
CC = 4.5 V, V
F
= 16 mA,
= 0.4 V
O
0.2
0.0
0
0.5
1
5
10
(mA)
–50
–25
0
25
50
75
(˚C)
100
Forward Current I
F
Ambient Temperature T
A
Remark The graphs indicate nominal characteristics.
5
Data Sheet PN10261EJ02V0DS
PS8103
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
OUTPUT VOLTAGE vs.
FORWARD CURRENT
10
8
6
5
4
3
2
1
I
F
= 25 mA
20 mA
15 mA
10 mA
6
RL
= 4.1 kΩ
20 kΩ
4
2
5 mA
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
Output Voltage V (V)
O
Forward Current I (mA)
F
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
15
10
5
10
V
CC = 5 V,
V
CC = 5 V
µ
µ
t
PLH
IF = 16 mA
t
PLH (R
L
= 20 kΩ)
1
t
PHL
t
PHL (R
L
= 4.1 kΩ)
= 20 kΩ)
t
PLH (R
L
= 4.1 kΩ)
t
PHL (R
L
0.1
0
5
10
15
20
(mA)
25
1
10
Load Resistance R (kΩ)
100
Forward Current I
F
L
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
3.0
Normalized to 1.0
at T
= 16 mA, VCC = 5 V,
= 2.2 kΩ, 20 kΩ
A
= 25˚C,
2.5
2.0
1.5
1.0
0.5
0
I
R
F
L
t
t
PLH
PHL
–50
–25
0
25
50
75
(˚C)
100
Ambient Temperature T
A
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10261EJ02V0DS
PS8103
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0±0.05
4.0±0.1
+0.1
–0
3.45 MAX.
1.5
1.55±0.1
3.0±0.1
3.9±0.1
8.0±0.1
0.3±0.05
Tape Direction
PS8103-F4
PS8103-F3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
R 1.0
φ
φ
φ
φ
21.0±0.8
13.5±1.0
17.5±1.0
11.9 to 15.4
Outer edge of
flange
Packing: 2 500 pcs/reel
7
Data Sheet PN10261EJ02V0DS
PS8103
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of peak reflow temperature
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
• Flux
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
8
Data Sheet PN10261EJ02V0DS
PS8103
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
9
Data Sheet PN10261EJ02V0DS
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
-AZ
(*)
Lead (Pb)
Mercury
< 1000 PPM
< 1000 PPM
< 100 PPM
< 1000 PPM
< 1000 PPM
< 1000 PPM
Not Detected
Not Detected
Cadmium
Hexavalent Chromium
PBB
Not Detected
Not Detected
Not Detected
Not Detected
PBDE
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance
content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
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suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.
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